VISHAY TNPW0201 High Stability Thin Film Flat Chip Resistors Instruction Manual
- June 1, 2024
- VISHAY
Table of Contents
VISHAY TNPW0201 High Stability Thin Film Flat Chip Resistors
Specifications
- Imperial size: 1206
- Metric size code: TNPW e3
- Resistance range: RR1005M to RR3225M
- Resistance tolerance: Varies with model
- Temperature coefficient: Varies with model
- Rated dissipation, P70: Varies with model
- Operating voltage, Umax: Varies with model
- Permissible film temperature, F max: Varies with model
- Operating temperature range: Varies with model
- Internal thermal resistance (typical): Varies with model
- Permissible voltage against ambient (insulation): Varies with model
- Failure rate: Varies with model
Application Information
When the resistor dissipates power, a temperature rise above the ambient
temperature occurs, dependent on the thermal resistance of the assembled
resistor together with the printed circuit board. The rated dissipation
applies only if the permitted film temperature is not exceeded.
Please consider the application note Thermal Management in Surface-Mounted
Resistor Applications for information on the general nature of thermal
resistance.
High Stability Thin Film Flat Chip Resistors
Vishay Automotive Grade TNPW e3 thin film flat ch ip resistors are the perfect choice for most fields of moder n electronics where highest reliability and stability is of major concern. Typical applications include automotive, industrial, test and measuring equipment, and medical equipment.
FEATURES
-
Rated dissipation P70 up to 0.52 W for size 1206
-
AEC-Q200 qualified
-
Single lot date code (optional)
-
Permissible film temperature up to 175 °C
-
Superior temperature cycling robustness
-
Excellent overall stability at different environmental conditions
Superior moisture resistivity, |ΔR/R| < 0.1 % (85 °C; 85 % RH; 1000 h) -
Advanced sulfur resistance verified according to ASTM B 809
-
Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
- Automotive
- Industrial equipment with enhanced requirements
- Test and measuring equipment
- Medical equipment
TECHNICAL SPECIFICATIONS
DESCRIPTION| TNPW0201 e3| TNPW0402 e3| TNPW0603 e3|
TNPW0805 e3| TNPW1206 e3| TNPW1210 e3
Imperial size| 0201| 0402| 0603| 0805| 1206| 1210
Metric size code| RR0603M| RR1005M| RR1608M| RR2012M| RR3216M| RR3225M
Resistance range| 22 Ù to 40 kÙ| 10 Ù to 100 kÙ| 1 Ù to 332 kÙ| 1 Ù to 1 MÙ| 1
Ù to 2 MÙ| 10 Ù to 3.01 MÙ
Resistance tolerance| ± 0.5 %; ± 0.1 %| ± 1 %; ± 0.5 %; ± 0.1 %
Temperature coefficient| ± 25 ppm/K| ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10
ppm/K
Rated dissipation, P 70 (1)| 0.075 W| 0.130 W| 0.210 W| 0.260 W| 0.520 W|
0.500 W
Operating voltage,
U max. ACRMS or DC
| 25 V| 50 V| 75 V| 150 V| 200 V| 200 V
Permissible film temperature, JF max. (1)| 175 °C
Operating temperature range (2)| -55 °C to 175 °C
Internal thermal resistance (typical) (1)| –| 90 K/W| 63 K/W| 38 K/W| 32 K/W|
–
Permissible voltage against ambient (insulation):
1 min; U ins
|
50 V
|
75 V
|
100 V
|
200 V
|
300 V
|
300 V
Failure rate: FITobserved| £ 0.1 x 10-9/h
Notes
- Please refer to APPLICATION INFORMATION
- Please refer to table MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION, see below
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient
temperature occurs, dependent on the thermal resistance of the assembled
resistor together with the printed circuit board. The rated dissipation
applies only if the permitted film temperature is not exceeded.
Please consider the application note “Thermal Management in Surface-Mounted
Resistor Applications”
(www.vishay.com/doc?28844) for information
on the general nature of thermal resistance.
These resistors do not feature a limited lifetime when operated within the
permissible limits. However, resistance value drift increasing over operating
time may result in exceeding a limit acceptable to the specific application,
thereby establishing a functional lifetime.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE| GENERAL| POWER| ADVANCED
Rated dissipation, P 70
| TNPW0201 e3| 0.050 W| 0.075 W| –
TNPW0402 e3| 0.070 W| 0.105 W| 0.130 W
TNPW0603 e3| 0.110 W| 0.170 W| 0.210 W
TNPW0805 e3| 0.140 W| 0.220 W| 0.260 W
TNPW1206 e3| 0.270 W| 0.420 W| 0.520 W
TNPW1210 e3| 0.330 W| 0.500 W| –
Operating temperature range| -55 °C to 125 °C| -55 °C to 155 °C| -55 °C to 175
°C
Permissible film temperature, J F max.| 125 °C| 155 °C| 175 °C
Max. resistance change at P 70 for resistance range,
|Ä R / R | after:
| TNPW0201 e3| 22 Ù to 40 kÙ
TNPW0402 e3| 10 Ù to 100 kÙ
TNPW0603 e3| 1 Ù to 332 kÙ
TNPW0805 e3| 1 Ù to 1 MÙ
TNPW1206 e3| 1 Ù to 2 MÙ
TNPW1210 e3| 1 Ù to 3.01 MÙ
1000 h
8000 h
225 000 h
| £ 0.05 %
£ 0.10 %
£ 0.30 %
| £ 0.10 %
£ 0.20 %
£ 0.60 %
| £ 0.20 %
–
–
Note
The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) fo r information on the general nature of thermal resistance
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE| TCR| TOLERANCE| RESISTANCE| E-SERIES
TNPW0201 e3
|
± 25 ppm/K
| ± 0.5 %| 22 Ù to 40 kÙ|
E24; E192
± 0.1 %| 22 Ù to 25 kÙ
TNPW0402 e3
|
± 50 ppm/K
| ± 1 %| 10 Ù to 100 kÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %| 47 Ù to 100 kÙ
± 25 ppm/K
| ± 1 %| 10 Ù to 100 kÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %|
47 Ù to 100 kÙ
± 15 ppm/K|
± 0.1 %
± 10 ppm/K
TNPW0603 e3
|
± 50 ppm/K
| ± 1 %| 1 Ù to 332 kÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %| 3.5 Ù to 332 kÙ
± 25 ppm/K
| ± 1 %| 1 Ù to 332 kÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %| 3.5 Ù to 332 kÙ
± 15 ppm/K|
± 0.1 %
| 47 Ù to 332 kÙ
± 10 ppm/K
TNPW0805 e3
|
± 50 ppm/K
| ± 1 %| 1 Ù to 1 MÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %| 3.5 Ù to 1 MÙ
± 25 ppm/K
| ± 1 %| 1 Ù to 1 MÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %|
3.5 Ù to 1 MÙ
± 15 ppm/K|
± 0.1 %
± 10 ppm/K
TNPW1206 e3
|
± 50 ppm/K
| ± 1 %| 1 Ù to 2 MÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %| 3.5 Ù to 2 MÙ
± 25 ppm/K
| ± 1 %| 1 Ù to 2 MÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %| 3.5 Ù to 2 MÙ
± 15 ppm/K|
± 0.1 %
| 47 Ù to 2 MÙ
± 10 ppm/K
TNPW1210 e3
|
± 50 ppm/K
| ± 1 %| 10 Ù to 3.01 MÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %| 47 Ù to 2.13 MÙ
± 25 ppm/K
| ± 1 %| 10 Ù to 3.01 MÙ| E24; E96
± 0.5 %|
E24; E192
± 0.1 %|
47 Ù to 2.13 MÙ
± 15 ppm/K|
± 0.1 %
± 10 ppm/K
PACKAGING
TYPE / SIZE
|
CODE
|
QUANTITY
| PACKAGING STYLE|
WIDTH
|
PITCH
| PACKAGING DIMENSIONS
TNPW0201 e3
| ET2 = EI| 5000|
Paper tape according IEC 60286-3, Type 1a
|
8 mm
|
2 mm
|
Ø 180 mm / 7″
ET7 = ED| 10 000
TNPW0402 e3
| ET2 = EI| 5000
ET7 = ED| 10 000
TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3| ET1 = EA| 5000| 4 mm| Ø
180 mm / 7″
ET6 = EC (1)|
20 000
|
4 mm
|
Ø 330 mm / 13″
Note
- 20 000 pieces packaging is available only for resistors with TCR ± 25 ppm/K and ± 50 ppm/K
Note
The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
DESCRIPTION
Production is strictly controlled and follows an extensive se t of instructions established for reproducibility. A homogeneous film of special metal alloy is deposited on a high grade ceramic substrate (AI2O3) and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The termination s receive a final pure matte tin on nickel plating. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. This includes full screening for the elimination of products with a potential risk of early life failures (feasible for R ≥ 10 Ω). Only accepted products are laid directly into the tape in accordance with IEC 60286-3, Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD assembly systems.
They are suitable for automatic soldering using wave, reflow, or vapour phase
as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry, including alcohols, esters
and aqueous solutions. The suitability of conformal coatings, potting
compounds and their processes, if applied, shall be qualified by appropriate
means to ensure the long-term stability of the whole system.
The resistors are RoHS-compliant, the pure matte tin plating provides
compatibility with lead (Pb)-free and lead-containing soldering processes.
Solderability is specified for 2 years after production or requalification.
The permitted storage time is 20 years. The immunity of the plating against
tin whisker growth has been proven unde r extensive testing.
MATERIALS
Vishay acknowledges the following systems for the regulation of hazardous
substances:
- IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2)
- The Global Automotive Declarable Substance List (GADSL) (3)
- The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for it s supply chain
The products do not contain any of the banned substances as per IEC 62474,
GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the followin g directives:
- 2000/53/EC End-of-Life Vehicle Directive (ELV) an d Annex II (ELV II)
- 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendmen t 2015/863/EU
- 2012/19/EU Waste Electrical and Electronic Equipmen t Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?28881
RELATED PRODUCTS
The TNPW with SnPb termination plating is designed for those applications,
where lead bearing terminations ar e mandatory. For ordering TNPW with SnPb
terminations please refer to latest edition of datasheet TNPW
www.vishay.com/doc?2888131006).
TNPU e3 ultra precision thin film flat chip resistors combine the proven
reliability of TNPW e3 products with a most advanced level of precision and
stability (www.vishay.com/doc?28779).
TNPS …. ESCC high-reliability thin film chip resistors are the premium choice
for design and manufacture of equipment, where matured technology and proven
reliability are of utmost importance. They are regularly used i n
communication and research satellites and fit equally well into aircraft and
military electronic systems.
European Space Components Coordination and registered in the ESCC Qualified
Parts List, REP00 5
(www.vishay.com/doc?28881).
TNPV e3 High Voltage Thin Film Flat Chip Resistors are designed for most
fields of modern electronics wher e precision, reliability and stability at
high operating voltage are primary concerns
(www.vishay.com/doc?28881).
Notes
- The quoted IEC standards are also released as EN standards with the same number and identical contents
- The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
- The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
- The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
FUNCTIONAL PERFORMANCE
Derating – Advanced Operation
Continuous Pulse
Note
- Typical figures, HF-characteristic also depends on termination and circuit design
Note
- Typical figures, HF-characteristic also depends on termination and circuit design
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following specifications:
- EN 60115-1, generic specification
- EN 60115-8, sectional specification
- EN 140401-801, detail specification
- IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. The detail specification EN 140401-801 does not cover case size 0201. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included.
The testing also covers most of the requirements specified by EIA / ECA-703
and JIS-C-5201-1.
The tests are carried out under standard atmospheric conditions in accordance
with IEC 60068-1, 4.3, whereupon the following values are applied:
- Temperature: 15 °C to 35 °C
- Relative humidity: 25 % to 75 %
- Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
- A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 CLAUSE| IEC 60068-2 (1)
TEST METHOD
| TEST| PROCEDURE| REQUIREMENTS PERMISSIBLE CHANGE ( Ä R
)
| | | Stability for product types:|
TNPW0201 e3| 22 Ù to 40 kÙ
TNPW0402 e3| 10 Ù to 100 kÙ
TNPW0603 e3| 1 Ù to 332 kÙ
TNPW0805 e3| 1 Ù to 1 MÙ
TNPW1206 e3| 1 Ù to 2 MÙ
TNPW1210 e3| 10 Ù to 3.01 MÙ
4.38
|
–
|
Electro static discharge (human body model)
| IEC 61340-3-1 (1);
3 pos. + 3 neg. (equivalent to MIL-STD-883, method
- TNPW0201 e3: 200 V TNPW0402 e3: 400 V TNPW0603 e3: 1000 V TNPW0805 e3: 1500 V TNPW1206 e3: 2000 V
|
± (0.5 % R + 0.05 Ù)
4.22
|
6 (Fc)
|
Vibration
| Endurance by sweeping; 10 Hz to 2000 Hz;
no resonance; amplitude £ 1.5 mm or
£ 200 m/s2; 7.5 h
|
± (0.05 % R + 0.01 Ù)
no visible damage
4.17
|
58 (Td)
|
Solderability
| Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s|
Good tinning (³ 95 % covered); no visible damage
Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
4.18| 58 (Td)| Resistance to soldering heat| Solder bath method; (260 ± 5) °C; (10 ± 1) s (3)| ± (0.02 % R + 0.01 Ù)
4.29
|
45 (XA)
| Component solvent resistance|
Isopropyl alcohol + 50 °C; method 2
|
No visible damage
4.32
|
21 (Ue3)
|
Shear (adhesion)
| TNPW0201 e3: 2 N|
No visible damage
TNPW0402 e3 and TNPW0603 e3: 9 N
TNPW0805 e3, TNPW1206 e3, and TNPW1210 e3: 45 N
4.33
|
21 (Ue1)
| Substrate bending|
Depth 2 mm, 3 times
| ± (0.05 % R + 0.01 Ù)
no visible damage,
no open circuit in bent position
4.7| –| Voltage proof| U RMS = U ins; 60 ± 5 s| No flashover or breakdown
4.35| –| Flammability| IEC 60695-11-5 (1),
needle flame test; 10 s
| No burning after 30 s
Notes
- The quoted IEC standards are also released as EN standards with the same number and identical contents
- Periodic electric overload test for power operation mode not applicable for case size 0201
- For TNPW0201 e3 only similar to DIN EN 60115-8 test procedure. Due to the components small size they were fixed by glue previous to testing instead of applying tweezers
DIMENSIONS
DIMENSIONS AND MASS
TYPE / SIZE
| L
(mm)
| W
(mm)
| H
(mm)
| T t / Tb **(mm)| MASS**
(mg)
TNPW0201 e3| 0.6 ± 0.05| 0.3 ± 0.05| 0.23 ± 0.03| 0.12 ± 0.05| 0.14
TNPW0402 e3| 1.0 ± 0.05| 0.5 ± 0.05| 0.35 ± 0.05| 0.2 ± 0.10| 0.65
TNPW0603 e3| 1.55 ± 0.05| 0.85 ± 0.10| 0.45 ± 0.10| 0.3 ± 0.20| 2
TNPW0805 e3| 2.0 ± 0.1| 1.25 ± 0.15| 0.45 ± 0.10| 0.4 ± 0.20| 5.5
TNPW1206 e3| 3.2 + 0.1 / – 0.2| 1.6 ± 0.15| 0.55 ± 0.10| 0.5 ± 0.25| 10
TNPW1210 e3| 3.2 + 0.1 / – 0.2| 2.45 ± 0.15| 0.60 ± 0.15| 0.5 ± 0.25| 16
SOLDERING RECOMMENDATIONS
For recommended solder pad dimensions please refer to
www.vishay.com/doc?28950. For recommended
soldering profiles please refer to
www.vishay.com/doc?31090.
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT
NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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persons acting on its or their behalf (collectively, “Vishay”), disclaim any
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often placed on Vishay products in generic applications. Such statements are
not binding statements about the suitability of products for a particular
application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable
for use in a particular application. Parameters provided in datasheets and /
or specifications may vary in different applications and performance may vary
over time. All operating parameters, including typical parameters, must be
validated for each customer application by the customer’s technical experts.
Product specifications do not expand or otherwise modify Vishay’s terms and
conditions of purchase, including but not limite d to the warranty expressed
therein.
Hyperlinks included in this datasheet may direct users to third-party
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© 2024 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
References
- GADSL | The GADSL is the result of the efforts of a global team from the automotive, automotive parts supplier (tier supplier) and chemical/plastics industries who have organized the Global Automotive Stakeholders Group (GASG).
- Vishay Intertechnology: Passives & Discrete Semiconductors
- How to Get Lead-Free / ROHS / Reach Status | Vishay
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