EBYTE E78-400M22S1C LPWAN Low Power LoRa Wireless SoC User Manual

June 5, 2024
ebyte

EBYTE E78-400M22S1C LPWAN Low Power LoRa Wireless SoC

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Introduction

Brief Introduction

E78 series are RF transceiver module of various frequency bands designed and manufactured by Chengdu Ebyte, with long communication distance and extremely low power mode current consumption. It is a small-sized SMD type (pin pitch 1. lmm).

EBYTE E78-400M22S1C LPWAN Low Power LoRa Wireless SoC

Features
  • The first domestic universal LPWAN wireless SoC module based on ASR6601SE;
  • Support LoRaWAN, LinkWAN multiple protocol standards;
  • Ultra-high sensitivity of -148 dBm and a maximum transmit power of 22 dBm;
  • Support 42 configurable GPIOs3xI2C1xICS4xUART1xLPUART1xSWD3xSPI1xQSPI 2xWDG;
  • 62.5Kbps air data rate under LoRa modulation, and 300Kbps under (G)FSK modulation;
  • Support the global license-free ISM 433MHz band, support 470MHz meter reading frequency band;
  • Support deep sleep, the power consumption of the whole machine is about 2uA in this mode;
  • The measured communication distance can reach 5.5km;
  • Built-in embedded LCD driver;
  • Support AES, DES, RSA, ECC, SHA, SM2/3/4 hardware encryption;
  • Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
  • IPEX and stamp hole optional, good for secondary development and integration.
Application
  • Street lamp control, environmental monitoring, etc;
  • Smart parking lot sensor;
  • Smart home and industrial sensors, etc.
  • Smart Agriculture Sensor;
  • Wireless alarm security system;
  • Building automation solutions;
  • Wireless industrial-grade remote control;
  • Health care products;
  • Advanced Meter Reading Architecture(AMI).

Specification and parameter

Specification

Model No.| Frequency| Transmit power| Reference distance(stamp hole/IPEX)| Package| Antenna
---|---|---|---|---|---
E78-400M22S1C| 410-490MHz| 21dBm| 5.5Km(Lora 1kbps)| SMD| Stamp/IPEX
Model No.| IC| Size| Net Weight| Operation Temperature| Operation Humidity| Storage Temperature
---|---|---|---|---|---|---
E78-400M22S1C| ASR6601S E| 26 162.8 mm| 1.9g| -40 ~ 85℃| 10% ~ 90%| -40 ~ 125°C

Limit parameter
Main parameter Performance Remark
  Min Max
Power supply(V) -0.3 3.9
Digital input level voltage(V) -0.3 3.9
Rf input power(dBm) +10

short distance
Temperature(℃)| Storage: -55~+125| Operating: -40~+85| Industrial grade
Humidity(%)| Storage: 5~95| Operating: 10~95| Without condensation

Operating parameter
Main parameter Performance Remark
Min Type Max
Power supply(V) 1.7 3.3
Communication level(V) 1.7 3.3
TX Current (mA) 105 108
RC current (mA) 8.5 8.7

TCXO
Sleep current(uA)| 0.8| 1| 1| MCU reserved
Sleep current(uA)| 1.6| 1.8| 1.8| RF/MCU/RTC reserved
TX power (dBm)| 20.6| 20.8| 21| Set up Pout=+22dBm
Recommended frequency (MHz)| 410| 433/470/490| 490| Module working frequency 410~490MHz
Receiving sensitivity (dBm)| –| -148| –|
TCXO crystal (MHz)| –| 32| –| Built-in crystal oscillator and uses PWR_TCXO for power supply
TCXO crystal voltage(V)| 1.8| 1.8| 3.3| Recommended output voltage of PWR_TCXO pin
Antenna| IPEX/Stamp hole| 50 ohm impedance

Parameter description
  • When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the remaining amount, and the whole machine is conducive to long-term stable operation;
  • The current required for the inst ant of launch is large but often because the launch time is extremely short, the total energy consumed may be smaller;
  • When customers uses an external antenna, the impedance matching degree between the antenna and the module at different frequency points will affect the magnitude of the transmission current to varying degrees;
  • The current consumed by the RF chip in the pure receiving state is called the receiving current. Some RF chips with communication protocols or developers have loaded some self-developed protocols on the whole machine, which may cause the receiving current of the test to be too large;
  • The current in the purely receiving state is often mA level, and the “receiving current” of the μA level needs to be processed by the developer through software;
  • The shutdown current is often much smaller than the current consumed by the power supply part of the whole machine at no load, without being overly demanding;
  • Since the material itself has a certain error, a single LRC component has an error of +0.1%. However, since a plurality of LRC components are used in the entire RF loop, there is a case where error accumulation occurs, resulting in a difference in emission current and reception current of different modules;
  • Reducing the transmit power can reduce power consumption to some extent, but reducing the transmit power emissions for a number of reasons reduces the efficiency of the internal PA.

Size and pin definition

Pin No. Item Direction Description
1 GND Ground wire, connected to the power reference ground
2 GND Ground wire, connected to the power reference ground
3 GND Ground wire, connected to the power reference ground
4 NC Reserved
5 GPIO01 Input/Output MCU GPIO
6 GPIO00 Input/Output MCU GPIO
7 GPIO03 Input/Output MCU GPIO
8 GPIO02 Input/Output MCU GPIO
9 GPIO06 Input/Output MCU GPIO
10 GPIO07 Input/Output MCU GPIO
11 NRST Input External reset pin
12 GPIO14 Input/Output MCU GPIO
13 GPIO15 Input/Output MCU GPIO
14 GPIO23 Input/Output MCU GPIO
15 GPIO25 Input/Output MCU GPIO
16 GPIO24 Input/Output MCU GPIO
17 GPIO27 Input/Output MCU GPIO
18 GPIO26 Input/Output MCU GPIO
19 GPIO29 Input/Output MCU GPIO
20 GND Ground wire, connected to the power reference ground
21 GPIO28 Input/Output MCU GPIO
22 GPIO30 Input/Output MCU GPIO
23 GPIO31 Input/Output MCU GPIO
24 GPIO62 Input/Output MCU GPIO
25 UART0_RX Input MCU GPIO
26 UART0_TX Output MCU GPIO
27 GPIO60 Input/Output MCU GPIO
28 GPIO58 Input/Output MCU GPIO
29 GPIO13 Input/Output MCU GPIO
30 GPIO12 Input/Output MCU GPIO
31 VCC Power supply, range 2.5V ~ 3.7V (recommended to add external

ceramic filter capacitor)
32| GND| –| Ground wire, connected to the power reference ground
33| GND| –| Ground wire, connected to the power reference ground
34| GPIO11| Input/Output| MCU GPIO
35| GPIO08| Input/Output| MCU GPIO
36| GPIO05| Input/Output| MCU GPIO
37| GPIO04| Input/Output| MCU GPIO
38| GPIO09| Input/Output| MCU GPIO
39| GPIO45| Input/Output| MCU GPIO
40| GPIO44| Input/Output| MCU GPIO
41| GPIO42| Input/Output| MCU GPIO
42| GPIO41| Input/Output| MCU GPIO
43| GPIO40| Input/Output| MCU GPIO
44| GPIO37| Input/Output| MCU GPIO
45| GPIO33| Input/Output| MCU GPIO
46| GPIO32| Input/Output| MCU GPIO
47| GPIO36| Input/Output| MCU GPIO
48| GPIO35| Input/Output| MCU GPIO
49| GPIO34| Input/Output| MCU GPIO
50| GND| –| Ground wire, connected to the power reference ground
51| ANT| Output| Antenna interface, stamp hole (50 ohm characteristic impedance)
52| GND| –| Ground wire, connected to the power reference ground
★    For the pin definition,software driver and communication protocol of the module, please refer to ASR official 《ASR6601SE Datasheet》 ★

E78-400M22S1C development

  • In the process of software development, please be sure to follow ASR6601SE official user manual and related software development materials in detail, details see ASR official;
  • The E78-400M22S1C module has a built-in 32MHz TCXO. The crystal  power supply uses the PWR_TCXO pin ofthe ASR6601SE chip. The recommended voltage is 1.8V;
  • The module has a built-in external 32.768KHz crystal oscillator, and the load capacitance of the crystal oscillator is programmable inside the ASR6601SE chip
  • Module firmware download can use SWD and UART two ways, the pins are respectively.
    Download port| Pin description
    ---|---
    SWD| GPIO06 (SWDATA), GPIO07 (SWCLK), NRST respectively are the 9th, 10th, and 11th pins
    Serial| UART0_RX and UART0_TX respectively are the 25th and 26th pins
    Note: Use the official SDK, before starting to download, please connect GPIO02 to high level, then restart the module to enter the serial download mode.
  • The module integrates a radio frequency switch, which supports two modes of single control and dual control, see the table below for details:
    Operating mode| GPIO10| GPIO59| Remark
    ---|---|---|---
    Transmit mode| 1| 1| Single control mode
    Receive mode| 1| 0| Single control mode
    Others: GPIO59 (LORA_RF_SWITCH) is the DIO2 pin with built-in RF. After the official SDK is modified to TCXO mode, it can be directly downloaded to the module for running test.

FAQ

Communication range is too short
  • The communication distance will be affected when obstacle exists;
  • Data lose rate will be affected by temperature, humidity and co-channel interference;
  • The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
  • Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
  • The signal will be affected when the antenna is near metal object or put in a metal case;
  • Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance);
  • The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the transmitting power;
  • Due to antenna quality or poor matching between antenna and module.
Module is easy to damage
  • Please check the power supply, ensure it is between the recommended  values, voltage exceed the maximum thanwill cause permanent damage to the module.
  • Please check the stability of power supply, the voltage cannot fluctuate too much.
  • Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic susceptibility.
  • Please ensure the humidity is within limited range, some parts are sensitive to humidity.
  • Please avoid using modules under too high or too low temperature.

Production guidance

Reflow soldering temperature

Profile Feature| Curve characteristics| Sn-Pb Assembly| Pb- Free Assembly
---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)| Min preheating temp.| 100℃| 150℃
Preheat temperature max (Tsmax)| Mx preheating temp.| 150℃| 200℃
Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average ramp-up rate| 3℃/second max| 3℃/second max
Liquidous Temperature (TL)| Liquid phase temp.| 183℃| 217℃
Time(TL)Maintained Above(TL)| Time below liquid phase line| 60-90 sec| 30-90 sec
Peak temperature(Tp)| Peak temp.| 220-235℃| 230-250℃
Aveage ramp-down rate(Tp to Tsmax)| Aveage ramp-down rate| 6℃/second max| 6℃/second max
Time 25℃ to peak temperature| Time to peak temperature for 25℃| 6 minutes max| 8 minutes max

Reflow soldering curve

Bulk packaging

Revision history

Version Date Description Issued by
1.0 2020/12/01 Initial version Linsoin

About us

Technical support: support@cdebyte.com
Documents and RF Setting download link: www.ebyte.com
Thank you for using Ebyte products! Please contact us with any questions or suggestions: info@cdebyte.co
————————————————————————————————-
Phone: +86 028-61399028
Web: www.ebyte.com
Address: B5 Mould Park, 199# Xiqu Ave, High-tech District, Sichuan, China

Chengdu Ebyte Electronic Technology Co.,Ltd. 11


References

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