VISHAY IRFP460LC Power MOSFET Owner’s Manual

: June 13, 2024
: VISHAY

Table of Contents

Power MOSFET
References
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VISHAY IRFP460LC Power MOSFET

Power MOSFET

FEATURES

Ultra low gate charge
Reduced gate drive requirement
Enhanced 30 V VGS rating
Reduced Ciss, Coss, Crss
Isolated central mounting hole
Dynamic dV/dt rating
Repetitive avalanche rated
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912

PRODUCT SUMMARY

Note

This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information tables in this datasheet for details

DESCRIPTION
This new series of low charge Power MOSFETs achieve significantly lower gate charge over conventional MOSFETs.
Utilizing advanced Power MOSFETs technology the device improvements allow for reduced gate drive requirements, faster switching speeds and increased total system savings.
These device improvements combined with the proven ruggedness and reliability of Power MOSFETs offer the designer a new standard in power transistors for switchingapplications.
The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because its isolated mounting hole.

ORDERING INFORMATION

Package| TO-247
Lead (Pb)-free| IRFP460LCPbF
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted

PARAMETER| SYMBOL| LIMIT| UNIT
Drain-source voltage| VDS| 500| V
Gate-source voltage| VGS| ± 30
Continuous drain current| VGS at 10 V| TC = 25 °C| ID| 20| A
TC = 100 °C| 12
Pulsed drain current a| IDM| 80
Linear derating Factor| | 2.2| W/°C
Single pulse avalanche energy b| EAS| 960| mJ
Repetitive avalanche currenta| IAR| 20| A
Repetitive avalanche energya| EAR| 28| mJ
Maximum power dissipation| TC = 25 °C| PD| 280| W
Peak diode recovery dV/dtc| dV/dt| 3.5| V/ns
Operating junction and storage temperature range| TJ, Tstg| -55 to +150| °C
Soldering recommendations (peak temperature)| for 10 s| | 300 d
Mounting torque| 6-32 or M3 screw| | 10| lbf · in
1.1| N · m

Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 4.3 mH, RG = 25 Ω, IAS = 20 A (see fig. 12)
c. ISD ≤ 20 A, dI/dt ≤ 160 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case

THERMAL RESISTANCE RATINGS

PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum junction-to-ambient| RthJA| –| –| °C/W
Case-to-sink, flat, greased surface| RthCS| 0.24| –
Maximum junction-to-case (Drain)| RthJC| –| 0.45
SPECIFICATIONS TJ = 25 °C, unless otherwise noted|
---|---
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.| MAX.| UNIT|
Static|
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 500| –| –| V|
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.59| –| V/°C|
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 2.0| –| 4.0| V|
Gate-source leakage| IGSS| VGS = ± 20 V| –| –| ± 100| nA|
Zero gate voltage drain current| IDSS| VDS = 500 V, VGS = 0 V| –| –| 25| μA|
VDS = 400 V, VGS = 0 V, TJ = 125 °C| –| –| 250
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 12 A b| –| –| 0.27| W|
Forward transconductance| gfs| VDS = 50 V, ID = 12 A b| 12| –| –| S|
Dynamic|
Input capacitance| Ciss| VGS = 0 V, VDS = 25 V,

f = 1.0 MHz, see fig. 5

| –| 3600| –| pF|
Output capacitance| Coss| –| 440| –
Reverse transfer capacitance| Crss| –| 39| –
Total gate charge| Qg| VGS = 10 V| ID = 20 A, VDS = 400 V,

see fig. 6 and 13 b

| –| –| 120| nC|
Gate-source charge| Qgs| –| –| 32
Gate-drain charge| Qgd| –| –| 49
Turn-on delay time| td(on)| VDD = 250 V, ID = 20 A

RG = 4.3 W, RD = 12 W, see fig. 10 b

| –| 18| –| ns|
Rise time| tr| –| 77| –
Turn-off delay time| td(off)| –| 40| –
Fall time| tf| –| 43| –
Internal drain inductance| LD| | | DS| | –| 5.0| –| |
Between lead,6 mm (0.25″) from package and center of die contact | G| nH|
Internal source inductance| LS| –| 13| –
Drain-Source Body Diode Characteristics|
Continuous source-drain diode current| IS| | | | DS| –| –| 20| |
MOSFET symbol showing the integral reverse p – n junction diode | G| A|
Pulsed diode forward current a| IS| –| –| 80
Body diode voltage| VSD| TJ = 25 °C, IS = 20 A, VGS = 0 V b| –| –| 1.8| V|
Body diode reverse recovery time| trr| TJ = 25 °C, IF = 20 A, dI/dt = 100 A/μs b| –| 570| 860| ns|
Body diode reverse recovery charge| Qrr| –| 6.6| 9.9| μC|
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)|

TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

Fig. 1 – Typical Output Characteristics, TC = 25 °C

Fig. 2 – Typical Output Characteristics, TC = 150 °C

Fig. 3 – Typical Transfer Characteristics

Fig. 4 – Normalized On-Resistance vs. Temperature

Fig. 5 – Typical Capacitance vs. Drain-to-Source Voltage

Fig. 6 – Typical Gate Charge vs. Gate-to-Source Voltage

Fig. 7 – Typical Source-Drain Diode Forward Voltage

Fig. 8 – Maximum Safe Operating Area

Fig. 9 – Maximum Drain Current vs. Case Temperature

Fig. 10 – Switching Time Test Circuit

Fig. 11 – Switching Time Waveforms

Fig. 12 – Maximum Effective Transient Thermal Impedance, Junction-to-Case

Fig. 13 – Unclamped Inductive Test Circuit

Fig. 14 – Unclamped Inductive Waveforms

Fig. 15 – Maximum Avalanche Energy vs. Drain Current

Fig. 16 – Basic Gate Charge Waveform

Fig. 17 – Gate Charge Test Circuit

TO-247AC (High Voltage)

VERSION 1: FACILITY CODE = 9

| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
A| 4.83| 5.21|
A1| 2.29| 2.55|
A2| 1.50| 2.49|
b| 1.12| 1.33|
b1| 1.12| 1.28|
b2| 1.91| 2.39| 6
b3| 1.91| 2.34|
b4| 2.87| 3.22| 6, 8
b5| 2.87| 3.18|
c| 0.55| 0.69| 6
c1| 0.55| 0.65|
D| 20.40| 20.70| 4
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
D1| 16.25| 16.85| 5
D2| 0.56| 0.76|
E| 15.50| 15.87| 4
E1| 13.46| 14.16| 5
E2| 4.52| 5.49| 3
e| 5.44 BSC|
L| 14.90| 15.40|
L1| 3.96| 4.16| 6
Ø P| 3.56| 3.65| 7
Ø P1| 7.19 ref.|
Q| 5.31| 5.69|
S| 5.54| 5.74|

Notes

Package reference: JEDEC® TO247, variation AC
All dimensions are in mm
Slot required, notch may be rounded
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body
Thermal pad contour optional with dimensions D1 and E1
Lead finish uncontrolled in L1
Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimension at maximum material condition

VERSION 2: FACILITY CODE = Y

| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
A| 4.58| 5.31|
A1| 2.21| 2.59|
A2| 1.17| 2.49|
b| 0.99| 1.40|
b1| 0.99| 1.35|
b2| 1.53| 2.39|
b3| 1.65| 2.37|
b4| 2.42| 3.43|
b5| 2.59| 3.38|
c| 0.38| 0.86|
c1| 0.38| 0.76|
D| 19.71| 20.82|
D1| 13.08| –|
| MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
D2| 0.51| 1.30|
E| 15.29| 15.87|
E1| 13.72| –|
e| 5.46 BSC|
Ø k| 0.254|
L| 14.20| 16.25|
L1| 3.71| 4.29|
Ø P| 3.51| 3.66|
Ø P1| –| 7.39|
Q| 5.31| 5.69|
R| 4.52| 5.49|
S| 5.51 BSC|
| |

Notes

Dimensioning and tolerancing per ASME Y14.5M-1994
Contour of slot optional
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
Thermal pad contour optional with dimensions D1 and E1
Lead finish uncontrolled in L1
Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
Outline conforms to JEDEC outline TO-247 with exception of dimension c

VERSION 3: FACILITY CODE = N

| MILLIMETERS| | | MILLIMETERS
---|---|---|---|---
DIM.| MIN.| MAX.| DIM.| MIN.| MAX.
A| 4.65| 5.31| D2| 0.51| 1.35
A1| 2.21| 2.59| E| 15.29| 15.87
A2| 1.17| 1.37| E1| 13.46| –
b| 0.99| 1.40| e| 5.46 BSC
b1| 0.99| 1.35| k| 0.254
b2| 1.65| 2.39| L| 14.20| 16.10
b3| 1.65| 2.34| L1| 3.71| 4.29
b4| 2.59| 3.43| N| 7.62 BSC
b5| 2.59| 3.38| P| 3.56| 3.66
c| 0.38| 0.89| P1| –| 7.39
c1| 0.38| 0.84| Q| 5.31| 5.69
D| 19.71| 20.70| R| 4.52| 5.49
D1| 13.08| –| S| 5.51 BSC
ECN: E20-0545-Rev. F, 19-Oct-2020 DWG: 5971

Notes

Dimensioning and tolerancing per ASME Y14.5M-1994
Contour of slot optional
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
Thermal pad contour optional with dimensions D1 and E1
Lead finish uncontrolled in L1
Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)

Disclaimer

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