VISHAY E Series Power MOSFET Owner’s Manual
- June 16, 2024
- VISHAY
Table of Contents
VISHAY E Series Power MOSFET Owner’s Manual
FEATURES
- A specific on resistance (m-cm2) reduction of 25 %
- Low figure-of-merit (FOM) Ron x Qg
- Low input capacitance (Ciss)
- Reduced switching and conduction losses
- Ultra low gate charge (Qg)
- Avalanche energy rated (UIS)
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
- Power factor correction power supplies (PFC)
- Hard switching PWM stages
- Computing
- Switch mode power supplies (SMPS)
- Lighting
- Light emitting diode (LED)
- High intensity discharge (HID)
- Telecom
- Server power supplies
- Renewable energy
- Photovoltaic inverters
- Industrial
- Welding
- Induction heating
- Motor drives
- Battery chargers
- Uninterruptable power supplies
**N-Channel MOSFET
**
PRODUCT SUMMARY
VDS (V) at TJ max.| 650
RDS(on) typ. (W) at 25 °C| VGS = 10 V| 0.082
Qg max. (nC)| 132
Qgs (nC)| 22
Qgd (nC)| 46
Configuration| Single
ORDERING INFORMATION
Package| D2PAK (TO-263)
Lead (Pb)-free and halogen-free| SiHB35N60E-GE3
SiHB35N60ET1-GE3
SiHB35N60ET5-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| LIMIT| UNIT
Drain-source voltage| VDS| 600| V
Gate-source voltage| VGS| ± 30
Continuous drain current (TJ = 150 °C)| VGS at 10 V| TC = 25 °C| ID| 32| A
TC = 100 °C| 20
Pulsed drain current a| IDM| 80
Linear derating factor| | 2| W/°C
Single pulse avalanche energy b| EAS| 691| mJ
Maximum power dissipation| PD| 250| W
Operating junction and storage temperature range| TJ, Tstg| -55 to +150| °C
Drain-source voltage slope| TJ = 125 °C| dV/dt| 57| V/ns
Reverse diode dV/dt d| 31
Soldering recommendations (peak temperature) c| for 10 s| | 300| °C
THERMAL RESISTANCE RATINGS
PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum junction-to-ambient| RthJA| –| 62| °C/W
Maximum junction-to-case (drain)| RthJC| –| 0.5
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.|
MAX.| UNIT
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 600| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.70|
–| V/°C
Gate-source threshold voltage (N)| VGS(th)| VDS = VGS, ID = 250 μA| 2| –| 4| V
Gate-source leakage| IGSS| VGS = ± 20 V| –| –| ± 100| nA
VGS = ± 30 V| –| –| ± 1| μA
Zero gate voltage drain current| IDSS| VDS = 600 V, VGS = 0 V| –| –| 1| μA
VDS = 480 V, VGS = 0 V, TJ = 125 °C| –| –| 25
Drain-source on-state resistance| RDS(on)| VGS = 10 V| ID = 17 A| –| 0.082|
0.094| W
Forward transconductance| gfs| VDS = 30 V, ID = 17 A| –| 13| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = 100 V,f = 1 MHz| –| 2760| –| pF
Output capacitance| Coss| –| 118| –
Reverse transfer capacitance| Crss| –| 5| –
Effective output capacitance, energy related a| Co(er)| VDS = 0 V to 480 V,
VGS = 0 V| –| 118| –
Effective output capacitance, time related b| Co(tr)| –| 429| –
Total gate charge| Qg| VGS = 10 V| ID = 17 A, VDS = 480 V| –| 88| 132| nC
Gate-source charge| Qgs| –| 22| –
Gate-drain charge| Qgd| –| 46| –
Turn-on delay time| td(on)| VDD = 480 V, ID = 17 A, VGS = 10 V, Rg = 9.1 W| –|
29| 58| ns
Rise time| tr| –| 61| 92
Turn-off delay time| td(off)| –| 78| 117
Fall time| tf| –| 32| 64
Gate input resistance| Rg| f = 1 MHz, open drain| 0.25| 0.5| 1| W
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol Showing the integral
reverse Gp – n junction diodes
| –| –| 32| A
Pulsed diode forward current| ISM| –| –| 80
Diode forward voltage| VSD| TJ = 25 °C, IS = 17 A, VGS = 0 V| –| 0.9| 1.2| V
Reverse recovery time| trr| TJ = 25 °C, IF = IS = 17 A,dI/dt = 100 A/μs, VR =
25 V| –| 455| 910| ns
Reverse recovery charge| Qrr| –| 8| 16| μC
Reverse recovery current| IRRM| –| 30| –| A
Notes
a. Costs (er) is a fixed capacitance that gives the same energy as Coss
while VDS is rising from 0 % to 80 % VDSS
b. Costs (tr) is a fixed capacitance that gives the same charging time as
Coss while VDS is rising from 0 % to 80 % VDSS
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Fig. 1 – Typical Output Characteristics
Fig. 2 – Typical Output Characteristics
Fig. 3 – Typical Transfer Characteristics
Fig. 4 – Normalized On-Resistance vs. Temperature
Fig. 5 – Typical Capacitance vs. Drain-to-Source Voltage
Fig. 6 – Coss and Eoss vs. VDS
Fig. 7 – Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 8 – Typical Source-Drain Diode Forward Voltage
Fig. 9 – Maximum Safe Operating Area
Fig. 10 – Maximum Drain Current vs. Case Temperature
Fig. 11 – Temperature vs. Drain-to-Source Voltage
Fig. 12 – Normalized Thermal Transient Impedance, Junction-to-Case
Fig. 13 – Switching Time Test Circuit
Fig. 14 – Switching Time Waveforms
Fig. 15 – Unclamped Inductive Test Circuit
Fig. 16 – Unclamped Inductive Waveforms
Fig. 17 – Basic Gate Charge Waveform
Fig. 18 – Gate Charge Test Circuit
Fig. 19 – For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91581.
Package Information
TO-263AB (HIGH VOLTAGE)
| MILLIMETERS| INCHES| | | MILLIMETERS| INCHES
---|---|---|---|---|---|---
DIM.| MIN.| MAX.| MIN.| MAX.| DIM.| MIN.|
MAX.| MIN.| MAX.
A| 4.06| 4.83| 0.160| 0.190| D1| 6.86| –| 0.270| –
A1| 0.00| 0.25| 0.000| 0.010| E| 9.65| 10.67| 0.380| 0.420
b| 0.51| 0.99| 0.020| 0.039| E1| 6.22| –| 0.245| –
b1| 0.51| 0.89| 0.020| 0.035| e| 2.54 BSC| 0.100 BSC
b2| 1.14| 1.78| 0.045| 0.070| H| 14.61| 15.88| 0.575| 0.625
b3| 1.14| 1.73| 0.045| 0.068| L| 1.78| 2.79| 0.070| 0.110
c| 0.38| 0.74| 0.015| 0.029| L1| –| 1.65| –| 0.066
c1| 0.38| 0.58| 0.015| 0.023| L2| –| 1.78| –| 0.070
c2| 1.14| 1.65| 0.045| 0.065| L3| 0.25 BSC| 0.010 BSC
D| 8.38| 9.65| 0.330| 0.380| L4| 4.78| 5.28| 0.188| 0.208
ECN: S-82110-Rev. A, 15-Sep-08 DWG: 5970
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994.
- Dimensions are shown in millimeters (inches).
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outmost extremes of the plastic body at datum A.
- Thermal PAD contour optional within dimension E, L1, D1 and E1.
- Dimension b1 and c1 apply to base metal only.
- Datum A and B to be determined at datum plane H.
- Outline conforms to JEDEC outline to TO-263AB.
RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead
Recommended Minimum Pads Dimensions in Inches/(mm)
Disclaimer
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References
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