TOPWAY LMT035DNJFWD-NNA-1 LCD Module User Manual

TOPWAY LMT035DNJFWD-NNA-1 LCD Module

Product Information

The LMT035DNJFWD-NNA-1 is an LCD module with a screen size of 3.5 inches (diagonal) and a display resolution of 320 x 480 pixels. It has a TFT panel and a color depth capable of displaying saturated color content and color scales content. The module has a viewing direction of 12 o’clock and a polarizer surface treatment. It also includes a touch panel and LED backlight circuit.

Basic Specifications

• Screen Size(Diagonal): 3.5”
• Color Depth: 65K/262K Color
• Number of dots : 320(RGB)x480
• Active Area: 48.96×73.44
• Dot Pitch: 0.153×0.153mm
• Display Technology: a-Si TFT active matrix
• Display Mode: Transmissive With Normally white
• Pixel Configuration: RGB Vertical Stripe
• Viewing Direction: 12H (1) (gray scale inverse) 6H (2)
• Polarizer Surface Treatment: HC
• Backlight Type: LEDs
• Outline Dimension: 55.26x 84.69 x 4.6 mm (exclude FPC , see dwg for details)
• Operating Temperature: -20 ~ +70°C (No Condensation)
• Storage Temperature: -30 ~ +80°C (No Condensation)

Note:

1. For saturated color display content (eg. pure-red, pure-green, pure-blue or pure-colors-combinations).
2. For “color scales” display content.
3. Color tone may slightly change by temperature and driving condition.

Block Diagram

Terminal Functions

Normal running.
10| VSYNC| Input| Vertical sync. signal in RGB mode If no used, please connect this pin to VSS
11| HSYNC| Input| Horizontal sync, signal in RGB mode If no used, please connect this pin to VSS
12| PCLK| Input| Pixel clock signal in RGB mode If no used, please connect this pin to VSS
13| DE| Output| Data enable signal in RGB mode If no used, please fix this pin at VSS level
14| DB17/R5,Msb| I/O| Data Bus
15| DB16/R4| I/O
:| :| :
18| DB13/R1| I/O
19| DB12/R0,Lsb| I/O
20| DB11/G5,Msb| I/O
21| DB10/G4| I/O
:| :| :
24| DB7/G1| I/O
25| DB6/G0,Lsb| I/O
26| DB5/B5,Msb| I/O
27| DB4/B4| I/O
:| :| :
30| DB1/B1| I/O
31| DB0/B0,Lsb| I/O
32| VSS| Power| Negative power supply,0V
33| DOUT| Output| Serial data output pin If no used, leave this pin open
34| SDA| I/O| serial data input /output bi-direction pin
35| RDX| Input| serve as a read signal
36| WRX_SCL| Input| (WR) Write data enable pin in DBI Type B (SCL) Write data enable pin in DBI Type C If no used, please connect this pin to IOVDD
37| DCX| Input| Data/Command Selection pin Low: Command
High: Parameter
38| CSX| Input| Chip select signal If no used, please connect this pin to IOVDD
39| XR(X+)| Passive| Right Side sense Terminal
40| YD(Y-)| Down Side sense Terminal
41| XL(X-)| Left Side sense Terminal
42| YU(Y+)| Up Side sense Terminal
43| LEDA| Power| LED ANODE
44~49| LEDK| Power| LEDK CATHODE
50| VSS| Power| Negative power supply,0V

Absolute Maximum Ratings

Cautions: Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

Electrical Characteristics

DC Characteristics

Items| Symbo l| MIN.| TYP.| MAX.| Unit| Condition / Application Pin
---|---|---|---|---|---|---
Operating Voltage| VDD| 2.65| 3.0| 3.6| V| VDD,IOVDD
Input High Voltage| VIH| 0.7xVDD| –| VDD| V| IM0~IM2,RESX,VSYNC,HSY NC,PCLK,DB17/R5,Msb, DB16/R4~DB13/R1,DB12/R0,Lsb,DB11/G5,Msb, DB10/G4~DB7/G1,DB6/G0,Lsb,DB5/B5,Msb, DB4/B4~DB1/B1,DB0/B0,Lsb, SDA,RDX,WRX_SCL,DCX,CSX,
Input Low Voltage| VIL| -0.3| –| 0.3xVDD| V
Output Low Voltage| VOL| 0| –| 0.99| V| DB17/R5,Msb,DB16/R4~DB13/R1,DB12/R0,Lsb,DB11/G5,Msb,DB10/G4~DB7/G1,DB6/G0,Lsb,DB5/B5,Msb, DB4/B4~DB1/B1,DB0/B0,Lsb,DE,SDA,DOUT
Operating Current| IDD| –| 8| –| mA| VDD (*1)

LED Backlight Circuit Characteristics

Items| Symbol| MIN.| TYP.| MAX.| Unit| Applicable Pin
---|---|---|---|---|---|---
Forward Voltage| LEDA| –| 3.2| –| V| LEDA
Forward Current| ILEDA| –| 120| –| mA| LEDA

AC Characteristics

DBI Type B

1. DBI Type B Timing Characteristic
2. DBI Type B Data Bus

Please refer to IC: ILI9488 data sheet for more details.

3-Line SPI Interface Timing Characteristic

Please refer to IC: ILI9488 data sheet for more details.

4-Line SPI Interface Timing Characteristic

Note: Ta=-30 to 70℃，IOVDD，VDD=2.5V to 3.3V，VSS=0V，T=10+/-0.5ns.
Please refer to IC: ILI9488 data sheet for more details.

DPI Interface

1. DPI Interface Characteristic
   Please refer to IC: ILI9488 data sheet for more details.
   

2. DPI Interface pixel format
   The Pixel clock (DCLK) runs all the time without stop. It is used to enter VS, HS, DE and D[17: 0] states when there is a rising edge of the DCLK. The DCLK cannot be used as the internal clock for other functions of the display module. Vertical synchronization (VS) is used to indicate when a new frame of the display is received. This is low enable and its state is read to the display module by a rising edge of the DCLK signal. Horizontal synchronization (HS) IS used to indicate when a new line of the frame is received. This is low enable and its state is read to the display module by a rising edge of the DCLK signal. Data Enable (DE) is used to indicate when the RGB information that should be transferred in the display is received. This is a high enable, and its state is read to the display module by a rising edge of the DCLK signal. D[17:0] is used to indicate what is the information of the image that is transferred on the display (when DE = 0 (low) and there is a rising edge of DCLK). D[17:0] can be 0(low) or 1(high). These lines are read by a rising edge of the DCLK signal. In RGB interface modes, the input display data is written to GRAM first then outputs the corresponding source voltage according to the gray data from GRAM.
   Note: Please refer to IC: ILI9488 data sheet for more details.

3. DPI(RGB) Interface timing

Power ON/OFF Sequence
IOVDD and VDD can be applied or powered down in any order. During the Power Off sequence ,if the LCD is in the Sleep In mode, VDD and IOVDD must be powered down with a minimum of 120 msec.If the LCD is in the Sleep In mode, VDD and IOVDD can be powered down with a minimum of 0msec after the /RST has been released. /CS can be applied at any time or can be permanently grounded. /RST has priority over /CS.

Notes:

1. There will be no damage to the ILI9488 if the power sequences are not met.
2. There will be no abnormal visible effects on the display panel during the Power On/Off Sequence.
3. There will be no abnormal visible effects on the display between the end of the Power On Sequence and before receiving the Sleep Out command, and also between receiving the Sleep In command and the Power Off Sequence.
4. If the /RST line is not steadily held by the host during the Power On Sequence as defined in Sections 11.1 and 11.2 ( ILI9488 datasheet ), then it will be necessary to apply the Hardware /RST after the completion of the Host Power On Sequence to ensure correct operations. Otherwise, all the functions are not guaranteed.
5. When the power is turned on, the climb period timing (Trise) must be greater than 10us.
6. Keep data pins D[17:0] at low level, or IOVDD comes later

Note: Please refer to IC: ILI9488 data sheet for more details.

Reset Timing

WIRING

K l    T er M in o_ l

No.| Pin   NuMe
1| vss

□

2| I    V DD

□

3| I    V DD
4| VDD
5| VDD
6| IMO
7| IMl
8| IM2
9| RESX
10| VSYNC
11| HSYNC
12| PCLK
13| DE
14| DB17/RS)Msb
15| DB16/R4
16| DB15/R3
17| DB14/R2
18| DB13/Rl
19| DB12/ROJsb
20| DBll/GS)Msb
21| DB10/G4
22| DB9/G3
23| DB8/G2
24| DB7 /Gl
25| DB6/GOJsb
Kl     Ter Min o_ l

No.| Pin    NuMe
26| DBS/BS)Msb
27| DB4/B4
28| DB3/B3
29| DB2/B2
30| DBl/Bl
31| DBO/BOJsb
32| vss

□

33| D UT
34| SDA
35| RDX
36| \JRX_SCL
37| DCX
38| CSX
39| XRCX+)
40| YDCY-)
41| XLCX-)
42| YUCY+)
43| LEDA
44| LEDK
45| LEDK
46| LEDK
47| LEDK
48| LEDK
49| LEDK
50| vss

Optical Characteristics

LCD Module Design and Handling Precautions

• Please ensure V0, VCOM is adjustable, to enable LCD module get the best contrast ratio under different temperatures, view angles and positions.
• Normally display quality should be judged under the best contrast ratio within viewable area. Unexpected display pattern may come out under abnormal contrast ratio.
• Never operate the LCD module exceed the absolute maximum ratings.
• Never apply signal to the LCD module without power supply.
• Keep signal line as short as possible to reduce external noise interference.
• IC chip (e.g. TAB or COG) is sensitive to light. Strong light might cause malfunction. Light sealing structure casing is recommended.
• Make sure there is enough space (with cushion) between case and LCD panel, to prevent external force passed on to the panel; otherwise that may cause damage to the LCD and degrade its display result.
• Avoid showing a display pattern on screen for a long time (continuous ON segment).
• LCD module reliability may be reduced by temperature shock.
• When storing and operating LCD module, avoids exposure to direct sunlight, high humidity, high or low temperature. They may damage or degrade the LCD module.
• Never leave LCD module in extreme condition (max./min storage/operate temperature) for more than 48hr.
• Recommend LCD module storage conditions is 0 C~40 C <80%RH.
• LCD module should be stored in the room without acid, alkali and harmful gas.
• Avoid dropping & violent shocking during transportation, and no excessive pressure press, moisture and sunlight.
• LCD module can be easily damaged by static electricity. Please maintain an optimum anti-static working environment to protect the LCD module. (eg. ground the soldering irons properly)
• Be sure to ground the body when handling LCD module.
• Only hold LCD module by its sides. Never hold LCD module by applying force on the heat seal or TAB.
• When soldering, control the temperature and duration avoid damaging the backlight guide or diffuser which might degrade the display result such as uneven display.
• Never let LCD module contact with corrosive liquids, which might cause damage to the backlight guide or the electric circuit of LCD module.
• Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl Alcohol. Other solvents (e.g. water) may damage the LCD.
• Never add force to components of LCD module. It may cause invisible damage or degrade the module’s reliability.
• When mounting LCD module, please make sure it is free from twisting, warping and bending.
• Do not add excessive force on surface of LCD, which may cause the display color change abnormally.
• LCD panel is made with glass. Any mechanical shock (e.g. dropping from high place) will damage the LCD module.
• Protective film is attached on LCD screen. Be careful when peeling off this protective film, since static electricity may be generated.
• Polarizer on LCD gets scratched easily. If possible, do not remove LCD protective film until the last step of installation.
• When peeling off protective film from LCD, static charge may cause abnormal display pattern. The symptom is normal, and it will turn back to normal in a short while.
• LCD panel has sharp edges, please handle with care.
• Never attempt to disassemble or rework LCD module.
• If display panel is damaged and liquid crystal substance leaks out, be sure not to get any in your mouth, if the substance comes into contact with your skin or clothes promptly wash it off using soap and water.

Mounting Instructions

CTP Mounting Instructions

Bezel Mounting (Figure 1)

• The bezel window should be bigger than the CTP active area. It should be≥0.5mm each side.
• Gasket should be installed between the bezel and the CTP surface. The final gap should be about 0.5~1.0mm.
• It is recommended to provide an additional support bracket for backside support when necessary (e.g. slim type TFT module without mounding structure). They should only provide appropriate support and keep the module in place.
• The mounting structure should be strong enough to prevent external uneven force or twist act onto the module.

Surface Mounting (Figure 2)

• As the CTP assembling on the countersink area with double side adhesive. The countersink area should be flat and clean to ensure the double side adhesive installation result.
• The Bezel is recommend to keep a gap (≥0.3mm each side) around the cover lens for tolerance.
• It is recommended to provide an additional support bracket with gasket for backside support when necessary (e.g. TFT module without mounding structure). They should only provide appropriate support and keep the module in place.
• The mounting structure should be strong enough to prevent external uneven force or twist act onto the module.

Additional Cover Lens Mounting (Figure 3)

• For the case of additional cover Lens mounting, it is necessary to recheck with the CTP specification about the material and thickness to ensure the functionality.
• It should keep a 0.2~0.3mm gap between the cover lens and the CTP surface..
• The cover lens window should be bigger than the active area of the CTP.It should be≥0.5mm each side.
• It is recommended to provide an additional support bracket for backside support when necessary (e.g. slim type TFT module without mounding structure). They should only provide appropriate support and keep the module in place.
• The mounting structure should be strong enough to prevent external uneven force or twist act onto the module.

RTP Mounting Instructions

• It should bezel touching the RTP Active Area (A.A.) to prevent abnormal touch.It should left gab D=0.2~0.3mm in between. (Figure 4)
• Outer bezel design should take care about the area outside the A.A. Those areas contain circuit wires which is having different thickness. Touching those areas could de-form the ITO film. As a result bezel the ITO film be damaged and shorten its lifetime. It is suggested to protect those areas with gasket (between the bezel and RTP).The suggested figures are B≥0.50mm; C≥0.50mm. (Figure 4)
• The bezel side wall should keep space E= 0.2 ~ 0.3mm from the RTP. (Figure 4)

Warranty

This product has been manufactured to our company’s specifications as a part for use in your company’s general electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the above applications, we will need to enter into a separate product liability agreement.

• We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product (including disassembly and reassembly), after product delivery.
• We cannot accept responsibility for any defect, which may arise after the application of strong external force to the product.
• We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the product has passed our company’s acceptance inspection procedures.
• When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may arise.
• We cannot accept responsibility for intellectual property of a third part, which may arise through the application of our product to our assembly with exception to those issues relating directly to the structure or method of manufacturing of our product.

URL: www.topwaydisplay.com

References

• 液晶显示模块-7寸显示屏-2.8寸显示屏-液晶屏厂家 | 拓普微科技

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