infineon CYBLE-343072-02 AIROC Bluetooth LE Module User Guide

: May 15, 2024
: infineon

Table of Contents

General description
Module description
Power consumption
Note
Functional capabilities
Benefits
References
Technical support
Overview
References
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infineon CYBLE-343072-02 AIROC Bluetooth LE Module User Guide

General description

The CYW20822-P4xxI040 is a fully integrated Bluetooth® LE wireless module. The CYW20822-P4xxI040 includes an onboard crystal oscillator, passive components, flash memory, and the CYW20822 silicon device. The CYW20822-P4xxI040 supports peripheral functions (ADC and PWM), UART, I2 C, and SPI communication, and a PDM interface. The CYW20822-P4xxI040 includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.0 core spec in a 20.2 × 10.5 × 2.3 mm package.
The CYW20822-P4xxI040 includes 1 MB of embedded flash memory and is pre-loaded with EZ-Serial firmware. The CYW20822-P4xxI040 is fully qualified by Bluetooth® SIG and is targeted at applications requiring cost-optimized Bluetooth® wireless connectivity.
The CYW20822-P4xxI040 is offered in two certified versions: CYW20822-P4TAI040 and CYW20822-P4EPI040. The CYW20822-P4TAI040 includes an integrated trace antenna. The CYW20822-P4EPI040 supports an external antenna through a RF solder pad output

Module description

Module size: 20.2 × 10.5 × 2.3 mm
Bluetooth® 5.0 core spec qualified module
- QDID: TBD
- Declaration ID: TBD
Certified to FCC, ISED, MIC, and CE regulations
Castelated solder pad connections for ease-of-use
1-MB embedded on-module serial flash memory
Up to 12 GPIOs
Temperature range: –45°C to +85°C
16-MHz Arm® Cortex®-M0 microcontroller unit MCU
Maximum TX output power
- +4 dBm for Bluetooth® Low Energy
- Bluetooth® LE connection range of up to 250 meters at 4 dBm[1]
RX sensitivity:
- Bluetooth® Low Energy: –101 dBm @ 125 kbps

Power consumption

Bluetooth® LE current consumption
- RX current: 1.3 mA @ -95 dBm
- TX current: 3 mA @ 0 dBm
- Retention: 2 µA @ 32 KB RAM
- Hibernation: 0.8 µA

Note

Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interference sources with output power of +4 dBM @ 125 kbps. Actual range will vary based on end product design, environment, receive sensitivity, and transmit output power of the central device.

Functional capabilities

8 × 16-bit PWMs
12 × GPIOs
Quadrature decoder
Analog comparator
2× peripheral UART
2× SPI
2× I2C
ADC (10-bit application ADC with one differential input or three single-ended inputs)
Hardware security engine

Benefits

CYW20822-P4xxI040 provides all necessary components required to operate Bluetooth® LE communication standards.

Proven ready-to-use hardware design
Cost optimized for applications without space constraints
Nonvolatile memory for self-sufficient operation and over-the-air updates
Bluetooth® SIG listed with QDID and declaration ID
Fully certified module eliminates the time needed for design, development, and certification processes
Pre-loaded EZ-Serial firmware provides an easy-to-use command interface to configure and use the module

More information
Infineon provides a wealth of data at www.infineon.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design.

References

Overview: AIROC™ Bluetooth® LE & Bluetooth® portfolio, Module portfolio
Development kits:
CYW920822M2P4TAI040-EVK, CYW20822-P4TAI040 evaluation board
- CYW920822M2P4EPI040-EVK, CYW20822-P4EPI040 evaluation board
EZ-Serial firmware:
- User guide of EZ-Serial firmware for CYW20822-P4xxI040
Knowledge base articles
KBA97095 – EZ-Bluetooth® LE module placement
KBA213976 – FAQ for Bluetooth® LE and regulatory certifications with EZ-BLE modules
KBA210802 – Queries on Bluetooth® LE qualification and declaration processes
KBA218122 – 3D Model Files for EZ-BLE/EZ-BT modules

Technical support

Infineon community: Whether you are a customer, partner, or a developer interested in the latest innovations, the developer community offers you a place to learn, share, and engage with both Infineon experts and other embedded engineers around the world.
Visit our support page and contact a local sales representatives. If you are in the United States, you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the promp

Overview

Functional block diagram
Figure 1 illustrates the CYW20822-P4xxI040 functional block diagram.

Figure 1 Functional block diagram (GPIOs)

Module description
The CYW20822-P4xxI040 module is a complete module designed to be soldered to the application’s main board.

Module dimensions and drawing
Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in
Figure 2. All dimensions are in millimeters (mm).

Table 1 Module design dimensions

Dimension item	Specification
Module dimensions	Length (X)
Width (Y)	20.2 ± 0.15 mm
Antenna connection location dimensions	Length (X)
Width (Y)	6.35 mm
PCB thickness	Height (H)
Shield height	Height (H)
Maximum component height	Height (H)
Total module thickness (bottom of module to highest component)	Height (H)