IXYS DSEI60-10A Fast Recovery Epitaxial Diode Single Diode Owner’s Manual
- June 1, 2024
- IXYS
Table of Contents
IXYS DSEI60-10A Fast Recovery Epitaxial Diode Single Diode
Product Description
Backside: cathode
Features / Advantages
- Planar passivated chips
- Low leakage current
- Very short recovery time
- Improved thermal behaviour
- Very low Irm-values
- Very soft recovery behaviour
- Avalanche voltage rated for reliable operation
- Soft reverse recovery for low EMI/RFI
- Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Applications
- Antiparallel diode for high frequency switching devices
- Anti Saturation diode
- Snubber diode
- Free wheeling diode
- Rectifiers in switch mode power supplies (SMPS)
- Uninterruptible power supplies (UPS)
Package: TO-247
- Industry standard outline
- RoHS compliant
- Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at Disclaimer Notice www.littelfuse.com/disclaimer- electronics.
Fast Diode
Fast Diode | Ratings |
---|---|
Symbol | **Definition |
Conditions** | |
V RSM | max. non-repetitive reverse blocking voltage |
25°C | |
V RRM | max. repetitive reverse blocking voltage |
1000 | V |
I R | reverse current, drain current VR = 1000 V |
3 | mA |
VR = 800 V | |
V **F | ** forward voltage drop |
2.30 | V |
IF = 120 A | |
IF = 60 A | |
IF = 120 A | |
I FAV | average forward current TC = 80°C rectangular d = |
0.5 | |
V F0 r F | threshold voltage _for power loss calculation |
only_ slope resistance | |
8 | mΩ |
R thJC | thermal resistance junction to case |
R thCH | thermal resistance case to heatsink |
P tot | total power dissipation |
I FSM | max. forward surge current t = 10 ms; (50 Hz), sine; |
0 V | TVJ = 45°C |
C J | junction capacitance VR = 600 V f = 1 MHz |
36 | |
I RM | ![Mathematical Formulas](https://manuals.plus/wp- |
content/uploads/2024/05/werwerwer.png) | TVJ = 25 °C |
TVJ = 100 °C | 23 |
t rr | TVJ = 25 °C |
TVJ = 100 °C | 200 |
Package | TO-247 |
--- | --- |
Symbol | Definition |
max. | Unit |
I RMS | RMS current |
T VJ | virtual junction temperature |
T op | operation temperature |
T stg | storage temperature |
Weight | |
M D | mounting torque |
F
C
| mounting force with clip| 20| 120| N
Product Marking
Ordering| Ordering Number| Marking on Product| Delivery
Mode| Quantity| Code No.
---|---|---|---|---|---
Standard| DSEI60-10A| DSEI60-10A| Tube| 30| 434515
Similar Part| Package| Voltage class
---|---|---
DSEI60-12A| TO-247AD (2)| 1200
Equivalent Circuits for Simulation| * on die level| TVJ = 1500° C
---|---|---
| Fast Diode|
V0 max| 1.44| V
R0 max| 5.5| mΩ
Outlines TO-247
Sym.
|
Inches
min. max.
|
Millimeter min. max.
---|---|---
A| 0.185| 0.209| 4.70| 5.30
A1| 0.087| 0.102| 2.21| 2.59
A2| 0.059| 0.098| 1.50| 2.49
D| 0.819 0.845| 20.79 21.45
E| 0.610 0.640| 15.48 16.24
E2| 0.170 0.216| 4.31 5.48
e| 0.430 BSC| 10.92 BSC
L| 0.780 0.800| 19.80 20.30
L1| – 0.177| – 4.49
Ø P| 0.140 0.144| 3.55 3.65
Q| 0.212 0.244| 5.38 6.19
S| 0.242 BSC| 6.14 BSC
b| 0.039| 0.055| 0.99| 1.40
b2| 0.065| 0.094| 1.65| 2.39
b4| 0.102| 0.135| 2.59| 3.43
c| 0.015| 0.035| 0.38| 0.89
D1| 0.515| –| 13.07| –
D2| 0.020| 0.053| 0.51| 1.35
E1| 0.530| –| 13.45| –
Ø P1| –| 0.29| –| 7.39
Fast Diode
-
Fig. 1 Forward current IF versus max. forward voltage drop VF
-
Fig. 2 Typ. reverse recov. charge Qr versus -diF /dt
-
Fig. 3 Typ. peak reverse current IRM versus -diF /dt
-
Fig. 4 Dynamic parameters Qr, IRM versus TVJ
-
Fig. 5 Typ. recovery time trr versus -diF/dt
-
Fig. 6 Typ. peak forward voltage VFR and tfr versus diF /d
-
Fig. 7 Transient thermal impedance junction to case
| Constants for ZthJC| calculation:
---|---|---
I| Rthi (K/W)| ti (s)
1| 0.080| 0.0018
2| 0.120| 0.0100
3| 0.100| 0.5000
4| 0.200| 0.0800
IXYS reserves the right to change limits, conditions and dimensions
Data according to IEC 60747 and per semiconductor unless otherwise specified