VISHAY SiHG47N60EE Series Power Mosfet Owner’s Manual

August 19, 2024
VISHAY

VISHAY SiHG47N60EE Series Power Mosfet

Specifications:

  • Product Name: SiHG47N60E Vishay Siliconix E Series Power
    MOSFET

  • Package Type: TO-247AC

  • Channel Type: N-Channel

  • Maximum Drain-Source Voltage (VDS): 600V

  • Gate-Source Voltage (VGS) at 10V

  • Maximum Continuous Drain Current (ID): 24A

  • Maximum Power Dissipation (PD): 300W

  • Operating Temperature Range: -55°C to +150°C

  • Thermal Resistance Junction-to-Ambient (RthJA): 40°C/W (typical)

  • Thermal Resistance Junction-to-Case (RthJC): 0.33°C/W (maximum

Product Usage Instructions

Features:

This power MOSFET is designed for high voltage applications with a maximum VDS of 600V. It offers a low on-state resistance and high power dissipation capability.

Applications:

Common applications include power supplies, motor control, and inverters where high voltage switching is required.

Ordering Information:

Available in lead (Pb)-free and halogen-free packaging. Two options: SiHG47N60E-E3 and SiHG47N60E-GE3 in TO-247AC package.

Thermal Resistance Ratings:

Maximum junction-to-ambient: 40°C/W (typical), Maximum junction-to-case: 0.33°C/W (maximum).

Frequently Asked Questions

  • Q: What is the maximum Drain-Source Voltage of SiHG47N60E?
    • A: The maximum Drain-Source Voltage (VDS) is 600V.
  • Q: What is the operating temperature range of the MOSFET?
    • A: The operating temperature range is from -55°C to +150°C.

PRODUCT SUMMARY

PRODUCT SUMMARY

VDS (V) at TJ max.| 650
RDS(on) max. (W) at 25 °C| VGS = 10 V| 0.064
Qg max. (nC)| 220
Qgs (nC)| 29
Qgd (nC)| 57
Configuration| Single

FEATURES

  • Low figure-of-merit (FOM) Ron x Qg
  • Low input capacitance (Ciss)
  • Reduced switching and conduction losses
  • Ultra low gate charge (Qg)
  • Avalanche energy rated (UIS)
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

  • Switch mode power supplies (SMPS)
  • Power factor correction power supplies (PFC)
  • Lighting
    • High-intensity discharge (HID)
    • Fluorescent ballast lighting
  • Industrial
    • Welding
    • Induction heating
    • Motor drives
    • Battery chargers
    • Renewable energy
    • Solar (PV inverters)

ORDERING INFORMATION

  • Package TO-247AC
  • Lead (Pb)-free SiHG47N60E-E3
  • Lead (Pb)-free and halogen-free SiHG47N60E-GE3

ABSOLUTE MAXIMUM RATINGS

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| LIMIT| UNIT
Drain-source voltage| VDS| 600| V
Gate-source voltage| VGS| ± 30
Continuous drain current (TJ = 150 °C)| VGS at 10 V| TC = 25 °C| ID| 47|

A

TC = 100 °C| 30
Pulsed drain current a| IDM| 145
Linear derating factor|  | 3| W/°C
Single pulse avalanche energy b| EAS| 1800| mJ
Maximum power dissipation| PD| 357| W
Operating junction and storage temperature range| TJ, Tstg| -55 to +150| °C
Drain-source voltage slope| VDS = 0 V to 80 % VDS| dV/dt| 70| V/ns
Reverse diode dV/dt d| 11
Soldering recommendations (peak temperature) c| for 10 s|  | 300| °C

Notes

  • a. Repetitive rating; pulse width limited by maximum junction temperature
  • b. VDD = 50 V, starting TJ = 25 °C, L = 73.5 mH, Rg = 25 Ω, IAS = 7 A
  • c. 1.6 mm from case
  • d. ISD ≤ ID, dI/dt = 100 A/μs, starting TJ = 25 °C

THERMAL RESISTANCE RATINGS

PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum junction-to-ambient| RthJA| –| 40| °C/W
Maximum junction-to-case (drain)| RthJC| –| 0.33

SPECIFICATIONS

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.| MAX.| UNIT
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 600| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 250 μA| –| 0.66| –| V/°C
Gate-source threshold voltage (N)| VGS(th)| VDS = VGS, ID = 250 μA| 2| –| 4| V
Gate-source leakage| IGSS| VGS = ± 20 V| –| –| ± 100| nA
VGS = ± 30 V| –| –| ± 1| μA
Zero gate voltage drain current| IDSS| VDS = 600 V, VGS = 0 V| –| –| 1| μA
VDS = 480 V, VGS = 0 V, TJ = 125 °C| –| –| 10
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 24 A| –| 0.053| 0.064| W
Forward transconductance| gfs| VDS = 8 V, ID = 3 A| –| 6.8| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = 100 V,

f = 1 MHz

| 2405| 4810| 9620|

pF

Output capacitance| Coss| 115| 230| 460
Reverse transfer capacitance| Crss| 1.7| 5| 10
Effective output capacitance, energy related a| Co(er)|

VDS = 0 V to 480 V, VGS = 0 V

| –| 170| –
Effective output capacitance, time related b| Co(tr)| –| 604| –
Total gate charge| Qg|

VGS = 10 V

|

ID = 24 A, VDS = 480 V

| 74| 148| 220|

nC

Gate-source charge| Qgs| 14.5| 29| 58
Gate-drain charge| Qgd| 28.5| 57| 86
Turn-on delay time| td(on)|

VDD = 480 V, ID = 24 A, VGS = 10 V, Rg = 4.4 W

| 14| 28| 56|

ns

Rise time| tr| 36| 72| 108
Turn-off delay time| td(off)| 47| 93| 140
Fall time| tf| 41| 82| 123
Gate input resistance| Rg| f = 1 MHz, open drain| 0.13| 0.65| 1.3| W
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol

showing the

integral reverse

p – n junction diode

| –| –| 47|

A

Pulsed diode forward current| ISM| –| –| 140
Diode forward voltage| VSD| TJ = 25 °C, IS = 24 A, VGS = 0 V| –| –| 1.2| V
Body diode reverse recovery time| trr|

TJ = 25 °C, IF = IS = 24 A,

dI/dt = 100 A/μs, VR = 25 V

| –| 582| 1164| ns
Body diode reverse recovery charge| Qrr| –| 11| 22| μC
Reverse recovery current| IRRM| –| 31| 62| A
Body diode reverse recovery time| trr|

TJ = 25 °C, IF = IS = 24 A,

dI/dt = 100 A/μs, VR = 400 V

| –| 550| 1164| ns
Body diode reverse recovery charge| Qrr| –| 10.7| 22| μC
Reverse recovery current| IRRM| –| 38| 62| A

Notes

  • a. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDSS
  • b. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDSS

TYPICAL CHARACTERISTICS

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

TO-247AC (High Voltage)

VERSION 1: FACILITY CODE = 9


| MILLIMETERS|
---|---|---
DIM.| MIN.| NOM.| MAX.| NOTES
A| 4.83| 5.02| 5.21|
A1| 2.29| 2.41| 2.55|
A2| 1.17| 1.27| 1.37|
b| 1.12| 1.20| 1.33|
b1| 1.12| 1.20| 1.28|
b2| 1.91| 2.00| 2.39| 6
b3| 1.91| 2.00| 2.34|
b4| 2.87| 3.00| 3.22| 6, 8
b5| 2.87| 3.00| 3.18|
c| 0.40| 0.50| 0.60| 6
c1| 0.40| 0.50| 0.56|
D| 20.40| 20.55| 20.70| 4
 | MILLIMETERS|
---|---|---
DIM.| MIN.| NOM.| MAX.| NOTES
D1| 16.46| 16.76| 17.06| 5
D2| 0.56| 0.66| 0.76|
E| 15.50| 15.70| 15.87| 4
E1| 13.46| 14.02| 14.16| 5
E2| 4.52| 4.91| 5.49| 3
e| 5.46 BSC|
L| 14.90| 15.15| 15.40|
L1| 3.96| 4.06| 4.16| 6
Ø P| 3.56| 3.61| 3.65| 7
Ø P1| 7.19 ref.|
Q| 5.31| 5.50| 5.69|
S| 5.51 BSC|

Notes

  1. Package reference: JEDEC® TO247, variation AC
  2. All dimensions are in mm
  3. Slot required, notch may be rounded
  4. Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body
  5. Thermal pad contour optional with dimensions D1 and E1
  6. Lead finish uncontrolled in L1
  7. Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
  8. Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimension at maximum material condition

VERSION 2: FACILITY CODE = Y

 | MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
A| 4.58| 5.31|
A1| 2.21| 2.59|
A2| 1.17| 2.49|
b| 0.99| 1.40|
b1| 0.99| 1.35|
b2| 1.53| 2.39|
b3| 1.65| 2.37|
b4| 2.42| 3.43|
b5| 2.59| 3.38|
c| 0.38| 0.86|
c1| 0.38| 0.76|
D| 19.71| 20.82|
D1| 13.08| –|
 | MILLIMETERS|
---|---|---
DIM.| MIN.| MAX.| NOTES
D2| 0.51| 1.30|
E| 15.29| 15.87|
E1| 13.72| –|
e| 5.46 BSC|
Ø k| 0.254|
L| 14.20| 16.25|
L1| 3.71| 4.29|
Ø P| 3.51| 3.66|
Ø P1| –| 7.39|
Q| 5.31| 5.69|
R| 4.52| 5.49|
S| 5.51 BSC|
 |  |

Notes

  1. Dimensioning and tolerancing per ASME Y14.5M-1994
  2. Contour of slot optional
  3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at  the outermost extremes of the plastic body
  4. Thermal pad contour optional with dimensions D1 and E1
  5. Lead finish uncontrolled in L1
  6. Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
  7. Outline conforms to JEDEC outline TO-247 with exception of dimension c

VERSION 3: FACILITY CODE = N

  MILLIMETERS     MILLIMETERS
DIM. MIN. MAX. DIM. MIN.
A 4.65 5.31 D2 0.51
A1 2.21 2.59 E 15.29
A2 1.17 1.37 E1 13.46
b 0.99 1.40 e 5.46 BSC
b1 0.99 1.35 k 0.254
b2 1.65 2.39 L 14.20
b3 1.65 2.34 L1 3.71
b4 2.59 3.43 N 7.62 BSC
b5 2.59 3.38 P 3.56
c 0.38 0.89 P1
c1 0.38 0.84 Q 5.31
D 19.71 20.70 R 4.52
D1 13.08 S 5.51 BSC

ECN: E22-0452-Rev. G, 31-Oct-2022 DWG: 5971

Notes

  1. Dimensioning and tolerancing per ASME Y14.5M-1994
  2. Contour of slot optional
  3. Dimensions D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
  4. Thermal pad contour optional with dimensions D1 and E1
  5. Lead finish uncontrolled in L1
  6. Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)

Legal Disclaimer Notice

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. Vishay products are not designed for use in life-saving or life-sustaining applications or any application in which the failure of the Vishay product could result in personal injury or death unless specifically qualified in writing by Vishay. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Revision: 01-Jul-2024 1 Document Number: 91000 For technical questions, contact: THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

For technical questions, contact: hvm@vishay.com

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