VISHAY IRF740AS Power MOSFET Owner’s Manual

June 9, 2024
VISHAY

VISHAY IRF740AS Power MOSFET

Power MOSFET

VISHAY IRF740AS Power MOSFET-fig-1

FEATURES

  • Low gate charge Qg results in cimple drive requirement

  • Improved gate, avalanche, and dynamic dV/d t ruggedness

  • Fully characterized capacitance and avalanch e voltage and current

  • Effective Coss specified

  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
    Note

    • This datasheet provides information about parts that RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details

APPLICATIONS

  • Switch mode power supply (SMPS)
  • Uninterruptible power supply
  • High speed power switching

TYPICAL SMPS TOPOLOGIES

  • Single transistor flyback Xfmr. reset
  • Single transistor forward Xfmr. reset (both for US line input only)

PRODUCT SUMMARY

ORDERING INFORMATION

ORDERING INFORMATION

Package| D2PAK (TO-263)| D2PAK (TO-263)| D2PAK (TO-263)| I2PAK (TO-262)
Lead (Pb)-free and Halogen-free| SiHF740AS-GE3| SiHF740ASTRL-GE3a| SiHF740ASTRR-GE3a| SiHF740AL-GE3
Lead (Pb)-free| IRF740ASPbF| IRF740ASTRLPbFa| IRF740ASTRRPbFa| IRF740ALPbF

Note
a. See device orientation.

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| LIMIT| UNIT
Drain-Source Voltage| VDS| 400| V
Gate-Source Voltage| VGS| ± 30
Continuous Drain Currente| VGS at 10 V| TC = 25 °C| ID| 10|

A

TC = 100 °C| 6.3
Pulsed Drain Currenta, e| IDM| 40
Linear Derating Factor|  | 1.0| W/°C
Single Pulse Avalanche Energyb, e| EAS| 630| mJ
Avalanche Currenta| IAR| 10| A
Repetiitive Avalanche Energya| EAR| 12.5| mJ
Maximum Power Dissipation| TA = 25 °C| PD| 3.1| W
TC = 25 °C| 125
Peak Diode Recovery dV/dtc, e| dV/dt| 5.9| V/ns
Operating Junction and Storage Temperature Range| TJ, Tstg| – 55 to + 150| °C
Soldering Recommendations (Peak Temperature)| for 10 s|  | 300d

Notes

  • Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
  • Starting TJ = 25 °C, L = 12.6 mH, Rg = 25 Ω, IAS = 10 A (see fig. 12)
  • ISD ≤ 10 A, dI/dt ≤ 330 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
  • 1.6 mm from case
  • Uses IRF740A, SiHF740A data and test conditions

THERMAL RESISTANCE RATINGS

VISHAY IRF740AS Power MOSFET-
fig-2

Note
a. When mounted on 1″ square PCB (FR-4 or G-10 material).VISHAY IRF740AS
Power MOSFET-fig-3

Notes

  • Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
  • Pulse width ≤ 300 μs; duty cycle ≤ 2 %.
  • Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80 % VDS.
  • Uses IRF740A, SiHF740A data and test conditions.

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

VISHAY IRF740AS
Power MOSFET-fig-4 VISHAY IRF740AS Power MOSFET-
fig-5 VISHAY IRF740AS Power MOSFET-fig-6 VISHAY
IRF740AS Power MOSFET-fig-7 VISHAY IRF740AS Power MOSFET-
fig-8

Peak Diode Recovery dV/dt Test Circuit

VISHAY IRF740AS Power MOSFET-
fig-9

Note
a. VGS = 5 V for logic level devices

TO-263AB (HIGH VOLTAGE)

VISHAY IRF740AS Power MOSFET-
fig-10-

Notes

  1. Dimensioning and tolerancing per ASME Y14.5M-1994.
  2. Dimensions are shown in millimeters (inches).
  3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outmost extremes of the plastic body at datum A.
  4. Thermal PAD contour optional within dimension E, L1, D1 and E1.
  5. Dimension b1 and c1 apply to base metal only.
  6. Datum A and B to be determined at datum plane H.
  7. Outline conforms to JEDEC outline to TO-263AB.
I2PAK (TO-262) (HIGH VOLTAGE)

VISHAY IRF740AS Power MOSFET-
fig-11

Notes

  1. Dimensioning and tolerancing per ASME Y14.5M-1994.
  2. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outmost extremes of the plastic body.
  3. Thermal pad contour optional within dimension E, L1, D1, and E1.
  4. Dimension b1 and c1 apply to base metal only.

RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead

VISHAY IRF740AS Power MOSFET-
fig-12

Disclaimer

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References

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