xiamen HS501003 Bluetooth Module User Manual

June 13, 2024
Xiamen

xiamen HS501003 Bluetooth Module

Product Information

HS5010-03 Bluetooth Module Specification V1.0

  1. 1. Product Characteristics:
    • Based on LE5010 Bluetooth low energy research and development
    • Supports private APP access and 2.4G remote control access
    • Bluetooth module designed with Bluetooth 5.0 low energy design
    • Working voltage: 1.8~3.6V
    • Working temperature: -40 degrees ~ +80 degrees (commercial specifications)
    • SMD package
  2. Bluetooth Features:
  * BLE5.0/5.1 support
  * Supports data rates of 125Kbps, 500Kbps, 1Mbps, and 2Mbps
  * Receiving sensitivity: -99.7dBm @1Mbps, -96dBm @2Mbps, -105dBm @125Kbps
  * Transmission power: maximum +12dBm (max)
  * Link gain: 117@125Kbps (max)
  * SUPPORT FOR SIG MESH, PRIVATE MESH AND BLE
3. MCU Features:
  * 32BIT CPU CORE
  * Up to 64M main frequency
  * Maximum 64KB SRAM
  * MAX 512 FLASH
  * RX mode: 4.5mA, TX mode: 4.3mA @0DB
  * Deep sleep: 1.1UA (GPIO+RTC wake-up)
  * ShutDOWN: 700NA (GPIO wake-up)
  * Real-time clock RTC
  * Peripheral interface: UART
  * All IOs support function mapping
4. Scope of Application:
  * LED intelligent control
  * Smart home appliances
  * Exercise Health
  * Sports wearable
  * Logistics label
  * Consumer products
5. Electrical Parameters:
  * Voltage:
    * Supply voltage: 1.7V (MIN) – 3.3V (TYP) – 3.6V (MAX)
    * I/0 voltage: 0V (MIN) – 3.3V (TYP) – 3.6V (MAX)
  * Operating temperature: -40 degrees (MIN) – +85 degrees (MAX)
  * Storage temperature: -40 degrees (MIN) – +125 degrees (MAX)
  * Power consumption:
    * RX mode: 4.5mA (TYP)
    * TX mode @0DB: 4.3mA (TYP)
    * Deep sleep (GPIO+RTC): 1.1UA (TYP)
    * ShutDOWN (GPIO): 700NA (TYP)
6. Module Shape and Interface:
  * HS5010-03 (small-size module)
  * Size: 18X10X2.6mm (L*W*H)
  * Pin Definitions:
Pin Name Description
GND Ground
PB15 GPIO/low-power wake-up pin/continuous low level into sleep;

High-level wake-up; There is a pull-up inside the dangling, which
wakes up by default indicates Bluetooth connection status; BLE or
SPP is connected and the output is high BLE and SPP are not
connected, and the output is low
PA00| Serial port data input UART_RX
PA01| Serial port data output UART_TX
PA02| Operating voltage range 1.8-3.6V GPIO
VCC| Operating voltage range 1.8-3.6V
PA14| All IOs support function mapping

Schematic : Confidential
Contact Us: mailas1@hosotech.com

FCC Statement: FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Device is equipped with PCB antenna, Antenna gain 3dBi

Product Usage Instructions

  • Power Supply:
    • Try to use a clean power supply with ripple control within 30.
  • Antenna:
    • The module can choose the on-board antenna or the external wire antenna.
    • When laying the patch or board, ensure there is complete headroom for the antenna, and do not lay copper and wire in its vicinity.
    • The side of the IC on the module should not face the high-frequency components on the drive, but the outside of the drive board.
    • The module should be placed far away from high-frequency components on the drive.
    • Consider the antenna placement of the module during the PCB layout of the driver.
    • For modules with welding antennas, there are front-welding and back-welding methods. If the module with the front welding antenna is not well placed during layout, consider using the module with back welding antenna.

 product features

  1. Based on LE5010 Bluetooth low energy research and development
  2. Support private APP access, 2.4G remote control access
  3. Bluetooth module designed with Bluetooth 5.0 low energy design
  4. Working voltage: 1.8~3.6V
  5. Working temperature: -40 degrees ~ +80 degrees (commercial specifications)
  6. SMD package

Bluetooth features:

  1. BLE5.0/5.1
  2. Support 125Kbps/500Kbps/1Mbps/2Mbps
  3. Receiving sensitivity: -99.7dBm @1Mbps
    • 96dBm @2Mbps
    • 105dBm @125Kbps
  4. Transmission power: maximum +12dBm (max)
  5. Link gain 117@125Kbps (max.)
  6. SUPPORT FOR SIG MESH, PRIVATE MESH AND BLE

MCU features:

  1. 32BIT CPU CORE
  2. Up to 64M main frequency
  3. Maximum 64KB SRAM
  4. MAX 512 FLASH
  5. RX mode: 4.5mA
  6. TX mode: 4.3mA @0DB
  7. Deep sleep: 1.1UA (GPIO+RTC wake-up)
  8. ShutDOWN: 700NA (GPIO wake-up)
  9. Real-time clock RTC
  10. peripheral interface: UART
  11. All IOs support function mapping,

Scope of application:

  1. LED intelligent control
  2. Smart home appliances
  3. Exercise health
  4. Sports wearable
  5. Logistics label
  6. Consumer products

Electrical parameters

Voltage

  MIN TYP MAX Unit
Supply voltage 1.7 3.3 3.6 V
I/0 voltage 0 ~ 3.6 V

Operating


temperature

| -40| ~| +85| degree
Storage


temperature

| -40| ~| +125| degree

Power consumption

  TYP unit
RX     MODE 4.5 mA
TX MODE@0DB 4.3 mA
Deep sleep 1.1UA(GPIO+RTC) uA
ShutDOWN 700NA(GPIO) nA

module shape and interface

  • 1, HS5010-03 (small size module)
  • Size: 18X10X2.6mm (LWH)

Definition

PIN Pin Name Pin Name
1 GND GND
2 PB15 **GPIO/low-power wake-up pin/continuous low level into

sleep; High-level wake-up; There is a pull-up inside the dangling, which**

wakes up by default

3| PA00| indicates Bluetooth connection status; BLE or SPP is connected and the output is high

BLE and SPP are not connected, and the

output is low

4| PA01| serial port data input UART_RX
5| PA02| PA02 serial port data output UART_TX
6| GND| GND
7| VCC| Operating voltage range 1.8-3.6V
8| PA14| GPIO

The schematic

Confidential
Notes:

  1. power supply, try to use a clean power supply, ripple control within 30mV
  2. Antenna
  3. The module can choose the on-board antenna or the external wire antenna, when laying the patch when laying the board, it is necessary to achieve complete headroom for the antenna, do not lay copper and wire;
  4. The side of the IC on the module cannot face the high-frequency components on the drive, but the outside of the drive board;
  5. The module should be far away from the high-frequency components on the drive;
  6.  The antenna placement of the module should be taken into account when the PCB layout of the driver is carried out;
  7. For the module of the welding antenna, there are front welding and back welding methods, if the module of the front welding antenna is not well placed during the layout, you can consider using the module of the back welding antenna

Contact Us

mailas1@hosotech.com

FCC Statement

FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247
The device is equipped with a PCB antenna, Antenna gain 3dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Note : This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and the receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2BCGR-HS501003 Or Contains FCC ID: 2BCGR-HS501003”
When the module is installed inside another device, the user manual of the host must contain below warning statements;

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

  1. This device may not cause harmful interference;
  2. This device must accept any interference received, including interference that may cause undesired operation.

Note : This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and the receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product.
Any company of the host device which installs the modular with modular approval should perform the test of radiated & conducted emission and spurious emission, etc. according to FCC part 15C: 15.247 and 15.209 & 15.207,15B Class B requirement, Only if the test result complies with FCC part 15C: 15.247 and 15.209 & 15.207,15B Class B requirement then the host can be sold legally.

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