VISHAY IRF730A Power MOSFET Owner’s Manual

June 16, 2024
VISHAY

VISHAY IRF730A Power MOSFET

VISHAY-IRF730A-Power-MOSFET-PRO

Product Information

Specifications

  • Manufacturer: Vishay Siliconix
  • Product Name: IRF730A
  • Package Type: D TO-220AB
  • Channel Type: N-Channel MOSFET
  • VDS (Drain-Source Voltage): 400V
  • RDS(on) (Drain-Source On-State Resistance): 1.0Ω
  • Qg max. (Total Gate Charge): 22nC
  • Qgs (Gate-Source Charge): 5.8nC
  • Qgd (Gate-Drain Charge): 9.3nC
  • Configuration: Single

Product Usage Instructions

Step 1: Installation

  1. Ensure the power supply is disconnected before installation.
  2. Identify the appropriate mounting location for the IRF730A MOSFET.
  3. Securely attach the MOSFET to the desired heat sink using a 6-32 or M3 screw.
  4. Apply a thin layer of thermal grease on the flat surface between the case and the heat sink for optimal heat dissipation.

Step 2: Connection

  1. Connect the drain (D) terminal of the MOSFET to the load or circuit where the high voltage is applied.
  2. Connect the gate (G) terminal of the MOSFET to the control signal or gate driver.
  3. Connect the source (S) terminal of the MOSFET to the common ground or return path of the circuit.

Step 3: Power Supply

  1. Ensure the power supply is compatible with the specified drain-source voltage (VDS) of 400V.
  2. Make sure the gate-source voltage (VGS) is within the recommended range, typically 10V.

Step 4: Circuit Protection
Implement appropriate circuit protection measures to prevent overcurrent, overvoltage, and overheating conditions. This may include using fuses, diodes, and thermal management techniques.

Frequently Asked Questions (FAQ)

  • Q1: What is the maximum drain-source voltage for the IRF730A?
    The maximum drain-source voltage (VDS) for the IRF730A is 400V.

  • Q2: What is the drain-source on-state resistance of the IRF730A?
    The drain-source on-state resistance (RDS(on)) of the IRF730A is 1.0Ω.

  • Q3: What is the total gate charge of the IRF730A?
    The total gate charge (Qg) of the IRF730A is 22nC.

  • Q4: Can the IRF730A be used in a single configuration?
    Yes, the IRF730A is designed for single-configuration usage.

  • Q5: What are the typical applications for the IRF730A?
    The IRF730A is commonly used in typical SMPS (Switched-Mode Power Supply) topologies.

FEATURES

  • Low gate charge Qg results in simple drive requirement
  • Improved gate, avalanche, and dynamic dV/dt ruggedness
  • Fully characterized capacitance and avalanche voltage and current
  • Effective Coss specified
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note * This datasheet provides information about parts that are RoHS- compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details

APPLICATIONS

  • Switch mode power supply (SMPS)
  • Uninterruptible power supply
  • High-speed power switching

TYPICAL SMPS TOPOLOGIES

  • Single transistor flyback Xfmr. reset
  • Single transistor forward Xfmr. reset (both US line inputs only)

PRODUCT SUMMARY

PRODUCT SUMMARY

VDS (V)| 400
RDS(on) (W)| VGS = 10 V| 1.0
Qg max. (nC)| 22
Qgs (nC)| 5.8
Qgd (nC)| 9.3
Configuration| Single

ORDERING INFORMATION

Package TO-220AB
Lead (Pb)-free IRF730APbF
Lead (Pb)-free and halogen-free IRF730APbF-BE3

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage VDS 400 V
Gate-source voltage VGS ± 30
Continuous drain current VGS at 10 V TC = 25 °C ID
TC = 100 °C 3.5
Pulsed drain current a IDM 22
Linear derating factor   0.6 W/°C
Single pulse avalanche energy b EAS 290 mJ
Repetitive avalanche current a IAR 5.5 A
Repetitive avalanche energy a EAR 7.4 mJ
Maximum power dissipation TC = 25 °C PD 74
Peak diode recovery dV/dt c dV/dt 4.6 V/ns
Operating junction and storage temperature range TJ, Tstg -55 to +150 °C
Soldering recommendations (peak temperature) d For 10 s   300
Mounting torque 6-32 or M3 screw   10
1.1 N · m

Notes

  • a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
  • b. Starting TJ = 25 °C, L = 19 mH, Rg = 25 Ω, IAS = 5.5 A (see fig. 12)
  • c. ISD ≤ 5.5 A, dI/dt ≤ 90 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
  • d. 1.6 mm from case

THERMAL RESISTANCE RATINGS

PARAMETER SYMBOL TYP. MAX. UNIT
Maximum junction-to-ambient RthJC 1.70 °C/W
Case-to-sink, flat, greased surface RthCS 0.50
Maximum junction-to-case (drain) RthJA 62

SPECIFICATIONS

(TJ = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.| MAX.| UNIT
---|---|---|---|---|---|---
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 400| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.5| –| V/°C
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 2.0| –| 4.5| V
Gate-source leakage| IGSS| VGS = ± 30 V| –| –| ± 100| nA
Zero gate voltage drain current| IDSS| VDS = 400 V, VGS = 0 V| –| –| 25| μA
VDS = 320 V, VGS = 0 V, TJ = 125 °C| –| –| 250
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 3.3 A b| –| –| 1.0| W
Forward transconductance| gfs| VDS = 50 V, ID = 3.3 A| 3.1| –| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = 25 V,

f = 1.0 MHz, see fig. 5

| –| 600| –| pF
Output capacitance| Coss| –| 103| –
Reverse transfer capacitance| Crss| –| 4.0| –
Output capacitance| Coss| VGS = 0 V| VDS = 1.0 V, f = 1.0 MHz| –| 890| –
VDS = 320 V, f = 1.0 MHz| –| 30| –
Effective output capacitance| Coss eff.| VDS = 0 V to 320 V c| –| 45| –
Total gate charge| Qg| VGS = 10 V| ID = 3.5 A, VDS = 320 V

see fig. 6 and 13 b

| –| –| 22| nC
Gate-source charge| Qgs| –| –| 5.8
Gate-drain charge| Qgd| –| –| 9.3
Turn-on delay time| td(on)| VDD = 200 V, ID = 3.5 A Rg = 12 W, RD = 57 W,

see fig. 10 b

| –| 10| –| ns
Rise time| tr| –| 22| –
Turn-off delay time| td(off)| –| 20| –
Fall time| tf| –| 16| –
Gate input resistance| Rg| f = 1 MHz, open drain| 2.7| –| 10.9| W
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol showing the integral reverse p – n junction diode| –| –| 5.5| A
Pulsed diode forward current a| ISM| –| –| 22
Body diode voltage| VSD| TJ = 25 °C, IS = 5.5 A, VGS = 0 V b| –| –| 1.6| V
Body diode reverse recovery time| trr| TJ = 25 °C, IF = 3.5 A, dI/dt = 100 A/μs b| –| 370| 550| ns
Body diode reverse recovery charge| Qrr| –| 1.6| 2.4| μC
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes

  • a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
  • b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %
  • c. Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS

TYPICAL CHARACTERISTICS

VISHAY-IRF730A-Power-MOSFET- \(3\) VISHAY-IRF730A-
Power-MOSFET- \(4\) VISHAY-IRF730A-Power-MOSFET-
\(5\) VISHAY-IRF730A-Power-MOSFET- \(6\) VISHAY-IRF730A-
Power-MOSFET- \(7\) VISHAY-IRF730A-Power-MOSFET-
\(8\) VISHAY-IRF730A-Power-MOSFET- \(9\)

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91045.

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