VISHAY TNPW0201 High Stability Thin Film Flat Chip Resistors Instruction Manual

VISHAY TNPW0201 High Stability Thin Film Flat Chip Resistors

Specifications

• Imperial size: 1206
• Metric size code: TNPW e3
• Resistance range: RR1005M to RR3225M
• Resistance tolerance: Varies with model
• Temperature coefficient: Varies with model
• Rated dissipation, P70: Varies with model
• Operating voltage, Umax: Varies with model
• Permissible film temperature, F max: Varies with model
• Operating temperature range: Varies with model
• Internal thermal resistance (typical): Varies with model
• Permissible voltage against ambient (insulation): Varies with model
• Failure rate: Varies with model

Application Information

When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded.
Please consider the application note Thermal Management in Surface-Mounted Resistor Applications for information on the general nature of thermal resistance.

High Stability Thin Film Flat Chip Resistors

Vishay Automotive Grade TNPW e3 thin film flat ch ip resistors are the perfect choice for most fields of moder n electronics where highest reliability and stability is of major concern. Typical applications include automotive, industrial, test and measuring equipment, and medical equipment.

FEATURES

• Rated dissipation P70 up to 0.52 W for size 1206

• AEC-Q200 qualified

• Single lot date code (optional)

• Permissible film temperature up to 175 °C

• Superior temperature cycling robustness

• Excellent overall stability at different environmental conditions
  Superior moisture resistivity, |ΔR/R| < 0.1 % (85 °C; 85 % RH; 1000 h)

• Advanced sulfur resistance verified according to ASTM B 809

• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

• Automotive
• Industrial equipment with enhanced requirements
• Test and measuring equipment
• Medical equipment

TECHNICAL SPECIFICATIONS

DESCRIPTION| TNPW0201 e3| TNPW0402 e3| TNPW0603 e3| TNPW0805 e3| TNPW1206 e3| TNPW1210 e3
Imperial size| 0201| 0402| 0603| 0805| 1206| 1210
Metric size code| RR0603M| RR1005M| RR1608M| RR2012M| RR3216M| RR3225M
Resistance range| 22 Ù to 40 kÙ| 10 Ù to 100 kÙ| 1 Ù to 332 kÙ| 1 Ù to 1 MÙ| 1 Ù to 2 MÙ| 10 Ù to 3.01 MÙ
Resistance tolerance| ± 0.5 %; ± 0.1 %| ± 1 %; ± 0.5 %; ± 0.1 %
Temperature coefficient| ± 25 ppm/K| ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
Rated dissipation, P 70 (1)| 0.075 W| 0.130 W| 0.210 W| 0.260 W| 0.520 W| 0.500 W
Operating voltage,

U max. ACRMS or DC

| 25 V| 50 V| 75 V| 150 V| 200 V| 200 V
Permissible film temperature, JF max. (1)| 175 °C
Operating temperature range (2)| -55 °C to 175 °C
Internal thermal resistance (typical) (1)| –| 90 K/W| 63 K/W| 38 K/W| 32 K/W| –
Permissible voltage against ambient (insulation):

1 min; U ins

|

50 V

|

75 V

|

100 V

|

200 V

|

300 V

|

300 V

Failure rate: FITobserved| £ 0.1 x 10-9/h

Notes

1.  Please refer to APPLICATION INFORMATION
2. Please refer to table MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION, see below

APPLICATION INFORMATION

When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded.
Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.

MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION

OPERATION MODE| GENERAL| POWER| ADVANCED

Rated dissipation, P 70

| TNPW0201 e3| 0.050 W| 0.075 W| –
TNPW0402 e3| 0.070 W| 0.105 W| 0.130 W
TNPW0603 e3| 0.110 W| 0.170 W| 0.210 W
TNPW0805 e3| 0.140 W| 0.220 W| 0.260 W
TNPW1206 e3| 0.270 W| 0.420 W| 0.520 W
TNPW1210 e3| 0.330 W| 0.500 W| –
Operating temperature range| -55 °C to 125 °C| -55 °C to 155 °C| -55 °C to 175 °C
Permissible film temperature, J F max.| 125 °C| 155 °C| 175 °C

Max. resistance change at P 70 for resistance range,

|Ä R / R | after:

| TNPW0201 e3| 22 Ù to 40 kÙ
TNPW0402 e3| 10 Ù to 100 kÙ
TNPW0603 e3| 1 Ù to 332 kÙ
TNPW0805 e3| 1 Ù to 1 MÙ
TNPW1206 e3| 1 Ù to 2 MÙ
TNPW1210 e3| 1 Ù to 3.01 MÙ
1000 h

8000 h

225 000 h

| £  0.05 %

£  0.10 %

£  0.30 %

| £  0.10 %

£  0.20 %

£  0.60 %

| £ 0.20 %
–
–

Note

The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) fo r information on the general nature of thermal resistance

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

TYPE / SIZE| TCR| TOLERANCE| RESISTANCE| E-SERIES

TNPW0201 e3

|

± 25 ppm/K

| ± 0.5 %| 22 Ù to 40 kÙ|

E24; E192

± 0.1 %| 22 Ù to 25 kÙ

TNPW0402 e3

|

± 50 ppm/K

| ± 1 %| 10 Ù to 100 kÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %| 47 Ù to 100 kÙ

± 25 ppm/K

| ± 1 %| 10 Ù to 100 kÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %|

47 Ù to 100 kÙ

± 15 ppm/K|

± 0.1 %

± 10 ppm/K

TNPW0603 e3

|

± 50 ppm/K

| ± 1 %| 1 Ù to 332 kÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %| 3.5 Ù to 332 kÙ

± 25 ppm/K

| ± 1 %| 1 Ù to 332 kÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %| 3.5 Ù to 332 kÙ
± 15 ppm/K|

± 0.1 %

| 47 Ù to 332 kÙ
± 10 ppm/K

TNPW0805 e3

|

± 50 ppm/K

| ± 1 %| 1 Ù to 1 MÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %| 3.5 Ù to 1 MÙ

± 25 ppm/K

| ± 1 %| 1 Ù to 1 MÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %|

3.5 Ù to 1 MÙ

± 15 ppm/K|

± 0.1 %

± 10 ppm/K

TNPW1206 e3

|

± 50 ppm/K

| ± 1 %| 1 Ù to 2 MÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %| 3.5 Ù to 2 MÙ

± 25 ppm/K

| ± 1 %| 1 Ù to 2 MÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %| 3.5 Ù to 2 MÙ
± 15 ppm/K|

± 0.1 %

| 47 Ù to 2 MÙ
± 10 ppm/K

TNPW1210 e3

|

± 50 ppm/K

| ± 1 %| 10 Ù to 3.01 MÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %| 47 Ù to 2.13 MÙ

± 25 ppm/K

| ± 1 %| 10 Ù to 3.01 MÙ| E24; E96
± 0.5 %|

E24; E192

± 0.1 %|

47 Ù to 2.13 MÙ

± 15 ppm/K|

± 0.1 %

± 10 ppm/K
PACKAGING

TYPE / SIZE

|

CODE

|

QUANTITY

| PACKAGING STYLE|

WIDTH

|

PITCH

| PACKAGING DIMENSIONS

TNPW0201 e3

| ET2 = EI| 5000|

Paper tape according IEC 60286-3, Type 1a

|

8 mm

|

2 mm

|

Ø 180 mm / 7″

ET7 = ED| 10 000

TNPW0402 e3

| ET2 = EI| 5000
ET7 = ED| 10 000
TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3| ET1 = EA| 5000| 4 mm| Ø 180 mm / 7″
ET6 = EC (1)|

20 000

|

4 mm

|

Ø 330 mm / 13″

Note

1.  20 000 pieces packaging is available only for resistors with TCR ± 25 ppm/K and ± 50 ppm/K

Note

The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION

DESCRIPTION

Production is strictly controlled and follows an extensive se t of instructions established for reproducibility. A homogeneous film of special metal alloy is deposited on a high grade ceramic substrate (AI2O3) and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The termination s receive a final pure matte tin on nickel plating. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. This includes full screening for the elimination of products with a potential risk of early life failures (feasible for R ≥ 10 Ω). Only accepted products are laid directly into the tape in accordance with IEC 60286-3, Type 1a (1).

ASSEMBLY

The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow, or vapour phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system.
The resistors are RoHS-compliant, the pure matte tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven unde r extensive testing.

MATERIALS
Vishay acknowledges the following systems for the regulation of hazardous substances:

• IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2)
• The Global Automotive Declarable Substance List (GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for it s supply chain

The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree.
Hence the products fully comply with the followin g directives:

• 2000/53/EC End-of-Life Vehicle Directive (ELV) an d Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendmen t 2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipmen t Directive (WEEE)

Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?28881

RELATED PRODUCTS
The TNPW with SnPb termination plating is designed for those applications, where lead bearing terminations ar e mandatory. For ordering TNPW with SnPb terminations please refer to latest edition of datasheet TNPW www.vishay.com/doc?2888131006).
TNPU e3 ultra precision thin film flat chip resistors combine the proven reliability of TNPW e3 products with a most advanced level of precision and stability (www.vishay.com/doc?28779).
TNPS …. ESCC high-reliability thin film chip resistors are the premium choice for design and manufacture of equipment, where matured technology and proven reliability are of utmost importance. They are regularly used i n communication and research satellites and fit equally well into aircraft and military electronic systems.

European Space Components Coordination and registered in the ESCC Qualified Parts List, REP00 5 (www.vishay.com/doc?28881).
TNPV e3 High Voltage Thin Film Flat Chip Resistors are designed for most fields of modern electronics wher e precision, reliability and stability at high operating voltage are primary concerns (www.vishay.com/doc?28881).

Notes

1.  The quoted IEC standards are also released as EN standards with the same number and identical contents
2. The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
3. The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
4. The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table

FUNCTIONAL PERFORMANCE

Derating – Advanced Operation

Continuous Pulse

Note

1. Typical figures, HF-characteristic also depends on termination and circuit design

Note

1. Typical figures, HF-characteristic also depends on termination and circuit design

TEST AND REQUIREMENTS

All tests are carried out in accordance with the following specifications:

• EN 60115-1, generic specification
• EN 60115-8, sectional specification
• EN 140401-801, detail specification
• IEC 60068-2-xx, test methods

The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. The detail specification EN 140401-801 does not cover case size 0201. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included.

The testing also covers most of the requirements specified by EIA / ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied:

• Temperature: 15 °C to 35 °C
• Relative humidity: 25 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
• A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days).

The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified.

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1 CLAUSE| IEC 60068-2 (1)

TEST METHOD

| TEST| PROCEDURE| REQUIREMENTS PERMISSIBLE CHANGE ( Ä R )
| | | Stability for product types:|
TNPW0201 e3| 22 Ù to 40 kÙ
TNPW0402 e3| 10 Ù to 100 kÙ
TNPW0603 e3| 1 Ù to 332 kÙ
TNPW0805 e3| 1 Ù to 1 MÙ
TNPW1206 e3| 1 Ù to 2 MÙ
TNPW1210 e3| 10 Ù to 3.01 MÙ

4.38

|

–

|

Electro static discharge (human body model)

| IEC 61340-3-1 (1);

3 pos. + 3 neg. (equivalent to MIL-STD-883, method

3015. TNPW0201 e3: 200 V TNPW0402 e3: 400 V TNPW0603 e3: 1000 V TNPW0805 e3: 1500 V TNPW1206 e3: 2000 V

|

± (0.5 % R + 0.05 Ù)

4.22

|

6 (Fc)

|

Vibration

| Endurance by sweeping; 10 Hz to 2000 Hz;

no resonance; amplitude £ 1.5 mm or

£ 200 m/s2; 7.5 h

|

± (0.05 % R + 0.01 Ù)

no visible damage

4.17

|

58 (Td)

|

Solderability

| Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s|

Good tinning (³ 95 % covered); no visible damage

Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux

(235 ± 3) °C; (2 ± 0.2) s

4.18| 58 (Td)| Resistance to soldering heat| Solder bath method; (260 ± 5) °C; (10 ± 1) s (3)| ± (0.02 % R + 0.01 Ù)

4.29

|

45 (XA)

| Component solvent resistance|

Isopropyl alcohol + 50 °C; method 2

|

No visible damage

4.32

|

21 (Ue3)

|

Shear (adhesion)

| TNPW0201 e3: 2 N|

No visible damage

TNPW0402 e3 and TNPW0603 e3: 9 N
TNPW0805 e3, TNPW1206 e3, and TNPW1210 e3: 45 N

4.33

|

21 (Ue1)

| Substrate bending|

Depth 2 mm, 3 times

| ± (0.05 % R + 0.01 Ù)

no visible damage,

no open circuit in bent position

4.7| –| Voltage proof| U RMS = U ins; 60 ± 5 s| No flashover or breakdown
4.35| –| Flammability| IEC 60695-11-5 (1),

needle flame test; 10 s

| No burning after 30 s

Notes

1. The quoted IEC standards are also released as EN standards with the same number and identical contents
2.  Periodic electric overload test for power operation mode not applicable for case size 0201
3.  For TNPW0201 e3 only similar to DIN EN 60115-8 test procedure. Due to the components small size they were fixed by glue previous to testing instead of applying tweezers

 DIMENSIONS

DIMENSIONS AND MASS

TYPE / SIZE

| L

(mm)

| W

(mm)

| H

(mm)

| T t / Tb **(mm)| MASS**

(mg)

TNPW0201 e3| 0.6 ± 0.05| 0.3 ± 0.05| 0.23 ± 0.03| 0.12 ± 0.05| 0.14
TNPW0402 e3| 1.0 ± 0.05| 0.5 ± 0.05| 0.35 ± 0.05| 0.2 ± 0.10| 0.65
TNPW0603 e3| 1.55 ± 0.05| 0.85 ± 0.10| 0.45 ± 0.10| 0.3 ± 0.20| 2
TNPW0805 e3| 2.0 ± 0.1| 1.25 ± 0.15| 0.45 ± 0.10| 0.4 ± 0.20| 5.5
TNPW1206 e3| 3.2 + 0.1 / – 0.2| 1.6 ± 0.15| 0.55 ± 0.10| 0.5 ± 0.25| 10
TNPW1210 e3| 3.2 + 0.1 / – 0.2| 2.45 ± 0.15| 0.60 ± 0.15| 0.5 ± 0.25| 16

SOLDERING RECOMMENDATIONS
For recommended solder pad dimensions please refer to www.vishay.com/doc?28950. For recommended soldering profiles please refer to www.vishay.com/doc?31090.

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non- infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limite d to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or approval by Vishay o f any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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© 2024 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

References

• GADSL | The GADSL is the result of the efforts of a global team from the automotive, automotive parts supplier (tier supplier) and chemical/plastics industries who have organized the Global Automotive Stakeholders Group (GASG).
• Vishay Intertechnology: Passives & Discrete Semiconductors
• How to Get Lead-Free / ROHS / Reach Status | Vishay

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