IXYS DSEP60-12AR HiPerFRED High Performance Fast Recovery Diode Owner’s Manual

June 1, 2024
IXYS

IXYS DSEP60-12AR HiPerFRED High Performance Fast Recovery Diode

IXYS DSEP60-12AR HiPerFRED High Performance Fast Recovery
Diode

Important Information

VRRM = 1200V
IFAV = 60A
trr = 40ns

High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode

Part number

DSEP60-12AR

Backside: isolated

Features
Features

Features / Advantages

  • Planar passivated chips
  • Very low leakage current
  • Very short recovery time
  • Improved thermal behaviour
  • Very low Irm-values
  • Very soft recovery behaviour
  • Avalanche voltage rated for reliable operation
  • Soft reverse recovery for low EMI/RFI
  • Low Irm reduces:
  • Power dissipation within the diode
  • Turn-on loss in the commutating switch

Applications

  • Antiparallel diode for high frequency switching devices
  • Antisaturation diode
  • Snubber diode
  • Free wheeling diode
  • Rectifiers in switch mode power supplies (SMPS)
  • Uninterruptible power supplies (UPS)

Package ISOPLUS247

  • Isolation Voltage: V~
  • Industry standard outline
  • RoHS compliant
  • Epoxy meets UL 94V-0
  • Soldering pins for PCB mounting
  • Backside: DCB ceramic
  • Reduced weight
  • Advanced power cycling

Disclaimer Notice

Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimerelectronics

Fast Diode

Fast Diode Ratings
Symbol **Definition
Conditions**
V RSM max. non-repetitive reverse blocking voltage
25°C
V RRM max. repetitive reverse blocking voltage
1200 V
I R reverse current, drain current VR = 1200 V
650 µA
VR = 1200 V
V F forward voltage drop IF =     60 A
IF = 120 A
IF =     60 A
IF = 120 A
I FAV average forward current TC =  85°C

rectangular                           d = 0.5

| | TVJ = 175°C| | | 60| A
V F0

r F

| threshold voltage

slope resistance for power loss calculation only

| | TVJ = 175°C| | | 1,08| V
9,4| mΩ
R thJC| thermal resistance junction to case| | | | | 0,65| K/W
R thCH| thermal resistance case to heatsink| | | | 0,25| | K/W
P tot| total power dissipation| | TC = 25°C| | | 230| W
I FSM| max. forward surge current t = 10 ms; (50 Hz), sine;| VR = 0 V| TVJ = 45°C| | | 500| A
C J| junction capacitance VR = 600 V f = 1 MHz| | TVJ = 25°C| | 30| | pF
I RM| max. reverse recovery current| | TVJ = 25 °C| | 13| | A
| IF =    60 A; VR = 600 V| | TVJ = 100°C| 20| A
t rr| reverse recovery time -diF /dt = 200 A/µs| | TVJ = 25 °C| | 80| | ns
| | | TVJ = 100°C| 220| ns
Package| ISOPLUS247| Ratings
---|---|---
Symbol| Definition Conditions| | min.| typ.| max.| Unit
I RMS| RMS current per terminal| | | | 70| A
T VJ| virtual junction temperature| | -55| | 175| °C
T op| operation temperature| | -55| | 150| °C
T stg| storage temperature| | -55| | 150| °C
Weight| | 6| | g
F C| mounting force with clip| | 20| | 120| N
d Spp/App| creepage distance on surface | striking distance through air| terminal to terminal| 5,4| | | mm
d Spb/Apb| | terminal to backside| 4,1| mm
V

ISOL

| isolation voltage t = 1 second t = 1 minute|

50/60 Hz, RMS; IISOL ≤ 1 mA

| 3600| | | V
3000| V

Product Marking

Product Marking

Ordering| Ordering Number| Marking on Product| Delivery Mode| Quantity| Code No.
---|---|---|---|---|---
Standard| DSEP60-12AR| DSEP60-12AR| Tube| 30| 481939
Similar Part| Package| Voltage class
---|---|---
DSEP60-12A| TO-247AD (2)| 1200
DHG60I1200HA| TO-247AD (2)| 1200
DSEP60-12B| TO-247AD (2)| 1200
Equivalent Circuits for Simulation| | on die level| T = V 175°C
---|---|---|---
| Fast Diode| |
V0 max threshold voltage| 1,08| | V
R0 max slope resistance
| 6,8| | mΩ

Outlines ISOPLUS247

Dim. Millimeter Inches
min max min
A 4.83 5.21
A1 2.29 2.54
A2 1.91 2.16
b 1.14 1.40
b2 1.91 2.20
b4 2.92 3.24
c 0.61 0.83
D 20.80 21.34
D1 15.75 16.26
D2 1.65 2.15
D3 20.30 20.70
E 15.75 16.13
E1 13.21 13.72
e 10.90 BSC 0.429 BSC
L 19.81 20.60
L1 3.81 4.38
Q 5.59 6.20
R 4.25 5.50
W 0.10

The convex bow of substrate is typ. < 0.04 mm over plastic surface level of device bottom side
This drawing will meet all dimensions requirement of JEDEC outline TO-247 AD except screw hole and except Lmax.

Dimension
Features

Fast Diode

  • Fig. 1 Forward current IF versus VF
    Fast Diode

  • Fig. 2 Typ. reverse recov. charge Qr versus -diF /dt
    Fast Diode

  • Fig. 3 Typ. peak reverse current IRM versus -diF /dt
    Fast Diode

  • Fig. 4 Typ. dynamic parameters Qr, IRM versus TVJ
    Fast Diode

  • Fig. 5 Typ. recovery time trr versus -diF /dt
    Fast Diode

  • Fig. 6 Typ peak forward voltage VFR and tfr versus diF /dt
    Fast Diode

  • Fig. 7 Transient thermal resistance junction to case
    Fast Diode

Constants for ZthJC calculation:

i Rthi (K/W) ti (s)
1 0.0500 0.0020
2 0.1000 0.0050
3 0.2000 0.0400
4 0.3000 0.1800

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References

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