VISHAY SiHF15N60E E Series Power MOSFET Owner’s Manual
- June 9, 2024
- VISHAY
Table of Contents
VISHAY SiHF15N60E E Series Power MOSFET
E Series Power MOSFET
PRODUCT SUMMARY
VDS (V) at TJ max.
| 650
RDS(on) max. (W) at 25 °C| VGS = 10 V|
0.28
Qg max. (nC)
| 78
Qgs(nC)|
9
Qgd(nC)
| 17
Configuration|
Single
FEATURES
- Low figure-of-merit (FOM) Ron x Qg
- Low input capacitance (Ciss)
- Reduced switching and conduction losses
- Ultra low gate charge (Qg)
- Avalanche energy rated (UIS)
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
-
Server and telecom power supplies
-
Switch mode power supplies (SMPS)
-
Power factor correction power supplies (PFC)
-
Lighting
– High-intensity discharge (HID)
– Fluorescent ballast lighting -
Industrial
– Welding
– Induction heating
– Motor drives
– Battery chargers
– Renewable energy
– Solar (PV inverters)
ORDERING INFORMATION
Package| TO-220 FULLPAK
Lead (Pb)-free| SiHF15N60E-E3
Lead (Pb)-free and Halogen-free| SiHF15N60E-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| LIMIT| UNIT
Drain-Source Voltage| VDS| 600|
V
Gate-Source Voltage| VGS| ± 30
Continuous Drain Current (TJ = 150 °C) e| VGS at 10 V| TC = 25 °C| ID| 15|
A
TC = 100 °C| 9.6
Pulsed Drain Current a| IDM| 39
Linear Derating Factor| | 0.27| W/°C
Single Pulse Avalanche Energy b| EAS| 102| mJ
Maximum Power Dissipation| PD| 34| W
Operating Junction and Storage Temperature Range| TJ, Tstg| -55 to +150| °C
Drain-Source Voltage Slope| VDS = 0 V to 80 % VDS|
dV/dt
| 70|
V/ns
Reverse Diode dV/dt d| 7.7
Soldering Recommendations (Peak temperature) c| For 10 s| | 300| °C
Mounting Torque| M3 screw| | 0.6| Nm
Notes
a. Repetitive rating; pulse width limited by maximum junction
temperature.
b. VDD = 50 V, starting TJ = 25 °C, L = 11.6 mH, Rg = 25 , IAS = 4.2 A.
c. 1.6 mm from case.
d. ISD > ID, dI/dt = 100 A/μs, starting TJ = 25 °C.
e. Limited by maximum junction temperature.
THERMAL RESISTANCE RATINGS
PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum Junction-to-Ambient| RthJA| –| 65|
°C/W
Maximum Junction-to-Case (Drain)| RthJC| –| 3.7
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.| MAX.| UNIT
Static
Drain-Source Breakdown Voltage
| VDS| VGS = 0 V, ID = 250 μA| 600| –| –| V
VDS Temperature Coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.71|
–|
V/°C
Gate-Source Threshold Voltage (N)
| VGS(th)| VDS = VGS, ID = 250 μA| 2| –| 4|
V
Gate-Source Leakage
| IGSS| VGS = ± 20 V| –| –| ± 100| nA
VGS = ± 30 V| –| –| ± 1|
μA
Zero Gate Voltage Drain Current
| IDSS| VDS = 600 V, VGS = 0 V| –| –| 1|
μA
VDS = 480 V, VGS = 0 V, TJ = 125 °C| –| –|
10
Drain-Source On-State Resistance
| RDS(on)| VGS = 10 V| ID = 8 A| –| 0.23| 0.28| W
Forward Transconductance| gfs| VDS = 30 V, ID = 8 A| –| 4.6| –|
S
Dynamic
Input Capacitance
| Ciss| VGS = 0 V, VDS = 100 V, f = 1 MHz| –| 1350| –|
pF
Output Capacitance| Coss| –| 70|
–
Reverse Transfer Capacitance
| Crss| –| 5| –
Effective Output Capacitance, Energy Related a| Co(er)| VDS = 0 V to 480 V,
VGS = 0 V| –| 53|
–
Effective Output Capacitance, Time Related b
| Co(tr)| –| 177|
–
Total Gate Charge
| Qg| VGS = 10 V| ID = 8 A, VDS = 480 V| –| 39| 78|
nC
Gate-Source Charge| Qgs| –| 11|
–
Gate-Drain Charge
| Qgd| –| 17|
–
Turn-On Delay Time
| td(on)| VDD = 480 V, ID = 8 A, VGS = 10 V, Rg = 9.1 W| –| 16| 32|
ns
Rise Time
| tr| –|
26
|
52
Turn-Off Delay Time| td(off)| –| 41|
82
Fall Time
| tf| –| 22| 44
Gate Input Resistance| Rg| f = 1 MHz, open drain| 0.3| 0.86| 1.7|
W
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
| | MOSFET symbol showing the integral reverse p – n junction diode
| –| –| 15|
A
Pulsed Diode Forward Current| ISM| –| –|
60
Diode Forward Voltage
| VSD| TJ = 25 °C, IS = 8 A, VGS = 0 V| –| 1.0| 1.2| V
Reverse Recovery Time
| trr|
TJ = 25 °C, IF = IS = 8 A, dI/dt = 100 A/μs, VR = 25 V
| –| 302| 604|
ns
Reverse Recovery Charge| Qrr| –| 4.0| 8|
μC
Reverse Recovery Current
| IRRM| –| 24| –|
A
Notes
a. Coss(er) is a fixed capacitance that gives the same energy as Coss
while VDS is rising from 0 % to 80 % VDSS.
b. Coss(tr) is a fixed capacitance that gives the same charging time as
Coss while VDS is rising from 0 % to 80 % VDSS.
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91480.
TO-220 FULLPAK (High Voltage)
OPTION 1: FACILITY CODE = 9
| MILLIMETERS
---|---
DIM.| MIN.| NOM.|
MAX.
A
| 4.60| 4.70| 4.80
b| 0.70| 0.80|
0.91
b1
| 1.20| 1.30| 1.47
b2| 1.10| 1.20|
1.30
C
| 0.45| 0.50| 0.63
D| 15.80| 15.87|
15.97
e
| 2.54 BSC
E| 10.00| 10.10|
10.30
F
| 2.44| 2.54| 2.64
G
| 6.50| 6.70|
6.90
L| 12.90| 13.10|
13.30
L1
| 3.13| 3.23| 3.33
Q| 2.65| 2.75|
2.85
Q1
| 3.20| 3.30|
3.40
Ø R
| 3.08| 3.18|
3.28
Notes
- To be used only for process drawing
- These dimensions apply to all TO-220 FULLPAK leadframe versions 3 leads
- All critical dimensions should C meet Cpk > 1.33
- All dimensions include burrs and plating thickness
- No chipping or package damage
- Facility code will be the 1st character located at the 2nd row of the unit marking
OPTION 2: FACILITY CODE = Y
| MILLIMETERS| INCHES
---|---|---
DIM.| MIN.| MAX.| MIN.|
MAX.
A
| 4.570| 4.830| 0.180| 0.190
A1| 2.570| 2.830| 0.101|
0.111
A2
| 2.510| 2.850| 0.099| 0.112
b| 0.622| 0.890| 0.024|
0.035
b2
| 1.229| 1.400| 0.048| 0.055
b3| 1.229| 1.400| 0.048|
0.055
c
| 0.440| 0.629| 0.017| 0.025
D| 8.650| 9.800| 0.341|
0.386
d1
| 15.88| 16.120| 0.622| 0.635
d3| 12.300| 12.920| 0.484|
0.509
E
| 10.360| 10.630| 0.408| 0.419
e| 2.54 BSC|
0.100 BSC
L
| 13.200| 13.730| 0.520| 0.541
L1| 3.100| 3.500| 0.122|
0.138
n
| 6.050| 6.150| 0.238| 0.242
Ø P| 3.050| 3.450| 0.120|
0.136
u
| 2.400| 2.500| 0.094| 0.098
V| 0.400| 0.500| 0.016|
0.020
ECN: E19-0180-Rev. D, 08-Apr-2019 DWG: 5972
Notes
- To be used only for process drawing
- These dimensions apply to all TO-220 FULLPAK leadframe versions 3 leads
- All critical dimensions should C meet Cpk > 1.33
- All dimensions include burrs and plating thickness
- No chipping or package damage
- Facility code will be the 1st character located at the 2nd row of the unit marking
Disclaimer
LL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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References
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