TOPWAY LMT035DNJFWD-NND LCD Module User Manual
- July 10, 2024
- Topway
Table of Contents
TOPWAY LMT035DNJFWD-NND LCD Module
Product Information
Specifications
- Screen Size(Diagonal):
- Active Area:
- Number of dots:
- Pixel Pitch:
- Color Depth:
- Display Technology:
- Display Mode:
- Display Interface:
- Viewing Direction:
- Touch Panel:
- Surface Treatment:
- Touch Interface:
- Storage Temperature:
- Operating Temperature:
Product Usage Instructions
Terminal Functions
The LCD Module has two main interface terminals:
- TFT Interface Terminal: Describes the connections for the Thin-Film Transistor display.
- CTP Interface Terminal: Details the connections for the Capacitive Touch Panel interface.
Absolute Maximum Ratings
This section provides the maximum values that should not be exceeded during
operation to prevent damage to the module.
Electrical Characteristics
Details the electrical properties of the LCD module, including voltage
requirements and power consumption.
AC Characteristics
Describes the AC characteristics of the module, such as response time and
refresh rate.
Optical Characteristics
Explains the optical properties of the display, including brightness, contrast
ratio, and viewing angles.
LCD Module Design and Handling Precautions
Provides guidelines on how to handle and design the LCD module to ensure
proper functioning and longevity.
CTP Mounting Instructions
Step-by-step guide on how to mount and integrate the Capacitive Touch Panel
with the LCD module.
Frequently Asked Questions (FAQ)
Q: Where can I find more information about the product?
A: You can visit the official website at
www.topwaydisplay.com or refer to the user
manual for detailed information.
LMT035DNJFWD-NND
LCD Module User Manual
Prepared by:
Caiwei
Date: 2024-04-30
| Checked by:
Date:
| Approved by:
Date:
---|---|---
Rev.| Descriptions| Edit| Release Date
---|---|---|---
0.1| Preliminary New release| Gong huimei| 2024-01-03
0.2| Updata Outline、2.2 CTP IIC address、3.Relative Humidity and Ambient
Humidity| Caiwei| 2024-04-30
| | |
| | |
| | |
| | |
TOPWAY
- Screen Size(Diagonal) : 3.5”
- Active Area : 48.96×73.44mm
- Number of dots : 320(RGB)x480
- Pixel Pitch : 0.153×0.153mm
- Color Depth: 2 62k Colors
- Display Technology : a-Si TFT active matrix
- Display Mode : Normally White,Transmissive
- Display Interface : MCU/RGB+SPI
- Viewing Direction : 12H (1) (gray scale inverse) 6H (2)
- Touch Panel : Capacitive Touch Panel
- Surface Treatment : Glare
- Touch Interface : IIC Touch Interface
- Storage Temperature : -30 ~ +80°C
- Operating Temperature : -20 ~ +70°C
Note
- For saturated color display content (eg. pure-red, pure-green, pure-blue or pure-colors-combinations).
- For “color scales” display content.
- Color tone may slightly change by temperature and driving condition
Block Diagram
Terminal Functions
TFT Interface Terminal
Pin No. | PIN Name | I/O | Descriptions |
---|---|---|---|
1 | VSS | P | Negative power supply,0V |
2,3 | IOVDD | P | I/O Positive Power |
4,5 | VDD | P | Positive power supply |
6 | IM0 | I | MPU system interface mode select |
7 | IM1 | I | MPU system interface mode select |
8 | IM2 | I | MPU system interface mode select |
**** 9 | **** RESX | **** I | Reset signal |
RESX = L, Initialization is executed RESX = H, Normal running
10| VSYNC| I| Vertical sync, signal in RGB mode
If no used, please connect this pin to VSS
11| HSYNC| I| Horizontal sync, signal in RGB mode
If no used, please connect this pin to VSS
12| PCLK| I| Pixel clock signal in RGB mode
If no used, please connect this pin to VSS
13| DE| O| Data enable signal in RGB mode
If no used, please connect this pin to VSS
14| DB17/R5,Msb| I/O| Data Bus
15| DB16/R4| I/O
:| :| :
18| DB13/R1| I/O
19| DB12/R0,Lsb| I/O
20| DB11/G5,Msb| I/O
21| DB10/G4| I/O
:| :| :
24| DB7/G1| I/O
25| DB6/G0,Lsb| I/O
26| DB5/B5,Msb| I/O
27| DB4/B4| I/O
:| :| :
30| DB1/B1| I/O
31| DB0/B0,Lsb| I/O
32| VSS| P| Negative power supply,0V
33| DOUT| O| Serial data output pin
If no used, leave this pin open
34| SDA| I/O| Serial data input /output bi-direction pin
If no used, please connect this pin to VSS
35| RDX| I| Serve as a read signal
If no used, please connect this pin to IOVDD
36
| ****
WRX_SCL
| ****
I
| (WR) Write data enable pin in DBI Type B (SCL) Write data enable pin in DBI Type C
If no used, please connect this pin to IOVDD
37
| ****
DCX
| ****
I
| Data/Command Selection pin Low: Command
High: Parameter
If no used, please connect this pin to IOVDD
38| CSX| I| Chip select signal
If no used, please connect this pin to IOVDD
39| NC(XR)| ****
–
| No connect
40| NC(YD)
41| NC(XL)
42| NC(YU)
43| LEDA| P| LED ANODE
44~49| LEDK| P| LED CATHODE
50| VSS| P| Negative power supply,0V
Note1:
- I- -Input,
- O –Output,
- P- -Power/Ground,VDD=VDD
Note2 :If use the RGB interface,need to initialize the interface with 3/4-Line SPI before using RGB to transfer data
CTP Interface Terminal
Pin No. | PIN Name | I/O | Descriptions |
---|---|---|---|
1 | RST | I | Reset Pin |
2 | VDD | P | Voltage power |
3 | GND | P | Ground |
4 | INT | O | External interrupt to the host |
5 | SDA | I/O | IIC data input and output |
6 | SCL | I | IIC clock input |
Note
-
- The capacitance touch drive IC is GT911,Please refer to IC: GT911 data sheet for more details.
- IIC address=0X14.
Absolute Maximum Ratings
Items | Symbol | Min. | Max. | Unit | Condition |
---|---|---|---|---|---|
Power Voltage | VDD | -0.3 | +3.3 | V | VSS = 0V |
Input Voltage | VIN | -0.3 | +3.3 | V | VSS = 0V |
Operating Temperature | TOP | -20 | +70 | °C | No Condensation |
Storage Temperature | TST | -30 | +80 | °C | No Condensation |
Relative Humidity(*1) | RH | – | ≤95 | % | Ta≤40˚C |
– | ≤85 | % | 40˚C< Ta≤50˚C | ||
– | ≤55 | % | 50˚C< Ta≤60˚C | ||
– | ≤36 | % | 60˚C< Ta≤70˚C | ||
– | ≤24 | % | 70˚C< Ta≤80˚C | ||
Ambient Humidity | AH | – | ≤70 | g/m3 | Ta>70˚C |
Cautions:
-
*Ta means the ambient temperature.
It is necessary to limit the relative humidity to the specified temperature range. Condensation on the module is not allowed. -
Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
DC Characteristics of TFT LCD Panel
Items| Symbol| MIN.| TYP.| MAX.| Unit|
Condition / Application Pin
---|---|---|---|---|---|---
Operating Voltage| VDD| 2.5| 2.8| 3.3| V| VDD,IOVDD
Input Signal Voltage| High Level| VIH| 0.7xVDD| –| VDD| V|
IM0~IM2,RESX,VSYNC,HSYNC, PCLK,DB17~DB0,SDA,RDX, WRX_SCL,DCX,CSX
Low Level| VIL| -0.3| –| 0.3xVDD| V
Output Low Voltage| High Level| VOH| 0.8xVDD| | VDD| V|
DB17~DB0,DE,SDA,DOUT
Low Level| VOL| 0| –| 0.2xVDD| V
Operating Current| IDD| –| 12| –| mA| VDD (*1)
**Note: *** 1. VDD=2.8V
DC Characteristics of CTP
Items| Symbol| MIN.| TYP.| MAX.| Unit|
Condition / Application Pin
---|---|---|---|---|---|---
Operating Voltage| VDD| 2.8| –| 3.3| V| VDD,IOVDD
Operating Current| IDD| –| 8| 14.5| mA| VDD active current
LED Backlight Circuit Characteristics
Items| Symbol| MIN.| TYP.| MAX.| Unit|
Remark
---|---|---|---|---|---|---
Forward Voltage| Vf| 2.7| 3.2| 3.4| V| For each LED
Forward Current| If| –| 120| –| mA| For total LED
LED lifetime| –| –| 30000| –| Hours|
Note 1: The LED driving condition is defined for each LED module (1LED
Serial, 6LED Parallel).
Note 2: Under LCM operating, the stable forward current should be
inputted. And forward voltage is for reference only.
Note 3: Optical performance should be evaluated at Ta=25℃ only If LED is
driven by high current, high ambient temperature & humidity condition. The
life time of LED will be reduced. Operating life means brightness goes down to
50% initial brightness. Typical operating life time is estimated data.At the
same time the luminance of Backlight would decrease under the hight
temperature. Note4: The LED driving condition is defined for each LED module.
AC Characteristics
DBI Type B
DBI Type B Timing Characteristic
Notes
- Ta = -30 to 70 °C, IOVCC = 1.65V to 3.3V, VCI = 2.5V to 3.3V, VSS=0V
- Logic high and low levels are specified as 30% and 70% of IOVCC for input signals.
- Input signal rising time and falling time:
- The CSX timing:
- . The Write to Read or the Read to Write timing:
Please refer to IC: ILI9488 data sheet for more details.
DBI Type B Data Bus
Notes
- The data order is as follows: MSB = DB7, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit 0 for Green data, and MSB = Bit 4, LSB = Bit 0 for Red and Blue data.
- 2times transfer is used to transmit 1 pixel data to the 16-bit color depth information.
- ‘-‘= void
Notes
- The data order is as follows: MSB = DB7, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit 0 for Green data, and MSB = Bit 4, LSB = Bit 0 for Red and Blue data.
- 3-times transfer is used to transmit 1 pixel data to the 18-bit color depth information.
- -‘= void
Notes
- The data order is as follows: MSB = DB8, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit 0 for Green, Red and Blue data.
- 2-times transfer is used to transmit 1 pixel data to the 18-bit color depth information.
- ‘-‘= void
Notes
- The data order is as follows: MSB = DB15, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit0 for Green data, and MSB = Bit4, LSB =Bit0 for Red and Blue data.
- 1-times transfer is used to transmit 1 pixel data to the 16-bit color depth information.
- .’-‘= void
Notes
- The data order is as follows: MSB = DB17, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit0 for Green , Red and Blue data.
- 1-times transfer is used to transmit 1 pixel data to the 18-bit color depth information.
3-Line SPI Interface Timing Characteristic
Please refer to IC : ILI9488 data sheet for more details.
4-Line SPI Interface Timing Characteristic
Note1 :Ta=-30 to 70℃,IOVDD,VDD=2.5V to 3.3V,VSS=0V,T=10+/-0.5ns.
Note2 :Does not include signal rising and falling times.
Please refer to IC : ILI9488 data sheet for more details.
DPI Interface
DPI Interface Characteristic
Please refer to IC: ILI9488 data sheet for more details.
DPI Interface pixel format
The Pixel clock (DCLK) runs all the time without stop. It is used to enter VS, HS, DE and D[17: 0] states when there is a rising edge of the DCLK. The DCLK cannot be used as the internal clock for other functions of the display module.
Vertical synchronization (VS) is used to indicate when a new frame of the display is received. This is low enable and its state is read to the display module by a rising edge of the DCLK signal.
Horizontal synchronization (HS) IS used to indicate when a new line of the frame is received. This is low enable and its state is read to the display module by a rising edge of the DCLK signal.
Data Enable (DE) is used to indicate when the RGB information that should be transferred in the display is received. This is a high enable, and its state is read to the display module by a rising edge of the DCLK signal. D[17:0] is used to indicate what is the information of the image that is transferred on the display (when DE = 0 (low) and there is a rising edge of DCLK). D[17:0] can be 0(low) or 1(high). These lines are read by a rising edge of the DCLK signal. In RGB interface modes, the input display data is written to GRAM first then outputs the corresponding source voltage according to the gray data from GRAM.
Note
Please refer to IC: ILI9488 data sheet for more details.
DPI(RGB) Interface timing
Display line: The number of gate-lines
Display pixel : The number of pixels in one gate-line Example : DOTCLK =
20Mhz, TE=70Hz, VBP=2, VFP=2, HBP=100, HFP=170.
Note: VBP|4:01/HBP|7:01 (Blanking Porch Control, RB5h) define as follows:
Note : VSPL = 0, HSPL = 0, DPL = 0 and EPL = 0 of Interface Mode Control B0h command
Figure 19: DPI Interface Timing Diagram Note: VSPL = 0, HSPL = 0, DPL = 0 and EPL = 0 of Interface Mode Control B0h command.
Power ON/OFF Sequence
Notes
- There are not any abnormal visual effects when one power mode changes to another power mode.
- There is not any limitation, which is not specified by users, when one power mode changes to another power mode.
IOVDD and VDD can be applied or powered down in any order. During the Power Off sequence ,if the LCD is in the Sleep In mode, VDD and IOVDD must be powered down with a minimum of 120 msec.If the LCD is in the Sleep In mode, VDD and IOVDD can be powered down with a minimum of 0msec after the /RST has been released. /CS can be applied at any time or can be permanently grounded. /RST has priority over /CS.
Notes
- There will be no damage to the ILI9488 if the power sequences are not met.
- There will be no abnormal visible effects on the display panel during the Power On/Off Sequence.
- There will be no abnormal visible effects on the display between the end of the Power On Sequence and before receiving the Sleep Out command, and also between receiving the Sleep In command and the Power Off Sequence.
- If the /RST line is not steadily held by the host during the Power On Sequence as defined in Sections 11.1 and 11.2 ( ILI9488 datasheet ), then it will be necessary to apply the Hardware /RST after the completion of the Host Power On Sequence to ensure correct operations. Otherwise, all the functions are not guaranteed.
- When the power is turned on, the climb period timing (Trise) must be greater than 10us.
- Keep data pins D[17:0] at low level, or IOVDD comes later
Note
Please refer to IC: ILI9488 data sheet for more details.
Reset timing
Item | Symbol | MIN. | TYP. | MAX. | Unit |
---|---|---|---|---|---|
Reset LOW pulse width | tRW | 1.0 | – | – | us |
Reset time | TRT | – | – | 120 | ms |
Please refer to IC: ILI9488 data sheet for more details.
Optical Characteristics
Item| Symbol| Condition| Min| Typ| Max|
Unit| Remark
---|---|---|---|---|---|---|---
View Angles| θT| CR≧10| –| 70| –| Degree| Note2,3
θB| –| 60| –
θL| –| 70| –
θR| –| 70| –
Contrast Ratio| CR| θ= 0°| 350| 500| –| –| Note 3
Response Time
| TON|
25℃
|
–
|
25
|
–
|
ms
|
Note 4
TOFF
Chromaticity|
White
| x| Backlight is on| 0.236| 0.286| 0.336|
–
| Note 1,5
y| 0.266| 0.316| 0.366
Red
| x| 0.586| 0.636| 0.686
y| 0.284| 0.334| 0.384
Green
| x| 0.276| 0.326| 0.376
y| 0.543| 0.593| 0.643
Blue| x| 0.100| 0.150| 0.200
y| 0.027| 0.077| 0.127
Uniformity| U| | 80| –| –| %| Note 6
NTSC| S| Θ= 0° Φ=0o| 60| –| –| %| Note 5
Luminance| L| 250| 300| –| cd/㎡| Note 7
Note:
IF= 120mA, and the ambient temperature is 25℃
Note
Definition of optical measurement system.
The optical characteristics should be measured in dark room. After 5 Minutes
operation, the optical properties are measured at the center point of the LCD
screen. All input terminals LCD panel must be ground when measuring the center
area of the panel.
Note 2: Definition of viewing angle range and measurement system.
viewing angle is measured at the center point of the LCD.
“White state” : The state is that the LCD should drive by white.
“Black state”: The state is that the LCD should drive by Vblack.
Vwhite: TBD V Vblack: TBD V.
Note 4: Definition of Response time
The response time is defined as the LCD optical switching time interval
between “White” state and “Black” state. Rise time (ToN) is the time between
photo detector output intensity changed from 90% to 10%. And fall time (ToFF)
is the time between photo detector output intensity changed from 10% to 90%.
Note 5: Definition of color chromaticity (CIE 1931) Color coordinates measured at center point of LCD.
Note 6: Definition of Luminance Uniformity Active area is divided into 9 measuring areas (Refer Fig. 2).
Every measuring point is placed at the center of each measuring area.
Luminance Uniformity (U) = Lmin/ Lmax
L—–Active area length W…- Active area width
Lmax : The measured Maximum luminance of all measurement position.
Lmin : The measured Minimum luminance of all measurement position.
Note 7: Definition of Luminance: Measure the luminance of white state at center point.
LCD Module Design and Handling Precautions
- Please ensure V0, VCOM is adjustable, to enable LCD module get the best contrast ratio under different temperatures, view angles and positions.
- Normally display quality should be judged under the best contrast ratio within viewable area. Unexpected display pattern may com out under abnormal contrast ratio.
- Never operate the LCD module exceed the absolute maximum ratings.
- Never apply signal to the LCD module without power supply.
- Keep signal line as short as possible to reduce external noise interference.
- IC chip (e.g. TAB or COG) is sensitive to light. Strong light might cause malfunction. Light sealing structure casing is recommended.
- Make sure there is enough space (with cushion) between case and LCD panel, to prevent external force passed on to the panel; otherwise that may cause damage to the LCD and degrade its display result.
- Avoid showing a display pattern on screen for a long time (continuous ON segment).
- LCD module reliability may be reduced by temperature shock.
- When storing and operating LCD module, avoids exposure to direct sunlight, high humidity, high or low temperature. They may damage or degrade the LCD module.
- Never leave LCD module in extreme condition (max./min storage/operate temperature) for more than 48hr.
- Recommend LCD module storage conditions is 0 C~40 C <80%RH.
- LCD module should be stored in the room without acid, alkali and harmful gas.
- Avoid dropping & violent shocking during transportation, and no excessive pressure press, moisture and sunlight.
- LCD module can be easily damaged by static electricity. Please maintain an optimum anti-static working environment to protect the LCD module. (eg. ground the soldering irons properly)
- Be sure to ground the body when handling LCD module.
- Only hold LCD module by its sides. Never hold LCD module by applying force on the heat seal or TAB.
- When soldering, control the temperature and duration avoid damaging the backlight guide or diffuser which might degrade the display result such as uneven display.
- Never let LCD module contact with corrosive liquids, which might cause damage to the backlight guide or the electric circuit of LCD module.
- Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl Alcohol. Other solvents (e.g. water) may damage the LCD.
- Never add force to components of LCD module. It may cause invisible damage or degrade the module’s reliability.
- When mounting LCD module, please make sure it is free from twisting, warping and bending.
- Do not add excessive force on surface of LCD, which may cause the display color change abnormally.
- LCD panel is made with glass. Any mechanical shock (e.g. dropping from high place) will damage the LCD module.
- Protective film is attached on LCD screen. Be careful when peeling off this protective film, since static electricity may be generated.
- Polarizer on LCD gets scratched easily. If possible, do not remove LCD protective film until the last step of installation.
- When peeling off protective film from LCD, static charge may cause abnormal display pattern. The symptom is normal, and it will turn back to normal in a short while.
- LCD panel has sharp edges, please handle with care.
- Never attempt to disassemble or rework LCD module.
- If display panel is damaged and liquid crystal substance leaks out, be sure not to get any in your mouth, if the substance comes into contact with your skin or clothes promptly wash it off using soap and water.
CTP Mounting Instructions
Surface Mounting (Figure 2)
- As the CTP assembling on the countersink area with double side adhesive.
The countersink area should be flat and clean to ensure the double side adhesive installation result.
- The Bezel is recommend to keep a gap (≥0.3mm each side) around the cover lens for tolerance.
- It is recommended to provide an additional support bracket with gasket for backside support when necessary (e.g. TFT module without mounding structure). They should only provide appropriate support and keep the module in place.
- The mounting structure should be strong enough to prevent external uneven force or twist act onto the module
Additional Cover Lens Mounting (Figure 3)
-
For the case of additional cover Lens mounting, it is necessary to recheck with the CTP specification about the material and thickness to ensure the functionality.
It should keep a 0.2~0.3mm gap between the cover lens and the CTP surface.. -
The cover lens window should be bigger than the active area of the CTP.
-
It should be≥0.5mm each side.
-
It is recommended to provide an additional support bracket for backside support when necessary (e.g. slim type TFT module without mounding structure). They should only provide appropriate support and keep the module in place.
-
The mounting structure should be strong enough to prevent external uneven force or twist act onto the module.
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the above applications, we will need to enter into a separate product liability agreement.
- We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product (including disassembly and reassembly), after product delivery.
- We cannot accept responsibility for any defect, which may arise after the application of strong external force to the product.
- We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the product has passed our company’s acceptance inspection procedures.
- When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may arise.
- We cannot accept responsibility for intellectual property of a third part, which may arise through the application of our product to our assembly with exception to those issues relating directly to the structure or method of manufacturing of our product.