ON Semiconductor NVH820S75L4SPBVE-Trac Direct Technical User Guide
- June 12, 2024
- ON Semiconductor
Table of Contents
VE-Trac™ Direct Technical Guide
AND9987/D
NVH820S75L4SPBVE-Trac Direct Technical
This document is intended to be a guide to explain the technical details of
the product features and capabilities. It is also designed to provide
reference circuits and application related notes to ensure that the product is
used in an optimal manner for its intended end use.
APPLIES TO THE FOLLOWING PARTS
NVH820S75L4SPB | 750 V, 820 A, Short Terminal |
---|---|
NVH820S75L4SPC | 750 V, 820 A, Long Terminal |
INTRODUCTION
The VE−Trac Family of power modules is an automotive qualified line of
products specifically designed for EV−traction inverters. The product line is
broadly classified into two platforms (i) Dual (ii) Direct. Each platform has
its own advantages, but this document’s scope is limited to understanding the
datasheet parameters and device characteristics of the Direct product line. It
also includes a design guide and recommendations for using the product
effectively. A separate document ‘VE−Trac Direct Assembly Guide’ provides
details related to assembling the power module in an assembly.
VE−Trac Direct product features:
- Compatible with popular module footprint.
- Robust and reliable new press−fit pin design.
- More power compared to similar module package.
- Direct cooling with leading thermal performance.
- Continuous 150°C operation with limited operation at 175°C.
- Thermistor based temperature sense per phase leg.
TECHNICAL DETAILS
ON Semiconductor’s latest generation of IGBTs and Diodes are incorporated into
the VE−Trac products. The 750 V VE−Trac products use the latest 4 th
Generation of IGBTs from ON Semiconductor.
Chip Technology![ON Semiconductor NVH820S75L4SPBVE Trac Direct Technical
- Technology](https://manuals.plus/wp-content/uploads/2023/08/ON-
Semiconductor-NVH820S75L4SPBVE-Trac-Direct-Technical-Technology.png) This new
generation of Field Stop (FS) IGBTs with a high density cell structure and an
optimized double layer shows remarkable device performance under static and
dynamic conditions with strong latch−up ruggedness. The design of the chip
uses sub−micron trench and mesa active with a narrow mesa width.
Package Design
The VE−Trac Direct is a single side direct cooled package with a form factor that is now becoming more common for EV traction application. The package consists of power devices that are soldered to DBC and wire−bonded on the top side. The DBCs are attached to a copper base plate that has a pin−fin structure on the other side to enable direct cooling (see Figure 4).For the signal connections, the module includes press−fit pins that are designed to meet the stringent automotive standards. The press−fit pins are fixed in position and orientation as shown in Figure 3. Detailed information on mounting the module and gate driver board can found in the assembly guide.The typical layout of the module is illustrated below with its pin assignments. Each phase leg has its DC power terminals on one side and the switching terminal on the opposing side with eight press−fit pins providing access to the signal terminals and the NTC thermistor located in each phase leg. Table 1. EXAMPLE PIN ASSIGNMENT FOR 820 A, 750 V MODULE TYPE
Pin # | Pin Function Description |
---|---|
P1, P2, P3 | Positive Power Terminals |
N1, N2, N3 | Negative Power Terminals |
1 | Phase 1 Output |
2 | Phase 2 Output |
3 | Phase 3 Output |
G1−G6 | IGBT Gate |
E1−E6 | IGBT Gate return |
C1−C6 | Desat detect / collector sense |
T11, T12 | Phase 1 temperature sensor output |
T21, T22 | Phase 2 temperature sensor output |
T31, T32 | Phase 3 temperature sensor output |
Creepage and Clearance Requirements
Care should be taken not to encroach on the creepage and clearance
requirements of the module as specified in the product data sheet. Additional
external components, like metal heatsinks, bus bars or fastening hardware can
inadvertently reduce the creepage and clearance distances in the assembly. It
is critical to check the assembly to ensure the minimum required creepage and
clearance are met as shown in Figure 6.
THERMAL PERFORMANCE
Direct cooling offers a shorter path for heat to flow from the chip to the
fluid. Since the module is direct cooled, there is no reason to use a thermal
interface material. Below are thermal parameters of the IGBT and Diode from
device junction to coolant fluid as shown in the data sheet below:
Table 2. BASIC THERMAL RESISTANCE AND IMPEDANCE CURVE IS PROVIDED FOR EACH
MODULE TYPE IN THE DATA SHEET
Symbol | Parameter | Min. | Typ. | Max. | Unit |
---|---|---|---|---|---|
IGBT.Rth.J-F | Rth, Junction to Fluid, 10L/min, 65°C, 50/50 EGW | 0.11 | tbd |
°C/W
Diode. Rth,J-F| Rth, Junction to Fluid, 10L/min, 65°C, 50/50 EGW| | 0.16| tbd|
°C/W
The Rth,J−F for the IGBT and Diode is measured using a reference cooling
jacket and may vary slightly with different cooling jacket designs, flow rate,
coolant temperature and coolant type. Please refer to the VE−Trac Direct
assembly guide for more details on the reference cooling jacket and its
sealing ring.
Thermal Measurements
The measurement of the thermal resistance is defined in the AQG324 standard.
It uses the following equation to determine the steady state thermal
resistance (Rth.j−f) for either the diode or the IGBT. The Tvj for the device
is determined using the Vce or Vf method described in detail in DIN
EN60747−15. The test setup measures the inlet fluid temperature (Tf.in) and
the outlet fluid temperature (Tf.out) to determine the average fluid
temperature. This value is then subtracted from the measured Tvj and divided
by the power dissipated (Pd) in the device to determine the thermal resistance
from junction to fluid. Thermal
Modeling
The information needed to develop circuit level or mathematical model for the
power module is provided below. This includes the equivalent thermal impedance
and thermal capacitance for a four node Foster thermal network for the
electrical equivalent models and math expressions. It is important to note
that the nodes are not related to material boundary or geometry of the
physical thermal stack up as shown in Figure 7. The information provided in
the table below is also provided in the respective data sheet for the product.
The table also includes the cross coupling thermal resistance between the IGBT
and the free−wheeling diode (FWD) for the same side and also to the opposing
side. It also shows the values between the high side IGBT and the low side
IGBT devices. The strongest coupling to consider is between the IGBT and its
FWD.
Table 3. FOUR NODE FOSTER MODEL EQUIVALENT RESISTANCE AND CAPACITANCE
VALUES FOR THE 820 A, 750 V MODULE TYPE
Nodes | IGBT | Diode |
---|---|---|
Rth | Cth | Rth |
Node 1 | 0.05071 | 2. |
Node 2 | 0.00010 | 10504. |
Node 3 | 0.01702 | 0.449 |
Node 4 | 0.03958 | 18. |
Total | 0.107 | – |
x-coupling Rth
IGBT <-> Diode
IGBT <-> IGBT| 0.036 (same side) n/a| 0.008 (opposing side)
0.008 (opposing side)
ELECTRICAL PERFORMANCE
This section explains the maximum, static and dynamic electrical parameters of
the IGBT and Diode used inside the module. Each functional switch of the
module consists of 3x IGBT and Diode chips connected in parallel. The
parameters included in the data sheet refers to a functional switch and not a
single chip. Maximum values of these parameters should not be exceeded, in
normal operation to prevent damage to the semiconductor. In addition, please
note that the temperature condition is 25°C, unless it is specified otherwise.
Maximum Ratings − IGBT
Operating Junction Temperature, Tvj This is the junction temperature range
where the device is guaranteed to operate without physical or electrical
damage.
Like similar automotive power modules the ratings, maximum Tvj includes a
continuous rating and a short term higher rating. VE−Trac Direct specifies a
continuous operational Tvj range −40°C to 175°C with no short duration rating.
Safe Operating Area of IGBT
The maximum allowed peak Collector to Emitter Voltage (VCES) is specified at a
junction temperature of 25°C. Please note this value has a positive
temperature coefficient, meaning at lower temperatures the maximum allowed
peak Collector to Emitter is also lower. There are two plots in the data sheet
that should be checked to ensure safe operation of the module. The first plot
is the Maximum VCE rating over temperature as shown in Figure 8. This
determines the absolute maximum allowed peak blocking voltage between the IGBT
Collector−Emitter across the operating temperature range. Note that at −40°C
the maximum VCE rating is 715 V.
The second plot to consider is the Reverse Bias Safe Operating Area (RBSOA).
This shows the peak VCE allowed as a function of collector current at 150°C
for the power module (see Figure 8). It shows the ideal SOA for the chip and
also the module, which includes the module parasitic inductance. However, it’s
important to also consider all the parasitic inductance in the power loop
(including DC filter capacitor) to determine the true SOA for the module in
the end application.![ON Semiconductor NVH820S75L4SPBVE Trac Direct Technical
- Design 5](https://manuals.plus/wp-content/uploads/2023/08/ON-Semiconductor-
NVH820S75L4SPBVE-Trac-Direct-Technical-Design-5.png)Lastly, the SOA plot
should be checked for pulsed conditions. The IGBT module must not be used in
the linear mode. Figure 9 shows the IGBT current capability for single pulse
events and for DC. This plot is not included in the data sheet. The DC rating
in the plot is limited the continuous Tj.max rating of 150°C, but the pulsed
plot lines are limited by the Tj.max value of 175°C.Continuous DC Collector Current, Ic nom
Ic_nom is the continuous DC current allowed when using the reference heatsink which results in Rth,J−F value specified in the data sheet. Ic nom is determined by three factors: Vcesat(as a function of Tvj and Ic), IGBT Junction to Fluid thermal resistance Rth,j−f and Max Operating Junction temperature. A design margin is also applied to determine the final Ic nom value and it is verified by characterization testing where Tvj is determined according to IEC60747−15.
Maximum Pulsed Collector Current, ICRM
VE−TracTM Direct modules specify ICRM as 2X of IGBT rating current at room temperature. When the fluid temperature is higher, pulse width should be determined by power dissipation and transient thermal impedance Zth to make sure Tvj is not exceeding 175°C.
Short Circuit Withstand Time, SCWT
SCWT of VE−Trac TM Direct modules is specified and verified according to AQG324 Type 1 short circuit (HSF: hard−switch−fault). The short circuit characteristics depend heavily on application specific parameters such as temperature, stray inductances/resistance and gate driver.
During a short circuit event, the IGBT has to withstand high junction temperature due to high power dissipation and turns off safely. Below figure show short circuit test setup. Maximum Ratings – Diode
Repetitive Peak Voltage, VRRM
VRRM Voltage is maximum allowed reverse biased voltage for the diode. As IGBT and Diode are anti−parallel connected, diodes have to withstand the same voltage as the IGBT. The collector−Emitter voltage ratings in the data sheet will also apply for the anti−parallel diode.
Continuous Forward Current, IF
Similar method of rating as the IGBT Ic nom. The continuous DC current rating for the diode is a little lower than the IGBT due to the higher Rth,J−F value specified in the data sheet for the Diode. IF value and it is verified by characterization testing where junction temperature is determined according to IEC60747−15.
Repetitive Peak Current, IFRM
VE−Trac Direct modules specify IFRM as 2X of IFN. When the fluid temperature is higher, pulse width should be determined by power dissipation and transient thermal impedance Zth to make sure the Junction temperature is not exceeding 175°C Surge Current Capability, I t value Diode surge current is in the form of a half sine wave of 2 10ms or 8.3 ms (50 or 60 Hz), where its peak current is denoted as Isurge. The device is able to withstand this current without damage provided this does not occur too often in the diode service life. Instead of peak current, the datasheet specifies this characteristic in the form of I2t value, given by: Static Characteristics
IGBT Output characteristics, Vcesat
Vcesat is the voltage drop across collector to emitter for a specified gate voltage and temperature which is used to calculate IGBT’s conduction losses and compare the losses between similar components. It is a temperature dependent parameter, as shown in Figure 11. Above the crossover, Vcesat exhibits positive temperature coefficient while below the crossover, it shows negative temperature coefficient. Positive temperature coefficient is beneficial in a way that it helps achieve better current sharing for paralleling operation.Collector to Emitter Leakage Current, ICES
ICES is the leakage current from collector to emitter whenIGBT is turned off. It is highly related to the IGBT chip size and features a positive temperature coefficient−−− ICES increases when temperature is increasing.
Gate to Emitter leakage current, IGES
The absolute maximum value of gate to emitter leakage current is typically specified at a gate voltage of 20V while collector and emitter are grounded. Typically only the maximum value is specified in the data sheet and is in the order of a few hundred Nano amperes. The exact value is defined the respective product data sheet.
Threshold Voltage, Vth
Vth indicates at what Vge voltage level the IGBT starts to conduct. It is tested by shorting Gate and Collector and applying a specified current source (e.g 5 mA) to collector.
Diode Forward Voltage, VF
Diode forward voltage is measured when IGBT is in off−state. A forcing current is applied to the power pins of the module and the VF is measured through sensing pins.
This helps eliminate the voltage drop effect along the current path (e.g wire, terminals) except the diode itself. Datasheet provides VF in a table with specified condition and curves at different temperatures and current.
Dynamic Characteristics
Parasitic Capacitances, Cies Coes Cres
As inherent parts of an IGBT device, several parasitic capacitances play a role in the device’s dynamic characteristics including: input capacitance Cies, output capacitance Coes and reverse transfer capacitance Cres. Input Capacitance, Cies=Cge+Cgc
Input capacitance is formed by parallel combination of gate−to−emitter and gate−to−collector. The gate−to−emitter consists mainly of the metal−oxide−semiconductor capacitance and is generally constant. However gate−to−collector capacitance is voltage VCE dependent.
Output Capacitance, Coes=Cce+Cgc
Output capacitance is formed by parallel combination of collect−to−emitter and gate−to−collector, both of which are voltage dependent and varies with different collector−to−emitter voltages.
Reverse Transfer Capacitance, Cres=Cgc
Made up of gate−to−collector capacitance, reverse transfer capacitance plays an essential role in gate driving of the IGBT, as it provides negative feedback from collector to gate and is responsible for the gate voltage plateau. Specifically, during IGBT turning on, the fast falling of collector−to−emitter voltage forms a considerable current from collector to gate through Cres which counteracts the rising of the gate voltage. Similarly, during IGBT turning off, the fast rising of collector−to−emitter voltage draws current from gate through Cres which counteracts the falling the gate voltage. Coes and Cres tend to decrease when VCE voltage is increasing while Cies is mostly stable across different VCE voltages. Figure 13 shows a typical Capacitance vs VCE Curve for a 750 V VE−Trac irect IGBT. Press−fit pin Inductance
The inductance of the press−fit connection is calculated with a modeling tool that considers the geometry and material properties of the module. LP. G E represents the inductance of the gate press−fit pin, DBC tracks, wire bonds and the gate return press−fit pin. In typical gate driver applications, one should also consider the PCB track inductance to get the complete gate−emitter loop inductance. Table 4. PRESS−FIT GATE−EMITTER LOOP INDUCTANCE CALCULATED USING FEM TOOL
SWITCH POSITION| LP. G E (nH)@1mHZ| LP. G E (nH)@10
mHz
---|---|---
UPPER SWITCH| 12.5| 11.8
LOWER SWITCH| 8.5| 8
Gate Charge, QG
Though input capacitance is useful, gate charge provides a more convenient way
in determining the average driving power for the IGBT. Specifically, the
driving power is determined by following equation:Where fs is switching frequency, Vge(on), Vge(off) are
on−state gate−to−emitter voltage and off−state gate−to−emitter voltage
respectively.
Besides a QG value at a certain Vge condition, the datasheet also provides a
QG curve where different QG vs Vge information can be found. Refer to below
figure for a typical QG curve. See section on gate drive to see how QG is used
to determine gate driver requirements.Figure
15. Example Gate Charge Characteristic of the 820 A, 750 V Module Type in Data
Sheet
IGBT Switching Characteristics
IGBT switching characteristics are one of the major focuses in improving IGBT
performance as switching losses constitute substantial part of overall losses.
The circuit diagram used in characterizing IGBT switching behavior is shown in
Figure 16.
IGBT Switching Characteristics are given in two types: one type is measured in
time dimension −−− delay time and rise/fall time, this information is useful
in determining an appropriate dead time between turn−on and turn−off of high
and low side IGBTs in a half bridge configuration. Another type is measured in
losses −−− turning on/off losses at room and high temperatures under a given
condition, such as Bus voltage, Gate resistance and Gate voltages etc. This
information is useful in estimating switching losses in real application and
compare performances of devices from different suppliers.The definitions for IGBT switching characteristics are
explained as below:
a. Turn on delay time, Td.on Time interval from the moment when gate−emitter
voltage reaches to 10% of rated value to the moment when collector current
reaches 10% of its nominal value.
b. Turn off delay time, Td.off Time interval from the moment when gate−emitter
voltage drops to 90% of rated value to the moment when collector current drops
to 90% of its nominal value.
c. Rise time, Tr Time it takes for collector current to rise from 10%to 90% of
its nominal value.
d. Fall time, Tf Time it takes for collector current to fall from 90% to 10%
of its nominal value.
e. Turn−on switching losses Eon, Turn−on switching losses are integral of
power−−Collect−to Emitter voltage multiplying Collector current −−−− over the
time interval starting when the collector current reaches 10% of its final
value and ending when collector−emitter voltage drops to 2% of IGBT’s
off−state value, illustrated as below equation: f. Turn−off losses, Eoff
Turn−off switching losses are integral of power−−Collect−to Emitter voltage
multiplying Collector current −−−− over the time interval starting when
collector−emitter voltage reaches 10% of its final value and ending when
collector current drops to 2% of IGBT’s on−state value, illustrated as below
equation: In Figure 17 the definitions of the terms with respect to the
waveforms are illustrated:Diode
Switching Characteristics
When the diode is switched from forward current carrying to reverse voltage
blocking by turning−on of the opposite side IGBT, it enters the Reverse
Recovery State. Refer to Figure 18 for double pulse testing configuration and
definition of diode reverse recovery parameters.a. Reverse Recovery Current, Irr
Reverse recovery current is the peak current when the diode current is
commutated from forward conducting to reverse bias. It depends on the initial
forward diode current and current slope rate — di/dt.
b. Reverse Recovery Charge, Qrr
Reverse recovery charge is the amount of charge that is recovered from the
diode during turning off.
It is calculated by integrating the reverse recovery current over the time
period starting when diode current crosses zero and ending when diode reverse
current return to 2% of its peak reverse current(Irr). Shown as below
equation: c. Reverse Recovery Energy, Err
Diode reverse recovery energy are integral of power—Diode reverse voltage
multiplying diode reverse current −−−− over the time interval starting when
reverse voltage reaches 10% of its final value and ending when reverse current
returns to 2% of its reverse recovery peak current, illustrated as below
equation: INTEGRATED THERMISTORS
Each VE−Trac Direct power module includes an NTC thermistor mounted on each
phase of the 6−pak module. The thermistor is located on top of the DBC
substrate close to the chips of the upper switch as shown in Figure 19. The
thermistor response can be used to implement over temperature protection or
other fault indications like loss of coolant flow. However, it be noted that
the response time of the thermistor is in the order of ~300 ms and thus will
not detect fast chip temperature variations. Table 5. TOLERANCE OF THE NTC THERMISTOR AT VARIOUS
TEMPERATURES
Ambient Temperature [ ° C]| Typ Resistance[kΩ]| Tolerance
[ ± %]
---|---|---
−40| 99.090| 17%
−35| 75.170| 16%
−30| 57.540| 16%
−25| 44.440| 15%
−20| 34.600| 14%
−15| 27.260| 13%
−10| 21.480| 13%
−5| 17.110| 13%
0| 13.720| 12%
5| 11.080| 12%
10| 9.000| 11%
15| 7.357| 11%
20| 6.048| 10%
25| 5.000| 10%
30| 4.156| 9%
35| 3.471| 9%
40| 2.914| 9%
45| 2.458| 8%
50| 2.083| 8%
55| 1.772| 8%
60| 1.515| 7%
65| 1.300| 7%
Ambient Temperature [ ° C]| Typ Resistance[kΩ]| Tolerance
[ ± %]
---|---|---
70| 1.120| 7%
75| 0.968| 6%
80| 0.840| 6%
85| 0.732| 6%
90| 0.640| 6%
95| 0.561| 5%
100| 0.493| 5%
105| 0.435| 5%
110| 0.385| 6%
115| 0.342| 6%
120| 0.304| 6%
125| 0.271| 6%
130| 0.243| 6%
135| 0.218| 7%
140| 0.196| 7%
145| 0.177| 7%
150| 0.160| 7%
155| 0.144| 7%
160| 0.131| 8%
165| 0.119| 8%
170| 0.109| 8%
175| 0.099| 8%
The relationship between
the Thermistor resistance and the Tvj of the IGBT and Diode are described in
Table 6 for a specific operating condition for the 750 V, 820 A module.
Users will need to make similar measurements to develop the relationship or
equation for their specific operating condition. This is necessary to have a
robust over temperature protection scheme. It should be noted that for the
data shown in Table 6 the devices are heated separately i.e. when the IGBTs
are conducting the diodes are not conducting and vice−versa.
Table 6. EXAMPLE RELATION BETWEEN NTC THERMISTOR TEMPERATURES TO DEVICE
JUNCTION TEMPERATURE FOR A SPECIFIC OPERATING CONDITION FOR THE 820 A, 750 A
MODULE
Coolant@65C, 10L/min, Ref. Cooler. DC current only in IGBT| Coolant@65C,
10L/min, Ref. Cooler. DC current only in FWD
---|---
Tvj.IGBT [C]| Thermistor.Resis tance [KOhms]| Thermistor.Temp erature [C]|
Tvj.Diode [C]| Thermistor.R esistance [KOhms]| Thermistor.Te mperature [C]
65| 1.36| 65| 65| 1.36| 65
76.8| 1.215| 68.75| 84| 1.224| 68.49
89.3| 1.122| 71.54| 106.9| 1.146| 70.79
104.3| 1.017| 75.04| 133.5| 1.006| 73.35
122.9| 0.912| 79.01| 150| 1.019| 74.97
142.1| 0.81| 83.44| 175| 0.96| 77.13
150| 0.775| 85.12|
175| 0.678| 90.29
DESIGN CONSIDERATIONS
Gate Driver
The gate driver turns on and off the IGBT to a defined VGE_ON and VGE_OFF
voltage levels. The transition between the two gate voltage levels needs a
power to be dissipated in the gate driver. The gate driver power rating should
be selected according to driver power required for an IGBT module.
The gate driver power required depends on QG − total gate charge of an IGBT
module, switching frequency Fsw and the gate driver output voltage swing ΔVGE
(VGE_ON VGE_OFF). If an external CGE is connected then the Power required for
charging and discharging the external CGE should also to be considered. The
switching speeds of an IGBT are controlled by charging and discharging rate of
the gate capacitances, Higher the peak current, lower are the losses. Other
switching factors like overvoltage stress and peak reverse recovery current of
freewheeling diode has a direct impact on this. The turn−on and turn−off peak
gate currents are controlled by resistors RG,ON and RG,OFF respectively (see
Figure 21). The average current
needed for switching an IGBT at switching frequency of Fsw and total gate
charge QG can be calculated as follows: The gate driver continuous current
rating should be > IG(AVG) calculated.
The peak charging and discharging rate of gate currents to the input
capacitance of an IGBT module results in power dissipation in the gate
resistors. The gate resistor must be sized to handle this power dissipation.
The peak charging or discharging current can be approximated as a
discontinuous triangular wave. Where:
IGPEAK :IGBT Gate drive peak current
Tp: Duration of the pulse usually between 500 ns to 1 µs
Fsw:IGBT switching Frequency
RG: Gate resistance
Sometimes there is significant ringing on the gate drive loop. The gate driver
equivalent circuit with parasitic is as shown below.The gate current is IG(t) is related to known second
order differential equation for RLC circuits. During turn −on LT and RT
represent total inductance and resistance in the turn−on path The minimum
value of RT required for non−oscillation orfor over damped condition is RT =
RG,ON + RGINT > 2 * SQRT(LT/CGG) During turn−off LTF and RTF represent total
inductance and resistance in the turn off path of the gate loop. The minimum
value of RTF required to prevent oscillation or for over damped condition is
RTF = RG,OFF + RGINT > 2
-
SQRT(LTF/CGG)
Uni−Polar versus Bi−Polar Drive
The unipolar gate drive switches on the IGBT with voltage VGE_ON (typically +15V) and turns off the IGBT voltage with 0V. This arrangement is not recommended for EV traction drive applications, since it tends to increase switching losses and increase EMC susceptibility. However, if a uni−polar drive is desired, the following precautions should be considered:- Parasitic Turn on due to miller capacitor and high dv/dt
- Parasitic turn on via stray inductances
Parasitic turn−on via stray inductance can be common when there is no kelvin
emitter sense, in which case the gate driver reference shares the same
reference as the power emitter.
In the Inverter half bridge application when the low side IGBT turns−on, a
high side IGBT experiences a voltage rise dvce/dt. This causes a displacement
current ICGC = CGC*dvce/dt to flow through the miller capacitor and RG,off of
the upper IGBT and back into the driver as shown in Figure 23. As a result VGE
rises when it exceeds the VGE(th) parasitic turn−on of the high side IGBT.
This can result in a shoot−through event i.e short across the DC link. A shoot event through
can destroy the module. Thus when designing a gate driver circuit, maximum
allowed dv/dt has to be considered. The maximum allowed dv/dt can be
calculated as follows: Where Vth is the threshold voltage of IGBT for VE−Trac
Direct. Vth is equal to 5.5 V and CGC is the Miller capacitance of the IGBT
and is equal to 1.3nF (for example).
Thus from above equation the maximum allowed dv/dt for VE−TracTM Direct will
be: Where RG, tot is the total gate resistance during turn off event.
In order to increase the robustness of unipolar gate drive against the
parasitic miller capacitor turn−on, consider using an Active Miller Clamp
circuit where during turn−off the VGE voltage is monitored internally within
the gate driver.
When the voltage VGE falls below 2 V relative to the emitter reference, the
clamp circuit is activated. This clamp switch (see Figure 24) shorts the Gate
Emitter terminals of an IGBT and shunts all the miller displacement current
into it, thereby reducing the VGE below the threshold voltage VGETH. Parallel Operation
The VE−Trac Direct family of modules are in 6−pak configuration and is
designed to be used as standalone modules in 3−phase inverter applications.
Although, they can be paralleled for higher power applications, the VE−Trac
Dual family of half−bridge modules represent a more cost effective option for
paralleling.
RELIABILITY
Module Life Estimation
Power module lifetime can be determined from power cycle capability curves.
However, since the power module has currently not completed qualification,
this data is not available yet. The lifetime reference curves will be added
when the product is fully qualified. The VE−Trac Direct modules are expected
to be at par or better than similar modules in the market today.
Qualification Tests
The objective of the qualification tests are to ensure general product quality
and reliability. The product use the requirements set in the AQG324 document
as its minimum requirements and in some cases will exceed these requirements.
Table 7. SUMMARY OF QUALIFICATION TESTS
Test | Standard | Test Conditions |
---|---|---|
High Temp Reverser Bias | AQG324 | Tj = 175°C, Bias = 80% VCE |
High Temp Gate Bias | AQG324 | Tj = 175°C, Bias = 20 V for +, VcE=0, VGE = |
negative mean for gate
High Temp / Low Temp Storage Life| JESD22-A101| Per JESD standards
Temperature Humidity Unbiased| JESD22-A101| Per JESD standards
High Humidity High Temperature Reverse Bias| JESD22-A101| Per JESD standards
Temperature Cycling & Vibration & Shock| AQG324, LV124, JESD22-A104| -40 to
+125°C
Power Cycling Test| AQG324| Multiple PCmin & PCsec conditions defined to meet
the requirements in the standard.
Vibration Variable Frequency| JESD22-B103| 25-500 Hz/15 min, 10G, 2hrs, XYZ
Package drop| EIAJ-ED-4701 Al24| 75 cm onto 3 cm maple board 3x
Solderability| JESD22-B102| TA = 254°C 20 sec dwell
Customer Destructive Physical Analysis| AEC Q101| Per 100TC, 100TS, 20k PCT
ESD Characterization| AEC 0101-001 and -005| HBM, CDM
Die Shear & Wire Bond Pull & Wire Bond Shear| MIL-STD883 Method 2019/2011 &
AEC-Q101-003| Per Assembly Spec
VISUAL MARKINGS
Traceability and Identification
For automotive applications, proper identification of materials and
traceability is an important aspect of quality.
Standard markings for the power module is shown below in Figure 25 and
explained in Table 7.![ON Semiconductor NVH820S75L4SPBVE Trac Direct Technical
- Design 39](https://manuals.plus/wp-content/uploads/2023/08/ON-Semiconductor-
NVH820S75L4SPBVE-Trac-Direct-Technical-Design-39.png)The 2D Code is readable
with most 2D scanners compatible with the IEC 24720 and IEC 16022 standard.
Certain apps for reading QR codes on android smart phones can also read the 2D codes on the module.
Table 8. EXPLANATION OF VISUAL MARKINGS ON THE MODULE
Marker | Description |
---|---|
COMPANY LOGO | onsemi Logo |
2D CODE 1 | Date Code (YYWW) + Assembly Location (XX) + Assembly Lot Number + |
S/N
2D CODE 2| Assy. Lot Number + S/N
SITE AND DATE CODE| Assembly location (XX) and date code (YYWW)
P/N NUMBER| 14 Character Product part number
Storage and Shipping
Transporting and storing the modules requires care to avoid extreme shock,
vibration and environments. The recommended storage conditions for the module
according to IEC 60721−3−1, class 1K2 should be followed and storage time
should not exceed 2 years. Below is a summary of the recommended storage
parameters:
Table 9. STORAGE AND SHIPPING CONDITIONS
Maximum air temperature | 40 | °C |
---|---|---|
Minimum air temperature | +5 | °C |
Maximum relative humidity | 85 | % |
Minimum relative humidity | 5 | % |
Condensation | Not Allowed | |
Precipitation | Not Allowed | |
Icing | Not Allowed |
VE−Trac is a trademark of Semiconductor Components Industries, LLC dba
“onsemi” or its affiliates and/or subsidiaries in the United States and/or
other countries.
onsemi, and other names, marks, and brands are registered and/or common
law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its
affiliates and/or subsidiaries in the United States and/or other countries.
onsemi owns the rights to a number of patents, trademarks, copyrights, trade
secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent−Marking.pdf.
onsemi reserves the right to make changes at any time to any products or
information herein, without notice. The information herein is provided “as−is”
and onsemi makes no warranty, representation or guarantee regarding the
accuracy of the information, product features, availability, functionality, or
suitability of its products for any particular purpose, nor does onsemi assume
any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. Buyer is responsible for its
products and applications using onsemi products, including compliance with all
laws, regulations and safety requirements or standards, regardless of any
support or applications information provided by onsemi. “Typical” parameters
which may be provided in onsemi data sheets and/or specifications can and do
vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. onsemi does not convey any
license under any of its intellectual property rights nor the rights of
others. onsemi products are not designed, intended, or authorized for use as a
critical component in life support systems or any FDA Class 3 medical devices
or medical devices with a same or similar classification in a foreign
jurisdiction or any devices intended for implantation in the human body.
Should Buyer purchase or use onsemi products for any such unintended or
unauthorized application, Buyer shall indemnify and hold onsemi and its
officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim
alleges that onsemi was negligent regarding the design or manufacture of the
part. onsemi is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale
in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to:orderlit@onsemi.com
onsemi Website:www.onsemi.com
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales
Representative
Documents / Resources
| ON
Semiconductor NVH820S75L4SPBVE-Trac Direct
Technical
[pdf] User Guide
NVH820S75L4SPBVE-Trac Direct Technical, NVH820S75L4SPBVE-, Trac Direct
Technical, Direct Technical, Technical
---|---
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>