belkin AUD006 SoundForm Wireless Headphones User Manual
- June 16, 2024
- belkin
Table of Contents
AUD006 SoundForm Wireless Headphones
User Manual
DIE LAYOUT
| BOM – AUDO006 | P# |
|---|---|
| Outer box | Refer Artwork |
| Paper Hanger | 7100-00267 Rev.A00O |
| RC Statement | Refer Artwork |
| Cable Slot Filler | Refer Artwork |
| QIG | Refer Artwork |
| Paper Wafer seal (2pcs) | 259mm |
Hanger folded in the case pack
Die Line Fie: IDL_AUDO06_SAP232 SOUNDFORM INSPIRE OVER EAR HEADPHONES| REV 000
---|---
Artwork File:
Business Unit: Core
Program Manager: Andrew Camba
Packaging Engineer: Matthew Duffy
Retail Outside Dimension (Including Hang Tab)
LxW-x D (in):
LxWxD (mm):
DIE/MATERIAL SPECS:
Material: Please refer to drawing
Blank Size (in): 64.053 x 23.725
Blank Size (mm): 1626.935 x 602.615
This dietine works for following skus (if any):
Unit: IN/MM
Side Shown: PRINT SIDE
Flute/Grain: horizontal
Tolerance:+/- 1/32″ – 0.8mm
Drawing Scale 1:1
RELEASE DATE: 03/02/2023
DIELINE:
Intermediata
THIS DOCUMENT & THE INFORMATION IN IT ARE THE CONFIDENTIAL PROPERTY OF
BELKIN INTERNATIONAL AND MUST NOT BE COPIED, REPRODUCED OR USED IN ANY MANNER
WITHOUT THE WRITTEN CONSENT OF BELKIN CORPORATION.
IT MUST BE RETURNED UPON REQUEST
DO NOT PRINT DIE LINES, PRINTERS NOTES
PRINT SPECS:………..
Color Plates:……….
Finish:………….
Notes:………….
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