IRL510 Vishay Siliconix Power Mosfet Owner’s Manual

June 22, 2024
VISHAY

IRL510 Vishay Siliconix Power Mosfet

FEATURES

  • Dynamic dV/dt rating
  • Repetitive avalanche rated
  • Logic-level gate drive
  • RDS(on) specified at VGS = 4 V and 5 V
  • 175 °C operating temperature
  • Fast switching
  • Ease of paralleling
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note: This datasheet provides information about parts that are RoHS- compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details

DESCRIPTION
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220AB package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO- 220AB contribute to its wide acceptance throughout the industry.

PRODUCT SUMMARY

VDS (V)| 100
RDS(on) (W)| VGS = 5.0 V| 0.54
Qg (Max.) (nC)| 6.1
Qgs (nC)| 2.6
Qgd (nC)| 3.3
Configuration| Single
ORDERING INFORMATION

Package| TO-220AB
Lead (Pb)-free| IRL510PbF
Lead (Pb)-free and halogen-free| IRL510PbF-BE3

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| LIMIT| UNIT
Drain-source voltage| VDS| 100| V
Gate-source voltage| VGS| ± 10
Continuous drain current| VGS at 5 V| TC = 25 °C| ID| 5.6|

A

TC = 100 °C| 4.0
Pulsed drain current a| IDM| 18
Linear derating factor|  | 0.29| W/°C
Single pulse avalanche energy b| EAS| 100| mJ
Repetitive avalanche current a| IAR| 5.6| A
Repetitive avalanche energy a| EAR| 4.3| mJ
Maximum power dissipation| TC = 25 °C| PD| 43| W
Peak diode recovery dV/dt c| dV/dt| 5.5| V/ns
Operating junction and storage temperature range| TJ, Tstg| -55 to +175| °C
Soldering recommendations (peak temperature) d| For 10 s|  | 300 d
Mounting torque| 6-32 or M3 screw|  | 10| lbf · in
1.1| N · m

Notes

  • a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
  • b. VDD = 25 V, starting TJ = 25 °C, L = 4.8 mH, Rg = 25 Ω, IAS = 5.6 A (see fig. 12)
  • c. ISD ≤ 5.6 A, dI/dt ≤ 75 A/μs, VDD ≤ VDS, TJ ≤ 175 °C
  • d. 1.6 mm from case

THERMAL RESISTANCE RATINGS

PARAMETER| SYMBOL| TYP.| MAX.| UNIT
Maximum junction-to-ambient| RthJA| –| 62|

°C/W

Case-to-sink, flat, greased surface| RthCS| 0.50| –
Maximum junction-to-case (drain)| RthJC| –| 3.5

Specfications

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER| SYMBOL| TEST CONDITIONS| MIN.| TYP.| MAX.| UNIT
Static
Drain-source breakdown voltage| VDS| VGS = 0 V, ID = 250 μA| 100| –| –| V
VDS temperature coefficient| DVDS/TJ| Reference to 25 °C, ID = 1 mA| –| 0.12| –| V/°C
Gate-source threshold voltage| VGS(th)| VDS = VGS, ID = 250 μA| 1.0| –| 2.0| V
Gate-source leakage| IGSS| VGS = ± 10 V| –| –| ± 100| nA

Zero gate voltage drain current

| IDSS| VDS = 100 V, VGS = 0 V| –| –| 25|

μA

VDS = 80 V, VGS = 0 V, TJ = 150 °C| –| –| 250

Drain-source on-state resistance

| RDS(on)| VGS = 5.0 V| ID = 3.4 Ab| –| –| 0.54| W
VGS = 4.0 V| ID = 2.8 Ab| –| –| 0.76
Forward transconductance| gfs| VDS = 50 V, ID = 3.4 Ab| 1.9| –| –| S
Dynamic
Input capacitance| Ciss| VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5| –| 250| –|

pF

Output capacitance| Coss| –| 80| –
Reverse transfer capacitance| Crss| –| 15| –
Total gate charge| Qg|

VGS = 5.0 V

|

ID = 5.6 A, VDS = 80 V see fig. 6 and 13b

| –| –| 6.1|

nC

Gate-source charge| Qgs| –| –| 2.6
Gate-drain charge| Qgd| –| –| 3.3
Turn-on delay time| td(on)| VDD = 50 V, ID = 5.6 A Rg = 12 W, RD= 8.4 W see fig. 10b| –| 9.3| –|

ns

Rise time| tr| –| 47| –
Turn-off delay time| td(off)| –| 16| –
Fall time| tf| –| 18| –
Internal drain inductance| LD| Between lead, 6 mm (0.25″) from package and center of die contact| G| DS|  | –| 4.5| –| nH
Internal source inductance| LS| –| 7.5| –
Drain-Source Body Diode Characteristics
Continuous source-drain diode current| IS| MOSFET symbol showing the integral reverse p – n junction diode| G|  | DS| –| –| 5.6|

A

Pulsed diode forward current a| ISM| –| –| 18
Body diode voltage| VSD| TJ = 25 °C, IS = 5.6 A, VGS = 0 Vb| –| –| 2.5| V
Body diode reverse recovery time| trr| TJ = 25 °C, IF = 5.6 A, dI/dt = 100 A/μsb| –| 110| 130| ns
Body diode reverse recovery charge| Qr| –| 0.50| 0.65| μC
Forward turn-on time| ton| Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes

  • a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
  • b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Peak Diode Recovery dv/dt Test Circuit

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91297.

Legal Disclaimer Notice

Disclaimer
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