VISHAY IRF9Z34PBF Power MOSFET User Manual
- June 16, 2024
- VISHAY
Table of Contents
VISHAY IRF9Z34PBF Power MOSFET
Product Information
Specifications
- Manufacturer: Vishay Siliconix
- Product Name: IRF9Z34
- Package Type: TO-220AB
- Configuration: P-Channel MOSFET
- Drain-Source Voltage (VDS): -60 V
- On-Resistance (RDS(on)): 9.9 Ω
- Gate Charge (Qg max.): 16 nC
- Gate-Source Charge (Qgs): 0.14 nC
- Gate-Drain Charge (Qgd): 5.9 nC
Description
The IRF9Z34 is a third-generation power MOSFET from Vishay Siliconix. It
offers fast switching, ruggedized device design, low on-resistance, and cost-
effectiveness. The TO-220AB package is widely preferred for commercial-
industrial applications with power dissipation levels up to approximately 50
W. The package has low thermal resistance and is cost-effective, making it
widely accepted in the industry.
Ordering Information
Package | Lead (Pb)-free | Lead (Pb)-free and halogen-free |
---|---|---|
TO-220AB | IRF9Z34PbF | IRF9Z34PbF-BE3 |
Thermal Resistance Ratings
Parameter | Symbol | TYP. | MAX. |
---|---|---|---|
Maximum junction-to-ambient | RthJA | – | 62 |
Case-to-sink, flat, greased surface | RthCS | 0.50 | 1.7 |
Maximum junction-to-case (drain) | RthJC | – | – |
Product Usage Instructions
Installation
To install the IRF9Z34 Power MOSFET, follow these steps:
- Select an appropriate heat sink for the TO-220AB package.
- Ensure the mounting surface is clean and free from debris.
- Apply a thin layer of thermal grease to the case of the MOSFET.
- Screw the MOSFET onto the heat sink using a 6-32 or M3 screw with the specified mounting torque.
Electrical Connections
Make the following electrical connections:
- Connect the drain (D) pin of the MOSFET to the load or circuit ground.
- Connect the source (S) pin of the MOSFET to the power supply ground.
- Connect the gate (G) pin of the MOSFET to the gate driver circuit.
Operating Conditions
The IRF9Z34 operates within the following conditions:
- Operating Junction Temperature (TJ): -55°C to +175°C
- Storage Temperature (Tstg): -55°C to +175°C
- Soldering Recommendations (peak temperature): 300°C for 10 seconds
Frequently Asked Questions (FAQ)
-
Q: What is the maximum drain-source voltage (VDS) of the IRF9Z34?
A: The maximum drain-source voltage is -60V. -
Q: Is the IRF9Z34 RoHS compliant?
A: The datasheet provides information about RoHS-compliant and non-RoHS- compliant parts. Parts with lead (Pb) terminations are not RoHS-compliant. Please refer to the information in the datasheet for specific details. -
Q: What is the on-resistance (RDS(on)) of the IRF9Z34?
A: The on-resistance is 9.9 Ω.
FEATURES
- Dynamic dV/dt rating
- Repetitive avalanche rated
- P-channel
- 175 °C operating temperature
- Fast switching
- Ease of paralleling
- Simple drive requirements
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Note
- This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
DESCRIPTION
Third-generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220AB package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO- 220AB contribute to its wide acceptance throughout the industry.
PRODUCT SUMMARY
VDS (V) | -60 |
---|---|
RDS(on) (W) | VGS = -10 V |
Qg max. (nC) | 34 |
Qgs (nC) | 9.9 |
Qgd (nC) | 16 |
Configuration | Single |
ORDERING INFORMATION
Package | TO-220AB |
---|---|
Lead (Pb)-free | IRF9Z34PbF |
Lead (Pb)-free and halogen-free | IRF9Z34PbF-BE3 |
ABSOLUTE MAXIMUM RATINGS
(TC = 25 °C, unless otherwise noted)
PARAMETER | SYMBOL | LIMIT | UNIT |
---|---|---|---|
Drain-source voltage | VDS | -60 | V |
Gate-source voltage | VGS | ± 20 | |
Continuous drain current | VGS at 10 V | TC = 25 °C | ID |
TC = 100 °C | -13 | ||
Pulsed drain current a | IDM | -72 | |
Linear derating factor | 0.59 | W/°C | |
Single pulse avalanche energy b | EAS | 370 | mJ |
Repetitive avalanche current a | IAR | -18 | A |
Repetitive avalanche energy a | EAR | 8.8 | mJ |
Maximum power dissipation | TC = 25 °C | PD | 88 |
Peak diode recovery dV/dt c | dV/dt | -4.5 | V/ns |
Operating junction and storage temperature range | TJ, Tstg | -55 to +175 | °C |
Soldering recommendations (peak temperature) d | For 10 s | 300 | |
Mounting torque | 6-32 or M3 screw | 10 | |
1.1 | N · m |
Notes
- a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
- b. VDD = -25 V, starting TJ = 25 °C, L = 1.3 mH, Rg = 25 Ω, IAS = -18 A (see fig. 12).
- c. ISD ≤ -18 A, dI/dt ≤ 170 A/μs, VDD ≤ VDS, TJ ≤ 175 °C.
- d. 1.6 mm from case.
THERMAL RESISTANCE RATINGS
PARAMETER | SYMBOL | TYP. | MAX. | UNIT |
---|---|---|---|---|
Maximum junction-to-ambient | RthJA | – | 62 | °C/W |
Case-to-sink, flat, greased surface | RthCS | 0.50 | – | |
Maximum junction-to-case (drain) | RthJC | – | 1.7 |
SPECIFICATIONS
(TJ = 25 °C, unless otherwise noted)
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = -250 μA| -60| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = -1 mA| –|
-0.060| –| V/°C
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| -2.0| –| -4.0|
V
Gate-source leakage| IGSS| VGS = ± 20 V| –| –| ± 100| nA
Zero gate voltage drain current| IDSS| VDS = -60 V, VGS = 0 V| –| –| -100| μA
VDS = -48 V, VGS = 0 V, TJ = 150 °C| –| –| -500
Drain-source on-state resistance| RDS(on)| VGS = -10 V| ID = -11 A b| –| –|
0.14| W
Forward transconductance| gfs| VDS = -25 V, ID = -11 A b| 5.9| –| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = -25 V,
f = 1.0 MHz, see fig. 5
| –| 1100| –| pF
Output capacitance| Coss| –| 620| –
Reverse transfer capacitance| Crss| –| 100| –
Total gate charge| Qg| VGS = -10 V| ID = -1 8 A, VDS = -48 V,
see fig. 6 and 13 b
| –| –| 34| nC
Gate-source charge| Qgs| –| –| 9.9
Gate-drain charge| Qgd| –| –| 16
Turn-on delay time| td(on)| VDD = -30 V, ID = -18 A,
Rg = 12 W, RD = 1.5 W, see fig. 10 b
| –| 18| –| ns
Rise time| tr| –| 120| –
Turn-off delay time| td(off)| –| 20| –
Fall time| tf| –| 58| –
Gate input resistance| LD| Between lead, 6 mm (0.25″) from package and center
of die contact| –| 4.5| –| nH
Internal drain inductance| LS| –| 7.5| –
Internal source inductance| Rg| f = 1 MHz, open drain| 0.7| –| 3.9| W
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol showing the integral
reverse p -n junction diode| –| –| -18| A
Pulsed diode forward current a| ISM| –| –| -72
Body diode voltage| VSD| TJ = 25 °C, IS = -18 A, VGS = 0 V b| –| –| -6.3| V
Body diode reverse recovery time| trr| TJ = 25 °C, IF = -18 A, dI/dt = 100
A/μs b| –| 100| 200| ns
Body diode reverse recovery charge| Qrr| –| 0.28| 0.52| μC
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is
dominated by LS and LD)
Notes
- a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?91092.
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References
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