VISHAY IRFP27N60KPBF Power MOSFET Owner’s Manual
- June 1, 2024
- VISHAY
Table of Contents
VISHAY IRFP27N60KPBF Power MOSFET
Product Information
Specifications
- Brand : Vishay Siliconix
- Model : IRFP27N60K
- Type : Power MOSFET
- Package : TO-247AC
- Channel Type : N-Channel
- Drain-Source Voltage (VDS) : 600V
- Gate-Source Voltage (VGS): 10V
- On-State Resistance (RDS(on)): 0.18Ω
- Maximum Gate Charge (Qg): 86nC
Features
- RoHS-compliant
- Single configuration
Thermal Resistance Ratings
- Junction-to-Ambient: Max. 40°C/W
- Case-to-Sink: Typ. 0.24°C/W, Max. 0.29°C/W
- Junction-to-Case: Max. 40°C/W
Applications
This Power MOSFET can be used in various applications requiring high power
handling capabilities.
Ordering Information
Package Lead (Pb)-free: TO-247AC IRFP27N60KPbF
Product Usage Instructions
Installation
- Ensure the mounting surface is clean and flat.
- Use a 6-32 or M3 screw to securely mount the MOSFET.
- Apply proper torque as specified for mounting.
Operating Conditions
Operate within the specified junction temperature range of -55 to +150°C.
Maintenance
Avoid exceeding the maximum ratings to prevent damage to the MOSFET.
FEATURES
- Low gate charge Qg results in simple drive requirement
- Improved gate, avalanche and dynamic dV/dt ruggedness
- Fully characterized capacitance and avalanche voltage and current
- Enhanced body diode dV/dt capability
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
PRODUCT SUMMARY
VDS (V)| 600
RDS(on) (Ù)| VGS = 10 V| 0.18
Qg (max.) (nC)| 180
Qgs (nC)| 56
Qgd (nC)| 86
Configuration| Single
Note
This datasheet provides information about parts that are RoHS-compliant and/or
parts that are non-RoHS-compliant. For example, parts with lead (Pb)
terminations are not RoHS-compliant. Please see the information/tables in this
datasheet for details
APPLICATIONS
- Hard switching primary or PFC switch
- Switch mode power supply (SMPS)
- Uninterruptible power supply
- High speed power switching
- Motor drive
ORDERING INFORMATION
Package| TO-247AC
Lead (Pb)-free| IRFP27N60KPbF
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| LIMIT| UNIT
Drain-source voltage| VDS| 600| V
Gate-source voltage| VGS| ± 30
Continuous drain current| VGS at 10 V| TC = 25 °C| ID| 27|
A
TC = 100 °C| 18
Pulsed drain Current a| IDM| 110
Linear derating Factor| | 4.0| W/°C
Single pulse avalanche energy b| EAS| 530| mJ
Repetitive avalanche current a| IAR| 27| A
Repetitive avalanche energy a| EAR| 50| mJ
Maximum power dissipation| TC = 25 °C| PD| 500| W
Peak diode recovery dV/dt c| dV/dt| 13| V/ns
Operating junction and storage temperature range| TJ, Tstg| -55 to +150| °C
Soldering recommendations (peak temperature) d| for 10 s| | 300d
Mounting torque| 6-32 or M3 screw| | 10| lbf · in
1.1| N · m
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- Starting TJ = 25 °C, L = 1.4 mH, Rg = 25 Ω, IAS = 27 A, dV/dt = 13 V/ns (see fig. 12)
- ISD ≤ 27 A, dI/dt ≤ 390 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
- 1.6 mm from case
THERMAL RESISTANCE RATINGS
PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum junction-to-ambient| RthJA| –| 40|
°C/W
Case-to-sink, flat, greased surface| RthCS| 0.24| –
Maximum junction-to-case (drain)| RthJC| –| 0.29
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 600| –| –| V
VDS temperature coefficient| ÄVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 640|
–| mV/°C
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 3.0| –| 5.0| V
Gate-source leakage| IGSS| VGS = ± 30 V| –| –| ± 100| nA
Zero gate voltage drain current| IDSS| VDS = 600 V, VGS = 0 V| –| –| 50| μA
VDS = 480 V, VGS = 0 V, TJ = 125 °C| –| –| 250
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 16 A b| –| 0.18|
0.22| Ù
Forward transconductance| gfs| VDS = 50 V, ID = 16 A| 14| –| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V VDS = 25 V
f = 1.0 MHz, see fig. 5
| –| 4660| –|
pF
Output capacitance| Coss| –| 460| –
Reverse transfer capacitance| Crss| –| 41| –
Output capacitance| Coss| VGS = 0 V| VDS = 1.0 V, f = 1.0 MHz| –| 5490| –
VGS = 0 V| VDS = 480 V, f = 1.0 MHz| –| 120| –
Effective output capacitance| Coss eff.| VGS = 0 V| VDS = 0 V to 480 V| –|
250| –
Total gate charge| Qg|
VGS = 10 V
|
ID = 27 A, VDS = 480 V
see fig. 6 and 13 b
| –| –| 180|
nC
Gate-source charge| Qgs| –| –| 56
Gate-drain charge| Qgd| –| –| 86
Turn-on delay time| td(on)|
VDD = 300 V, ID = 27 A
Rg = 4.3 Ù, VGS = 10 V, see fig. 10 b
| –| 27| –|
ns
Rise time| tr| –| 110| –
Turn-off delay time| td(off)| –| 43| –
Fall time| tf| –| 38| –
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol
D
showing the
integral reverse G
p – n junction diode S
| –| –| 27|
A
Pulsed diode forward current a| ISM|
–
|
–
|
110
Body diode voltage| VSD| TJ = 25 °C, IS = 27 A, VGS = 0 V b| –| –| 1.5| V
Body diode reverse recovery time| trr|
TJ = 25 °C, IF = 27 A, dI/dt = 100 A/μs b
| –| 620| 920| ns
Body diode reverse recovery charge| Qrr| –| 11| 16| μC
Reverse recovery current| IRRM| –| 36| 53| A
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is
dominated by LS and LD)
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- Pulse width ≤ 300 μs; duty cycle ≤ 2 %
- Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80% VDS
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
TO-247AC (High Voltage)
VERSION 1: FACILITY CODE = 9
| MILLIMETERS|
---|---|---
DIM.| MIN.| NOM.| MAX.| NOTES
A| 4.83| 5.02| 5.21|
A1| 2.29| 2.41| 2.55|
A2| 1.17| 1.27| 1.37|
b| 1.12| 1.20| 1.33|
b1| 1.12| 1.20| 1.28|
b2| 1.91| 2.00| 2.39| 6
b3| 1.91| 2.00| 2.34|
b4| 2.87| 3.00| 3.22| 6, 8
b5| 2.87| 3.00| 3.18|
c| 0.40| 0.50| 0.60| 6
c1| 0.40| 0.50| 0.56|
D| 20.40| 20.55| 20.70| 4
| MILLIMETERS|
---|---|---
DIM.| MIN.| NOM.| MAX.| NOTES
D1| 16.46| 16.76| 17.06| 5
D2| 0.56| 0.66| 0.76|
E| 15.50| 15.70| 15.87| 4
E1| 13.46| 14.02| 14.16| 5
E2| 4.52| 4.91| 5.49| 3
e| 5.46 BSC|
L| 14.90| 15.15| 15.40|
L1| 3.96| 4.06| 4.16| 6
Ø P| 3.56| 3.61| 3.65| 7
Ø P1| 7.19 ref.|
Q| 5.31| 5.50| 5.69|
S| 5.51 BSC|
Notes
- Package reference: JEDEC TO247, variation AC
- All dimensions are in mm
- Slot required, notch may be rounded
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
- Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimension at maximum material condition
VERSION 2: FACILITY CODE = Y
Lead Assignments
- Gate
- Drain
- Source
- Drain
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
A| 4.58| 5.31|
A1| 2.21| 2.59|
A2| 1.17| 2.49|
b| 0.99| 1.40|
b1| 0.99| 1.35|
b2| 1.53| 2.39|
b3| 1.65| 2.37|
b4| 2.42| 3.43|
b5| 2.59| 3.38|
c| 0.38| 0.86|
c1| 0.38| 0.76|
D| 19.71| 20.82|
D1| 13.08| –|
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
D2| 0.51| 1.30|
E| 15.29| 15.87|
E1| 13.72| –|
e| 5.46 BSC|
Ø k| 0.254|
L| 14.20| 16.25|
L1| 3.71| 4.29|
Ø P| 3.51| 3.66|
Ø P1| –| 7.39|
Q| 5.31| 5.69|
R| 4.52| 5.49|
S| 5.51 BSC|
| |
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- Contour of slot optional
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
- Outline conforms to JEDEC outline TO-247 with exception of dimension c
VERSION 3: FACILITY CODE = N
MILLIMETERS | MILLIMETERS | |||
---|---|---|---|---|
DIM. | MIN. | MAX. | DIM. | MIN. |
A | 4.65 | 5.31 | D2 | 0.51 |
A1 | 2.21 | 2.59 | E | 15.29 |
A2 | 1.17 | 1.37 | E1 | 13.46 |
b | 0.99 | 1.40 | e | 5.46 BSC |
b1 | 0.99 | 1.35 | k | 0.254 |
b2 | 1.65 | 2.39 | L | 14.20 |
b3 | 1.65 | 2.34 | L1 | 3.71 |
b4 | 2.59 | 3.43 | N | 7.62 BSC |
b5 | 2.59 | 3.38 | P | 3.56 |
c | 0.38 | 0.89 | P1 | – |
c1 | 0.38 | 0.84 | Q | 5.31 |
D | 19.71 | 20.70 | R | 4.52 |
D1 | 13.08 | – | S | 5.51 BSC |
ECN: E22-0452-Rev. G, 31-Oct-2022 DWG: 5971
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- Contour of slot optional
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
Disclaimer
- ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
- Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.
- Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims
- any and all liability arising out of the application or use of any product,
- any and all liability, including without limitation special, consequential or incidental damages, and
- any and all implied warranties, including warranties of fitness for a particular purpose, non-infringement and merchantability.
- Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.
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For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED
HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
FAQ
Q: Is this MOSFET RoHS-compliant?
A: Yes, this datasheet provides information about parts that are RoHS-
compliant.
Q: What is the maximum drain-source voltage of this MOSFET?
A: The maximum drain-source voltage is 600V.
References
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