VISHAY IRFP450 Power Mosfet Owner’s Manual
- June 13, 2024
- VISHAY
Table of Contents
VISHAY IRFP450 Power Mosfet
Product Information
IRFP450 – Vishay Siliconix Power MOSFET
The IRFP450 is a N-Channel MOSFET with a drain-source voltage (VDS) of 500V
and a gate-source voltage (VGS) of 10V. It is designed for high power
applications and comes in a TO-247 package.
FEATURES
- Dynamic dV/dt Rating
- Repetitive Avalanche Rated
- Isolated Central Mounting Hole
- Fast Switching
- Ease of Paralleling
- Simple Drive Requirements
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because its isolated mounting hole. It also provides greater creepage distances between pins to meet the requirements of most safety specifications.
PRODUCT SUMMARY
| VDS (V) | 500 |
|---|---|
| RDS(on) (W) | VGS = 10 V |
| Qg (Max.) (nC) | 150 |
| Qgs (nC) | 20 |
| Qgd (nC) | 80 |
| Configuration | Single |
ORDERING INFORMATION
| Package | TO-247 |
|---|---|
| Lead (Pb)-free | IRFP450PbF |
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
| PARAMETER | SYMBOL | LIMIT | UNIT |
|---|---|---|---|
| Drain-Source Voltage | VDS | 500 | V |
| Gate-Source Voltage | VGS | ± 20 | |
| Continuous Drain Current | VGS at 10 V | TC = 25 °C | ID |
| TC = 100 °C | 8.7 | ||
| Pulsed Drain Currenta | IDM | 56 | |
| Linear Derating Factor | 1.5 | W/°C | |
| Single Pulse Avalanche Energyb | EAS | 760 | mJ |
| Repetitive Avalanche Currenta | IAR | 8.7 | A |
| Repetitive Avalanche Energya | EAR | 19 | mJ |
| Maximum Power Dissipation | TC = 25 °C | PD | 190 |
| Peak Diode Recovery dV/dtc | dV/dt | 3.5 | V/ns |
| Operating Junction and Storage Temperature Range | TJ, Tstg | – 55 to + 150 | °C |
| Soldering Recommendations (Peak Temperature) | for 10 s | 300d | |
| Mounting Torque | 6-32 or M3 screw | 10 | |
| 1.1 | N · m |
Notes
Notes
- a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- b. VDD = 50 V, starting TJ = 25 °C, L = 7.0 mH, RG = 25 Ω, IAS = 14 A (see fig. 12)
- c. ISD ≤ 14 A, dI/dt ≤ 130 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
- d. 1.6 mm from case
THERMAL RESISTANCE RATINGS
| PARAMETER | SYMBOL | TYP. | MAX. | UNIT |
|---|---|---|---|---|
| Maximum Junction-to-Ambient | RthJA | – | 40 | °C/W |
| Case-to-Sink, Flat, Greased Surface | RthCS | 0.24 | – | |
| Maximum Junction-to-Case (Drain) | RthJC | – | 0.65 |
SPECIFICATIONS
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
---|---|---|---|---|---|---
Static
Drain-Source Breakdown Voltage| VDS| VGS = 0 V, ID = 250 μA| 500| –| –| V
VDS Temperature Coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.63|
–| V/°C
Gate-Source Threshold Voltage| VGS(th)| VDS = VGS, ID = 250 μA| 2.0| –| 4.0| V
Gate-Source Leakage| IGSS| VGS = ± 20 V| –| –| ± 100| nA
Zero Gate Voltage Drain Current| IDSS| VDS = 500 V, VGS = 0 V| –| –| 25| μA
VDS = 400 V, VGS = 0 V, TJ = 125 °C| –| –| 250
Drain-Source On-State Resistance| RDS(on)| VGS = 10 V| ID = 8.4 Ab| –| –|
0.40| W
Forward Transconductance| gfs| VDS = 50 V, ID = 8.4 Ab| 9.3| –| –| S
Dynamic
Input Capacitance| Ciss| VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5| –|
2600| –| pF
Output Capacitance| Coss| –| 720| –
Reverse Transfer Capacitance| Crss| –| 340| –
Total Gate Charge| Qg| VGS = 10 V| ID = 14 A, VDS = 400 V, see fig. 6 and 13b|
–| –| 150| nC
Gate-Source Charge| Qgs| –| –| 20
Gate-Drain Charge| Qgd| –| –| 80
Turn-On Delay Time| td(on)| VDD = 250 V, ID = 14 A,
RG = 6.2 W, RD = 17 W, see fig. 10b
| –| 17| –| ns
Rise Time| tr| –| 47| –
Turn-Off Delay Time| td(off)| –| 92| –
Fall Time| tf| –| 44| –
Internal Drain Inductance| LD| Between lead, 6 mm (0.25″) from package and
center of die contact| –| 5.0| –| nH
Internal Source Inductance| LS| –| 13| –
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current| IS| MOSFET symbol showing the integral
reverse p – n junction diode| –| –| 14| A
Pulsed Diode Forward Currenta| ISM| –| –| 56
Body Diode Voltage| VSD| TJ = 25 °C, IS = 14 A, VGS = 0 Vb| –| –| 1.4| V
Body Diode Reverse Recovery Time| trr| TJ = 25 °C, IF = 14 A, dI/dt = 100
A/μsb| –| 540| 810| ns
Body Diode Reverse Recovery Charge| Qrr| –| 4.8| 7.2| μC
Forward Turn-On Time| ton| Intrinsic turn-on time is negligible (turn-on is
dominated by LS and LD)
Notes
- a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %
TYPICAL CHARACTERISTICS
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91233.
Package Information
TO-247AC (High Voltage)
- VERSION 1: FACILITY CODE = 9
**
| MILLIMETERS|
---|---|---
DIM.| MIN.| NOM.| MAX.| NOTES
A| 4.83| 5.02| 5.21|
A1| 2.29| 2.41| 2.55|
A2| 1.17| 1.27| 1.37|
b| 1.12| 1.20| 1.33|
b1| 1.12| 1.20| 1.28|
b2| 1.91| 2.00| 2.39| 6
b3| 1.91| 2.00| 2.34|
b4| 2.87| 3.00| 3.22| 6, 8
b5| 2.87| 3.00| 3.18|
c| 0.40| 0.50| 0.60| 6
c1| 0.40| 0.50| 0.56|
D| 20.40| 20.55| 20.70| 4
| MILLIMETERS|
---|---|---
DIM.| MIN.| NOM.| MAX.| NOTES**
D1| 16.46| 16.76| 17.06| 5
D2| 0.56| 0.66| 0.76|
E| 15.50| 15.70| 15.87| 4
E1| 13.46| 14.02| 14.16| 5
E2| 4.52| 4.91| 5.49| 3
e| 5.46 BSC|
L| 14.90| 15.15| 15.40|
L1| 3.96| 4.06| 4.16| 6
Ø P| 3.56| 3.61| 3.65| 7
Ø P1| 7.19 ref.|
Q| 5.31| 5.50| 5.69|
S| 5.51 BSC|
Notes
1. Package reference: JEDEC® TO247, variation AC
2. All dimensions are in mm
3. Slot required, notch may be rounded
4. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body
5. Thermal pad contour optional with dimensions D1 and E1
6. Lead finish uncontrolled in L1
7. Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
8. Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimension at maximum material condition- VERSION 2: FACILITY CODE = Y
**
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
A| 4.58| 5.31|
A1| 2.21| 2.59|
A2| 1.17| 2.49|
b| 0.99| 1.40|
b1| 0.99| 1.35|
b2| 1.53| 2.39|
b3| 1.65| 2.37|
b4| 2.42| 3.43|
b5| 2.59| 3.38|
c| 0.38| 0.86|
c1| 0.38| 0.76|
D| 19.71| 20.82|
D1| 13.08| –|
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES**
D2| 0.51| 1.30|
E| 15.29| 15.87|
E1| 13.72| –|
e| 5.46 BSC|
Ø k| 0.254|
L| 14.20| 16.25|
L1| 3.71| 4.29|
Ø P| 3.51| 3.66|
Ø P1| –| 7.39|
Q| 5.31| 5.69|
R| 4.52| 5.49|
S| 5.51 BSC|
| |
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994
2. Contour of slot optional
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
4. Thermal pad contour optional with dimensions D1 and E1
5. Lead finish uncontrolled in L1
6. Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
7. Outline conforms to JEDEC outline TO-247 with exception of dimension c- VERSION 3: FACILITY CODE = N
**
| MILLIMETERS| | | MILLIMETERS
---|---|---|---|---
DIM.| MIN.| MAX.| DIM.| MIN.| MAX.**
A| 4.65| 5.31| D2| 0.51| 1.35
A1| 2.21| 2.59| E| 15.29| 15.87
A2| 1.17| 1.37| E1| 13.46| –
b| 0.99| 1.40| e| 5.46 BSC
b1| 0.99| 1.35| k| 0.254
b2| 1.65| 2.39| L| 14.20| 16.10
b3| 1.65| 2.34| L1| 3.71| 4.29
b4| 2.59| 3.43| N| 7.62 BSC
b5| 2.59| 3.38| P| 3.56| 3.66
c| 0.38| 0.89| P1| –| 7.39
c1| 0.38| 0.84| Q| 5.31| 5.69
D| 19.71| 20.70| R| 4.52| 5.49
D1| 13.08| –| S| 5.51 BSC
ECN: E22-0452-Rev. G, 31-Oct-2022 DWG: 5971
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994
2. Contour of slot optional
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
4. Thermal pad contour optional with dimensions D1 and E1
5. Lead finish uncontrolled in L1
6. Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)Disclaimer
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