Guangzhou YOOAI-T1 2.4GHz Wi-Fi and BLE5.0 Combo Module User Manual

Guangzhou YOOAI-T1 2.4GHz Wi-Fi and BLE5.0 Combo Module

Product Information

General

• Chip: ESP32-C3
• Module Size:18mm25.5mm3mm
• 4MByte embedded flash (default)
• 384KB ROM
• 400KB SRAM
• SPI;
• EN ;
• PWM x 6 ;
• ADC

Wi-Fi Features

• IEEE 802.11 b/g/n-compliant
• Center frequency range of operating channel: 2412 ~ 2484 MHz
• Supports 20 MHz, 40 MHz bandwidth in 2.4
• GHz band
• 1T1R mode with data rate up to 150 Mbps
• TX/RX A-MPDU, TX/RX A-MSDU
• Immediate Block ACK
• Fragmentation and defragmentation
• Automatic Beacon monitoring (hardware TSF)
• 4 X virtual Wi-Fi interfaces
• Simultaneous support for Infrastructure BSS in Station mode, Soft-AP mode, Station +Soft-AP mode, and promiscuous mode

Bluetooth Features

• Bluetooth LE: Bluetooth 5, Bluetooth mesh
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• Advertising extensions
• Multiple advertisement sets
• Channel selection algorithm #2

Peripheral Interfaces

• GPIO * 15;
• UART * 2;
• IIC
• SPI;
• EN ;
• PWM x 6 ;
• ADC;

Applications

• Serial transparent transmission;
• Wi-Fi prober;
• Smart power plug/Smart LED light;
• Mesh networks;
• Sensor networks;
• Over-the-top (OTT) devices;
• Wireless location system beacon;
• Industrial field bus;

Module Type

Name

|

Antenna Type

---|---
YOOAI- T1| PCB ANT
YOOAI-T1 -E| U.FL Ipex

Module Structure

Update Record

Date

| Version|

Update

---|---|---
2023-02-20| V1.0| First released

Introduction

• YOOAI-T1 Wi-Fi and BLE coexistence Module is a highly integrated single-chip low power 802. 11bgn Wireless LAN (WLAN) network controller. It combines a RISC CPU, WLAN MAC, a 1T1R capable WLAN baseband, RF, and Bluetooth in a single chip. It also provides a bunch of configurable GPIO, which are configured as digital peripherals for different applications and control usage.
• YOOAI-T1 Module use ESP32-C3 as Wi-Fi and BLE coexistence SOC chip.
• YOOAI-T1 Module integrates internal memories for complete Wi-Fi protocol functions. The embedded memory configuration also provides convenient application developments.
• YOOAI-T1 module supports the standard IEEE802.11 b/g/n/e/i protocol and the complete TCP/IP protocol stack. User can use it to add the Wi-Fi function for the installed devices, and also can be viewed as an independent network controller. Anyway, YOOAI-T1 Wi-Fi module provides many probabilities with the best price.

Fig.1.1 YOOAI-T1 Module Structure

Technical parameters for YOOAI-T1 are listed as follows.

Table.1.1 YOOAI-T1 Parameters

Type

| Item|

Parameter

---|---|---
Wi-Fi| Frequency| 2.4G~2.5G (2412M~2484M)
Transmit power| 802.11b: +20.5 dBm
802.11g: +19 dBm
802.11n: +17.5 dBm
Receiver sensitivity| 802.11b: -89 dBm (11Mbps)
802.11g: -77 dBm（54Mbps）
802.11n: -74 dBm（MCS7）
EVM| -25dB @802.11b,11Mbps @21dBm
-28dB @802.11n,54Mbps @19dBm
-30dB @802.11n,HT40,MCS7 @18.5dBm
Antenna| PCB antenna / U.FL
BLE| RF power control range| -27~18dBm
Hardware| CPU| 32-bit RISC CPU
Interface| UART/SDIO/SPI/I2C/GPIO/PWM
Working voltage| 3.0V ~ 3.6V
Working temperature| -40°C ~ 85°C
Environment temperature| -40°C ~ 105°C
Shape| 18mm x 25.5mm x 3mm
Software| Wi-Fi working mode| STA, Soft-AP and sniffer modes
Security mode| WPS / WEP / WPA / WPA2 / WPA3
Update firmware| UART Download
Software develop| SDK
Network protocol| IPv4, TCP/UDP/HTTP/FTP/MQTT

Interface Definition

YOOAI-T1 Wi-Fi & BLE module interface definition is shown as below。

Fig.2.1 YOOAI-T1 Pins Definition

Working modes and pins function is shown in Table 2.1.

Table.2.1Working Mode

Mode

|

IO9 Voltage Level

---|---
UART Download Mode| LOW
Flash Boot Mode| HIGH (Default)

Table.2.2 Pins Function Definition

EFUSE_JTAG_SEL_ENABLE is 0, JTAG signals cannot be used.   1, if IO10 is 0, JTAG signals come from chip pins; if IO10 is 1, JTAG signals cannot be used
17| SPIHD| I/O| SPIHD, GPIO12, Connect With Internal Flash
18| SPIWP| I/O| SPIWP, GPIO13, Connect With Internal Flash
19| SPICS| I/O| SPICS, GPIO14, Connect With Internal Flash
20| SPICLK| I/O| SPICLK, GPIO15, Connect With Internal Flash
21| SPIQ| I/O| SPIQ, GPIO17, Connect With Internal Flash
22| SPID| I/O| SPID, GPIO16, Connect With Internal Flash
25| IO9| I/O| GPIO9
30| IO18| I/O| GPIO18,USB-D-
31| IO19| I/O| GPIO19,USB-D+
34| RX0| I/O| GPIO20,U0RXD
35| TX0| I/O| GPIO21,U0TXD

Size and Layout

Size for YOOAI-T1 can be shown as follows.

Fig.3.1 Shape for YOOAI-T1

• (a) Vertical View

Fig.3.2 Size for YOOAI-T1

• (b) Side View

Fig. 3.3 PCB Layout for YOOAI-T1

Electronica Characteristics

Table.4.1 Electronica Characteristics

Parameter

| Condition| Min| Classical| Max|

Unit

---|---|---|---|---|---
Store Temperature| –| -40| Normal| 150| ℃
Sold Temperature| IPC/JEDEC J-STD-020| –| –| 260| ℃
Working Voltage| –| 3.0| 3.3| 3.6| V

I/O

| VIL| –| -0.3| –| 0.25VDD| V
VIH| –| 0.75VDD| –| VDD+0.3
VOL| –| –| –| 0.1VDD
VOH| –| 0.8VDD| –| –
Electrostatic           Release Quantity (Human model)| TAMB=25℃| –| –| 2| KV
---|---|---|---|---|---
Electrostatic           Release Quantity (Machine model)| TAMB=25℃| –| –| 0.5| KV

 Power Consumption

Table.5.1 Power Consumption

Parameter| Min| Classical| Max|

Unit

---|---|---|---|---
RX    11b /g/n, HT20| –| –| 82| mA
RX    11n, HT40| | –| 84| mA
TX    11b, 1Mbps @21dBm| | –| 350| mA
TX    11g, 54Mbps @19dBm| –| –| 295| mA
TX    11n, HT20, MCS7, @18.5dBm| –| –| 290| mA
TX    11n, HT40, MCS7, @18.5dBm| –| –| 290| mA
Modem-sleep, CPU is powered on @80MHz| –| 15| –| mA
Light-sleep| –| 130| –| uA
Deep-sleep, RTC timer + RTC memory| –| 5| –| uA
Power off, CHIP_PU is set to low level| –| 1| 0| uA

The peak current consumption of YOOAI-T1 exceed 400mA when the module start work (RF calibration work consumes maximum current). Therefore, the recommended power supply is no less than 500mA.
Note

1. Active Mode: CPU and RF are all turned on.
2. Modem-sleep Mode : CPU is turned on. RF and baseband are turned off, but the communication is still connected.
3. Light-sleep Mode: CPU is turned off. RTC/external interrupt/MAC can wake up the chip. The communication is still connected.
4. Deep-sleep Mode : Only RTC is turned on.

Wi-Fi RF Characteristics

The data in the following table is gotten when voltage is 3.3V in the indoor temperature environment.

Parameter

| Min| Classical| Max|

Unit

---|---|---|---|---
Input frequency| 2412| –| 2484| MHz
802.11b @1Mbps,11Mbps| –| 20.5| –| dBm
802.11g @6Mbps| –| 20.0| –| dBm
802.11g @54Mbps| –| 18.0| –| dBm
802.11n,HT20 MCS0| –| 19.0| –| dBm
802.11n,HT40 MCS0| –| 18.5| –| dBm
EVM @11b,1Mbps@20dBm| –| -24.5| –| dBm
EVM @11g,54Mbps@19dBm| –| -28| –| dBm
EVM @11n,MCS7@18.5dBm| –| -30| –| dBm
EVM @11n, HT40, MCS7@18.5dBm| –| -30.5| –| dBm

Table.6.2 Wi-Fi RX Sensitivity

Parameter

| Min| Classical| Max|

Unit

---|---|---|---|---
802.11b,1Mbps| –| -98| –| dBm
802.11b,11Mbps| –| -88| –| dBm
802.11g,6Mbps| –| -92| –| dBm
802.11g,54Mbps| –| -76| –| dBm
802.11n,HT20,MCS0| –| -92| –| dBm
802.11n,HT20,MCS3| –| -85| –| dBm
802.11n,HT20,MCS7| –| -74| –| dBm
802.11n,HT40,MCS0| –| -90| –| dBm
802.11n,HT40,MCS3| –| -81| –| dBm
802.11n,HT40,MCS7| –| -71| –| dBm

Table.6.3 Wi-Fi RX Characteristics

Parameter| Min| Classical| Max|

Unit

---|---|---|---|---
MAX RX Level @11b,1Mbps| –| 5| –| dBm
MAX RX Level @11b,11Mbps| –| 5| –| dBm
MAX RX Level @11g,6Mbps| –| 5| –| dBm
---|---|---|---|---
MAX RX Level @11g,54Mbps| –| 0| –| dBm
MAX RX Level @11n,HT20,MCS0| –| 5| –| dBm
MAX RX Level @11n,HT20,MCS7| –| 0| –| dBm
MAX RX Level @11n,HT40,MCS0| –| 5| –| dBm
MAX RX Level @11n,HT40,MCS7| –| 0| –| dBm
RX Adjacent Channel Rejection@11b,1Mbps| –| 35| –| dB
RX Adjacent Channel Rejection@11b,11Mbps| –| 35| –| dB
RX Adjacent Channel Rejection@11g,6Mbps| –| 31| –| dB
RX Adjacent Channel Rejection@11g,54Mbps| –| 14| –| dB
RX Adjacent Channel Rejection@11n,HT20,MCS0| –| 31| –| dB
RX Adjacent Channel Rejection@11n,HT20,MCS7| –| 13| –| dB
RX Adjacent Channel Rejection@11n,HT40,MCS0| –| 19| –| dB

Bluetooth LE Radio

Table.7.1 TX Transmitter General Characteristics

Parameter| Min| Classical| Max|

Unit

---|---|---|---|---
Gain control power| –| 3| –| dBm
RF power control range| -27| –| 18| dBm
In-band emissions @F-F0±3MHz, LE 1M| –| -41.95| –| dBm
In-band emissions @F-F0±>3MHz, LE 1M| –| -44.48| –| dBm
Modulation characteristics @ △f1avg, LE 1M| –| 245| –| kHz
Modulation characteristics @△f2max, LE 1M| –| 208| –| kHz
Carrier frequency offset, LE 1M| –| -9| –| kHz
In-band emissions @F-F0±5MHz, LE 2M| –| -45.26| –| dBm
In-band emissions @F-F0±>5MHz, LE 2M| –| -47| –| dBm
Modulation characteristics @ △f1avg, LE 2M| –| 497| –| kHz
Modulation characteristics @△f2max, LE 2M| –| 398| –| kHz
Carrier frequency offset, LE 2M| –| -9| –| kHz
In-band emissions @F-F0±3MHz, LE 500K| –| -41.3| –| dBm
In-band emissions @F-F0±>3MHz, LE 500K| –| -42.8| –| dBm
---|---|---|---|---
Modulation characteristics @ △f1avg, LE 500K| –| 220| –| kHz
Modulation characteristics @△f2max, LE 500K| –| 205| –| kHz
Carrier frequency offset, LE 500K| –| -11.9| –| kHz
Maximum received signal @30.8% PER| –| 10| –| dBm

Table.7.2 RX Transmitter General Characteristics

Parameter

| Min| Classical| Max|

Unit

---|---|---|---|---

1

M

| Sensitivity @30.8% PER| –| -96| –| dBm
Maximum received signal @30.8% PER| –| 10| –| dBm
Co-channel C/I| –| 8| –| dB
Image frequency| –| -29| –| dB
Adjacent channel to image frequency @F =Fimage+1| –| -38| –| dB
Adjacent channel to image frequency @F =Fimage-1| –| -34| –| dB
Adjacent channel selectivity @ F =F0+1| –| -4| –| dB
Adjacent channel selectivity @ F =F0-1| –| -3| –| dB
Adjacent channel selectivity @ F ≥F0+3| –| –| –| dB
Adjacent channel selectivity @ F ≤F0-3| –| -39| –| dB

2

M

| Sensitivity @30.8% PER| –| -93| –| dBm
Maximum received signal @30.8% PER| –| 0| –| dBm
Co-channel C/I| –| 10| –| dB
Image frequency| –| -27| –| dB
Adjacent channel to image frequency @F =Fimage+2| –| -39| –| dB
Adjacent channel to image frequency @F =Fimage-2| –| –| –| dB
Adjacent channel selectivity @ F =F0+2| –| -7| –| dB
Adjacent channel selectivity @ F =F0-2| –| -7| –| dB
Adjacent channel selectivity @ F ≥F0+6| –| -39| –| dB
Adjacent channel selectivity @ F ≤F0-6| –| -39| –| dB

1

2

5

K

| Sensitivity @30.8% PER| –| -104| –| dBm
Maximum received signal @30.8% PER| –| 10| –| dBm
Co-channel C/I| –| 2| –| dB
| Image frequency| –| -34| –| dB
---|---|---|---|---|---
Adjacent channel to image frequency @F =Fimage+1| –| -44| –| dB
Adjacent channel to image frequency @F =Fimage-1| –| -37| –| dB
Adjacent channel selectivity @ F =F0+2| –| -40| –| dB
Adjacent channel selectivity @ F =F0-2| –| -42| –| dB
Adjacent channel selectivity @ F ≥F0+3| –| –| –| dB
Adjacent channel selectivity @ F ≤F0-3| –| -46| –| dB

Recommended Sold Temperature Curve

1. Reflow Times <= 2 times (Max.)
2. Max Rising Slope: 3℃/sec
3. Max Falling Slope: -3℃/sec
4. Over 217℃ Time: 60~120sec
5. Peak Temp:240℃~250℃

Fig.8.1 Recommended Reflow Profile

Minimum User System

This module can work just at 3.3V voltage condition

Fig.9.1 Minimum System

Note

1. The working voltage for module is DC 3.3V;
2. The max current from IO of this module is 40mA;
3. Wi-Fi module is at download mode: IO9 is LOW level, then module reset to power;
4. Wi-Fi module is connected to RXD of the other MCU, and TXD is connected to RXD of the other MCU.

Recommended Layout Design

YOOAI-T1 module can be sold on PCB board directly. For the high RF performance for the device , please notice the placement of the module. There are three ways to use the module for Wi-Fi Module with PCB antenna.

1. Solution 1: optical solution. The Wi-Fi module is placed on the side of the board, and the antennas are all exposed, and there is no metal material around the antenna, including wires, metal casings, weight plates, and the like.
2. Solution 2: sub-optical solution. The Wi-Fi module is placed on the side of the board, and the antenna below is hollowed out. There is a gap of not less than 5 mm reserved with the PCB, and there is no metal material around the antenna, including wires, metal casings, weight plates, and the like.
3. Solution 3: The Wi-Fi module is placed on the side of the board, and the PCB area under the antenna is empty, and copper cannot be laid.

Fig.10.1 Solution 1

Fig.10.2 Solution 2

Fig.10.3 Solution 3

Peripheral Design Suggestion

Wi-Fi module is already integrated into high-speed GPIO and Peripheral interface, which may be generated the switch noise. If there is a high request for the power consumption and EMI characteristics,it is suggested to connect a serial 10~100 ohm resistance, which can suppress overshoot when switching power supply, and can smooth signal. At the same time, it also can prevent electrostatic discharge (ESD).

Product Handling

12.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non- condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked.

Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

U.FL RF Connector
YOOAI-T1 module use U.FL type RF connector for external antenna connection. (IPEX V1.0).

Fig.13.1 U.FL RF Connector

Packing Instruction

The product is packed in a tray, as shown in the following figure.
The size of the single box is: 340 x 360 x 60mm, and 550 pieces module is in the box. And the outer box size is 355 x 375 x 325mm, including 5 single box which include 2750 pieces module.

Fig.14.1 Module Package

FCC WARNING

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2.  This device must accept any interference received, including interference that may cause undesired operation.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

NOTE : This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
•  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

To maintain compliance with FCC’s RF Exposure guidelines, This equipment should be installed and operated with minimum 20cm distance between the radiator and your body: Use only the supplied antenna.

• This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
• This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
• The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination.
• The firmware setting is not accessible by the end user.
• The final end product must be labelled in a visible area with the following: “Contains Transmitter Module “FCC ID: 2BAGT-YOOAI-T1” Requirement per KDB996369 D03

List of applicable FCC rules

List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See alsoSection 2.10 below concerning the need to notify host manufacturers that further testing is required.3

• Explanation : This module meets the requirements of FCC part 15C (15.247).it Specifically identified AC Power Line Conducted Emission, Radiated Spurious emissions, Band edge and RF Conducted Spurious Emissions, Conducted Peak Output Power, Bandwidth, Power Spectral Density, Antenna Requirement.

Summarize the specific operational use conditions

• Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to- point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands.
• Explanation : The product antenna uses an irreplaceable antenna with a gain of 1.49dBi 2.4 Single Modular If a modular transmitter is approved as a “Single Modular ,” then the module manufacturer isresponsible for approving the host environment that the Single Modular is used with. The manufacturer of a Single Modular must describe, both in the filing and in the installation instructions, the alternative means that the Single Modular manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions.
• A Single Modular manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited. module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval.
• This Single Modular procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module.
• Explanation : The module is a single module.

Trace antenna designs

For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.

1. Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
2. Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
3. The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
4. Appropriate parts by manufacturer and specifications;
5. Test procedures for design verification; and
6. Production test procedures for ensuring compliance

The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application

RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information:

1.  to the host product manufacturer, to define the application conditions (mobile, portable – xx cm from a person’s body); and
2. additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application).

Explanation : The module complies with FCC radiofrequency radiation exposure limits for uncontrolled environments. The device is installed and operated with a distance of more than 20 cm between the radiator and your body.” This module follows FCC statement design,

FCC ID: 2BAGT-YOOAI-T1

Antennas

• A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”).
• For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product.
• The module manufacturers shall provide a list of acceptable unique connectors.
• Explanation : The product antenna uses an irreplaceable antenna with a gain of 1.49dBi

Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices – KDB Publication 784748.

Explanation : The host system using this module, should have label in a visible area indicated the following texts: “Contains FCC ID: 2BAGT-YOOAI-T1

Information on test modes and additional testing requirements5

• Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
• The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host.
• Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements.
• Explanation : Guangzhou You’ an Information Technology Co.,Ltd can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter.

Additional testing, Part 15 Subpart B disclaimer

• The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15
• Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
• Explanation : The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.

References

• 右岸物联|一站式物联网开放平台,NB-IoT,5G物联网解决方案,物联网整体解决方案提供商

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