VISHAY IRFB13N50A Discrete Semiconductor User Guide
- May 15, 2024
- VISHAY
Table of Contents
VISHAY IRFB13N50A Discrete Semiconductor
Product Information
Specifications
- Brand: Vishay Siliconix
- Model: IRFB13N50A
- Type: Power MOSFET
- Package: TO-220AB
- Channel Type: N-Channel MOSFET
- Drain-Source Voltage (VDS): 500 V
- RDS(on): 81 ohms (VGS = 10 V)
- Maximum Gate Charge (Qg max.): 20 nC
- Total Gate Charge (Qg): 36 nC
- Configuration: Single
Features
- RoHS-compliant
- Lead (Pb)-free package available
Thermal Resistance Ratings
- Maximum junction-to-ambient: 62 °C/W
- Case-to-sink, flat, greased surface: 0.50 °C/W
- Maximum junction-to-case (drain): 0.50 °C/W
Parameter Details
For detailed parameter specifications, please refer to the user manual.
Product Usage Instructions
Installation
- Ensure proper grounding before installation.
- Mount the MOSFET securely using a 6-32 or M3 screw with the recommended torque.
Usage
- Apply the appropriate gate-source voltage within the specified range.
- Connect the drain and source terminals correctly based on your circuit requirements.
Maintenance
Regularly check for any signs of overheating or damage during operation.
FAQ
Q: Is the IRFB13N50A lead-free?
A: Yes, the IRFB13N50A is available in a lead (Pb)-free package variant.
Q: What is the maximum drain-source voltage supported by the IRFB13N50A?
A: The IRFB13N50A supports a maximum drain-source voltage of 500V.
Q: Can the IRFB13N50A be used in high-power applications?
A: Yes, the IRFB13N50A is suitable for high-power applications with its
low RDS(on) and high drain current capabilities.
PRODUCT OVERVIEW
FEATURES
- Lower gate charge Qg results in simpler drive requirements
- Improved gate, avalanche, and dynamic dV/dt ruggedness
- Fully characterized capacitance and avalanche voltage
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Note
This datasheet provides information about parts that are RoHS-compliant and/or
parts that are non-RoHS-compliant. For example, parts with lead (Pb)
terminations are not RoHS-compliant.
Please see the information/tables in this datasheet for details
APPLICATIONS
- Switch mode power supply (SMPS)
- Uninterruptible power supplies
- High-speed power switching
Power MOSFET
PRODUCT SUMMARY
VDS (V) | 500 |
---|---|
RDS(on) (W) | VGS = 10 V |
Qg max. (nC) | 81 |
Qgs (nC) | 20 |
Qgd (nC) | 36 |
Configuration | Single |
ORDERING INFORMATION
Package | TO-220AB |
---|---|
Lead (Pb)-free | IRFB13N50APbF |
ABSOLUTE MAXIMUM RATINGS
(TC = 25 °C, unless otherwise noted)
PARAMETER | SYMBOL | LIMIT | UNIT |
---|---|---|---|
Drain-source voltage | VDS | 500 | V |
Gate-source voltage | VGS | ± 30 | |
Continuous drain current | VGS at 10 V | TC = 25 °C | ID |
A
TC = 100 °C| 9.1
Pulsed drain current a| IDM| 56
Linear derating factor| | 2.0| W/°C
Single pulse avalanche energy b| EAS| 560| mJ
Repetitive avalanche current a| IAR| 14| A
Repetitive avalanche energy a| EAR| 25| mJ
Maximum power dissipation| TC = 25 °C| PD| 250| W
Peak diode recovery dV/dt c| dV/dt| 9.2| V/ns
Operating junction and storage temperature range| TJ, Tstg| -55 to +150| °C
Soldering recommendations (peak temperature) d| For 10 s| | 300
Mounting torque| 6-32 or M3 screw| | 10| lbf · in
1.1| N · m
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- Starting TJ = 25 °C, L = 5.7 mH, Rg = 25 Ω, IAS =14 A, dV/dt = 7.6 V/ns (see fig. 12a)
- ISD ≤ 14 A, dI/dt ≤ 250 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
- 1.6 mm from case
THERMAL RESISTANCE RATINGS
PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum junction-to-ambient| RthJA| –| 62|
°C/W
Case-to-sink, flat, greased surface| RthCS| 0.50| –
Maximum junction-to-case (drain)| RthJC| –| 0.50
SPECIFICATIONS
(TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
---|---|---|---|---|---|---
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 500| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.55|
–| V/°C
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 2.0| –| 4.0| V
Gate-source leakage| IGSS| VGS = ± 30 V| –| –| ± 100| nA
Zero gate voltage drain current| IDSS| VDS = 500 V, VGS = 0 V| –| –| 25| μA
VDS = 400 V, VGS = 0 V, TJ = 125 °C| –| –| 250
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 8.4 A b| –| –|
0.450| W
Forward transconductance| gfs| VDS = 50 V, ID = 8.4 A| 8.1| –| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = 25 V,
f = 1.0 MHz, see fig. 5
| –| 1910| –|
pF
Output capacitance| Coss| –| 290| –
Reverse transfer capacitance| Crss| –| 11| –
Output capacitance| Coss|
VGS = 0 V
| VDS = 1.0 V, f = 1.0 MHz| –| 2730| –
VDS = 400 V, f = 1.0 MHz| –| 82| –
Effective output capacitance| Coss eff.| VDS = 0 V to 400 V c| –| 160| –
Total gate charge| Qg|
VGS = 10 V
|
ID = 14 A, VDS = 400 V,
see fig. 6 and 13 b
| –| –| 81|
nC
Gate-source charge| Qgs| –| –| 20
Gate-drain charge| Qgd| –| –| 36
Turn-on delay time| td(on)|
VDD = 250 V, ID = 14 A, Rg = 7.5 W,
see fig. 10 b
| –| 15| –|
ns
Rise time| tr| –| 39| –
Turn-off delay time| td(off)| –| 39| –
Fall time| tf| –| 31| –
Gate input resistance| Rg| f = 1 MHz, open drain| 0.5| –| 2.1| W
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol
D
showing the
integral reverse
p – n junction diode S
| –| –| 14|
A
Pulsed diode forward current a| ISM| –| –| 56
Body diode voltage| VSD| TJ = 25 °C, IS = 14 A, VGS = 0 V b| –| –| 1.5| V
Body diode reverse recovery time| trr|
TJ = 25 °C, IF = 14 A,
TJ = 125 °C, dI/dt = 100 A/μs b
| –| 370| 550| ns
Body diode reverse recovery charge| Qrr| –| 4.4| 6.5| μC
Body diode reverse recovery current| IRRM| –| 21| 31| A
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is
dominated by LS and LD)
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- Pulse width ≤ 300 μs; duty cycle ≤ 2 %
- Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91095.
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT
NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all
persons acting on its or their behalf (collectively,“Vishay”), disclaim any
and all liability for any errors, inaccuracies or incompleteness contained in
any datasheet or in any other disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the
suitability of the products for any particular purpose or the continuing
production of any product. To the maximum extent permitted by applicable law,
Vishay disclaims (i) any and all liability arising out of the application or
use of any product, (ii) any and all liability, including without limitation
special, consequential or incidental damages, and (iii) any and all implied
warranties, including warranties of fitness for particular purpose, non-
infringement and merchantability.
Statements regarding the suitability of products for certain types of
applications are based on Vishay’s knowledge of typical requirements that are
often placed on Vishay products in generic applications. Such statements are
not binding statements about the suitability of products for a particular
application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable
for use in a particular application. Parameters provided in datasheets and /
or specifications may vary in different applications and performance may vary
over time. All operating parameters, including typical parameters, must be
validated for each customer application by the customer’s technical experts.
Product specifications do not expand or otherwise modify Vishay’s terms and
conditions of purchase, including but not limited to the warranty expressed
therein.
Hyperlinks included in this datasheet may direct users to third-party
websites. These links are provided as a convenience and for informational
purposes only. Inclusion of these hyperlinks does not constitute an
endorsement or an approval by Vishay of any of the products, services or
opinions of the corporation, organization or individual associated with the
third-party website.
Vishay disclaims any and all liability and bears no responsibility for the
accuracy, legality or content of the third-party website or for that of
subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for
use in medical, life-saving, or life-sustaining applications or for any other
application in which the failure of the Vishay product could result in
personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in
such applications do so at their own risk. Please contact authorized Vishay
personnel to obtain written terms and conditions regarding products designed
for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2024 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
For technical questions, contact:
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED
HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>