EBYTE E73-2G4M04S1F BLE Module User Manual

: June 3, 2024
: ebyte

Table of Contents

Disclaimer
Overview
Specification and parameter
Size and pin definition
Basic Operation
FAQ
Welding operation guidance
Related Model
Antenna Type
Batch packaging
Documents / Resources

E73-2G4M04S1F User Manual
RF52811 2.4GHz BLE5.1/IEEE 802.15.4-2006 BLE Module

Disclaimer

The information in this document, including the URL address for reference, is subject to change without notice. The document is provided “as is” without any guarantee responsibility, including any guarantee for marketability, suitability for a specific purpose, or non-infringement, and any guarantee for any proposal, specification or sample mentioned elsewhere. This document does not bear any responsibility, including the responsibility for infringement of any patent rights caused by the use of the information in this document. This document does not grant any license for the use of intellectual property rights in estoppel or other ways, whether express or implied.
The test data obtained in the article are all obtained by the Ebyte laboratory, and the actual results may vary slightly.
We hereby declared that all brand names, trademarks and registered trademarks mentioned in this document are the property of their respective owners.
The final interpretation right belongs to Chengdu Ebyte Electronic Technology Co.,Ltd.
Notice :
Due to product version upgrades or other reasons, the contents of this manual may be changed. Ebyte Electronic Technology Co., Ltd. reserves the right to modify the contents of this manual without any hint or noticet. This manual is only used as a guide. Chengdu Ebyte Electronic Technology Co., Ltd. makes every effort to provide accurate information in this manual. However, we does not guarantee that the contents of the manual are completely free of errors. All statements, information and suggestions in this manual do not constitute any express or implied guarantee.

Overview

1.1 Introduction
E73-2G4M04S1F is a small volume chip Bluetooth wireless module independently developed based on nrf52811 chip ofNordic ofNorway. It adopts 32mhz industrial crystal oscillator to ensure its industrial characteristics and stable performance.
NRF52811 comes with high-performance ARM CORTEX-M4 core, IEEE 802.15.4-2006 RF transceiver and protocol stack ofBLE 5.1.
Especially the direction finding function, pushing Bluetooth positioning to a new height. It has rich peripheral resources such as UART, I2C, SPI, ADC, DMA, PWM, etc. The module leads out almost all IO ports. Please check the pin definition for details, so as to facilitate users to carry out multi- directional development. The module can be connected with other antennas through IPEX.
Because the module is a pure hardware SOC module, it can be used only after the user programs it.
1.2 Features

Support BLE 5.1, all functions of bluetooth 5 and IEEE 802.15.4-2006;
Maximum transmission power is 2.5mW, is is multi-level adjustable by software;
Built-in 32.768 kHz clock crystal oscillator;
Support for the global license-free ISM 2.4GHz band;
Built in Cortex-M4 core processor with high performance and low power consumption;
Rich resources, 192KB FLASH, 24KB RAM;
Support 1.8V~3.6V power supply, more than 3.3V power supply can guarantee the best performance;
Industrial grade standard design, can work under -40 ~ 85 °C for a long time;
Under ideal conditions, the communication distance can reach 100m.

1.3 Application

Smart home and industrial sensors；
Security system and positioning system;
Wireless remote control, UAV；
Wireless Game Remote Controller；
Health care products；
Wireless voice, wireless headset；
Automotive industry applications.

Specification and parameter

2.1 Limit parameter

Main parameter	Performance	Remark
Min.	Max.
Power supply (V)	0	4.

module
Blocking power (dBm)| –| 10| Chances of burn is slim when modules are used in short distance
Operating temperature (°C)| -40| 85| Industrial grade

2.2 Operating parameter

Main parameter	Performance	Remark
Min.	Typ.	Max.
Operating voltage (V)	2.	3.
Communication level (V)	–	3.0

down
Operating temperature (°C)| -40| –| 85| Industrial design
Operating frequency (MHz)| 2379| 2430| 2496| Support ISM band
Power consumption| TX current (mA)| –| 18| –| Instant power consumption
RX current (mA)| –| 13| –| –
Sleep current (..iit)| –| 2| –| Software is shut down
Max Tx power (dBm)| 4.| 4| 4.| –
Receiving sensitivity (dBm)| -104dBm @ BLE 125kbps| Long ditance mode
-97dBm @ BLE 1Mbps| –
Main parameter| Description| Remark
Distance for reference| 120m| Test condition: clear and open area, antenna gain: 5dBi,
antenna height: 2.5m, air data rate: 1Mbps
Crystal frequency| 32MHz / 32.768KHz|
Support protocal| BLE 5.1/IEEE 802.15.4-2006|
Package| SMD|
Connector| 1.27mm|
IC| nRF5281 l-QFAA/QFN48|
FLASH| 192KB|
RAM| 24KB|
kernel| ARM CORTEX-M4|
Size| 17.5 * 23.5 mm|
Antenna| PCB/IPEX| Default PCB antenna; Impedance is about 50 ohms

Size and pin definition

EBYTE E73 2G4M04S1F BLE Module - Figure 2

NQ	Plit	Pin direction	Description
0	GND	Input	Ground, connected to reference ground of power
1	GND	Input	Ground, connected to reference ground of power
2	GND	Input	Ground, connected to reference ground of power
3	DEC2	–	1.3 V digital power decoupling regulator (see chip manual for

Basic Operation

4.1 Hardware Design

It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse connection is connected, the module may be permanently damaged.
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged.
Please check the stability of the power supply, the voltage can not be significantly frequent.
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, and the whole machine is beneficial for long-term stable operation.
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference.
High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to the digital part of the module and routed in the Bottom Layer.
Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees.
Assume that there are traces with large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If possible, you can do it properly. Isolation and shielding
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage).
Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside of the case.
The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.

4.2 Software Programming

The core of this module is nRF52811, which is completely equivalent to nRF52811. Users can operate according to the nRF52811 chip manual (see nRF52811 manual for details).
Because the officially provided programming tool nRFgo Studio has poor compatibility, it is recommended to use J-LINK-V8 or above for program burning.
About the issue that the old model can be programmed, while the new model can’t be programmed, It is because the new model being added with read/write protection during production. It needs to be properly connected to the line and then use the official nRFgo Studio for Recover (Jlink supports the official nRFgo). Studio), as shown below:

EBYTE E73 2G4M04S1F BLE Module - Figure 3

FAQ

5.1 Communication range is too short

The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
Due to antenna quality or poor matching between antenna and module.

5.2 Module is easy to damage

Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.

5.3 High bit error rate

There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel to avoid interference.
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus line should not be too long.
Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.

Welding operation guidance

6.1 Reflow Soldering Temperature

Profile Feature

| Curve feature| Sn-Pb Assembly|

Pb-Free Assembly

---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）| Minimum preheating temperature| 100℃| 150℃
Preheat temperature max (Tsmax)| Maximum preheating temperature| 150℃| 200℃
Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average rising rate| 3℃/second max| 3℃/second max
Liquidous Temperature (TL)| Liquid phase temperature| 183℃| 217℃
Time（tL）Maintained Above（TL）| Time above liquidus| 60-90 sec| 30-90 sec
Peak temperature（Tp）| Peak temperature| 220-235℃| 230-250℃
Aveage ramp-down rate（Tp to Tsmax）| Average descent rate| 6℃/second max| 6℃/second max
Time 25℃ to peak temperature| Time of 25 ° C to peak temperature| 6 minutes max| 8 minutes max

6.2 Reflow Soldering Curve EBYTE E73 2G4M04S1F BLE Module - Figure
4

7.1 E73 Hardware Module

Model

Antenna

---|---|---|---|---|---|---|---
E73-2G4M04S1F| nRF52811| BLE5.1/IEEE 802.15.4-2006| 192KB| 24KB| 4dBm| 17.5*28.7mm| PCB/IPEX
E73-2G4M04S1FX| nRF52811| BLE5.1/IEEE 802.15.4-2006| 192KB| 24KB| 4dBm| 17.5*28.7mm| *** IPEX
E73-2G4M04S1B| nRF52832| BLE4.2/5.0| 512KB| 64KB| 4dBm| 17.528.7mm| PCB/IPEX
E73-2G4M04S1BX| nRF52832| BLE4.2/5.0| 512KB| 64KB| 4dBm| 17.528.7mm| IPEX
E73-2G4M08S1C| nRF52840| BLE4.2/5.0| 1024KB| 256KB| 8dBm| 1318mm| Ceramic
E73-2G4M08S1CX| nRF52840| BLE4.2/5.0| 1024KB| 256KB| 8dBm| 1318mm| IPEX
E73-2G4M04S1D| nRF52822| BLE4.2| 256KB| 16KB| 4dBm| 17.528.7mm| PCB/IPEX
E73-2G4M08S1E| nRF52833| BLE5.1、BLE Mesh、Thread、Zigbee| 512KB| 128kB| 8dBm| 13*18mm| **** Ceramic

7.2 E104 Protocal Module

Model

Features

---|---|---|---|---|---
E104-BT5005A| nRF52805| BLE5.0| 99mm| Ceramic| master-slave integrated module, small size
E104-BT5010A| nRF52810| BLE5.0| 11.516mm| Ceramic| master-slave integrated module
E104-BT5011A| nRF52810| BLE5.1| 11.516mm| Ceramic| master-slave integrated module, support Long Range
E104-BT5032A| nRF52832| BLE5.0| 11.516mm| Ceramic| Multi-master and multi- slave coexistence
E104-BT5040U| nRF52840| BLE4.2/5.0| 5918mm| PCB| USB Dongle，support nRF Connect
E104-BT5040UA| nRF52840| BLE4.2/5.0| 5918mm| PCB| USB Dongle，support BLE5.0 packet capture

Antenna Type

8.1 Antenna recommendation
The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent performance and reasonable price.

Product

Feature

---|---|---|---|---|---|---|---
TX2400-NP-5010| Flexible antenna| 2.4G| 2.0| 10*50| –| IPEX| Built-in flexible FPC soft
TX2400-JZ-3| Rubber antenna| 2.4G| 2.0| 30| –| SMA-J| Short straight, omnidirectional
TX2400-JZ-5| Rubber antenna| 2.4G| 2.0| 50| –| SMA-J| Short straight, omnidirectional
TX2400-JW-5| Rubber antenna| 2.4G| 2.0| 50| –| SMA-J| Fixed bend, omnidirectional
TX2400-JK-11| Rubber antenna| 2.4G| 2.5| 110| –| SMA-J| Bendable, omnidirectional
TX2400-JK-20| Rubber antenna| 2.4G| 3.0| 200| –| SMA-J| Bendable, omnidirectional
TX2400-XPL-150| Sucker antenna| 2.4G| 3.5| 150| 150| SMA-J| Small sucker antenna, cost effective

8.2 Antenna

Batch packaging

EBYTE E73 2G4M04S1F BLE Module - Figure 6 Revision history

Version| Date| Description|

Issued by

---|---|---|---
1.0| 2021-7-15| Initial version|

Linson

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