Infineon CYW920829M2EVK-02 Evaluation Kit Release Bluetooth Low Energy Instructions

June 1, 2024
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Infineon CYW920829M2EVK-02 Evaluation Kit Release Bluetooth Low Energy

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Product Information

Specifications

  • Product Name: CYW920829M2EVK-02 Evaluation Kit
  • Model Number: CYW920829M2EVK-02
  • Release Date: August 25, 2023

Product Usage Instructions

Release Contents
The CYW920829M2EVK-02 Evaluation Kit includes the following items:

  1. CYW20829 Evaluation Board (CYW9BTM2BASE3+CYW920829M2IPA2)
  2. USB Type-A to Micro-B cable
  3. Six jumper wires (five inches each)
  4. Quick start guide

Tool Information
Software and Tools
Code examples for this kit require ModusToolboxTM software 3.0 or later, which can be found on the ModusToolboxTM software webpage. Please refer to the kit guide for more detailed
instructions.

FAQ (Frequently Asked Questions)

  1. Q: Who is the intended audience for the CYW920829M2EVK-02 Evaluation Kit?
    A: This kit is intended for anyone who uses the CYW920829M2EVK-02 Evaluation Kit.

  2. Q: Where can I find technical support for the kit?
    A: Technical support information can be found in the documentation provided with the kit.

About this document
Scope and purpose
Thank you for your interest in the CYW920829M2EVK-02 Evaluation Kit. This document lists kit contents, installation requirements, kit documentation, and limitations.

Intended audience
This document is intended for anyone who uses the CYW920829M2EVK-02 Evaluation Kit.

Release contents

Kit contents
The CYW920829M2EVK-02 Evaluation Kit box includes the following:

  1. CYW20829 Evaluation Board (CYW9BTM2BASE3+CYW920829M2IPA2)
  2. USB Type-A to Micro-B cable
  3. Six jumper wires (five inches each)
  4. Quick start guide

Tool information

Software and tools
Code examples for this kit require ModusToolbox™ software 3.0 or later. This is available on the ModusToolbox™ software webpage. Refer to the kit guide for details. KitProg3 firmware v2.40 or later is required to program the AIROC™ CYW20829 Bluetooth® LE SoC device on the kit. The ModusToolbox™ installer automatically installs KitProg3 drivers.

Code examples and kit collateral
The kit webpage includes the documents and hardware files. The code examples are available on the Infineon GitHub repository.

Installation
All required software installation instructions are provided in the kit guide, which is available on the kit webpage.

Kit revision
This is the initial revision (Rev. **)

Limitations

  1. The SWD and SPI (MOSI, MISO) interfaces share the same GPIOs and must use one interface at a time. See the kit guide for more information on enabling the SPI option.

    • Workaround: None
  2. The SPI (CS, CLK), User Button2, and USER LED1 share the same GPIOs, when you install the R105 to use SPI_CLK, the USER LED1 will be glowing based on SPI CLK speed as R90 is loaded by default.

    • Workaround: This can be isolated with tripad resistors.
    • Default P1.0 is connected to USER_BTN2 via R87; remove it and install R104 to use SPI_CS
    • Default P1.1 is connected to USER_LED1 via R90; remove it and install R105 to use SPI_CLK
  3. SCB1 UART is not connected via KitProg3, if you need to use SCB1 UART.

    • Workaround: Connect the UART lines from Arduino-compatible shield pins D4 and D5 to MiniProg4 or FTDI.
  4. SCB2 I2C (P5.0, P5.1) pins are not connected to resistor pull-ups.

    • Resistor pull-ups are not given, as the same pins are used for CANFD by default.
    • Workaround: Follow any one of the methods to make SCB2 work as a master.
    • You can use the SCB0 I2C pins (P4.0, P4.1) as master and loop back the SCB2 I2C pins (P5.0, P5.1).
    • HAL: Connect external pull-up resistors
    • PDL: Enable the SCB from the device configurator and change the pin drive mode from “open drain, drives low, input buffer on” to “resistive pull-up, input buffer on”.
  5. The Rev. ** version of the kit contains the engineering sample (ES) parts of the AIROC™ CYW20829 Bluetooth® LE SoC. The production parts will be available in the next revision of the kit.

    • Workaround: None
  6. Mismatch of EXT_LPO pin connection

    • EXT_LPO is connected to P5.0(WCO_IN); this should have been connected to P5.1(WCO_OUT)
    • Workaround:
    • PILO is used as default clock source, in case you need to use external crystal oscillator, you need to rework the following tripad resistors in M.2 board CYW920829M2IPA2:
    • R31-Remove resistor from option AC and install at position BC
    • R30-Remove resistor from option AC and install at position BC
    • R6- Remove resistor from the M.2 Board
  7. a. When device is in DS-RAM mode the following pins are utilized for SWD operation.

    • P1_0_CPUSS_SWJ_SWO_TDO

    • P1_1_CPUSS_SWJ_SWDOE_TDI

    • P1_2_CPUSS_SWJ_SWDIO_TMS

    • P1_3_CPUSS_CLK_SWJ_SWCLK_TCLK

    • Workaround: To utilize these pins, disable the debug mode before the device enters DS-RAM mode by using the Cy_Syslib_SetWarmBootEntryPoint( ) API. To disable debug mode in DS-RAM, 2nd parameter in the API must be set to ‘false’.
      If the debug mode is disabled, the evaluation kit cannot be programmed.

    • Workaround: To re-program the device use ‘make erase’ command on modus shell.

  8. VDDIO current is more than 2 µA in DS and DS-RAM during current measurement.

    • Workaround:
    • Remove the R12 and R13 resistors that are loaded by default on the CYW920829M2IPA2.
    • Configure the RTS and CTS pins to Analog High-Z state before entering
      DeepSleep/DeepSleep-RAM and after waking up, it should be reconfigured back to its original state.
  9. I2C and SPI doesn’t operate when we provide power using coin cell for Master and Slave devices. Since the KitProg 3 section is not powered ON, the current is sinking into KitProg 3 internal ESD diodes.

    • Workaround:
    • For I2C, resistors R31 and R32 which are connected to KitProg3 must be isolated at the master side.
    • For SPI, resistors R56 and R57 which are connected to SWDCLK and SWDIO must be isolated at the Master side.
  10. KitProg3 section in the kit does not support hardware interface for JTAG, Secondary UART, SPI, and GPIO.

    • Workaround: None

Documentation
The following kit documents are available on the kit webpage.

  • CYW920829M2EVK-02 Evaluation Kit guide
  • CYW920829M2EVK-02 Evaluation Kit quick start guide
  • CYW920829M2EVK-02 Evaluation Kit release notes

Technical support
For assistance, go to www.infineon.com/support. Visit community.infineon.com to ask your questions in the Infineon developer community.

Additional information

Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2023-08-25
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2023 Infineon Technologies AG. All Rights Reserved.

Do you have a question about this document?
Email: erratum@infineon.com
Document reference
002-37478 Rev. *B

Important notice
The information contained in this document is given as a hint for the implementation of the product only and shall in no event be regarded as a description or warranty of a certain functionality, condition or quality of the product. Before implementation of the product, the recipient of this document must verify any function and other technical information given herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this document. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.

Warnings
Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.

References

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