ON Semiconductor STK5x4U3xx Compact IPM Series EVB Evaluation Board User Manual

ON Semiconductor STK5x4U3xx Compact IPM Series EVB Evaluation Board

STK5x4U3xx Series, NFAxxx60xxx Series Evaluation Board User’s Manual

Introduction

This user’s guide is intended to provide practical guidelines for the STK5x4U3xx series and NFAxxx60xxx series. From now on, these series are called the compact IPM series. It should be used in conjunction with the datasheet and application note

Product Description
The compact IPM series is Intelligent Power Module (IPM) for 3−phase motor drives which contain the main power circuitry and the supporting control circuitry.
The Compact IPMs are a fully−integrated inverter power stage consisting of a high−voltage driver, six IGBTs for three−phase inverter, six fast recovery diodes, three bootstrap diodes and a thermistor, suitable for driving permanent magnet synchronous (PMSM) motors, brushless−DC (BLDC) motors and AC asynchronous motors. The IGBTs are configured in a 3−phase bridge with separate emitter connections for the lower legs for maximum flexibility in the choice of control algorithm.

Features

• Three−phase 3 A ~ 15 A/600 V IGBT Module with Integrated Drivers
• Compact IPM 29.6 mm x 18.2 mm, Dual In−line Package
• Cross−conduction Protection
• Adjustable Over−current Protection Level
• Integrated Boot−strap Diodes and Resistors
• Enable Pin
• Thermistor

Typical Application

• Industrial Pumps, Fans and Automation
• Home Appliances

Table 1. LINE−UP

 | ****

STK5C4U332J − E

| ****

STK5Q4U352J − E

| STK5C4U362J − E NFAQ1060L33T (Note 1)| NFAQ1560R43T

(Note 1)

---|---|---|---|---
Package| DIP−S (Note 2)| DIP−S3 (Note 3)| DIP−S3/6 (Note 3)| DIP−S6 (Note 3)
Voltage (VCEMAX)| 600 V
Current, IC| 3 A| 8 A| 10 A| 15 A
Peak Current, ICMAX| 6 A| 16 A| 20 A| 30 A
Isolation Voltage| 2000 V

1. Under development.
2. DIP−S package is full package and has cavity hole.
3. DIP−S3/6 are DBC version, DIP−S3 has cavity hole, DIP−S6 is no cavity hole.

COMPACT IPM SERIES EVB

EVALUATION BOARD DESCRIPTION

Schematic
Figure 1 shows a circuity of the evaluation board of Compact IPM. The evaluation board consists of interface circuit, bootstrap capacitors, snubber capacitor, short−circuit protection circuit, fault out circuit and one shunt resistor.

Figure 2 shows the evaluation board of the Compact IPM.

COMPACT IPM SERIES EVB

PCB Map
Figure 3 shows the PCB layout of compact IPM.

Circuit Layout Design Guidance

1. PCB size is 83.0 mm x 60.0 mm

2. To avoid malfunction, the wiring of each input should be as short as possible. (Less than 2−3 cm)

3. To prevent protection function errors, the “R12” and “C20” wiring should be as short as possible

4. All the de−coupling capacitors and filter capacitors should be placed very close to IPM

5. The short−circuit protection time constant
   R12*C20 should be set in the range of 1.5~2.0 sec

6. The isolation distance of DC−P, U, V, W−phase, DC−N/GND block should be over 2.54 mm (100 mil) for 300 V~500 V P−N voltage

7. Power−GND and signal−GND should be connected with each other through only one 1.5~2 mm width pattern

8. To prevent surge destruction, the wiring between the filter capacitor and the P & Ground pins should be as short as possible. The use of a high frequency non−inductive capacitor (Snubber, C3) between the P & Ground pins is recommended. In addition to reducing local voltage spikes, the placement and quality of this capacitor will have a direct impact on both conducted and radiated EMI.

This evaluation board is simple, customer have to connect just the signal interface, VPN voltage and Motor connection (U/V/W). For future detail information, refer to the datasheet and application note.

Pin Description

Table 2. PIN DESCRIPTION

Printed Circuit Board

BILL of Materials

Table 3. BILL OF MATERIALS

(Non−Inductive Resistor)

| 1| RARA ELEC.
C1| CL21B104KB| 100 nF, 50 V| 1| SAMSUNG ELEC.
C2| KXL 33 µF, 35 V| 33 µF, 35 V| 1| SAMYOUNG
C3| PCMP483D6U104| 0.1 µF, 630 V| 1| PILKOR
C4| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C5| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C6| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C7| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C8| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C9| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C10| CL21B104 KB| 100 nF, 50 V| 1| SAMSUNG ELEC.
C11| KXL 33 µF, 35 V| 33 µF, 35 V| 1| SAMYOUNG
C12| CL21B102 KB| 1 µF, 50 V| 1| SAMSUNG ELEC.
C13| CL21B102 KB| 1 µF, 50 V| 1| SAMSUNG ELEC.
C14| KXL 220 µF, 35 V| 220 µF, 35 V| 1| SAMYOUNG
C15| CL21B104 KB| 100 nF, 50 V| 1| SAMSUNG ELEC.
C16| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C17| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C18| CL21B102 KB| 1 nF, 50 V| 1| SAMSUNG ELEC.
C19| CL21B104 KB| 100 nF, 50 V| 1| SAMSUNG ELEC.
C20| CL21B103 KB| 10 nF, 50 V| 1| SAMSUNG ELEC.
C21| CL21B104 KB| 100 nF, 50 V| 1| SAMSUNG ELEC.
C22| KXL 33 µF, 35 V| 33 µF, 35 V| 1| SAMYOUNG
ZD1| MMSZ5252B| 24 V, 0.5 W| 1| ON Semiconductor
ZD2| MMSZ5252B| 24 V, 0.5 W| 1| ON Semiconductor
ZD3| MMSZ5252B| 24 V, 0.5 W| 1| ON Semiconductor
ZD4| MMSZ5252B| 24 V, 0.5 W| 1| ON Semiconductor
CN1| SMW250−11| 11pin Connector| 1| YEONHO
U1, V1, W1, P1, N1| GP881191−2| Tab Terminal| 1| KET
IPM1| Compact IPM| Motion−SPMTM in a small−DIP| 1| ON Semiconductor

PACKAGE OUTLINE

• There are three kind of package type for compact IPM.
• The package of DIP-S shown in Figure 6, DIP-S3 shown in
• Figure 7 and DIP-S6 shown in Figure 8.

Package Outline and Dimension

Recommended Land Pattern

HEAT SINK MOUNTING

Heat Sink Mounting and Torque
If a heat sink is used, insufficiently secure or inappropriate mounting can lead to a failure of the heat sink to dissipate heat adequately. This can lead to an inability of the device to provide its inherent performance, a serious reduction in reliability, or even destruction, burst and burn of the device due to overheating.
The following general points should be observed when mounting IPM on a heat sink:

1. Verify the following points related to the heat sink:
   • There must be no burrs on aluminum or copper heat sinks
   • Screw holes must be countersunk
   • There must be no unevenness in the heat sink surface that contacts IPM
   • There must be no contamination on the heat sink surface that contacts IPM
2. Highly thermal conductive silicone grease needs to be applied to the whole back (substrate side) uniformly, and mount IPM on a heat sink. Upon re−mounting apply silicone grease (50um to 100um) again uniformly
3. For an intimate contact between the IPM and the heat sink, the mounting screws should be tightened gradually and sequentially while a left/right balance in pressure is maintained. Either a bind head screw or a truss head screw is recommended. Please do not use tapping screw. We recommend using a flat washer in order to prevent slack. The standard heat sink mounting condition of Compact IPM series is as follows

Table 4. MOUNTING CONDITION

Bind machine screw, Truss machine screw, Pan machine screw

Washer| Plane washer, Don’t use spring washer

The size is D: 7.0 mm, d: 3.2 mm and t: 0.5 mm

Heat sink| Material: Copper or Aluminum

Warpage (the surface that contacts IPM) : −50 ~ 50 µm Screw holes must be countersunk

No contamination on the heat sink surface that contacts IPM

Torque| DIP−S/DIP−S3/DIP−S6

Final tightening : 0.4 ~ 0.6 Nm

Temporary tightening : 50 ~ 60% of final tightening

Grease| Silicone grease Thickness : 50 ~ 100 µm

Uniformly apply silicon grease to whole back (Figure 12)

Steps to mount an IPM on a heat sink

1. Temporarily tighten maintaining a left/right balance.
2. Finally tighten maintaining a left/right balance.

Mounting and PCB considerations
In designs in which the printed circuit board and the heat sink are mounted to the chassis independently, use a mechanical design which avoids a gap between IPM and the heat sink, or which avoids stress to the lead frame of IPM by an assembly that slipping IPM is forcibly fixed to the heat sink with a screw.

Figure 13. Fix to Heat Sink
Maintain a separation distance of at least 1.5 mm between the IPM case and the printed circuit board. In particular, avoid mounting techniques in which the IPM substrate or case directly contacts the printed circuit board.
Do not mount IPM with a tilted orientation. This can result in stress being applied to the lead frame and IPM substrate could short out tracks on the printed circuit board. Always mount the IPM vertically. If stress is given by compulsory correction of a lead frame after the mounting, a lead frame may drop out. Be careful of this point.

Since the use of sockets to mount IPM can result in poor contact with IPM leads, we strongly recommend making direct connections to PCB.
IPMs are flame retardant. However, under certain conditions, it may burn, and poisonous gas may be generated or it may explode. Therefore, the mounting structure of the IPM should also be flame retardant.
Mounting on a Printed Circuit Board

1. Align the lead frame with the holes in the printed circuit board and do not use excessive force when inserting the pins into the printed circuit board. To avoid bending the lead frames, do not try to force pins into the printed circuit board unreasonably
2. Do not insert IPM into printed circuit board with an incorrect orientation, i.e. be sure to prevent reverse insertion. IPM may be destroyed, exploded, burned or suffer a reduction in their operating lifetime by this mistake
3. Do not bend the lead frame

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