IXYS DSEI60-10A Fast Recovery Epitaxial Diode Single Diode Owner’s Manual

June 1, 2024
IXYS

IXYS DSEI60-10A Fast Recovery Epitaxial Diode Single Diode

Product Description

Backside: cathode

Product Description

Features / Advantages

  • Planar passivated chips
  • Low leakage current
  • Very short recovery time
  • Improved thermal behaviour
  • Very low Irm-values
  • Very soft recovery behaviour
  • Avalanche voltage rated for reliable operation
  • Soft reverse recovery for low EMI/RFI
  • Low Irm reduces:
    • Power dissipation within the diode
    • Turn-on loss in the commutating switch

Applications

  • Antiparallel diode for high frequency switching devices
  • Anti Saturation diode
  • Snubber diode
  • Free wheeling diode
  • Rectifiers in switch mode power supplies (SMPS)
  • Uninterruptible power supplies (UPS)

Package: TO-247

  • Industry standard outline
  • RoHS compliant
  • Epoxy meets UL 94V-0

Disclaimer Notice

Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at Disclaimer Notice www.littelfuse.com/disclaimer- electronics.

Fast Diode

Fast Diode Ratings
Symbol **Definition
Conditions**
V RSM max. non-repetitive reverse blocking voltage
25°C
V RRM max. repetitive reverse blocking voltage
1000 V
I R reverse current, drain current VR = 1000 V
3 mA
VR = 800 V
V **F    ** forward voltage drop
2.30 V
IF = 120 A
IF =     60 A
IF = 120 A
I FAV average forward current TC = 80°C rectangular         d =
0.5
V F0 r F threshold voltage _for power loss calculation
only_ slope resistance
8 mΩ
R thJC thermal resistance junction to case
R thCH thermal resistance case to heatsink
P tot total power dissipation
I FSM max. forward surge current t = 10 ms; (50 Hz), sine;
0 V TVJ = 45°C
C J junction capacitance VR = 600 V f = 1 MHz
36
I RM ![Mathematical Formulas](https://manuals.plus/wp-
content/uploads/2024/05/werwerwer.png) TVJ = 25 °C
TVJ = 100 °C 23
t rr TVJ = 25 °C
TVJ = 100 °C 200
Package TO-247
--- ---
Symbol Definition
max. Unit
I RMS RMS current
T VJ virtual junction temperature
T op operation temperature
T stg storage temperature
Weight
M D mounting torque

F

C

| mounting force with clip| 20| 120| N

Product Marking

Ordering| Ordering Number| Marking on Product| Delivery Mode| Quantity| Code No.
---|---|---|---|---|---
Standard| DSEI60-10A| DSEI60-10A| Tube| 30| 434515
Similar Part| Package| Voltage class
---|---|---
DSEI60-12A| TO-247AD (2)| 1200
Equivalent Circuits for Simulation| * on die level| TVJ = 1500° C
---|---|---
| Fast Diode|
V0 max| 1.44| V
R0 max| 5.5| mΩ

Outlines TO-247

Outlines TO-247

Sym.

|

Inches

min.     max.

|

Millimeter min.     max.

---|---|---
A| 0.185| 0.209| 4.70| 5.30
A1| 0.087| 0.102| 2.21| 2.59
A2| 0.059| 0.098| 1.50| 2.49
D| 0.819 0.845| 20.79 21.45
E| 0.610 0.640| 15.48 16.24
E2| 0.170 0.216| 4.31     5.48
e| 0.430 BSC| 10.92 BSC
L| 0.780 0.800| 19.80 20.30
L1| –       0.177| –         4.49
Ø P| 0.140 0.144| 3.55     3.65
Q| 0.212 0.244| 5.38     6.19
S| 0.242 BSC| 6.14 BSC
b| 0.039| 0.055| 0.99| 1.40
b2| 0.065| 0.094| 1.65| 2.39
b4| 0.102| 0.135| 2.59| 3.43
c| 0.015| 0.035| 0.38| 0.89
D1| 0.515| –| 13.07| –
D2| 0.020| 0.053| 0.51| 1.35
E1| 0.530| –| 13.45| –
Ø P1| –| 0.29| –| 7.39

Fast Diode

  • Fig. 1 Forward current IF versus max. forward voltage drop VF
    Fast Diode

  • Fig. 2 Typ. reverse recov. charge Qr versus -diF /dt
    Fast Diode

  • Fig. 3 Typ. peak reverse current IRM versus -diF /dt
    Fast Diode

  • Fig. 4 Dynamic parameters Qr, IRM versus TVJ
    Fast Diode

  • Fig. 5 Typ. recovery time trr versus -diF/dt
    Fast Diode

  • Fig. 6 Typ. peak forward voltage VFR and tfr versus diF /d
    Fast Diode

  • Fig. 7 Transient thermal impedance junction to case
    Fast Diode

| Constants for ZthJC| calculation:
---|---|---
I| Rthi (K/W)| ti (s)
1| 0.080| 0.0018
2| 0.120| 0.0100
3| 0.100| 0.5000
4| 0.200| 0.0800

IXYS reserves the right to change limits, conditions and dimensions

Data according to IEC 60747 and per semiconductor unless otherwise specified

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References

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