VISHAY SUM70042E-GE3 Discrete Semiconductor User Guide

VISHAY SUM70042E-GE3 Discrete Semiconductor

Product Information

Specifications

• Brand: Vishay Siliconix
• Type: N-Channel MOSFET
• Drain-Source Voltage (VDS): 100V
• RDS(on) max. at VGS = 10V: 0.0040 ohms
• RDS(on) max. at VGS = 7.5V: 0.0045 ohms
• Gate Charge (Qg): 84nC
• Continuous Drain Current (ID): 150A
• Package Type: TO-263

Features
For detailed features, please refer to www.vishay.com/doc?99912.

Applications
This N-Channel MOSFET is commonly used in applications requiring high power switching.

Ordering Information
Package Lead (Pb)-free and halogen-free TO-263 SUM70042E-GE3

Thermal Resistance Ratings

• Junction-to-Ambient: 40°C/W
• Junction-to-Case: 0.55°C/W

Operating Conditions

Operating Junction and Storage Temperature Range: -55 to +175°C

Product Usage Instructions

Installation

1. Ensure proper grounding before installation.
2. Mount the MOSFET securely on a suitable PCB using appropriate insulation materials.
3. Connect the drain, gate, and source terminals correctly as per the circuit design.

Operation

1. Apply the recommended gate voltage for the desired operation.
2. Avoid exceeding the maximum rated drain-source voltage during operation.
3. Monitor the thermal conditions to prevent overheating.

Maintenance

1. Regularly inspect the MOSFET for any physical damage.
2. Ensure proper ventilation for heat dissipation.

Disposal
Dispose of the MOSFET according to local regulations for electronic waste disposal.

FAQs

Q: What is the maximum drain-source voltage for this MOSFET?
A: The maximum drain-source voltage is 100V.

Q: What is the maximum continuous drain current supported?
A: The MOSFET supports a maximum continuous drain current of 150A.

N-Channel 100 V (D-S) MOSFET

OVERVIEW

FEATURED

• TrenchFET® power MOSFET
• Maximum 175 °C junction temperature
• Very low Qgd reduces power loss from passing through Vplateau
• 100 % Rg and UIS tested
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

• Switching power supply
• DC/DC converter
• Power tools
• Motor drive switch
• DC/AC inverter
• Battery management
• OR-ing / e-fuse

PRODUCT SUMMARY

ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| LIMIT| UNIT
Drain-source voltage| VDS| 100| V
Gate-source voltage| VGS| ± 20
Continuous drain current (TJ = 150 °C)| TC = 25 °C| ID| 150 d|

A

TC = 70 °C| 139
Pulsed drain current (t = 100 μs)| IDM| 200
Avalanche current| IAS| 50
Single avalanche energy a| L = 0.1 mH| EAS| 125| mJ
Maximum power dissipation a| TC = 25 °C| PD| 278 b| W
TC = 125 °C| 178 b
Operating junction and storage temperature range| TJ, Tstg| -55 to +175| °C
THERMAL RESISTANCE RATINGS

PARAMETER| SYMBOL| LIMIT| UNIT
Junction-to-ambient (PCB mount) c| RthJA| 40|

°C/W

Junction-to-case (drain)| RthJC| 0.55

Notes

• Duty cycle ≤ 1 %
• See SOA curve for voltage derating
• When mounted on 1″ square PCB (FR4 material)
• Package limited

SPECIFICATIONS

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.| MAX.| UNIT
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 10 mA| 100| –| –|

V

Gate threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 2| –| 4
Gate-body leakage| IGSS| VDS = 0 V, VGS = ± 20 V| –| –| ± 250| nA

Zero gate voltage drain current

|

IDSS

| VDS = 100 V, VGS = 0 V| –| –| 1|

μA

VDS = 100 V, VGS = 0 V, TJ = 125 °C| –| –| 150
VDS = 100 V, VGS = 0 V, TJ = 175 °C| –| –| 5| mA
On-state drain current a| ID(on)| VDS ³ 10 V, VGS = 10 V| 50| –| –| A
Drain-source on-state resistance a|

RDS(on)

| VGS = 10 V, ID = 20 A| –| 0.0033| 0.0040| W
VGS = 7.5 V, ID = 15 A| –| 0.0036| 0.0045
Forward transconductance a| gfs| VDS = 15 V, ID = 15 A| –| 60| –| S
Dynamic b
Input capacitance| Ciss|

VGS = 0 V, VDS = 50 V, f = 1 MHz

| –| 6490| –|

pF

Output capacitance| Coss| –| 570| –
Reverse transfer capacitance| Crss| –| 20| –
Total gate charge c| Qg|

VDS = 50 V, VGS = 10 V, ID = 20 A

| –| 84| 110|

nC

Gate-source charge c| Qgs| –| 33.5| –
Gate-drain charge c| Qgd| –| 9.5| –
Gate resistance| Rg| f = 1 MHz| 0.26| 1.3| 2.6| W
Turn-on delay time c| td(on)|

VDD = 50 V, RL = 5 W

ID @ 10 A, VGEN = 10 V, Rg = 1 W

| –| 25| 50|

ns

Rise time c| tr| –| 18| 36
Turn-off delay time c| td(off)| –| 45| 90
Fall time c| tf| –| 14| 28
Drain-Source Body Diode Ratings and Characteristics b (TC = 25 °C)
Pulsed current (t = 100 μs)| ISM|  | –| –| 200| A
Forward voltage a| VSD| IF = 10 A, VGS = 0 V| –| 0.8| 1.5| V
Reverse recovery time| trr|

IF = 10 A, di/dt = 100 A/μs

| –| 58| 116| ns
Peak reverse recovery charge| IRM(REC)| –| 3.9| 5.9| A
Reverse recovery charge| Qrr| –| 126| 189| μC
Reverse recovery fall time| ta| –| 42| –| ns
Reverse recovery rise time| tb| –| 16| –

Notes

• Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
• Guaranteed by design, not subject to production testing
• Independent of operating temperature

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

TYPICAL CHARACTERISTICS

(TA = 25 °C, unless otherwise noted)

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?63052.

TO-263 (D2PAK): 3-LEAD

DIM.

| INCHES| MILLIMETERS
---|---|---
MIN.| MAX.| MIN.| MAX.
A| 0.160| 0.190| 4.064| 4.826
b| 0.020| 0.039| 0.508| 0.990
b1| 0.020| 0.035| 0.508| 0.889
b2| 0.045| 0.055| 1.143| 1.397
c*| Thin lead| 0.013| 0.018| 0.330| 0.457
Thick lead| 0.023| 0.028| 0.584| 0.711
c1| Thin lead| 0.013| 0.017| 0.330| 0.431
Thick lead| 0.023| 0.027| 0.584| 0.685
c2| 0.045| 0.055| 1.143| 1.397
D| 0.340| 0.380| 8.636| 9.652
D1| 0.220| 0.240| 5.588| 6.096
D2| 0.038| 0.042| 0.965| 1.067
D3| 0.045| 0.055| 1.143| 1.397
D4| 0.044| 0.052| 1.118| 1.321
E| 0.380| 0.410| 9.652| 10.414
E1| 0.245| –| 6.223| –
E2| 0.355| 0.375| 9.017| 9.525
E3| 0.072| 0.078| 1.829| 1.981
e| 0.100 BSC| 2.54 BSC
K| 0.045| 0.055| 1.143| 1.397
L| 0.575| 0.625| 14.605| 15.875
L1| 0.090| 0.110| 2.286| 2.794
L2| 0.040| 0.055| 1.016| 1.397
L3| 0.050| 0.070| 1.270| 1.778
L4| 0.010 BSC| 0.254 BSC
M| –| 0.002| –| 0.050
ECN: T13-0707-Rev. K, 30-Sep-13 DWG: 5843

Notes

1. Plane B includes maximum features of heat sink tab and plastic.

2. No more than 25 % of L1 can fall above seating plane by max. 8 mils.

3. Pin-to-pin coplanarity max. 4 mils.

4. *: Thin lead is for SUB, SYB.
   Thick lead is for SUM, SYM, SQM.

5. Use inches as the primary measurement.

6. This feature is for thick lead.

RECOMMENDED

RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead

Disclaimer
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References

• Vishay Intertechnology: Passives & Discrete Semiconductors
• SUM70042E MOSFETs | Vishay

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