VISHAY IRF730A Power MOSFET Owner’s Manual
- June 16, 2024
- VISHAY
Table of Contents
VISHAY IRF730A Power MOSFET
Product Information
Specifications
- Manufacturer: Vishay Siliconix
- Product Name: IRF730A
- Package Type: D TO-220AB
- Channel Type: N-Channel MOSFET
- VDS (Drain-Source Voltage): 400V
- RDS(on) (Drain-Source On-State Resistance): 1.0Ω
- Qg max. (Total Gate Charge): 22nC
- Qgs (Gate-Source Charge): 5.8nC
- Qgd (Gate-Drain Charge): 9.3nC
- Configuration: Single
Product Usage Instructions
Step 1: Installation
- Ensure the power supply is disconnected before installation.
- Identify the appropriate mounting location for the IRF730A MOSFET.
- Securely attach the MOSFET to the desired heat sink using a 6-32 or M3 screw.
- Apply a thin layer of thermal grease on the flat surface between the case and the heat sink for optimal heat dissipation.
Step 2: Connection
- Connect the drain (D) terminal of the MOSFET to the load or circuit where the high voltage is applied.
- Connect the gate (G) terminal of the MOSFET to the control signal or gate driver.
- Connect the source (S) terminal of the MOSFET to the common ground or return path of the circuit.
Step 3: Power Supply
- Ensure the power supply is compatible with the specified drain-source voltage (VDS) of 400V.
- Make sure the gate-source voltage (VGS) is within the recommended range, typically 10V.
Step 4: Circuit Protection
Implement appropriate circuit protection measures to prevent overcurrent,
overvoltage, and overheating conditions. This may include using fuses, diodes,
and thermal management techniques.
Frequently Asked Questions (FAQ)
-
Q1: What is the maximum drain-source voltage for the IRF730A?
The maximum drain-source voltage (VDS) for the IRF730A is 400V. -
Q2: What is the drain-source on-state resistance of the IRF730A?
The drain-source on-state resistance (RDS(on)) of the IRF730A is 1.0Ω. -
Q3: What is the total gate charge of the IRF730A?
The total gate charge (Qg) of the IRF730A is 22nC. -
Q4: Can the IRF730A be used in a single configuration?
Yes, the IRF730A is designed for single-configuration usage. -
Q5: What are the typical applications for the IRF730A?
The IRF730A is commonly used in typical SMPS (Switched-Mode Power Supply) topologies.
FEATURES
- Low gate charge Qg results in simple drive requirement
- Improved gate, avalanche, and dynamic dV/dt ruggedness
- Fully characterized capacitance and avalanche voltage and current
- Effective Coss specified
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Note * This datasheet provides information about parts that are RoHS- compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
APPLICATIONS
- Switch mode power supply (SMPS)
- Uninterruptible power supply
- High-speed power switching
TYPICAL SMPS TOPOLOGIES
- Single transistor flyback Xfmr. reset
- Single transistor forward Xfmr. reset (both US line inputs only)
PRODUCT SUMMARY
PRODUCT SUMMARY
VDS (V)| 400
RDS(on) (W)| VGS = 10 V| 1.0
Qg max. (nC)| 22
Qgs (nC)| 5.8
Qgd (nC)| 9.3
Configuration| Single
ORDERING INFORMATION
Package | TO-220AB |
---|---|
Lead (Pb)-free | IRF730APbF |
Lead (Pb)-free and halogen-free | IRF730APbF-BE3 |
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER | SYMBOL | LIMIT | UNIT |
---|---|---|---|
Drain-source voltage | VDS | 400 | V |
Gate-source voltage | VGS | ± 30 | |
Continuous drain current | VGS at 10 V | TC = 25 °C | ID |
TC = 100 °C | 3.5 | ||
Pulsed drain current a | IDM | 22 | |
Linear derating factor | 0.6 | W/°C | |
Single pulse avalanche energy b | EAS | 290 | mJ |
Repetitive avalanche current a | IAR | 5.5 | A |
Repetitive avalanche energy a | EAR | 7.4 | mJ |
Maximum power dissipation | TC = 25 °C | PD | 74 |
Peak diode recovery dV/dt c | dV/dt | 4.6 | V/ns |
Operating junction and storage temperature range | TJ, Tstg | -55 to +150 | °C |
Soldering recommendations (peak temperature) d | For 10 s | 300 | |
Mounting torque | 6-32 or M3 screw | 10 | |
1.1 | N · m |
Notes
- a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- b. Starting TJ = 25 °C, L = 19 mH, Rg = 25 Ω, IAS = 5.5 A (see fig. 12)
- c. ISD ≤ 5.5 A, dI/dt ≤ 90 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
- d. 1.6 mm from case
THERMAL RESISTANCE RATINGS
PARAMETER | SYMBOL | TYP. | MAX. | UNIT |
---|---|---|---|---|
Maximum junction-to-ambient | RthJC | – | 1.70 | °C/W |
Case-to-sink, flat, greased surface | RthCS | 0.50 | – | |
Maximum junction-to-case (drain) | RthJA | – | 62 |
SPECIFICATIONS
(TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
---|---|---|---|---|---|---
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 400| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.5|
–| V/°C
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 2.0| –| 4.5| V
Gate-source leakage| IGSS| VGS = ± 30 V| –| –| ± 100| nA
Zero gate voltage drain current| IDSS| VDS = 400 V, VGS = 0 V| –| –| 25| μA
VDS = 320 V, VGS = 0 V, TJ = 125 °C| –| –| 250
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 3.3 A b| –| –|
1.0| W
Forward transconductance| gfs| VDS = 50 V, ID = 3.3 A| 3.1| –| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = 25 V,
f = 1.0 MHz, see fig. 5
| –| 600| –| pF
Output capacitance| Coss| –| 103| –
Reverse transfer capacitance| Crss| –| 4.0| –
Output capacitance| Coss| VGS = 0 V| VDS = 1.0 V, f = 1.0 MHz| –| 890| –
VDS = 320 V, f = 1.0 MHz| –| 30| –
Effective output capacitance| Coss eff.| VDS = 0 V to 320 V c| –| 45| –
Total gate charge| Qg| VGS = 10 V| ID = 3.5 A, VDS = 320 V
see fig. 6 and 13 b
| –| –| 22| nC
Gate-source charge| Qgs| –| –| 5.8
Gate-drain charge| Qgd| –| –| 9.3
Turn-on delay time| td(on)| VDD = 200 V, ID = 3.5 A Rg = 12 W, RD = 57 W,
see fig. 10 b
| –| 10| –| ns
Rise time| tr| –| 22| –
Turn-off delay time| td(off)| –| 20| –
Fall time| tf| –| 16| –
Gate input resistance| Rg| f = 1 MHz, open drain| 2.7| –| 10.9| W
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol showing the integral
reverse p – n junction diode| –| –| 5.5| A
Pulsed diode forward current a| ISM| –| –| 22
Body diode voltage| VSD| TJ = 25 °C, IS = 5.5 A, VGS = 0 V b| –| –| 1.6| V
Body diode reverse recovery time| trr| TJ = 25 °C, IF = 3.5 A, dI/dt = 100
A/μs b| –| 370| 550| ns
Body diode reverse recovery charge| Qrr| –| 1.6| 2.4| μC
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is
dominated by LS and LD)
Notes
- a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %
- c. Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS
TYPICAL CHARACTERISTICS
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91045.
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References
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