VISHAY IRF740AS Power MOSFET Owner’s Manual
- June 9, 2024
- VISHAY
Table of Contents
- VISHAY IRF740AS Power MOSFET
- Power MOSFET
- FEATURES
- APPLICATIONS
- TYPICAL SMPS TOPOLOGIES
- PRODUCT SUMMARY
- ORDERING INFORMATION
- ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
- THERMAL RESISTANCE RATINGS
- TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
- TO-263AB (HIGH VOLTAGE)
- RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead
- Disclaimer
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
VISHAY IRF740AS Power MOSFET
Power MOSFET
FEATURES
-
Low gate charge Qg results in cimple drive requirement
-
Improved gate, avalanche, and dynamic dV/d t ruggedness
-
Fully characterized capacitance and avalanch e voltage and current
-
Effective Coss specified
-
Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Note- This datasheet provides information about parts that RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
APPLICATIONS
- Switch mode power supply (SMPS)
- Uninterruptible power supply
- High speed power switching
TYPICAL SMPS TOPOLOGIES
- Single transistor flyback Xfmr. reset
- Single transistor forward Xfmr. reset (both for US line input only)
PRODUCT SUMMARY
ORDERING INFORMATION
ORDERING INFORMATION
Package| D2PAK (TO-263)| D2PAK (TO-263)| D2PAK (TO-263)| I2PAK (TO-262)
Lead (Pb)-free and Halogen-free| SiHF740AS-GE3| SiHF740ASTRL-GE3a|
SiHF740ASTRR-GE3a| SiHF740AL-GE3
Lead (Pb)-free| IRF740ASPbF| IRF740ASTRLPbFa| IRF740ASTRRPbFa| IRF740ALPbF
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| LIMIT| UNIT
Drain-Source Voltage| VDS| 400| V
Gate-Source Voltage| VGS| ± 30
Continuous Drain Currente| VGS at 10 V| TC = 25 °C| ID| 10|
A
TC = 100 °C| 6.3
Pulsed Drain Currenta, e| IDM| 40
Linear Derating Factor| | 1.0| W/°C
Single Pulse Avalanche Energyb, e| EAS| 630| mJ
Avalanche Currenta| IAR| 10| A
Repetiitive Avalanche Energya| EAR| 12.5| mJ
Maximum Power Dissipation| TA = 25 °C| PD| 3.1| W
TC = 25 °C| 125
Peak Diode Recovery dV/dtc, e| dV/dt| 5.9| V/ns
Operating Junction and Storage Temperature Range| TJ, Tstg| – 55 to + 150| °C
Soldering Recommendations (Peak Temperature)| for 10 s| | 300d
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
- Starting TJ = 25 °C, L = 12.6 mH, Rg = 25 Ω, IAS = 10 A (see fig. 12)
- ISD ≤ 10 A, dI/dt ≤ 330 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
- 1.6 mm from case
- Uses IRF740A, SiHF740A data and test conditions
THERMAL RESISTANCE RATINGS
Note
a. When mounted on 1″ square PCB (FR-4 or G-10 material).
Notes
- Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
- Pulse width ≤ 300 μs; duty cycle ≤ 2 %.
- Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80 % VDS.
- Uses IRF740A, SiHF740A data and test conditions.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Peak Diode Recovery dV/dt Test Circuit
Note
a. VGS = 5 V for logic level devices
TO-263AB (HIGH VOLTAGE)
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994.
- Dimensions are shown in millimeters (inches).
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outmost extremes of the plastic body at datum A.
- Thermal PAD contour optional within dimension E, L1, D1 and E1.
- Dimension b1 and c1 apply to base metal only.
- Datum A and B to be determined at datum plane H.
- Outline conforms to JEDEC outline to TO-263AB.
I2PAK (TO-262) (HIGH VOLTAGE)
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994.
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outmost extremes of the plastic body.
- Thermal pad contour optional within dimension E, L1, D1, and E1.
- Dimension b1 and c1 apply to base metal only.
RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead
Disclaimer
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References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>