EBYTE Bluetooth Module E104-BT53A1 User Manual
- June 6, 2024
- ebyte
Table of Contents
E104-BT53A1 User Manual
EFR32BG22, 2.4G, BLE5.2
Low power consumption
Bluetooth module
Overview
1.1 Brief introduction
E104-BT53A1 is a small-sized SMD Bluetooth BT5.2 module based on Silicon
Labs’ original IC EFR32BG22; uses a 38.4MHz industrial-grade high-precision
low-temperature drift crystal oscillator to ensure its industrial-grade
function and
stable performance.
EFR32BG22 chip integrates 32-bit ARM® Cortex®-M33 core and Bluetooth
5.2 RF transceiver and protocol stack, and has rich peripheral resources of
UART,
I2C, SPI, ADC, DMA, PWM. The module provides almost all IO ports (please check
the pin definition for details) to allow users to carry out multi-directional
development.
This module is a pure hardware SoC module without a firmware program. The
functions of Bluetooth-based broadcasting, scanning, connection, and
transparent transmission can only be realized after the user’s secondary
development.
1.2 Features
- Support Bluetooth 5.2 protocol;
- Support Direction Finding;
- Maximum transmit power 0dBm, adjustable by software;
- Support the global license-free ISM 2.4GHz band;
- Built-in high-performance low-power Cortex®-M33 core processor;
- Rich resources, 352KB FLASH, 32KB RAM;
- Support 1.9 ~ 3.6V power supply, 3.3-3.6V can guarantee the best performance;
- Industrial standard design, support long-term use at -40～+85℃;
- The experimental communication distance is 120 meters;
- The module uses a PCB antenna.
1.3 Application
- Smart home and industrial sensors;
- security system;
- Wireless remote control, UAV;
- Wireless game remote control;
- Healthcare products;
- Wireless voice, wireless headset;
- Asset tags, beacons, etc.
Parameters
2.1 Limit Parameters
| Parameters | Value | Specification |
|---|---|---|
| Min | Max | |
| Power supply voltage (V) | 0 | 3.6 |
| Blocking power (dBm) | – | 10 |
| Working temperature (℃) | -40 | +85 |
2.2 Working Parameters
| Parameters | Value | Specification |
|---|---|---|
| Min | Typical | Max |
| Working voltage (V) | 1.9 | 3.3 |
| Communication level (V) | – | 3.3 |
| Working temperature (℃) | -40 | – |
| Working frequency band (MHz) | 2402 | 2440 |
| TRX（mA） | – | 3.4 |
| RX（mA） | – | 3.6 |
| Sleeping Current（uA） | – | 0.17 |
| Max TRX Power（dBm） | – | 0 |
| Receiving sensitivity（dBm） |
–
|
-98.9
|
–
| -98.9 dBm sensitivity @ 1 Mbit/s GFSK
-96.2 dBm sensitivity @ 2 Mbit/s GFSK
Air Rate| GFSK（bps）| 125k| –| 2M| Programmable by User
Parameters
| Specification|
Note
---|---|---
Reference distance| 70m| Clear and open, antenna gain 5dBi, antenna height
2.5m, air rate 1kbps
Crystal frequency| 38.4MHz| –
supporting agreement| BLE 5.2| –
Packaging method| SMD| –
Interface method| 1.27mm| –
IC full name| EFR32BG22C112F352 GM32-C| –
FLASH| 352KB| –
RAM| 32KB| –
Kernel| ARM®Cortex®-M33| –
Dimensions| 13*19mm| –
RF interface| PCB| Equivalent impedance is about 50Ω
Size and Pin Definition
Pin No.| Name| Type|
Definition
---|---|---|---
1| GND| Input| Ground wire, connect to power reference ground
2| PB02| input Output| MCU GPIO (see EFR32BG22 manual for details)
3| PB01| input Output| MCU GPIO (see EFR32BG22 manual for details)
4| PB00| input Output| MCU GPIO (see EFR32BG22 manual for details)
5| PA00| input Output| MCU GPIO (see EFR32BG22 manual for details)
6| PA01| Input| SWCLK, serial line debugging clock input debugging and
programming (see EFR32BG22 manual for details)
7| PA02| Input| SWDIO, serial line debugging and programming debugging (see
EFR32BG22 manual for details)
8| PA03| input Output| MCU GPIO (see EFR32BG22 manual for details)
9| GND| Input| Ground wire, connect to power reference ground
10| GND| Input| Ground wire, connect to power reference ground
11| PA04| input Output| MCU GPIO (see EFR32BG22 manual for details)
12| PA05| input Output| MCU GPIO (see EFR32BG22 manual for details)
13| PA06| input Output| MCU GPIO (see EFR32BG22 manual for details)
14| VCC| Input| Power supply, range 1.9 ~ 3.6V (recommended to add ceramic
filter capacitors externally)
15| VCC| Input| Power supply, range 1.9 ~ 3.6V (recommended to add ceramic
filter capacitors externally)
16| GND| Input| Ground wire, connect to power reference ground
17| GND| Input| Ground wire, connect to power reference ground
18| PD01| input Output| MCU GPIO (see EFR32BG22 manual for details)
19| PD00| input Output| MCU GPIO (see EFR32BG22 manual for details)
20| PC00| input Output| MCU GPIO (see EFR32BG22 manual for details)
21| PC01| input Output| MCU GPIO (see EFR32BG22 manual for details)
22| PC02| input Output| MCU GPIO (see EFR32BG22 manual for details)
23| PC03| input Output| MCU GPIO (see EFR32BG22 manual for details)
24| PC04| input Output| MCU GPIO (see EFR32BG22 manual for details)
25| PC05| input Output| MCU GPIO (see EFR32BG22 manual for details)
26| RST| Input| Chip reset trigger input pin, effective when low level
Hardware and Software
4.1 Hardware Notice
- If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, it may still damage the module);
- Try to stay away from the TTL protocol which is also 2.4GHz in some physical layers, for example USB3.0;
- It is recommended to use a DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded
- Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection may cause permanent damage to the module;
- Please check the power supply to ensure that it is between the recommended power supply voltage if exceeding the maximum value will cause permanent damage to the module;
- Please check the power supply stability, the voltage cannot fluctuate significantly and frequently;
- When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so that the whole machine is conducive to long-term stable work;
- The module should be as far away as possible from the power supply, transformer, high-frequency wiring, and other parts with large electromagnetic interference
- High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is absolutely necessary to pass under the module, it is assumed that the module is soldered to the top layer, and the copper layer is laid on the top layer of the contact part of the module (all copper And well-grounded), must be close to the digital part of the module and the wiring is on the Bottom Layer;
- Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route on the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
- Assuming that there are devices with large electromagnetic interference around the module, it will greatly affect the performance of the module. It is recommended to stay away from the module according to the intensity of the interference. If the situation permits, appropriate isolation and shielding can be done;
- It is assumed that there are traces with high electromagnetic interference around the module (high-frequency digital high-frequency analog, and power traces), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the intensity of the interference. Isolation and shielding;
- The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna is exposed, preferably vertically. When the module is installed inside the cabinet, you can use a high-quality antenna extension cord to extend the antenna to the outside of the cabinet;
- The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance.
4.2Programming
-
The core IC of this module is EFR32BG22C112F352GM32-C, and its programming method is the same as this IC.
Users can follow the EFR32BG22C112F352GM32-C official programming guide; -
For general I/O port configuration, please refer to the EFR32BG22C112F352GM32-C manual for details;
-
Regarding software development, it is recommended that users use the Simplicity Studio officially provided by silicon-labs. This IDE document describes in detail and complete information. Using Simplicity Studio, users need to go to the silicon-labs official website to register an account to use.
-
Users can use the development board provided by silicon-labs to download the program or use the universal JLINK.
JLINK program download software is as follows:
FAQ
5.1 Communication range is too short
- The communication distance will be affected when an obstacle exists.
- Data loss rate will be affected by temperature, humidity, and co-channel interference.
- The ground will absorb and reflect wireless radio waves, so the performance will be poor when testing near the ground.
- Seawater has a great ability in absorbing wireless radio waves, so performance will be poor when testing near the sea.
- The signal will be affected when the antenna is near a metal object or put in a metal case.
- Power register was set incorrectly, the air data rate is set as too high (the higher the air data rate, the shorter the distance).
- When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
- The use of the antenna and the module is poorly matched or the quality of the antenna itself is defective.
5.2 Module is easy to damage
- Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to permanent damage to the module.
- Please check the stability of the power supply and ensure the voltage not fluctuate too much.
- Please make sure anti-static measures are taken when installing and using, high-frequency devices that have electrostatic susceptibility.
- Please ensure the humidity is within a limited range for some parts are sensitive to humidity.
- Please avoid using modules under too high or too low temperatures.
5.3 Bit error rate is too high
- When there are co-channel signal interference nearby, be away from interference sources or modify frequency and channel to avoid interference;
- Unfavorable power supply may cause code error. Make sure that the power supply is reliable.
- The quality of extension cables and feeders is poor or too long can also cause a high bit error rate.
Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature
| Curve feature| Sn-Pb Assembly|
Pb-Free Assembly
---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）| Minimum preheating temperature| 100℃| 150℃
Preheat temperature max (Tmax)| Maximum preheating temperature| 150℃| 200℃
Preheat Time (Tasmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Ts max to Tp)| Average rising rate| 3℃/second max|
3℃/second max
Liquidous Temperature (TL)| Liquid phase temperature| 183℃| 217℃
Time（tL）Maintained Above（TL）| Time above liquidus| 60-90 sec| 30-90 sec
Peak temperature（Tp）| Peak temperature| 220-235℃| 230-250℃
Average ramp-down rate（Tp to Tsmax）| Average descent rate| 6℃/second max|
6℃/second max
Time 25℃ to peak temperature| Time of 25 ° C to peak temperature| 6 minutes
max| 8 minutes max
6.2 Reflow Soldering Curve
Revision History
Version| Date| Description|
Issued by
---|---|---|---
1.0| 2020-05-08| Initial version|
Contact Us:
Sales hotline: 4000-330-990
Support: support@cdebyte.com
Address:
Tel: 028-61399028
Website: www.ebyte.com
Innovation Center B333~D347, 4# XI-XIN road, High-tech district (west),
Chengdu, Sichuan, China
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd.
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>