ON Semiconductor RSL10 Evaluation and Development Board User Manual

EVAL BOARD USER’S MANUAL
www.onsemi.com
RSL10 Evaluation and Development Board User’s
Manual
EVBUM2529/D

INTRODUCTION

Purpose
This manual provides detailed information about the configuration and use of the RSL10 Evaluation and Development Board (RSL10−002GEVB). The Evaluation and Development Board is designed to be used with the software  development tools to evaluate the performance and capabilities of the RSL10 radio System-on-Chip (SoC).
Manual Organization
The Evaluation and Development Board Manual contains the following chapters and appendices:

• Chapter 1: Introduction describes the purpose of this manual, describes the target reader, explains how the book is organized, and provides a list of suggested reading for more information.

• Chapter 2: Overview provides an overview of the Evaluation and Development Board described in this manual.

• Chapter 3: Evaluation and Development Board provides the details of the Evaluation and Development Board. The chapter is divided into the following topics:
  ♦ Development Board Setup
  ♦ Development Board Design
  ♦ Power Supply
  ♦ Level Translators
  ♦ LED Circuitry
  ♦ RSL10 SoC
  ♦ Measuring the Current Consumption
  ♦ SWJ−DP Debug Port
  ♦ Digital Input/Output (DIO)
  ♦ Power Supply and Test Points

• Appendix A: Connectors provides a complete list of the connectors and jumpers on the Evaluation and Development Board.

• Appendix B: Schematics contains the schematics for the Evaluation and Development Board.

• Appendix C: Bill of Materials contains a list of the parts that are used to manufacture the Evaluation and Development Board.

Further Reading
For more information, refer to the following documents:

• Getting Started with RSL10
• RSL10 Firmware Reference
• RSL10 Hardware Reference
• RSL10 Datasheet

OVERVIEW

Introduction
The RSL10 Evaluation and Development Board is used for evaluating the RSL10 SoC and for application development. The board provides access to all input and output connections via 0.1″ standard headers. The on-board communication interface circuit provides communication to the board from a host PC. The communication interface translates RSL10 SWJ−DP debug port signals to the USB of the host PC. There is also an on-board 4-bit level shifter for debugging; it translates the I/O signal level of RSL10 to the 3.3 V digital logic level. It is not enabled by default; you enable it when it is needed.
Evaluation and Development Board Features
The Evaluation and Development Board enables developers to evaluate the performance and capabilities of the RSL10 radio SoC in addition to developing, demonstrating and debugging applications.
Key features of the board include:

• J−Link onboard solution provides a SWJ−DP (serial-wire and/or JTAG) interface that enables you to debug the board via a USB connection with the PC

• Alternate onboard SWJ−DP (serial-wire and/or JTAG)® interface for Arm Cortex
  −M3 processor debugging

• Access to all RSL10 peripherals via standard 0.1″ headers

• Onboard 4-bit level translator to translate the LPDSP32 debug interface at low voltage to a 3.3 V JTAG debugger

• Antenna matching and filtering network

• Integrated PCB antenna

• Compliance with the Arduino form factor

• Support for PMOD (i.e., J4 is a standard connector)

EVALUATION AND DEVELOPMENT BOARD

Evaluation and Development Board Setup
This section is an overview of how to configure the Evaluation and Development Board. Details of the development board configuration are discussed later in this manual.
Figure 1 represents an overview of the board setup.

If you want to use an external J−Link debugger instead of the onboard one, connect the debugger to connector P2 on the QFN board, as shown in Figure 2. Notice that for this setup, you also need a power supply.

Evaluation and Development Board Design
The following sections detail the various sub-circuits of the RSL10 Evaluation and Development Board. The block diagram in Figure 3 shows the locations of the various circuit sections. Figure 5 and Figure 6 provide 3-dimensional illustrations of the QFN board.

Power Supply
The Evaluation and Development Board can be powered by one of the following:

• Micro USB port with regulator
• External power supply connector (P5) with regulator
• External power supply connector (P5) without regulator
  Use the jumpers on pin headers P4, P7 and P10 to select a power supply option as show in Table 1.

Table 1. POWER SUPPLY SELECTION

Power Source| Jumper Position on P4| Jumper Position on P7| Jumper Position on P10
---|---|---|---
Micro USB Port with Regulator| 1 &2| 2&3| 1 &2
External Power Supply with Regulator| 3&4| 2&3| 1 &2
External Power Supply without Regulator| 5&6| 2&3| 2&3

Table 2. MINIMUM/MAXIMUM EXTERNAL REGULATED VOLTAGES

Level Translators
The board has level translators for the DIO signals of RSL10, including the clock signal. The level translators facilitate interfacing to external devices that operate at a higher voltage than RSL10.
VDDO and 3.3 V are two different power rails. The translator allows a logic signal on the VDDO side to be translated to either a higher or a lower logic signal voltage on the 3.3 V side, and vice-versa.
The level translation circuitry consists of components U4 and the 2×4 header. Signals are translated from the VDDO voltage reference to 3.3 V (default) voltage provided by the regulator output or by an external supply. The VDDO voltage  is configured by the pin on header P11 (located on the board edge) to either VBAT_DUT, 3.3 V or other level within the VDDO voltage range, which is 1.1 to 3.3 V.
The NLSX5014 level translators are bi-directional. They have the following features:

• Wide voltage operating range: 0.9 V to 4.5 V
• VDDO and 3.3 V are independent
• VDDO can be equal to, or less than, 3.3 V when connected to the power rail

To enable the level translators, populate positions R34 and R35 with 0 ohms. By default, the level translators are disabled. NOTE: Enabling the level translator affects power consumption.
LED Circuitry
There are two LEDs on the board. One is a dual color LED, called LD1, connected to the J−Link emulator microcontroller unit (MCU). The other is the green LED, connected to DIO 6 of RSL10. You can use this LED within your applications as an indication LED by programming DIO 6. If DIO 6 is high, this LED is on.
Measuring the Current Consumption
This section deals with measuring current consumption for the Evaluation and Development Board.
Headers are provided for each of the regulated voltages for additional capacitance and/or for measurements. RSL10 has 16 digital I/Os. The VDDO pin in header P9 configures the I/O voltages for power domains to VBAT. The VBAT pin in header P10 configures the VBAT source. The power select pin in header P4 configures the power source of the RSL10. In addition the measurements should be done by connecting an ammeter to current measure header P3 to measure  the device power consumption in isolation.
To measure the current consumption of RSL10 only, you need to source the chip using the external power supply without the regulator as shown in Table 2. To remove leakage currents during current measurement, remove the jumpers  on header SWD. Removing the jumpers between the MCU and RSL10 that connect nRESET, SWDIO and SWCLK prevents current leakage from the JTAG interface, avoiding inaccurate current measurements. In addition, DIOs 4, 5 and 6 must be configured to High−Z (disabled) with no pull up in software. DIOs 4 and 5 are directly connected to the Atmel chip and will leak power into it. DIO 6 is directly connected to the transistor driving the LED and can leak power into it.

SWJ−DP DEBUG Port
The J−Link adapters are typically used to communicate with RSL10 using the standard Coresight SWJ−DP debug port in a JTAG/SW communication protocol. The 9-pin 0.05 in Samtec FTSH header (P1), defined by the Arm Cortex−M3  core on the board, connects RSL10 to external dapters compatible with the Arm Cortex−M3 processor’s SWJ−DP interface. Alternatively, you can connect the micro USB port on the board to a PC.
DIGITAL Input/Output (DIO)
RSL10 contains 16 digital I/O (DIO) signals. The DIO voltage domain is VDDO, while the input voltage can be VBAT or external voltage as outlined in Section “Measuring the Current Consumption” on page 7.
The DIO signals on RSL10 are multiplexed with several interfaces, including:

• One I 2C interface (DIO [7:8])
• Four external inputs to the low-speed analog to digital converters (DIO [0:3])
• One PCM interface
• Two PWM drivers
• Two SPI interfaces (DIO [13:15])
• One UART interface (DIO [4:5])
• Support interfaces that can be used to monitor control of the RF front-end and Bluetooth® baseband controller

For more information about the DIO multiplexed signals, refer to the RSL10 Hardware Reference.
The board provides access to any of the DIOs or their multiplexed signals via the Arduino Headers (Power1, AD1, IOL1, and IOH1).
The LED circuit provides visual monitoring of the DIOs; refer to Section “LED Circuitry” on page 7 for further information.
Power Supplies
There are several external power supplies available on your Evaluation and Development Board.
The user can also access signals on various headers on boards, as described throughout this document.
The external power supplies available for QFN boards are:

• VBUS, 5 V from USB connection − available only when USB is plugged in
• V3.3, 3.3 V from LDO − available when regulated supply is selected
• VEXT, (P5 header) unregulated external supply available when unregulated supply is selected
• Battery (J5 Battery Holder, 12 mm coin cell battery)

Export Control Classification Number (ECCN)
The ECCN designation for RSL10 is 5A991.g.

APPENDIX A − CONNECTORS

Overview
This appendix lists all connectors on the Evaluation and Development Board. The sections that follow provide descriptions for:

• Jumpers and their possible configurations
• Headers
• Switches and their possible configurations
• Connectors

Configuration Header Jumpers
Table 3. JUMPER DESCRIPTIONS

Headers
Table 4. HEADER DESCRIPTIONS

Switches
Table 5. SWITCH DESCRIPTIONS

Connectors
Table 6. CONNECTOR DESCRIPTIONS

APPENDIX B − SCHEMATICS
This appendix contains schematics for the Evaluation and Development Board, version 1.3:

• The Top-level (Arduino interface) schematic
• The RSL10 schematic
• The Interface MCU schematic
• The Power Supply schematic

Figure 7. Top-Level (Arduino Interface) Schematic Figure 8. RSL10 SoC Schematic Figure 9. Interface MCU Schematic Figure 10. Power Supply Schematic

APPENDIX C − BILL OF MATERIALS
Table 7. BILL OF MATERIALS FOR RSL10 QFN EVALUATION AND DEVELOPMENT BOARD VERSION 1.3

Designator| Description| Footprint Doc| Manufacturer
Part Number| Supplier
Part Number
---|---|---|---|---
AD1| Arduino Stackable Header 6-pin| n/a| SSO-106-03-G-S| SAM1198-06-ND
C2, C3, co, C5, C6| Capacitor, NPO, -±2%| 402| GRM1555C1E1 20GAO1D| 490-8169-1-ND
C7| CAP CER 2.2 !IF 10 V X5R 0402| 402| GRM155R61A225KE95D| 490-10451-1-ND
C9, C16,C40| CAP CER 4.7 11F 10 V X5R 0603,
CAP CER 4.7 taF 25 V X5R 0603| 603| GRM188R61A475KE15D| 490-10477-1-ND
C11| Capacitor, NPO, ±2%| 402| GRM1555C1H101JA01J| 490-7754-1-ND
C12, C13| CAP CER 1.5 PF 50 V NPO 0402| 402| GCM1555C1 H1R5CA16D| 490-13289-1-ND
C14| Capacitor, NPO, ±2%| 402| GRM1555C1E1 20GAO1D| 490-8169-1-ND
C10,C18, C19, C20,
C21, C23, C25, C27,
C29, C30, C31, C32,
033, C36, 037, C38.
C30, C48| Capacitor, NPO, ±2%| 402| GRM155R61E104KA87D| 490-5920-1-ND
C22| Capacitor. NPO, ±2%| 402| GRM1555C1E100JA01D| 490-6168-1-ND
C24, C34, C35| Capacitor, X5R, ±10%| 603| GRM188R61A106KE69D| 490-10474-1-ND
C26, C28| Capacitor. NPO, 2%| 402| GRM1555C1E18WAO1D| 490-6172-1-ND
Cl, C13, C17, C41, C42,
C45, C46| Capacitor, NPO, ±10%| 402| GRM155R61A105KE15D| 490-3890-1-ND
C44, C47| Capacitor, NPO, ±2%| 402| GRM155R71H103KAI38D| 490-4516-1-ND
D1| Ultra low capacitance double
rail-to-rail ESD protection diode| SOT-143B| PRTR5VOU2X,215| 568-4140-1-ND
10H1| Arduino Stackable Header 10-pin| | SSQ-110-03-G-S| SAM1198-10-ND
10L1, POWER1| Arduino Stackable Header 8-Pin| | SSO-108-03-G-S| SAM1198-08-ND
J1| Coaxial Connector with Switch| COAXIAL-SWF| MM8130-2600RA2| 490-4981-1-ND
J2| MicroUSB-B-SMT| FCI10118193-0001LF| 10118193-0001LF| 609-44316-1-ND
J4| WR-PHD 2.54 mm Angled Dual
Socket Header, 12p| | 613012243121| S5559-ND
J5| HOLDER BATTERY 12 MM COIN| | 2996| 36-2996-ND
Ll| FIXED IND 3NH 800MA
170 MOHM SMD| 402| LOG15HS3NOSO2D| 490-6570-1-ND
L2| FIXED IND 1.8NH 950MA
100 MOHM| 402| LOG15HS1N8S02D| 490-2613-1-ND
L3| Inductor, 320 mA, ±5%| 402| HK100515NJ-T| 587-1521-1-ND
L4| Imported| 805| CKP2012N2R2M-T| 587-2771-1-ND
LD1| Ultra bright AlInGaP Bi-Color LED| LED DUAL 0606
_| LTST-C195KGJRKT| 160-1452-1-ND
LED 1| LED SMARTLED GREEN 570NM
0603| 603| LNJ337W83RA| LNJ337W83RACT-ND
Pl, P4| Header 2×3 SMT| | 15-91-2060| WM17449-ND
P2| SAMTEC – CONN HEADER 1OPOS
DUAL .05″ SMD KEYING SHROUD| FISH-105| FTSH-105-01 -F-DV-K| SAM8796-ND
P3, P5| HEADER, 2POS, 1ROW; Series:
961; Pitch Spacing: 2.54 mm; RA| | 961102-5604-AR| 3M9467-ND
P6| 2×4 Pin Header| | 15-91-2080| WM17450-ND
P7, P8, P9, P10| HEADER, 3POS, 1 ROW; Series:
961; Pitch Spacing: 2.54 mm;| | 961103-6404-AR| 3M9448-ND
1| NMOS Transistor| SOT65P210X105-3N| RU1 J002YNTCL| RU1 J002YNTCLCT-ND
R1, R2, R4. R9, R30.
R31| Resistor, ±1%, 0.063 W| 402| ERJ-2RKF68ROX| P68.0LCT-ND

Table 7. BILL OF MATERIALS FOR RSL10 QFN EVALUATION AND DEVELOPMENT BOARD VERSION 1.3

Designator| Description| Footprint Doc| Manufacturer
Part Number| Supplier
Part Number
---|---|---|---|---
R3, R5, R6, R26, R27,
R32,R44, R46, R48,
R49, R50,| Resistor, ±1%, 0.063 W| 402| ERJ-2RKF68ROX, ERJ-2RKF68ROX, ERJ- 2RKF68ROX, ERJ-2GEOROOX, ERJ-2GEOROOX, ERJ-2GEOROOX, ERJ-2GEJ103X, ERJ- 2GEJ103X, ERJ-2GEJ103X, ERJ-2GEOROOX, ERJ-2GEOROOX, ERJ-2GEOROOX, ERJ- 2GEOROOX, ERJ-2GEOROOX, ERJ-2GEJ103X| P68.0LCT-ND, P68.0LCT-ND,
P68.OLCT-ND,
PO.OJCT-ND, PO.OJCT-ND,
173-8862,
P1OKJCT-ND, P1OKJCT-ND,
P1OKJCT-ND,
173-8862, 173-8862, 173-8862,
173-8862, 173-8862, P1OKJCT-ND
R7, R36, R40, R41,R42,
R43, R51| Resistor, ±1%, 0.1 W| 402| ERJ-2GEJ103X| P1OKJCT-ND
R10, R11| Resistor, ±1%, 0.1 W| 402| ERJ-2RKF39ROX| P39.OLCT-ND
R12, R13, R14, R20| Resistor, ±1%, 0.1 W| 402| ERJ-2RKF4701X| P4.70KLCT-ND
R15, R16| Resistor, ±1%, 0.1 W| 402| ERJ-2RKF2200X| P220LCT-ND
R17, R18, R19, R29| Resistor, ±1%, 0.1 W| 402| ERJ-2RKF6801X| P6.80KLCT-ND
R21, R45, R47, R52,
R53| Resistor, ±1%, 0.1 W| 402| ERJ-2GEOROOX| PO.OJCT-ND
R22, R23, R24, R25,
R28| Resistor, ±1%, 0.1 W| 402| ERJ-2RKF1500X| 173-8862
R54| Resistor, ±1%, 0.1 W| 402| ERJ-2RKF1003X| P100KLCT-ND
SW1, SW2| ALPS – SKHUALE010 – Tactile
Switch, SPNO, SMD,
6.5 x 6.2 x 2.5 mm| ALPS_SKHU>c<x010_WO_GND| SKHUALE010| 35-790-00
U1| RSL10 QFN| | |
U2| IC MCU 32 bit 128 kB flash
100LQFP| LQFP-100| ATSAM3U2CA-AU| ATSAM3U2CA-AU-ND
U3| IC REG UN 3.3 V 600MA 5TSOP| TSOP-SIPC| NCP114ASN330T1G| NCP114ASN330T1GOSCT-ND
U4| TRANSLATOR LEVEL 4BIT
14-TSSOP| TSOP65P640X120-14N| NLSX5014DTR2G| NLSX5014DTR2GOSCT-ND
U5| Remote 16•bit expander| QFN50P400X400| PCA9655EMTTXG| PCA9655EMTTXGOSDKR- ND
X1| ECS 48 MHz Crystal| XTAL 4 pads| ECS-480-8-47-JTN-TR| XC1969CT-ND
X2| EPSON TOYOCOM – FC-135
32.768 kHz ±20 PPM| XTAL_3215| FC-135 32.768KHZ ±2OPPM| FC-135 32.7680KA-AC-ND
X3| XTAL SMD 3225, 12 MHz, 18 pF,
±30 ppm| BT-XTAL _3225| 7M-12.000MAAJ-T| 887-1121-1-ND
See Jumper Location| CONN JUMPER SHORTING GOLD
FLASH| CONN JUMPER (2.54mm) Gold| SPCO2SYAN| S9001 -ND
See Installation| MACHINE SCREW PAN PHILLIPS
4-40| n/a| NY PMS 440 0025 PH| H542-ND
See Installation| HEX STANDOFF 4-40 NYLON 3/8″| n/a| 1902B| 36-1902B-ND

NOTE: Designators C2, C3, C4, C5, C6 and R3, R5, R6, R26, R27, R32,R44, R46, R48, R49, R50 are not populated.

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