VISHAY IRF740B D Series Power MOSFET Owner’s Manual
- June 9, 2024
- VISHAY
Table of Contents
VISHAY IRF740B D Series Power MOSFET Owner’s Manual
PRODUCT SUMMARY
VDS (V) at TJ max.| 450
RDS(on) max. (W) at 25 °C| VGS = 10 V| 0.6
Qg max. (nC)| 30
Qgs (nC)| 4
Qgd (nC)| 7
Configuration| Single
FEATURES
- Optimal design
- Low area specific on-resistance
- Low input capacitance (Ciss)
- Reduced capacitive switching losses
- High body diode ruggedness
- Avalanche energy rated (UIS)
- Optimal efficiency and operation
- Low cost
- Simple gate drive circuitry
- Low figure-of-merit (FOM): Ron x Qg
- Fast switching
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Note
***** This datasheet provides information about parts that are RoHS-compliant
and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb)
terminations are not RoHS-compliant. Please see the information / tables in
this datasheet for details.
APPLICATIONS
- Consumer electronics
- Displays (LCD or plasma TV)
- Server and telecom power supplies
- SMPS
- Industrial
- Welding
- Induction heating
- Motor drives
- Battery chargers
ORDERING INFORMATION
Package| TO-220AB
Lead (Pb)-free| IRF740BPbF
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| LIMIT| UNIT
Drain-Source Voltage| VDS| 400| V
Gate-Source Voltage| VGS| ± 30
Gate-Source Voltage AC (f > 1 Hz)| 30
Continuous Drain Current (TJ = 150 °C)| VGS at 10 V| TC = 25 °C| ID| 10| A
TC = 100 °C| 6
Pulsed Drain Current a| IDM| 23
Linear Derating Factor| | 1.2| W/°C
Single Pulse Avalanche Energy b| EAS| 194| mJ
Maximum Power Dissipation| PD| 147| W
Operating Junction and Storage Temperature Range| TJ, Tstg| -55 to +150| °C
Drain-Source Voltage Slope| TJ = 125 °C| dV/dt| 24| V/ns
Reverse Diode dV/dt d| 0.6
Soldering Recommendations (Peak temperature) c| for 10 s| | 300| °C
Notes
a. Repetitive rating; pulse width limited by maximum junction
temperature.
b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 , IAS = 13 A.
c. 1.6 mm from case.
d. ISD ID, starting TJ = 25 °C.
THERMAL RESISTANCE RATINGS
PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum Junction-to-Ambient| RthJA| –| 62| °C/W
Maximum Junction-to-Case (Drain)| RthJC| –| 0.85
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
Static
Drain-Source Breakdown Voltage| VDS| VGS = 0 V, ID = 250 μA| 400| –| –| V
VDS Temperature Coefficient| DVDS/TJ| Reference to 25 °C, ID = 250 μA| –|
0.53| –| V/°C
Gate-Source Threshold Voltage (N)| VGS(th)| VDS = VGS, ID = 250 μA| 3| –| 5| V
Gate-Source Leakage| IGSS| VGS = ± 30 V| –| –| ± 100| nA
Zero Gate Voltage Drain Current| IDSS| VDS = 400 V, VGS = 0 V| –| –| 1| μA
VDS = 320 V, VGS = 0 V, TJ = 125 °C| –| –| 10
Drain-Source On-State Resistance| RDS(on)| VGS = 10 V| ID = 5 A| –| 0.5| 0.6|
W
Forward Transconductance| gfs| VDS = 50 V, ID = 5 A| –| 2.7| –| S
Dynamic
Input Capacitance| Ciss| VGS = 0 V, VDS = 100 V,f = 1 MHz| –| 526| –|
pF
Output Capacitance| Coss| –| 59| –
Reverse Transfer Capacitance| Crss| –| 9| –
Effective Output Capacitance, Energy Related a| Co(er)| VGS = 0 V, VDS = 0 V
to 320 V| –| 66| –
Effective Output Capacitance, Time Related b| Co(tr)| –| 84| –
Total Gate Charge| Qg| VGS = 10 V| ID = 5 A, VDS = 320 V| –| 15| 30| nC
Gate-Source Charge| Qgs| –| 4| –
Gate-Drain Charge| Qgd| –| 7| –
Turn-On Delay Time| td(on)| VDD = 400 V, ID = 10 A, VGS = 10 V, Rg = 9.1 W| –|
12| 24|
ns
Rise Time| tr| –| 18| 36
Turn-Off Delay Time| td(off)| –| 18| 36
Fall Time| tf| –| 14| 28
Gate Input Resistance| Rg| f = 1 MHz, open drain| 0.9| 1.8| 3.6| W
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current| IS| MOSFET symbolDshowing theintegral
reverse Gp – n junction diode S| –|
–| 10| A
Pulsed Diode Forward Current| ISM| –| –| 40
Diode Forward Voltage| VSD| TJ = 25 °C, IS = 5 A, VGS = 0 V| –| –| 1.2| V
Reverse Recovery Time| trr| TJ = 25 °C, IF = IS = 5 A,dI/dt = 100 A/μs, V =
25 VR| –| 230| –| ns
Reverse Recovery Charge| Qrr| –| 1.6| –| μC
Reverse Recovery Current| IRRM| –| 14| –| A
Notes
a. Coss(er) is a fixed capacitance that gives the same energy as Coss
while VDS is rising from 0 % to 80 % VDS.
b. Coss(tr) is a fixed capacitance that gives the same charging time as
Coss while VDS is rising from 0 % to 80 % VDS.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Fig. 1 – Typical Output Characteristics
Fig. 2 – Typical Output Characteristics
Fig. 3 – Typical Transfer Characteristics
Fig. 4 – Normalized On-Resistance vs. Temperature
Fig. 5 – Typical Capacitance vs. Drain-to-Source Voltage
Fig. 6 – Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 7 – Typical Source-Drain Diode Forward Voltage
Fig. 8 – Maximum Safe Operating Area
Fig. 9 – Maximum Drain Current vs. Case Temperature
Fig. 10 – Temperature vs. Drain-to-Source Voltage
Fig. 11 – Normalized Thermal Transient Impedance, Junction-to-Case
Fig. 12 – Switching Time Test Circuit
Fig. 13 – Switching Time Waveforms
Fig. 14 – Unclamped Inductive Test Circuit
Fig. 15 – Unclamped Inductive Waveforms
Fig. 16 – Basic Gate Charge Waveform
Fig. 17 – Gate Charge Test Circuit
Fig. 18 – For N-Channel
DIM. | MILLIMETERS | INCHES |
---|---|---|
MIN. | MAX. | MIN. |
A | 4.24 | 4.65 |
b | 0.69 | 1.02 |
b(1) | 1.14 | 1.78 |
c | 0.36 | 0.61 |
D | 14.33 | 15.85 |
E | 9.96 | 10.52 |
e | 2.41 | 2.67 |
e(1) | 4.88 | 5.28 |
F | 1.14 | 1.40 |
H(1) | 6.10 | 6.71 |
J(1) | 2.41 | 2.92 |
L | 13.36 | 14.40 |
L(1) | 3.33 | 4.04 |
Ø P | 3.53 | 3.94 |
Q | 2.54 | 3.00 |
ECN: E21-0621-Rev. D, 04-Nov-2021 DWG: 6031
Disclaimer
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References
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