Banggood TEC1-7103 Low-power Semiconductor Refrigeration User Manual
- June 6, 2024
- banggood
Table of Contents
Manual
Feature:
Chip model: TEC1-7103
Dimensions: 30304. 3mm (71 pairs of element pairs)
Wire specification: lead length 150±8mm RV standard wire single head 5mm tin-
plated
Internal resistance: 2.1-2.3Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Maximum temperature difference: above 65℃
Maximum current: lmax=3A
Maximum voltage: 8.4V
Assembly pressure: 85N/cm2
Working environment: temperature range -55℃ ～ 83℃ (excessive ambient
temperature will directly affect the cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Packaging standard: foam box packaging, storage conditions
Ambient temperature -10℃～40℃
Storage conditions: -40~60℃
Device characteristics: red wire positive, black wire negative (with literal
for Refrigeration surface, without literal for Heat dissipation surface)
Note:
A radiator or water cooling device must be installed on the heat dissipation
surface, otherwise, it will burn. (Note: Thermally conductive silicone grease
should be applied
regardless of water cooling or air cooling)
Note: If the refrigeration sheet is burned out due to poor heat
dissipation, our shop is not responsible for the warranty. The cooling effect
will be achieved when the power is turned on during the test in a state of no
heat dissipation. The power should be unplugged immediately within 1 second.
Otherwise, it is easy to burn the refrigeration film.
<Please test carefully, novices should not use this method to test. >
Mobile phone kit installation tutorial
Method 1:
Step 1: Paste a heat-insulating strip and a 3cm thermal conductive sheet
on the back of the heat sink. The surface map is made of silica gel for better
adhesion.
Step 2: Attach the blank side of the cooling fin to the top of the cooling fan, and the side with words is the cooling surface.
Step 3: The fan with an icon is that the air outlet faces the heat sink. Cover the grille and screw the screw. The screw is stuck in the gap of the heat sink and is a bit misplaced. Mind you can use silica gel to stick it.
Step 4: Put the heat-shrinkable tube into the female wire first.
Step 5: Cut the wires of the fan and the cooling plate to the same length, and connect the red wire to the red wire and the black wire to the black wire of the female wire.
Step 6: Coat the cooling surface with thermal conductive glue and paste the thermally conductive sheet to avoid poor adhesion of the thermally conductive sheet on the cooling surface.
Method 2: Find a mobile phone case, open a 40*40mm hole, and insert it directly. The edges can be fixed with thermally conductive glue. This method is firmer and can be added with copper.