VISHAY SiHF15N60E E Series Power MOSFET Owner’s Manual

June 9, 2024
VISHAY

VISHAY SiHF15N60E E Series Power MOSFET

SiHF15N60E E Series Power MOSFET

E Series Power MOSFET

PRODUCT SUMMARY

VDS (V) at TJ max.

| 650
RDS(on) max. (W) at 25 °C| VGS = 10 V|

0.28

Qg max. (nC)

| 78
Qgs(nC)|

9

Qgd(nC)

| 17
Configuration|

Single

FEATURES
  • Low figure-of-merit (FOM) Ron x Qg
  • Low input capacitance (Ciss)
  • Reduced switching and conduction losses
  • Ultra low gate charge (Qg)
  • Avalanche energy rated (UIS)
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
  • Server and telecom power supplies

  • Switch mode power supplies (SMPS)

  • Power factor correction power supplies (PFC)

  • Lighting
    – High-intensity discharge (HID)
    – Fluorescent ballast lighting

  • Industrial
    – Welding
    – Induction heating
    – Motor drives
    – Battery chargers
    – Renewable energy
    – Solar (PV inverters)

ORDERING INFORMATION

Package| TO-220 FULLPAK
Lead (Pb)-free| SiHF15N60E-E3
Lead (Pb)-free and Halogen-free| SiHF15N60E-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| LIMIT| UNIT
Drain-Source Voltage| VDS| 600|

V

Gate-Source Voltage| VGS| ± 30
Continuous Drain Current (TJ = 150 °C) e| VGS at 10 V| TC = 25 °C| ID| 15|

A

TC = 100 °C| 9.6
Pulsed Drain Current a| IDM| 39
Linear Derating Factor|  | 0.27| W/°C
Single Pulse Avalanche Energy b| EAS| 102| mJ
Maximum Power Dissipation| PD| 34| W
Operating Junction and Storage Temperature Range| TJ, Tstg| -55 to +150| °C
Drain-Source Voltage Slope| VDS = 0 V to 80 % VDS|

dV/dt

| 70|

V/ns

Reverse Diode dV/dt d| 7.7
Soldering Recommendations (Peak temperature) c| For 10 s|  | 300| °C
Mounting Torque| M3 screw|  | 0.6| Nm

Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
b. VDD = 50 V, starting TJ = 25 °C, L = 11.6 mH, Rg = 25 , IAS = 4.2 A.
c. 1.6 mm from case.
d. ISD > ID, dI/dt = 100 A/μs, starting TJ = 25 °C.
e. Limited by maximum junction temperature.

THERMAL RESISTANCE RATINGS

PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum Junction-to-Ambient| RthJA| –| 65|

°C/W

Maximum Junction-to-Case (Drain)| RthJC| –| 3.7
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.| MAX.| UNIT
Static

Drain-Source Breakdown Voltage

| VDS| VGS = 0 V, ID = 250 μA| 600| –| –| V
VDS Temperature Coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.71| –|

V/°C

Gate-Source Threshold Voltage (N)

| VGS(th)| VDS = VGS, ID = 250 μA| 2| –| 4|

V

Gate-Source Leakage

| IGSS| VGS = ± 20 V| –| –| ± 100| nA
VGS = ± 30 V| –| –| ± 1|

μA

Zero Gate Voltage Drain Current

| IDSS| VDS = 600 V, VGS = 0 V| –| –| 1|

μA

VDS = 480 V, VGS = 0 V, TJ = 125 °C| –| –|

10

Drain-Source On-State Resistance

| RDS(on)| VGS = 10 V| ID = 8 A| –| 0.23| 0.28| W
Forward Transconductance| gfs| VDS = 30 V, ID = 8 A| –| 4.6| –|

S

Dynamic

Input Capacitance

| Ciss| VGS = 0 V, VDS = 100 V, f = 1 MHz| –| 1350| –|

pF

Output Capacitance| Coss| –| 70|

Reverse Transfer Capacitance

| Crss| –| 5| –
Effective Output Capacitance, Energy Related a| Co(er)| VDS = 0 V to 480 V, VGS = 0 V| –| 53|

Effective Output Capacitance, Time Related b

| Co(tr)| –| 177|

Total Gate Charge

| Qg| VGS = 10 V| ID = 8 A, VDS = 480 V| –| 39| 78|

nC

Gate-Source Charge| Qgs| –| 11|

Gate-Drain Charge

| Qgd| –| 17|

Turn-On Delay Time

| td(on)| VDD = 480 V, ID = 8 A, VGS = 10 V, Rg = 9.1 W| –| 16| 32|

ns

Rise Time

| tr| –|

26

|

52

Turn-Off Delay Time| td(off)| –| 41|

82

Fall Time

| tf| –| 22| 44
Gate Input Resistance| Rg| f = 1 MHz, open drain| 0.3| 0.86| 1.7|

W

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current

| | MOSFET symbol showing the integral reverse p – n junction diode
| –| –| 15|

A

Pulsed Diode Forward Current| ISM| –| –|

60

Diode Forward Voltage

| VSD| TJ = 25 °C, IS = 8 A, VGS = 0 V| –| 1.0| 1.2| V

Reverse Recovery Time

| trr|

TJ = 25 °C, IF = IS = 8 A, dI/dt = 100 A/μs, VR = 25 V

| –| 302| 604|

ns

Reverse Recovery Charge| Qrr| –| 4.0| 8|

μC

Reverse Recovery Current

| IRRM| –| 24| –|

A

Notes
a. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDSS.
b. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDSS.

TYPICAL CHARACTERISTICS

(25 °C, unless otherwise noted)
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91480.

TO-220 FULLPAK (High Voltage)

OPTION 1: FACILITY CODE = 9

To-220 Fullpak \(High Voltage\)

| MILLIMETERS
---|---
DIM.| MIN.| NOM.|

MAX.

A

| 4.60| 4.70| 4.80
b| 0.70| 0.80|

0.91

b1

| 1.20| 1.30| 1.47
b2| 1.10| 1.20|

1.30

C

| 0.45| 0.50| 0.63
D| 15.80| 15.87|

15.97

e

| 2.54 BSC
E| 10.00| 10.10|

10.30

F

| 2.44| 2.54| 2.64

G

| 6.50| 6.70|

6.90

L| 12.90| 13.10|

13.30

L1

| 3.13| 3.23| 3.33
Q| 2.65| 2.75|

2.85

Q1

| 3.20| 3.30|

3.40

Ø R

| 3.08| 3.18|

3.28

Notes

  1. To be used only for process drawing
  2. These dimensions apply to all TO-220 FULLPAK leadframe versions 3 leads
  3. All critical dimensions should C meet Cpk > 1.33
  4. All dimensions include burrs and plating thickness
  5. No chipping or package damage
  6. Facility code will be the 1st character located at the 2nd row of the unit marking
OPTION 2: FACILITY CODE = Y

To-220 Fullpak \(High Voltage\)

| MILLIMETERS| INCHES
---|---|---
DIM.| MIN.| MAX.| MIN.|

MAX.

A

| 4.570| 4.830| 0.180| 0.190
A1| 2.570| 2.830| 0.101|

0.111

A2

| 2.510| 2.850| 0.099| 0.112
b| 0.622| 0.890| 0.024|

0.035

b2

| 1.229| 1.400| 0.048| 0.055
b3| 1.229| 1.400| 0.048|

0.055

c

| 0.440| 0.629| 0.017| 0.025
D| 8.650| 9.800| 0.341|

0.386

d1

| 15.88| 16.120| 0.622| 0.635
d3| 12.300| 12.920| 0.484|

0.509

E

| 10.360| 10.630| 0.408| 0.419
e| 2.54 BSC|

0.100 BSC

L

| 13.200| 13.730| 0.520| 0.541
L1| 3.100| 3.500| 0.122|

0.138

n

| 6.050| 6.150| 0.238| 0.242
Ø P| 3.050| 3.450| 0.120|

0.136

u

| 2.400| 2.500| 0.094| 0.098
V| 0.400| 0.500| 0.016|

0.020

ECN: E19-0180-Rev. D, 08-Apr-2019 DWG: 5972

Notes

  1. To be used only for process drawing
  2. These dimensions apply to all TO-220 FULLPAK leadframe versions 3 leads
  3. All critical dimensions should C meet Cpk > 1.33
  4. All dimensions include burrs and plating thickness
  5. No chipping or package damage
  6. Facility code will be the 1st character located at the 2nd row of the unit marking

Disclaimer

LL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.

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References

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