VISHAY IRFP340 Power MOSFET Owner’s Manual
- June 3, 2024
- VISHAY
Table of Contents
IRFP340 Power MOSFET
Owner’s Manual
IRFP340 Power MOSFET
PRODUCT SUMMARY
VDS (V)| 400
RDS(on) (L)| VGS = 10 V| 0.55
Qg (max.) (nC)| 62
Qgs (nC)| 10
Qgd (nC)| 30
Configuration| Single
FEATURES
- Dynamic dV/dt rating
- Repetitive avalanche rated
- Isolated central mounting hole
- Fast switching
- Ease of paralleling
- Simple drive requirements
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Available
Note
- This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details.
DESCRIPTION
Third-generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance, and cost-effectiveness. The TO-247AC package is preferred for commercial- industrial applications where higher power levels preclude the use of TO-220AB devices. The TO-247AC is similar to but superior to the earlier TO-218 package because its isolated mounting hole. It also provides greater creepage distances between pins to meet the requirements of most safety specifications.
ORDERING INFORMATION
Package| TO-247AC
Lead (Pb)-free| IRFP340PbF
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| LIMIT| UNIT
Drain-source voltage| VDS| 400| V
Gate-source voltage| VGS| ± 20
Continuous drain current| VGS at 10 V| TC = 25 °C| ID| 11| A
TC = 100 °C| 6.9
Pulsed drain Current a| IDM| 44
Linear derating factor| | 1.2| W/°C
Single pulse avalanche energy b| EAS| 480| mJ
Repetitive avalanche current a| IAR| 11| A
Repetitive avalanche energy a| EAR| 15| mJ
Maximum power dissipation| TC = 25 °C| PD| 150| W
Peak diode recovery dV/dt c| dV/dt| 4.0| V/ns
Operating junction and storage temperature range| TJ, Tstg| -55 to +150| °C
Soldering recommendations (peak temperature) d| for 10 s| | 300d
Mounting torque| 6-32 or M3 screw| | 10| lbf · in
1.1| N · m
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see
fig. 11)
b. VDD = 50 V, starting TJ = 25 °C, L = 6.9 mH, Rg = 25 Ω, IAS = 11 A (see
fig. 12)
c. ISD ≤ 11 A, dI/dt ≤ 120 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
THERMAL RESISTANCE RATINGS
PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum junction-to-ambient| that| –| 40| °C/W
Case-to-sink, flat, greased surface| RCS| 0.24| –
Maximum junction-to-case (drain)| RthJC| –| 0.83
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 400| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.49|
–| V/°C
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 2.0| –| 4.0| V
Gate-source leakage| IGSS| VGS = ± 20 V| –| –| ± 100| nA
Zero gate voltage drain current| IDSS| VDS = 400 V, VGS = 0 V| –| –| 25| μA
VDS = 320 V, VGS = 0 V, TJ = 125 °C| –| –| 250
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 6.6 A b| –| –|
0.55| L
Forward transconductance| gfs| VDS = 50 V, ID = 6.6 A b| 7.7| –| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5| –|
1400| –| pF
Output capacitance| Coss| –| 400| –
Reverse transfer capacitance| Crss| –| 130| –
Total Gate charge| Qg| VGS = 10 V| ID = 10 A, VDS = 320 V, see fig. 6 and 13
b| –| –| 62| nC
Gate-source charge| Qgs| –| –| 10
Gate-drain charge| Qgd| –| –| 30
Turn-on delay time| td(on)| VDD = 200 V, ID = 10 A , Rg = 9.1 L, RD = 20 L,
see fig. 10 b| –| 14| –| ns
Rise time| tr| –| 27| –
Turn-off delay time| td(off)| –| 50| –
Fall time| tf| –| 24| –
Internal drain inductance| LD| Between lead, 6 mm (0.25″) from the package and
center of dying contact| –| 5.0| –| NH
Internal source inductance| LS| –| 13| –
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol showing the integral
reverse p – n junction diode| –| –| 11| A
Pulsed diode forward current a| ISM| –| –| 44
Body diode voltage| VSD| TJ = 25 °C, IS = 11 A, VGS = 0 V b| –| –| 2.0| V
Body diode reverse recovery time| trr| TJ = 25 °C, IF = 10 A, dI/dt = 100 A/μs
b| –| 330| 660| ns
Body diode reverse recovery charge| Qrr| –| 2.5| 5.9| μC
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is
dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see
fig. 11)
b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
| 
---|---
| 
Vishay Siliconix maintains worldwide manufacturing capability. Products may be
manufactured at one of several qualified locations. Reliability data for
Silicon Technology and Package Reliability represent a composite of all
qualified locations. For related documents such as package/tape drawings, part
marking, and reliability data, see
www.vishay.com/ppg?91222
TO-247AC (High Voltage)
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
A| 4.83| 5.21|
A1| 2.29| 2.55|
A2| 1.50| 2.49|
b| 1.12| 1.33|
b1| 1.12| 1.28|
b2| 1.91| 2.39| 6
b3| 1.91| 2.34|
b4| 2.87| 3.22| 6, 8
b5| 2.87| 3.18|
c| 0.55| 0.69| 6
c1| 0.55| 0.65|
D| 20.40| 20.70| 4
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
D1| 16.25| 16.85| 5
D2| 0.56| 0.76|
E| 15.50| 15.87| 4
E1| 13.46| 14.16| 5
E2| 4.52| 5.49| 3
e| 5.44 BSC|
L| 14.90| 15.40|
L1| 3.96| 4.16| 6
Ø P| 3.56| 3.65| 7
Ø P1| 7.19 ref.|
Q| 5.31| 5.69|
S| 5.54| 5.74|
Notes
- Package reference: JEDEC® TO247, variation AC
- All dimensions are in mm
- Slot required, notch may be rounded
- Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
- Dimensions b2 and b4 do not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimensions at the maximum material condition.
VERSION 2: FACILITY CODE = Y
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
A| 4.58| 5.31|
A1| 2.21| 2.59|
A2| 1.17| 2.49|
b| 0.99| 1.40|
b1| 0.99| 1.35|
b2| 1.53| 2.39|
b3| 1.65| 2.37|
b4| 2.42| 3.43|
b5| 2.59| 3.38|
c| 0.38| 0.86|
c1| 0.38| 0.76|
D| 19.71| 20.82|
D1| 13.08| –|
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
D2| 0.51| 1.30|
E| 15.29| 15.87|
E1| 13.72| –|
e| 5.46 BSC|
Ø k| 0.254|
L| 14.20| 16.25|
L1| 3.71| 4.29|
Ø P| 3.51| 3.66|
Ø P1| –| 7.39|
Q| 5.31| 5.69|
R| 4.52| 5.49|
S| 5.51 BSC|
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- The contour of slot optional
- Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
- Outline conforms to JEDEC outline TO-247 with exception of dimension c
VERSION 3: FACILITY CODE = N
| MILLIMETERS
---|---
DIM.| MIN.| MAX.
A| 4.65| 5.31
A1| 2.21| 2.59
A2| 1.17| 1.37
b| 0.99| 1.40
b1| 0.99| 1.35
b2| 1.65| 2.39
b3| 1.65| 2.34
b4| 2.59| 3.43
b5| 2.59| 3.38
c| 0.38| 0.89
c1| 0.38| 0.84
D| 19.71| 20.70
D1| 13.08| –
| MILLIMETERS
---|---
MIN.| DIM.| MAX.
0.51| D2| 1.35
15.29| E| 15.87
13.46| E1| –
5.46 BSC| e
0.254| k
14.20| L| 16.10
3.71| L1| 4.29
7.62 BSC| N
3.56| P| 3.66
–| P1| 7.39
5.31| Q| 5.69
4.52| R| 5.49
5.51 BSC| S
ECN: E20-0545-Rev. F, 19-Oct-2020 DWG: 5971
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- The contour of the slot optional
- Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
Disclaimer
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Revision: 01-Jan-2022
Document Number: 91000
References
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