DELL Technologies R7625 Rack Server User Guide

: June 15, 2024
: DELL Technologies

Table of Contents

R7625 Rack Server
Product Information
Specifications
Chapter 1: System Overview
Chapter 2: System Features and Generational Comparison
Chapter 4: Processor
Chapter 5: Memory Subsystem
Chapter 8: PCIe Subsystem
Chapter 10: Rack, Rails, and Cable Management
Chapter 11: Supported Operating Systems
Chapter 12: Dell OpenManage Systems Management
Chapter 15: Appendix B. Standards Compliance
Chapter 16: Appendix C Additional Resources
Product Usage Instructions
Chapter 1: System Overview
Chapter 4: Processor
Chapter 5: Memory Subsystem
Chapter 8: PCIe Subsystem
Chapter 10: Rack, Rails, and Cable Management
Chapter 11: Supported Operating Systems
Chapter 12: Dell OpenManage Systems Management
FAQ
Q: How do I power off the Dell PowerEdge R7625?
Q: Can I use third-party memory modules in the Dell PowerEdge
- of ports
- of ports
- of PERC type
- of
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)

R7625 Rack Server

Product Information

Specifications

Regulatory Model: E94S
Regulatory Type: E94S001
February 2023 Rev. A00

Chapter 1: System Overview

The Dell PowerEdge R7625 is a high-performance server designed
for various key workloads and incorporates new technologies.

Chapter 2: System Features and Generational Comparison

This chapter provides an in-depth look at the system features
and a comparison with previous generations of the product.

Chapter 4: Processor

The processor section covers the features of the processor and
provides information on the supported processors for the Dell
PowerEdge R7625.

Chapter 5: Memory Subsystem

This chapter details the supported memory configurations for the
Dell PowerEdge R7625.

Chapter 8: PCIe Subsystem

The PCIe subsystem section discusses the PCIe risers and their
functionality in the Dell PowerEdge R7625.

Chapter 10: Rack, Rails, and Cable Management

This chapter provides information on the rack, rails, and cable
management for the Dell PowerEdge R7625.

Chapter 11: Supported Operating Systems

Here, you will find a list of supported operating systems for
the Dell PowerEdge R7625.

Chapter 12: Dell OpenManage Systems Management

This chapter covers the Integrated Dell Remote Access Controller
(iDRAC) and the software support matrix for systems management.

Chapter 15: Appendix B. Standards Compliance

Appendix B provides information on the standards compliance of
the Dell PowerEdge R7625.

Chapter 16: Appendix C Additional Resources

Appendix C contains additional resources and references for
further information on the Dell PowerEdge R7625.

Product Usage Instructions

Chapter 1: System Overview

The system overview chapter provides an introduction to the Dell
PowerEdge R7625 and its key features. It is recommended to read
this chapter to familiarize yourself with the product before
proceeding with the usage instructions.

Chapter 4: Processor

To install or replace a processor in the Dell PowerEdge R7625,
follow these steps:

Ensure that the server is powered off and unplugged from the
power source.
Open the server chassis and locate the processor socket.
Carefully remove the protective cover from the socket.
Align the processor with the socket and gently lower it into
place.
Secure the processor by closing the socket lever.
Replace the protective cover on the socket.
Close the server chassis and reconnect any cables that were
disconnected.
Power on the server and verify that the new processor is
recognized.

Chapter 5: Memory Subsystem

To install or upgrade memory in the Dell PowerEdge R7625, follow
these steps:

Power off and unplug the server.
Open the server chassis and locate the memory slots.
Remove any existing memory modules, if necessary.
Align the new memory module with the slot and firmly press it
in until it clicks into place.
Repeat the process for each additional memory module.
Close the server chassis and reconnect any cables that were
disconnected.
Power on the server and verify that the new memory is
recognized.

Chapter 8: PCIe Subsystem

If you need to install or replace a PCIe riser in the Dell
PowerEdge R7625, follow these steps:

Power off and unplug the server.
Open the server chassis and locate the PCIe riser slots.
Remove any existing riser, if necessary, by unscrewing it from
the chassis.
Align the new riser with the slot and gently push it into
place.
Screw the riser into the chassis to secure it.
Close the server chassis and reconnect any cables that were
disconnected.
Power on the server and verify that the new PCIe riser is
recognized.

Chapter 10: Rack, Rails, and Cable Management

To properly install the Dell PowerEdge R7625 into a rack with
rails and manage the cables, follow these steps:

Refer to the rack and rail documentation for instructions on
installing the rails into the rack.
Slide the server onto the rails and ensure it is securely
attached.
Organize the cables and route them through the cable management
system.
Secure the cables using cable ties or other cable management
accessories.
Ensure that the cables are not interfering with any server
components or obstructing airflow.
Close the rack door and verify that the server is properly
installed and the cables are well-managed.

Chapter 11: Supported Operating Systems

Before installing an operating system on the Dell PowerEdge
R7625, refer to this chapter to ensure compatibility with the
desired operating system. Follow the installation instructions
provided by the operating system vendor for a successful
installation.

Chapter 12: Dell OpenManage Systems Management

The Dell OpenManage Systems Management software is designed to
help you manage and monitor your Dell PowerEdge R7625. Follow the
instructions in this chapter to install and configure the software
for optimal system management.

FAQ

Q: How do I power off the Dell PowerEdge R7625?

A: To power off the server, press and hold the power button on
the front panel until the system powers down completely.

Q: Can I use third-party memory modules in the Dell PowerEdge

R7625?

A: It is recommended to use Dell-approved memory modules for
optimal performance and compatibility. The use of third-party
memory modules may not be supported and could result in system
instability.

Dell PowerEdge R7625
Technical Guide
Regulatory Model: E94S Regulatory Type: E94S001 February 2023 Rev. A00

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2023 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.

Contents

Chapter 1: System overview……………………………………………………………………………………………. 5 Key workloads…………………………………………………………………………………………………………………………………………………. 5 New technologies……………………………………………………………………………………………………………………………………………. 5
Chapter 2: System features and generational comparison……………………………………………………. 7
Chapter 3: Chassis views and features……………………………………………………………………………..10 Chassis views………………………………………………………………………………………………………………………………………………….10 Front view of the system…………………………………………………………………………………………………………………………. 10 Rear view of the system…………………………………………………………………………………………………………………………… 11 Inside the system……………………………………………………………………………………………………………………………………… 12 Quick Resource Locator…………………………………………………………………………………………………………………………… 13
Chapter 4: Processor……………………………………………………………………………………………………. 15 Processor features………………………………………………………………………………………………………………………………………… 15 Supported processors………………………………………………………………………………………………………………………………. 15
Chapter 5: Memory subsystem………………………………………………………………………………………..17 Supported memory………………………………………………………………………………………………………………………………………… 17
Chapter 6: Storage………………………………………………………………………………………………………. 18 Storage controllers………………………………………………………………………………………………………………………………………… 18 Supported Drives…………………………………………………………………………………………………………………………………………… 18 Internal storage configuration………………………………………………………………………………………………………………………..19 External Storage…………………………………………………………………………………………………………………………………………….20
Chapter 7: Networking…………………………………………………………………………………………………. 22 Overview……………………………………………………………………………………………………………………………………………………….. 22 OCP 3.0 support…………………………………………………………………………………………………………………………………………….22 Supported OCP cards……………………………………………………………………………………………………………………………… 22 OCP NIC 3.0 vs. rack Network Daughter Card comparisons………………………………………………………………… 23
Chapter 8: PCIe subsystem…………………………………………………………………………………………… 24 PCIe risers……………………………………………………………………………………………………………………………………………………… 24
Chapter 9: Power, thermal, and acoustics……………………………………………………………………….. 33 Power…………………………………………………………………………………………………………………………………………………………….. 33 Power Supply Units…………………………………………………………………………………………………………………………………..34 Thermal………………………………………………………………………………………………………………………………………………………….. 35 Thermal design…………………………………………………………………………………………………………………………………………. 36 Acoustics……………………………………………………………………………………………………………………………………………………….. 36 Acoustical configurations of R7625 ………………………………………………………………………………………………………..36 PowerEdge acoustical specifications……………………………………………………………………………………………………… 38

Contents

3

Chapter 10: Rack, rails, and cable management………………………………………………………………… 47 Rails and cable management information…………………………………………………………………………………………………….. 47
Chapter 11: Supported Operating Systems………………………………………………………………………. 56
Chapter 12: Dell OpenManage Systems Management…………………………………………………………. 57 Integrated Dell Remote Access Controller (iDRAC)……………………………………………………………………………………. 57 Systems Management software support matrix…………………………………………………………………………………………. 58
Chapter 13: Appendix D: Service and support…………………………………………………………………… 60 Default support levels…………………………………………………………………………………………………………………………………… 60 Default deployment levels……………………………………………………………………………………………………………………….. 60 Other services and support information……………………………………………………………………………………………………….60 Dell deployment services…………………………………………………………………………………………………………………………. 60 Dell custom deployment Services…………………………………………………………………………………………………………….64 Dell Residency Services…………………………………………………………………………………………………………………………… 64 Dell Data Migration Services…………………………………………………………………………………………………………………….64 Dell Enterprise Support Services……………………………………………………………………………………………………………..65 Enterprise connectivity……………………………………………………………………………………………………………………………. 67 Dell TechDirect………………………………………………………………………………………………………………………………………….68 Dell Technologies Consulting Services…………………………………………………………………………………………………….68
Chapter 14: Appendix A. Additional specifications…………………………………………………………….. 70 Chassis dimensions ………………………………………………………………………………………………………………………………………. 70 System weight……………………………………………………………………………………………………………………………………………….. 71 NIC port specifications………………………………………………………………………………………………………………………………….. 71 Video specifications……………………………………………………………………………………………………………………………………….. 71 USB ports specifications………………………………………………………………………………………………………………………………. 72 PSU rating……………………………………………………………………………………………………………………………………………………… 72 Environmental specifications………………………………………………………………………………………………………………………… 73 Thermal air restrictions……………………………………………………………………………………………………………………………. 75 Thermal restriction matrix……………………………………………………………………………………………………………………….. 76
Chapter 15: Appendix B. Standards compliance………………………………………………………………… 80
Chapter 16: Appendix C Additional resources……………………………………………………………………. 81

4

Contents

1

System overview

The PowerEdge R7625 system is a 2U server that supports: Two AMD EPYC 4th Generation 9004 series processor with up to 96 cores Up to 24 RDIMMs, with up to 3 TB of memory and speeds up to 4800 MT/s Two redundant AC or DC power supply units Up to 8 x 3.5-inch SATA/SAS drives or 8 x 2.5 SATA/SAS/NVMe or 12 x 3.5-inch SATA/SAS or 16 x 2.5-inch SATA/SAS/
NVMe 24 x 2.5-inch SATA/SAS/NVMe (HDD/SSD) drives PCI Express® (PCIe) 5.0 enabled expansion slots Network interface technologies to cover Network Interface Card (NIC)
Topics:
· Key workloads · New technologies

Key workloads
Customers looking for accelerated compute to maximize performance in a dense, scalable server architecture to address the following applications:
High Performance Computing Virtual Desktop Infrastructure (VDI) Virtualization

New technologies
Table 1. New technologies Technology AMD Genoa Processor (SP5)
4800 MT/s DDR5 Memory
PCIe Gen PCIe Slot Flex I/O

Detailed Description
Core count: Up to 96 core processor
5nm process technology
AMD Inter-chip global memory interconnect (xGMI) up to 64 lanes
Speeds up to 4.1 GHz
Maximum TDP: 400 W
Up to 12 channels with 1 DPC per CPU and 24 DIMMs in total
Supports RDIMM, 3DS DIMM DDR5 with ECC up to 4800 MT/s
Gen5 @32 GT/s
Up to eight PCIe Slots with x8 or x16 lanes
LOM board, 2 x1Gb with BCM5720 LAN controller
Rear I/O with: 1 GB Dedicated Management Network Port 1 x USB 3.0 1 x USB 2.0 VGA port

System overview

5

Table 1. New technologies (continued) Technology
CPLD 1-wire Dedicated PERC
Software RAID Power Supplies

Detailed Description
Serial Port Option with STD RIO board
OCP Mezz 3.0 (supported by x8 PCIe lanes) (optional)
Front I/O with: 1 x iDRAC Direct (Micro-AB USB) port 1 x USB 2.0 1 x VGA
Support payload data of Front PERC, Riser, BOSS N1, BP and Rear IO to BIOS and iDRAC
PERC 11 HBA355i, H355, H755, H755N PERC 12 H965i
S160
60 mm / 86 mm dimension is the new PSU form factor on 16G design
Platinum 800 W AC/HVDC
Platinum 1100 W AC/HVDC
Platinum 1400 W AC/HVDC
Titanium 1800 W AC/HVDC
Platinum 2400 W AC/HVDC
Titanium 2800 W AC/HVDC

6

System overview

2

System features and generational comparison

The following table shows the comparison between the PowerEdge 7625 with the PowerEdge R7525.

Table 2. Features comparison

Features

PowerEdge R7625

PowerEdge R7525

Processors

Two AMD® EPYCTM 4th Generation 9004 series processors

Two AMD® EPYCTM Generation 2 or Generation 3 processors

CPU interconnect

Inter-chip global memory interconnect (xGMI) Inter-chip global memory interconnect (xGMI)

32GT/sec

16GT/sec

Memory

24 x DDR5 RDIMM (3 TB), bandwidth up to 4800 MT/S

32 x DDR4 RDIMM (2TB), LRDIMM (4TB), bandwidth up to 3200 MT/S

Storage Controllers Drive Bays

PERC 11: HBA355i, H355, H755, H755N PERC 12: H965i Software RAID: S160 BOSS-N1

Adapters: HBA355E, H840 PERC: H345, H745, H755, H755N Software RAID: S150

Front bays:

Up to 8 x 3.5-inch SAS4/SATA (HDD/SSD) 3.5 inches, 2.5 inches – 12 Gb SAS, 6 Gb SATA,

max 160 TB

NVMe HDD

Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 240 TB

Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 122.88 TB

Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 245.76 TB

Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 368.64 TB

Rear bay:

Up to 2 x 2.5-inch SAS4/SATA/NVMe (HDD/SSD) max 30.72 TB

Up to 4 x 2.5-inch SAS4/SATA/NVMe (HDD/SSD) max 61.44 TB

Power Supplies
Cooling Options Fans

Mixed Mode (MM) AC/HVDC (Platinum) 800 W, 1400 W, 2400 W
Mixed Mode (MM) AC/HVDC (Titanium) 1100 W, 1800 W, 2800 W
(-48 V) 1100 W DC PSU
Air Cooling
Up to six High performance Silver (HPR) / Very High Performance Gold (VHP) hot plug fans

Mixed Mode (MM) AC/HVDC (Platinum) 800 W, 1400 W, 2400 W
Titanium 1100 W Mixed Mode AC/HVDC, (-48 V) 1100 W DC PSU
,
Air Cooling
Up to six Standard (STD) / High performance (HPR) / Very High Performance (VHP) hot plug fans

Dimension

Height: 86.8 mm (3.41 inches)

Width: 482 mm (18.97 inches)

Depth: 772.13 mm (30.39 inches) with bezel Depth: 772.13 mm (30.39 inches) with bezel

System features and generational comparison

7

Table 2. Features comparison (continued)

Features

PowerEdge R7625
Depth: 758.29 mm (29.85 inches) without bezel

PowerEdge R7525 Depth: 758.29 mm (29.85 inches) without bezel

Form Factor

2U rack server

Embedded Management
Bezel

iDRAC9 iDRAC Direct iDRAC RESTful with Redfish iDRAC Service Manual Quick Sync 2 wireless module
Optional LCD bezel or security bezel

iDRAC9 iDRAC Direct iDRAC Service Module Quick Sync 2 wireless module
Optional LCD bezel or security bezel

OpenManage Software

OpenManage Enterprise OpenManage Power Manager plugin OpenManage SupportAssist plugin OpenManage Update Manager plugin CloudIQ for PowerEdge plug in OpenManage Enterprise Integration for
VMware vCenter
OpenManage Integration for Microsoft System Center
OpenManage Integration with Windows Admin Center

OpenManage Enterprise OpenManage Power Center

Mobility

OpenManage Mobile

OpenManage Integrations

BMC TrueSight Microsoft System Center OpenManage Integration with ServiceNow Red Hat Ansible Modules Terraform Providers VMware vCenter and vRealize Operations
Manager

BMC TrueSight Microsoft System Center Red Hat Ansible Modules VMware vCenter

Security

Cryptographically signed firmware

Data at Rest Encryption (SEDs with local or Secure Boot

external key mgmt)

Secure Erase

Secure Boot

Silicon Root of Trust

Secure Erase

System Lockdown (requires iDRAC9 Enterprise or

Secured Component Verification (Hardware Datacenter)

integrity check)

TPM 1.2/2.0 (optional), TCM 2.0 optional

Silicon Root of Trust

AMD Secure Memory Encryption (SME)

System Lockdown (requires iDRAC9

AMD Secure Encrypted Virtualization (SEV)

Enterprise or Datacenter)

TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ

AMD Secure Memory Encryption (SME)

AMD Secure Encrypted Virtualization (SEV)

Embedded NIC

2 x 1GbE LOM card (optional)

2 x 1GE LOM

Networking Options

1 x OCP card 3.0 (optional) NOTE: The system allows either LOM card or an OCP card or both to be installed in the system.

OCP x16 Mezz 3.0

GPU Options

Up to two double wide 300W, or six single wide 75W accelerators

Up to three double wide 300W or six single wide 75W accelerators

8

System features and generational comparison

Table 2. Features comparison (continued)

Features Ports

PowerEdge R7625

PowerEdge R7525

Front Ports
1 x Dedicated iDRAC (micro-USB USB) port
1 x USB 2.0 1 x VGA

Rear Ports 1 x USB 2.0 1 x iDRAC ethernet
port 1 x USB 3.0 1 x Serial port
(optional) 1 x VGA

Front Ports 1 x Dedicated
iDRAC micro-USB 1 x USB 2.0

Rear Ports
1 x USB 2.0 1 x iDRAC Direct/
ethernet port
1 x USB 3.0 1 x Serial port (optioanl) 1 x VGA

Internal Port: 1 x USB 3.0

PCIe

Up to eight PCIe slots
4 x PCIe Gen5 slots 8 x PCIe Gen4 slots

Operating System and Hypervisors

Canonical Ubuntu Server LTS Microsoft Windows Server with Hyper-V Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware ESXi For specifications and interoperability details, see Dell Enterprise Operating Systems on Servers, Storage, and Networking page at Dell.com/OSsupport.

8 x PCIe Gen4 slots
Canonical Ubuntu Server LTS Citrix Hypervisor Windows Server LTSC with Hyper-V Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware ESXi For specifications and interoperability details, see Dell Enterprise Operating Systems on Servers, Storage, and Networking page at Dell.com/ OSsupport.

System features and generational comparison

9

Topics:
· Chassis views
Chassis views

3
Chassis views and features

Front view of the system

Figure 1. Front view of 24 x 2.5-inch drive system Figure 2. Front view of 16 x 2.5-inch drive system Figure 3. Front view of 8 x 2.5-inch drive system

10

Chassis views and features

Figure 4. Front view of 12 x 3.5-inch drive system Figure 5. Front view of 8 x 3.5-inch drive system
Rear view of the system
Figure 6. Rear view of the system Figure 7. Rear view of the system with 2 x 2.5-inch rear drive module Figure 8. Rear view of the system with 4 x 2.5-inch rear drive module

Chassis views and features

11

Inside the system

Figure 9. Inside the system

12

Chassis views and features

Figure 10. Inside the system with full length risers and GPU shroud
Quick Resource Locator
The QRL on everything (SILs, GSG, Installation and Service Manual except on the EST) is a generic QRL for R7625 that leads to a webpage for that product. That webpage has links for things like setup and service videos, iDRAC manual, and other things that apply to the platform. The QRL on the EST is unique and specific to that service tag and will contain the Service Tag number and the iDRAC password. The label and the QRL code within it are printed on demand at the L10 factories. This QRL links to a webpage that shows the exact configuration as built for that customer, and the specific warranty purchased. It is one click away from the same content of generic information that applies to R7625 that is available in the other QRLs.

Chassis views and features

13

Figure 11. R7625 Quick Resource Locator

14

Chassis views and features

Topics:
· Processor features
Processor features

4
Processor

The AMD EPYCTM9004 Series Processor (“Genoa”) is the 4th Generation AMD EPYCTM System on a chip (SOC) supporting the modern data center. The AMD EPYCTM 9004 Series Processor is based on AMD’s SP5 compatible socket infrastructure with a new BIOS. AMD EPYCTM9004 Series Processor is not drop-in compatible to AMD’s SP3 socket infrastructure for EPYCTM Series 7002 (“Rome”) and 7003 (“Milan”) Processors. Based on AMD’s “Zen4” cores, integrated I/O controllers, up to 32 MB of L3 cache per core, advanced security, and synchronized fabric and memory clock speeds, “Genoa” is designed for improved performance, lower TCO, and faster time to results with next gen technologies.
The following lists the features and functions included in the AMD Genoa offering:
Supports up to 96 AMD Zen4 x86 cores with enhance performance with 32 MB L3 cache/core. Integrated I/O support for up to 128 lanes with PCI Express 5 on Dell platforms (AMD support up to 160 I/O lanes with 2P).
Enhanced Memory Performance with support up to 4800 MT/s DIMMs (1 DPC), 3DS RDIMM support. Enhanced Memory Performance with: Infinity FabricTM and Memory Clock Synchronized. Largest Available x86 L3 Cache Up to 32 MB / core.
Memory Capacity up to 12 channels DDR5 and up to 256 GB/channel support with 2, 4, 6, 8, 10 and 12 channel performance optimization options.
Enhanced physical and virtual security with AMD Infinity Guard that includes silicon embedded security and virtual features (Secure Memory Encryption and Secure Encrypted Virtualization-Secure Nested Paging (SEV-SNP) to further improve platform and data security capabilities.
Supported processors

Table 3. Supported processor for the PowerEdge R7625

Processor

Base

model number frequency in

GHz

Cores/ Threads

Default TDP in cTDP in W W

9654

2.40

96/192

360

320 – 400

9554

3.10

64/128

360

320 – 400

9454

2.75

48/96

290

240 – 300

9354

3.25

32/64

280

240 – 300

9334

2.70

32/64

210

200 – 240

L3 Cache in MB
384 256 256 256 128

Max DDR frequency (1 DPC) MT/s
4800
4800
4800
4800
4800

Processor

15

Table 3. Supported processor for the PowerEdge R7625 (continued)

Processor

Base

model number frequency in

GHz

9224

2.50

Cores/ Threads
24/48

Default TDP in cTDP in W W

200

200 – 240

9124

3.00

16/32

200

200 – 240

9474F

3.60

48/96

360

360 – 320

9374F

3.85

32/64

320

320 – 320

9174F

4.10

16/32

320

320 – 320

L3 Cache in MB
64 64 256 256 256

NOTE: The processors are 12 channel and has a maximum frequency of 4800 MT/s (1DPC).

Max DDR frequency (1 DPC) MT/s
4800
4800
4800
4800
4800

16

Processor

5

Memory subsystem

Topics:
· Supported memory
Supported memory

Table 4. Memory technology comparison Feature DIMM type Transfer speed Voltage

PowerEdge R7625 (DDR5) RDIMM 4800 MT/s (1DPC) 1.1 V

The following table lists the supported DIMMs for the R7615. For the latest information about supported memory and memory configurations, reference the latest SDL.

Table 5. Supported DIMMs

DIMM Speed (MT/s)
4800

DIMM Type DDR5 RDIMM

4800

DDR5 RDIMM

4800

DDR5 RDIMM

4800

DDR5 RDIMM

DIMM Capacity (GB) 16 32 64 128

Ranks per DIMM Data Width

1

x8

2

x8

2

x4

4

x4

DIMM Volts (V)
1.1 1.1 1.1 1.1

Memory subsystem

17

6

Storage

Topics:
· Storage controllers · Supported Drives · Internal storage configuration · External Storage

Storage controllers

Dell’s RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar. 16G PERC Controller offerings will be a heavy leverage of 15G PERC family. The Value and Value Performance levels will carry over to 16G from 15G. New to 16G, is the Harpoon-based Premium Performance tier offering. This high-end offering will drive IOPs performance and enhanced SSD performance.

Table 6. PERC Series controller offerings Performance Level Entry Value Premium Performance External Controllers

Controller and Description S160 H355, HBA355i H755, H755N, H965i HBA355E

NOTE: For more information on the features of the Dell PowerEdge RAID controllers (PERC), Software RAID controllers, or BOSS card, and on deploying the cards, see the storage controller documentation at www.dell.com/ storagecontrollermanuals.

Supported Drives

The table shown below lists the internal drives supported by the R7625. Refer to Agile for the latest SDL.

Table 7. Supported Drives

Form Factor Type

Speed

2.5 inches 2.5 inches 3.5 inches 2.5 inches 2.5 inches 2.5 inches 2.5 inches

SAS

12Gb

SAS

12Gb

SATA

6Gb

vSAS SSD 12Gb

SAS SSD 24Gb

SATA SSD 6Gb

NVMe SSD Gen4

Rotational Speed 7.2K 10K 7.2K N/A N/A N/A N/A

Capacities
2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB 600 GB, 1.2 TB, 2.4 TB 2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB 960 GB, 1.92 TB, 3.84 TB, 7.68 TB 800 GB, 960 GB, 1.6 TB, 1.92 TB, 3.84 TB, 7.68 TB 480 GB, 960 GB, 1.92 TB, 3.84 TB 400 GB, 800 GB, 1.6 TB, 1.92 TB, 3.2 TB, 3.84 TB, 6.4 TB, 7.68 TB, 15.36 TB

18

Storage

Table 7. Supported Drives (continued)

Form Factor Type

Speed

2.5 inches

DC NCMe Gen4 SSD

Rotational Speed
N/A

Capacities 960 GB, 3.84 TB

Internal storage configuration

Table 8. Internal Storage Configuration Matrix

Total HDD/ SSD (not BOSS)

NVMe Enabled / Universal Slots

16G Storage Front

Rear Storage

0*

0 / 0

N/A

8

0 / 0

8x 3.5″ SAS3/SATA

N/A

12

0 / 0

12x 3.5″ SAS3/SATA

N/A

14

0 / 0

12x 3.5″ SAS3/SATA

Rear 2×2.5″

univ SAS4

14

0 / 0

12x 3.5″ SAS3/SATA

Rear 2×2.5″

univ SAS4

16

0 / 0

12x 3.5″ SAS3/SATA

Rear 4×2.5″

univ SAS4

16

0 / 0

12x 3.5″ SAS3/SATA

Rear 4×2.5″

univ SAS4

12

0 / 0

12x 3.5″ SAS3/SATA

N/A

16

0 / 0

12x 3.5″ SAS3/SATA

4x Rear E3

G5x4

8

8 / 0

8x U.2 G4

N/A

8

8 / 0

8x U.2 G4

N/A

8

8 / 0

8x U.2 G4

N/A

8

0 / 8

8x 2.5″ Universal

N/A

16

0 / 0

16x 2.5″ SAS4/SATA

N/A

16

0 / 0

16x 2.5″ SAS4/SATA

N/A

16

16 / 0

16x U.2 G4

N/A

16

16 / 0

16x U.2 G4

N/A

16

16 / 0

16x U.2 G4

N/A

24

8 / 0

16x 2.5″ SAS4/SATA + 8x N/A

U.2 G4

24

8 / 0

16x 2.5″ SAS4/SATA + 8x N/A

U.2 G4

24

0 / 0

24x 2.5″ SAS4/SATA

N/A

24

0 / 0

24x 2.5″ SAS4/SATA

N/A

PERC Storage Qty Controller(s)

Controller Form Factor

0

N/A

1

HBA355iF/H355F Front PERC

1

HBA355i / H355 / PERC Adapter

H755

1

HBA355i / H355 / PERC Adapter

H755

1

H965i

PERC Adapter

1

HBA355i / H355 / PERC Adapter

H755

1

H965i

PERC Adapter

1

HBA355

PERC Adapter

1

HBA355i/HBA355/ PERC Adapter

H755/S160

0

S160 _NVMe

N/A

1

H755N F

Front PERC

1

H965i F

Front PERC

1

HBA355i F/H355 F/ Front PERC

H755 F/S160

1

HBA355i F/H355 F/ Front PERC

H755 F

1

H965i F

Front PERC

0

S160

N/A

2

H755N F

Front PERC

2

H965i F

Front PERC

1

HBA355i F/H355 F/ Front PERC

H755 F/S160

1

H965i Adpt/S160

PERC Adapter

1

HBA355i F/H355 F/ Front PERC

H755 F

1

H965i F

Front PERC

Storage

19

Table 8. Internal Storage Configuration Matrix (continued)

Total HDD/ SSD (not BOSS)
24

NVMe Enabled / Universal Slots
0 / 8

16G Storage Front 24x 2.5″ SAS4/SATA

Rear Storage PERC Storage Qty Controller(s)

Controller Form Factor

N/A

1

HBA355i F/H355 F/ Front PERC

H755 F

24

0 / 6

24x 2.5″ SAS4/SATA

N/A

1

H965i F

Front PERC

26

0 / 0

24x 2.5″ SAS4/SATA

Rear 2×2.5″

1

HBA355i F/H355 F/ Front PERC

univ SAS4

H755 F

26

0 / 0

24x 2.5″ SAS4/SATA

Rear 2×2.5″

1

H965i F

univ SAS4

Front PERC

26

2 / 0

24x 2.5″ SAS4/SATA

Rear 2×2.5″

1

HBA355i F/H355 F/ Front PERC

univ SAS4

H755 F

26

2 / 0

24x 2.5″ SAS4/SATA

Rear 2×2.5″

1

H965i F

univ SAS4

Front PERC

28

0 / 0

24x 2.5″ SAS4/SATA

Rear 4×2.5″

1

HBA355i F/H355 F/ Front PERC

univ SAS4

H755 F

28

0 / 0

24x 2.5″ SAS4/SATA

Rear 4×2.5″

1

H965i F

univ SAS4

Front PERC

28

4 / 0

24x 2.5″ SAS4/SATA

Rear 4×2.5″

1

HBA355i F/H355 F/ Front PERC

univ SAS4

H755 F/S160

28

4 / 0

24x 2.5″ SAS4/SATA

Rear 4×2.5″

1

H965i F/S160

Front PERC

univ SAS4

24

24 / 0

24x U.2 G5 Switched

N/A

0

S160

N/A

24

24 / 0

24x U.2 G5 Switched

N/A

2

H965i F

Front PERC

16

16 / 0

16x E3.S G4 Ortho

N/A

2

H755N F

Front PERC

16

16 / 0

16x E3.S G4 Ortho

N/A

2

H965i F

Front PERC

32

32 / 0

32x E3.S G5 Ortho

N/A

0

S160

N/A

36

36 / 0

32x E3.S G5 Ortho

4x E3 G5 Rear 0

S160

N/A

Ortho

8

8 / 0

8x E3.S G5 Ortho

N/A

0

S160

N/A

16

16 / 0

16x E3.S G5 Ortho

N/A

0

S160

N/A

20

20 / 0

16xE3.S (NVMe G5) +4x N/A

0

S160

N/A

SCM E3.S 2T

NOTE: *BOSS/IDSDM Mandatory: All other configurations support optional BOSS/IDSDM.

External Storage

The R7625 support the external storage device types listed in the table below.

Table 9. Support for External Storage Devices Device Type External Tape NAS/IDM appliance software

Description Supports connection to external USB tape products Supports NAS software stack

20

Storage

Table 9. Support for External Storage Devices (continued)

Device Type JBOD

Description Supports connection to 12Gb MD-series JBODs

Storage

21

7

Networking
Topics:
· Overview · OCP 3.0 support
Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies are chosen, and systems management features are added by our partners to firmware to tie in with iDRAC and Lifecycle Controller. These adapters are rigorously validated for worry- free, fully supported use in our servers.
OCP 3.0 support

Table 10. OCP 3.0 feature list Feature Form factor PCIe Gen Max PCIe width Max no.of ports Port type Max port speed NC-SI SNAPI WoL Power consumption

OCP 3.0 SFF Gen4 x8 4 BT/SFP+/SFP28 25 GbE Yes Yes Yes 35 W

Supported OCP cards

Table 11. R7625 OCP 3.0 support list 2

Form Factor

DPN

Vendor

of ports

OCP 3.0 9M6PR Broadcom

2

OCP 3.0 V23H0 Broadcom

4

OCP 3.0 VMFKR

Intel

2

OCP 3.0 50RV4

Intel

4

OCP 3.0

YJYK1

Intel

2

OCP 3.0 VF81P

Intel

4

Max Port Port type speed

100GbE QSFP56

25GbE

SFP28

10GbE

BT

10GbE

BT

10GbE

SFP+

10GbE

SFP+

SNAPI
No No No No No No

WOL
Yes Yes Yes Yes Yes Yes

Max PCIe PCIe Gen width

X16

Gen4

X16

Gen4

X8

Gen3

X8

Gen3

X8

Gen3

X8

Gen3

22

Networking

Table 11. R7625 OCP 3.0 support list 2 (continued)

Form Factor
OCP 3.0

DPN

Vendor

G9XC9 Broadcom

of ports

4

Max Port speed
1GbE

Port type BT

OCP 3.0 T6HR8 Broadcom

2

10GbE

BT

OCP 3.0 6JKXY Broadcom

2

10GbE

SFP+

OCP 3.0 NHN45 Broadcom

2

25GbE

SFP28

OCP 3.0 JTK7F Broadcom

4

25GbE

SFP28

OCP 3.0 42T22

QLogic

2

10GbE

BT

OCP 3.0 RHVFN QLogic

2

10GbE

SFP+

OCP 3.0 NP0K8

QLogic

2

25GbE

SFP28

OCP 3.0 GJJG2

QLogic

4

10GbE

BT

OCP 3.0 47W4V

QLogic

4

10GbE

SFP+

OCP 3.0 4TRD3 Mellanox

2

25GbE

SFP28

OCP 3.0 TTKWY SolarFlare

2

25GbE

SFP28

OCP 3.0 8HRW3 SolarFlare

2

25GbE

SFP28

OCP 3.0 WW2NX

Intel

4

1GbE

BT

SNAPI
No No No No Yes No No No No No Yes No No No

WOL
Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

Max PCIe PCIe Gen width

X4

Gen2

X8

Gen3

X8

Gen3

X8

Gen3

X8

Gen3

X8

Gen3

X8

Gen3

X8

Gen3

X8

Gen3

X8

Gen3

X16

Gen3

X16

Gen3

X16

Gen3

X4

Gen2

OCP NIC 3.0 vs. rack Network Daughter Card comparisons

Table 12. OCP 3.0, 2.0, and rNDC NIC comparison

Form Factor

Dell rNDC

OCP 2.0 (LOM Mezz) OCP 3.0

PCIe Gen

Gen 3

Gen 4

Max PCIe Lanes

x8

Up to x16

Up to x8

Shared LOM

Yes

Aux Power

Yes

Notes
Supported OCP3 are SFF (small form factor)
See server slot priority matrix
This is iDRAC port redirect
Used for Shared LOM

Networking

23

Topics:
· PCIe risers
PCIe risers

8
PCIe subsystem

Figure 12. Expansion card riser slot connectors
1. Riser 2 2. Riser 1 3. Riser 4 4. Riser 3

24

PCIe subsystem

Figure 13. Riser 1B 1. Slot 1 2. Slot 2
Figure 14. Riser 1P HL 1. Slot 2

PCIe subsystem

25

Figure 15. Riser 1P FL 1. Slot 2
Figure 16. Riser 1Q 1. Slot 2

26

PCIe subsystem

Figure 17. Riser 1S FL 1. Slot 2
Figure 18. Riser 1S HL 1. Slot 2

PCIe subsystem

27

Figure 19. Riser 2A 1. Slot 6 2. Slot 3
Figure 20. Riser 3A FL 1. Slot 5

28

PCIe subsystem

Figure 21. Riser 3A HL 1. Slot 5
Figure 22. Riser 3B 1. Slot 4 2. Slot 5

PCIe subsystem

29

Figure 23. Riser 4B 1. Slot 8 2. Slot 7
Figure 24. Riser 4Q 1. Slot 7 2. Slot 8

30

PCIe subsystem

Figure 25. Riser 4P FL 1. Slot 7

Figure 26. Riser 4P HL 1. Slot 7

Table 13. PCIe Riser Configs

Confi RSR

of PERC type

g # Configuration CPU supported

s

0

2

Front PERC

1

R1B + R4B

2

Front PERC

2

R1B + R2A + 2

Front PERC /

R3B + R4B

Adaptor PERC

3

R1Q + R2A + 2

Front PERC /

R3B + R4Q

Adaptor PERC

4

R1P + R2A + 2

Front PERC /

R3B + R4P

Adaptor PERC

5

R1S + R2A + 2

Front PERC

R3A +R4P

Rear Storage Possible No No No
No
No
No

x8 CPU 1
0 2 2 2 0 0

x16 CPU 1 x8 CPU 2 x16 CPU 2

0

2

0

1

4

1

4

1

2

3

0

3

PCIe subsystem

31

Table 13. PCIe Riser Configs (continued)

Confi RSR

of

g # Configuration CPU

s

6

R2A + R4Q

2

PERC type supported
Front PERC / Adaptor PERC

Rear Storage Possible
Yes

7

R1Q + R2A + 2

Front PERC / Yes

R4Q

Adaptor PERC

8

U.2 R1 Paddle 2

No

card + R2A +

R3B + R4D

Paddle card

9

R1B + R2A

1

Adaptor PERC No

10

R2A + R3B

2

Front PERC / Yes

Adaptor PERC

11

R1-E3 Paddle 2

No

Yes

card + R2A +

R3B + 2U R4-

E3 Paddle card

12

R1-E3X4

2

No

Yes

Paddle

card+R2A+R3B

+R4-E3 Paddle

card

13

R1-E3 Paddle 2

No

Yes

card+R2A+R3B

+R4-SCMX4

Paddle card

x8 CPU 1 0 2 0
2 0 0
0
0

x16 CPU 1 x8 CPU 2 x16 CPU 2

1

2

1

2

1

2

1

0

1

2

1

2

32

PCIe subsystem

9

Power, thermal, and acoustics

PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate temperature thereby reducing server noise and power consumption. The table below lists the tools and technologies Dell offers to lower power consumption and increase energy efficiency.
Topics:
· Power · Thermal · Acoustics
Power

Table 14. Power tools and technologies

Feature

Description

Power Supply Units(PSU) portfolio

Dell’s PSU portfolio includes intelligent features such as dynamically optimizing efficiency while maintaining availability and redundancy. Find additional information in the Power supply units section.

Tools for right sizing

Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the most efficient configuration possible. With Dell’s EIPT, you can calculate the power consumption of your hardware, power infrastructure, and storage at a given workload. Learn more at www.dell.com/calc.

Industry Compliance

Dell’s servers are compliant with all relevant industry certifications and guide lines, including 80 PLUS, Climate Savers and ENERGY STAR.

Power monitoring accuracy PSU power monitoring improvements include:

Dell’s power monitoring accuracy is currently 1%, whereas the industry standard is 5% More accurate reporting of power Better performance under a power cap

Power capping

Use Dell’s systems management to set the power cap limit for your systems to limit the output of a PSU and reduce system power consumption. Dell is the first hardware vendor to leverage Intel Node Manager for circuit-breaker fast capping.

Systems Management

iDRAC Enterprise and Datacenter provides server-level management that monitors, reports and controls power consumption at the processor, memory and system level.

Dell OpenManage Power Center delivers group power management at the rack, row, and data center level for servers, power distribution units, and uninterruptible power supplies.

Active power management

Intel Node Manager is an embedded technology that provides individual server- level power reporting and power limiting functionality. Dell offers a complete power management solution comprised of Intel Node Manager accessed through Dell iDRAC9 Datacenter and OpenManage Power Center that allows policy-based management of power and thermal at the individual server, rack, and data center level. Hot spare reduces power consumption of redundant power supplies. Thermal control off a speed optimizes the thermal settings for your environment to reduce fan consumption and lower system power consumption.
Idle power enables Dell servers to run as efficiently when idle as when at full workload.

Fresh Air cooling

Refer to ASHRAE A3/A4 Thermal Restriction.

Power, thermal, and acoustics

33

Table 14. Power tools and technologies (continued)

Feature Rack infrastructure

Description
Dell offers some of the industry’s highest-efficiency power infrastructure solutions, including: Power distribution units (PDUs) Uninterruptible power supplies (UPSs) Energy Smart containment rack enclosures Find additional information at: https://www.delltechnologies.com/en-us/servers/power- andcooling.htm.

Power Supply Units

Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining availability and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high efficiency power conversion and advanced thermal-management techniques, and embedded power-management features, including highaccuracy power monitoring. The table below shows the power supply unit options that are available for the R7625.

Table 15. Power supply Unit Options

Wattage

Frequency

800 W Mixed Mode

50/60Hz

Voltage
100~240 V AC 9.2-4.7 A

Class Platinum

Heat dissipation
3000 BTU/hr

N/A

240 V DC

N/A

3000 BTU/hr

3.8 A

1100 W Mixed Mode

50/60Hz

100~240 Vac 12-6.3 A

Titanium

4125 BTU/hr

N/A

240 V DC

N/A

4125 BTU/hr

5.2 A

1400 W Mixed 50/60Hz Mode

100~240 Vac 12-8 A

Platinum

5250 BTU/hr

N/A

240 V DC

N/A

5250 BTU/hr

6.6 A

1800 W Mixed 50/60Hz Mode

200~240 Vac 10 A

Titanium

6610 BTU/hr

N/A

240 V DC

N/A

6610 BTU/hr

8.2 A

2400 W Mixed 50/60Hz Mode

100~240 V AC 16-13.5 A

Platinum

9000 BTU/hr

N/A

240 V DC

N/A

9000 BTU/hr

11.2 A

34

Power, thermal, and acoustics

Table 15. Power supply Unit Options (continued)

Wattage

Frequency

Voltage

2800 W Mixed 50/60Hz Mode
N/A

1100 W DC

N/A

200~240 Vac 15.6 A
240 V DC 13.6 A
240 V DC 27 A

Class Titanium N/A N/A

Heat dissipation 10500 BTU/hr
10500 BTU/hr
4265 BTU/hr

NOTE: If a system with AC 2400W PSUs operates at low line 100-120 V AC, then the power rating per PSU is derated to 1400W.
NOTE: If a system with AC 1400W/1100W PSUs operates at low line 100-120 V AC, then the power rating per PSU is derated to 1050W.

Figure 27. PSU power cords

Table 16. PSU power cords Form factor Redundant 60 mm
Redundant 86 mm

Output 800 W AC 1100 W AC 1100 W -48 LVDC 1400 W AC 1800 W AC 2400 W AC 2800 W AC

Power cord C13 C13 C13 C13 C15 C19 C21

NOTE: C19 power cord combined with C20 to C21 jumper power cord can be used to adapt 2800 W PSU. NOTE: C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate temperature thereby reducing server noise and power consumption.

Power, thermal, and acoustics

35

Thermal design
Thermal management of the platform helps deliver high performance with the right amount of cooling to components, while maintaining the lowest fan speeds possible. This is done across a wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature ranges.

Figure 28. Thermal design characteristics
The thermal design of the PowerEdge R7625 reflects the following: Optimized thermal design: The system layout is architected for optimum thermal design. System component placement and layout are designed to provide maximum airflow coverage to critical components with
minimum expense of fan power. Comprehensive thermal management: The thermal control system regulates the fan speed based on several different
responses from all system-component temperature sensors, as well as inventory for system configurations. Temperature monitoring includes components such as processors, DIMMs, chipset, the inlet air ambient, hard disk drives, and OCP. Open and closed loop thermal fan speed control: Open loop thermal control uses system configuration to determine fan speed based on inlet air ambient temperature. Closed loop thermal control method uses feedback temperatures to dynamically determine proper fan speeds. User-configurable settings: With the understanding and realization that every customer has unique set of circumstances or expectations from the system, in this generation of servers, we have introduced limited user- configurable settings residing in the iDRAC “BIOS setup” screen. For more information, see the Dell PowerEdge R7625 Installation and Service Manual at www.dell.com/poweredgemanuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on Dell.com. Cooling redundancy: The R7625 allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system. Cooling redundancy: The R7625 with >4 fans allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system. Environmental Specifications: The optimized thermal management makes the R7625 reliable under a wide range of operating environments.
Acoustics
Acoustical configurations of R7625
Dell PowerEdge R7625 is a rack-mount server for which acoustical output ranges from that appropriate for an office to that of data centers. Acoustical performance is provided in terms of five configuration: Minimum, Typical-1, Typical-2, GPU and Feature Rich. Although the R7625 is designed for use in data centers, some users may prefer to use it in a quieter setting.

36

Power, thermal, and acoustics

Table 17. Configurations tested for acoustical experience

Configuration CPU Type

Minimum AMD

Typical-1, 2.5inch
AMD

Typical-2, 3.5inch
AMD

GPU configuration
AMD

Feature Rich AMD

CPU TDP / Cores 200 W / 24C

200 W / 24C

260 W / 32C

320 W / 32C

CPU Quantity

2

RDIMM Memory 16 GB, RDIMM

16 GB, RDIMM

32 GB, RDIMM

Memory Quantity 6

12

24

Backplane Type

12 x 3.5-inch BP 8 x 2.5-inch BP

12 x 3.5-inch BP + 24 x 2.5-inch exp 24 x 2.5-inch exp BP

4 x E3 rear BP

BP

HDD Type

3.5-inch SATA

2.5-inch SSD

3.5-inch HDD + E3 2.5-inch SSD

2.5-inch SSD

HDD Quantity

1

8

12 x 3.5-inch + 4 x 16

24

E3

PSU Type

800 W

1400 W

2400 W

PSU Quantity

2

OCP

Dual Port 10 GbE Dual Port 25 GbE Dual Port 25 GbE Dual Port 25 GbE Dual Port 25 GbE

PCI 1

X

25 Gb PCI

10 Gb PCI

GPU: Double-Wide 100 Gb PCI

PCI 2

X

25 Gb PCI

10 Gb PCI

100 Gb PCI

PCI 3

X

100 Gb PCI

X

PCI 4

X

GPU: Double-Wide X

Table 18. Acoustical experience of R7625 configurations

Configuration

Minimum

Typical-1, 2.5-inch Typical-2, 3.5-inch

Acoustical Performance: Idle/ Operating @ 25°C Ambient

L wA,m (B) Idle(4)

5.0

4.6

6.8

Operating(5)(6)

5.4

5.1

6.8

K v (B)

Idle (4)

0.4

Operating(5)(6)

0.4

L pA,m (dB) Idle(4)

35

32

51

Operating(5)(6)

39

33

51

Prominent tones(3)

Prominence ratio < 15 dB

Acoustical Performance: Idle @ 28°C Ambient

L wA,m(1) (B)

5.2

4.6

6.9

K v (B)

0.4

L pA,m(2) (dB)

37

32

51

Acoustical Performance: Max. loading @ 35°C Ambient

L wA,m(1) (B) K v (B) L pA,m(2)(dB)

7.2

6.7

7.9

0.4

57

52

61

GPU

Feature Rich

configuratio

n

6.7

7.3

6.7

7.3

0.4

52

57

52

57

6.9

7.4

0.4

55

58

8.3

8.8

0.4

69

73

Power, thermal, and acoustics

37

(1)LwA,m: The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 with data collected using the methods described in ISO 7779 (2010). Engineering data presented here may not be fully compliant with ISO 7779 declaration requirements.
(2)LpA,m: The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296 and measured using methods described in ISO 7779. The system is placed in a 24U rack enclosure, 25cm above a reflective floor. Engineering data presented here may not be fully compliant with ISO 7779 declaration requirements.
(3)Prominent discrete tones: Criteria of Annex D of ECMA-74 & Prominence Ratio method of ECMA-418 are followed to determine if discrete tones are prominent and to report them, if so.
(4)Idle mode: Idle mode is the steady-state condition in which the server is energized but not operating any intended function.
(5)Operating mode: Operating mode is represented by the maximum of the steady state acoustical output at 50% of CPU TDP or active storage drives for the respective sections of Annex C of ECMA-74.

PowerEdge acoustical specifications

Dell typically categorizes servers in categories of acoustically acceptable usage:
Category 1: Table-top in Office Environment Category 2: Floor-standing in Office Environment Category 3: General Use Space Category 4: Attended Data Center Category 5: Unattended Data Center Category 6: Data Center Modular/Modular Enclosure

Category 1: Table-top in Office Environment

When Dell determines that a specific ISG product is to be used on a Table-top in Office Environment, e.g., on a desk around a seated user’s head height, then the acoustical specification in the table below applies. Small, light- weight towers are examples of these types of products.

Table 19. Dell Enterprise Category 1, “Table-top in Office Environment” acoustical specification category

Measurement Metric, re

Position re

AC0159

AC0158

Test Modes, re AC0159 (note must be in steady Simulate (that is, set fan

state, see AC0159, except where noted below) speeds representative) for Idle

at 28° C & 35° C Ambient,

Standby in

Idle in 23±2° C Operating in and for 100% loading and

23±2° C

Ambient

23±2° C

maximum configuration, at 35°

Ambient

Ambient if C Ambient

not otherwise

specified in

the program’s

configuration

document,

then processor

and hard drive

operating

modes are

required

Sound Power LWA,m, B

4.2

4.7

5.0

Report

Sound Quality (both positions must meet limits): Front Binaural HEAD and Rear Microphone

Tones, Hz, dB

No prominent tones per criteria D.10.6 and D.10.8 of ECMA-74

Tonality, tu

0.35

Dell Modulation, 35 %

35

Loudness, sones Report

Report

Report tones Report Report Report

LpA-single point, dBA

Report

38

Power, thermal, and acoustics

Table 19. Dell Enterprise Category 1, “Table-top in Office Environment” acoustical specification category (continued)

Measurement Metric, re

Position re

AC0159

AC0158

Test Modes, re AC0159 (note must be in steady Simulate (that is, set fan

state, see AC0159, except where noted below) speeds representative) for Idle

at 28° C & 35° C Ambient,

Standby in

Idle in 23±2° C Operating in and for 100% loading and

23±2° C

Ambient

23±2° C

maximum configuration, at 35°

Ambient

Ambient if C Ambient

not otherwise

specified in

the program’s

configuration

document,

then processor

and hard drive

operating

modes are

required

Front Binaural HEAD

Transients

Oscillation (see AC0159), if observed, during 20- N/A minute steady-state observation, must adhere to the following two criteria:
Max. {LpA} < 3.0 dB Event count < 3 for “1.5 dB < LpA < 3.0 dB” Acoustical Jump (see AC0159), during air
mover speed transition from Idle to Operating Mode must be 15dB.
Startup behavior Report Startup behavior re. AC0159 Startup must proceed smoothly, i.e., no sudden or large jumps
Transient inputs: Report time-history sound pressure levels re AC0159 “Train of Step Functions on Processor”

Any

Other

No rattles, squeaks, or unexpected noises.

Sound should be “even” around the EUT (one side should not be dramatically louder than another).

Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS and iDRAC.

Specific operating conditions are defined in “Configurations and Configuration Dependencies” for each platform.

Sound Pressure

LpA-reported, dBA, re AC0158 and program configuration document

Report for all mics

Category 2: Floor-standing in Office Environment
When Dell determines that a specific ISG product is to be used primarily when it is sitting on the floor, i.e., next to a user’s feet, then the acoustical specification in the table below applies. Noise from the product should not annoy or otherwise interfere with the user’s thoughts or speech, e.g., on the telephone.

Power, thermal, and acoustics

39

Table 20. Dell Enterprise Category 2, “Floor-standing in Office Environment” acoustical specification category

Measurement Metric, re

Position re

AC0159

AC0158

Test Modes, re AC0159 (note must be in steady state, see AC0159, except where noted below)

Standby in 23±2° C Ambient

Idle in 23±2° C Ambient

Operating in 23±2° C Ambient if not otherwise specified in the program’s configuration document, then processor and hard drive operating modes are required

Simulate (that is, set fan speeds representative) for Idle at 28° C & 35° C Ambient, and for 100% loading and maximum configuration, at 35° C Ambient

Sound Power LWA,m, B

4.9

5.1

5.4

Report

Sound Quality (both positions must meet limits): Front Binaural HEAD and Rear Microphone

Tones, Hz, dB

No prominent tones per criteria D.10.6 and D.10.8 of ECMA-74

Tonality, tu

0.35

Dell Modulation, 35 %

35

Loudness, sones Report

Report

Report tones Report Report Report

LpA-single point, dBA

Report

Front Binaural HEAD

Transients

Oscillation (see AC0159), if observed, during 20- N/A minute steady-state observation, must adhere to the following two criteria:
Max. {LpA} < 3.0 dB Event count < 3 for “1.5 dB < LpA < 3.0 dB” Acoustical Jump (see AC0159), during air mover speed transition from Idle to Operating Mode must be 15 dB.
Startup behavior Report Startup behavior re. AC0159 Startup must proceed smoothly, that is, no sudden or large jumps
Transient inputs: Report time-history sound pressure levels re AC0159 “Train of Step Functions on Processor”

Any

Other

No rattles, squeaks, or unexpected noises.

Sound should be “even” around the EUT (one side should not be dramatically louder than another).

Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS and iDRAC.

Specific operating conditions are defined in “Configurations and Configuration Dependencies” for each platform.

Sound Pressure

LpA-reported, dBA, re AC0158 and program configuration document

Report for all mics

40

Power, thermal, and acoustics

Category 3: General Use Space

When Dell determines that a specific ISG product is to be predominantly used in a general use space, then the acoustical specification in the table below applies. These products could be found in laboratories, schools, restaurants, open office space layouts, small ventilated closets, etc., though not in close proximity to any particular person nor in quantities greater than a few in any location. People within proximity of a few of these products should not experience any impact to speech intelligibility or annoyance from the noise of the product. A rack product sitting on a table in a common area is an example.

Table 21. Dell Enterprise Category 3, “General Use Space” acoustical specification category

Measurement Metric, re

Position re

AC0159

AC0158

Test Modes, re AC0159 (note must be in steady Simulate (i.e., set fan speeds

state, see AC0159, except where noted below) representative) for Idle at 28

& 35° C Ambient, and for

Standby in

Idle in 23±2° C Operating in 100% loading and maximum

23±2° C

Ambient

23±2° C

configuration, at 35° C

Ambient

Ambient if Ambient

not otherwise

specified in

the program’s

configuration

document,

then processor

and hard drive

operating

modes are

required

Sound Power LWA,m, B

5.2

5.5

5.8

Report

Sound Quality (both positions must meet limits): Front Binaural HEAD and Rear Microphone

Tones, Hz, dB

No prominent tones per criteria D.10.6 and D.10.8 of ECMA-74

Tonality, tu

0.35

Dell Modulation, 40 %

40

Loudness, sones Report

Report

Report tones Report Report Report

LpA-single point, dBA

Report

Front Binaural HEAD

Transients

Oscillation (see AC0159), if observed, during 20- N/A minute steady-state observation, must adhere to the following two criteria:
Max. {LpA} < 3.0 dB Event count < 3 for “1.5 dB < LpA < 3.0 dB” Acoustical Jump (see AC0159), during air
mover speed transition from Idle to Operating Mode must be 15dB.
Startup behavior Report Startup behavior re. AC0159 Startup must proceed smoothly, i.e., no sudden or large jumps.
Transient inputs: Report time-history sound pressure levels re AC0159 “Train of Step Functions on Processor”

Any

Other

No rattles, squeaks, or unexpected noises.

Sound should be “even” around the EUT (one side should not be dramatically louder than another).

Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS and iDRAC.

Specific operating conditions are defined in “Configurations and Configuration Dependencies” for each platform.

Sound Pressure LpA-reported, Report for all dBA, re AC0158 mics and program

Report for all mics

Power, thermal, and acoustics

41

Table 21. Dell Enterprise Category 3, “General Use Space” acoustical specification category (continued)

Measurement Metric, re

Position re

AC0159

AC0158

configuration document

Test Modes, re AC0159 (note must be in steady Simulate (i.e., set fan speeds

state, see AC0159, except where noted below) representative) for Idle at 28

& 35° C Ambient, and for

Standby in

Idle in 23±2° C Operating in 100% loading and maximum

23±2° C

Ambient

23±2° C

configuration, at 35° C

Ambient

Ambient if Ambient

not otherwise

specified in

the program’s

configuration

document,

then processor

and hard drive

operating

modes are

required

Category 4: Attended Data Center

When Dell determines that a specific ISG product is to be predominantly used in an attended data center, then the acoustical specification in the table below applies. The phrase “attended data center” is used to mean a space in which many (from tens to 1000s) of ISG products are deployed in proximity (i.e., in the same room) to personnel whose speech (perhaps with raised voices) is expected to be intelligible over the data center noise. Hearing protection or hearing monitoring programs are not expected in these areas. Examples in this category include monolithic rack products.

Table 22. Dell Enterprise Category 4, “Attended Data Center” acoustical specification category

Measurement Metric, re

Position re

AC0159

AC0158

Test Modes, re AC0159 (note must be in steady state, see AC0159, except where noted below)

Standby in 23±2° C Ambient

Idle in 23±2° C Ambient

Operating in 23±2° C Ambient if not otherwise specified in the program’s configuration document, then processor and hard drive operating modes are required

Simulate (that is, set fan speeds representative ) for Idle at 28° C & 35° C Ambient

Simulate (that is, set fan speeds representative ) for 100% loading and maximum configuration, at 35° C Ambient

Sound Power LWA,m, B

Report

6.9

7.1

Report

Front Binaural HEAD

Tones, Hz, dB Tonality, tu

Report Report

< 15 dB Report

Report Report

Dell Modulation, Report %

Report

Loudness, sones Report

Report

LpA-single point, dBA

Report

Transients

Oscillation (see AC0159), if observed, during 20- N/A minute steady-state observation, must adhere to the following two criteria:
Max. {LpA} < 3.0 dB Event count < 3 for “1.5 dB < LpA < 3.0 dB” Acoustical Jump (see AC0159), during air
mover speed transition from Idle to Operating Mode must be 15 dB.

42

Power, thermal, and acoustics

Table 22. Dell Enterprise Category 4, “Attended Data Center” acoustical specification category (continued)

Measurement Metric, re

Position re

AC0159

AC0158

Test Modes, re AC0159 (note must be in steady state, see AC0159, except where noted below)

Standby in 23±2° C Ambient

Idle in 23±2° C Ambient

Operating in 23±2° C Ambient if not otherwise specified in the program’s configuration document, then processor and hard drive operating modes are required

Simulate (that is, set fan speeds representative ) for Idle at 28° C & 35° C Ambient

Simulate (that is, set fan speeds representative ) for 100% loading and maximum configuration, at 35° C Ambient

Startup behavior Report Startup behavior re. AC0159
Startup must proceed smoothly, that is, no sudden or large jumps
Transient inputs: Report time-history sound pressure levels re AC0159 “Train of Step Functions on Processor”

Any

Other

No rattles, squeaks, or unexpected noises.

Sound should be “even” around the EUT (one side should not be dramatically louder than another).

Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS and iDRAC.

Specific operating conditions are defined in “Configurations and Configuration Dependencies” for each platform.

Sound Pressure LpA-reported, dBA

Report for all mics

Category 5: Unattended Data Center
When Dell determines that a specific ISG product is to be predominantly used in an unattended data center (and not blades or blade enclosures; these have their own category), then the acoustical specification in the table below applies. The phrase “unattended data center” is used to mean a space in which many (from tens to 1000s) of ISG products are deployed together, its own heating and cooling systems condition the space, and operators or servicers of equipment enter generally only to deploy, service, or decommission equipment. Hearing protection or hearing monitoring programs may be expected (per government or company guidelines) in these areas. Examples in this category include monolithic rack products.

Power, thermal, and acoustics

43

Table 23. Dell Enterprise Category 5, “Unattended Data Center” acoustical specification category

Measuremen Metric, re t Position re AC0159 AC0158
Sound Power LWA,m, B

Test Modes, re AC0159 (note must be in steady state, see AC0159, except where noted below)

Standby in 23±2° C Ambient

Idle in 23±2° C Ambient

Operating in 23±2° C Ambient if not otherwise specified in the program’s configuratio n document, then processor and hard drive operating modes are required

Simulate (that is, set air mover speeds representative) for Idle at 28° C & 35° C Ambient

Report

7.5

7.7

Report

Simulate (that is, set air mover speeds representative ) for 100% loading and maximum configuration, at 35° C Ambient
Report

Front Binaural Tones, Hz, dB Report

HEAD

Tonality, tu Report

< 15 dB Report

Report Report

Dell Modulation, %

Report

Loudness, sones

Report

LpA-single point, dBA

Report

Front Binaural Transients HEAD

Oscillation (see AC0159), if

N/A

observed, during 20-minute steady-state

observation, must adhere to the following

two criteria:

Max. {LpA} < 3.0 dB

Event count < 3 for “1.5 dB < LpA < 3.0 dB”

Report Acoustical Jump (see AC0159) during air mover speed transition from Idle to Operating Mode.

Startup behavior

Report Startup behavior re. AC0159

Startup must proceed smoothly, that is, no sudden or large jumps, and air

mover speed during startup must not

exceed 50% of its maximum

Transient inputs: Report time-history sound pressure levels re AC0159 “Train of

Step Functions on Processor”

Any

Other

No rattles, squeaks, or unexpected noises.

Sound should be “even” around the EUT (one side should not be dramatically louder than another).

Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS and iDRAC.

Specific operating conditions are defined in “Configurations and Configuration Dependencies” for each platform.

Sound Pressure

LpA-reported, Report for all Report for all Report for all Report for all mics

dBA, re

mics

AC0158 and

Report for all mics

44

Power, thermal, and acoustics

Table 23. Dell Enterprise Category 5, “Unattended Data Center” acoustical specification category (continued)

Measuremen Metric, re t Position re AC0159 AC0158

Test Modes, re AC0159 (note must be in steady state, see AC0159, except where noted below)

Standby in 23±2° C Ambient

Idle in 23±2° C Ambient

Operating in 23±2° C Ambient if not otherwise specified in the program’s configuratio n document, then processor and hard drive operating modes are required

Simulate (that is, set air mover speeds representative) for Idle at 28° C & 35° C Ambient

Simulate (that is, set air mover speeds representative ) for 100% loading and maximum configuration, at 35° C Ambient

program configuration document

Category 6: Data Center Modular/Modular Enclosure

When the product is a blade for or a blade enclosure itself, then the hosting blade enclosure must adhere to the acoustical specification in below table. One underlying assumption is that blade enclosures are deployed in unattended data centers (see description in Category 5). If the parties responsible for selection of product acoustical specification category determine that a specific blade or blade enclosure will be deployed in a more stringent acoustical environment, then specific configurations, capabilities, and/or user ships must be requested in formal documentation so that features to support the more restrictive performance may be designed as appropriate.

Table 24. Dell Enterprise Category 6, “”Data Center Modular/Modular Enclosure” acoustical specification category

Measuremen Metric, re t Position re AC0159 AC0158

Test Modes, re AC0159 (note must be in steady state, see AC0159, except where noted below)

Standby in 23±2° C Ambient

Idle in 23±2° C Ambient

Operating in 23±2° C Ambient if not otherwise specified in the program’s configuratio n document, then processor and hard drive operating modes are required

Simulate (that is, set air mover speeds representative) for Idle at 28° C & 35° C Ambient

Simulate (that is, set air mover speeds representative ) for 100% loading and maximum configuration, at 35° C Ambient

Sound Power LWA,m, B

Report

8.2

Report

Front Binaural Tones, Hz, dB Report

HEAD

Tonality, tu Report

< 15 dB Report

Report Report

Dell Modulation, %

Report

Power, thermal, and acoustics

45

Table 24. Dell Enterprise Category 6, “”Data Center Modular/Modular Enclosure” acoustical specification category (continued)

Measuremen Metric, re t Position re AC0159 AC0158

Test Modes, re AC0159 (note must be in steady state, see AC0159, except where noted below)

Standby in 23±2° C Ambient

Idle in 23±2° C Ambient

Operating in 23±2° C Ambient if not otherwise specified in the program’s configuratio n document, then processor and hard drive operating modes are required

Simulate (that is, set air mover speeds representative) for Idle at 28° C & 35° C Ambient

Simulate (that is, set air mover speeds representative ) for 100% loading and maximum configuration, at 35° C Ambient

Loudness, sones

Report

LpA-single point, dBA

Report

Front Binaural Transients HEAD

Oscillation (see AC0159), if

N/A

observed, during 20-minute steady-state

observation, must adhere to the following

two criteria:

Max. {LpA} < 3.0 dB

Event count < 3 for “1.5 dB < LpA < 3.0 dB”

Report Acoustical Jump (see AC0159) during air mover speed transition from Idle to Operating Mode.

Startup behavior

Report Startup behavior re. AC0159

Startup must proceed smoothly, that is, no sudden or large jumps.

Transient inputs: Report time-history sound pressure levels re AC0159 “Train of Step Functions on Processor”

Any

Other

No rattles, squeaks, or unexpected noises.

Sound should be “even” around the EUT (one side should not be dramatically louder than another).

Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS and iDRAC.

Specific operating conditions are defined in “Configurations and Configuration Dependencies” for each platform.

Sound Pressure

LpA-reported, Report for all

dBA, re

mics

AC0158 and

program

configuration

document

Report for all mics

46

Power, thermal, and acoustics

10
Rack, rails, and cable management
Topics:
· Rails and cable management information
Rails and cable management information
The rail offerings for the PowerEdge R7625 consist of two general types: sliding and static. The cable management offerings consist of an optional cable management arm (CMA) and an optional strain relief bar (SRB). See the Dell Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at https://i.dell.com/sites/csdocuments/ Business_solutions_engineering- Docs_Documents/en/rail-rack-matrix.pdf for information regarding: Specific details about rail types. Rail adjustability ranges for various rack mounting flange types Rail depth with and without cable management accessories Rack types that are supported for various rack mounting flange types Key factors governing proper rail selection include the following: Spacing between the front and rear mounting flanges of the rack Type and location of any equipment that is mounted in the back of the rack such as power distribution units (PDUs) Overall depth of the rack
Sliding rails features summary
The sliding rails allow the system to be fully extended out of the rack for service. There are two types of sliding rails available, ReadyRails II sliding rails and Stab-in/Drop-in sliding rails. The sliding rails are available with or without the optional cable management arm (CMA) or strain relief bar (SRB).
B6 ReadyRails sliding rails for 4-post racks Supports drop-in installation of the chassis to the rails. Support for tool-less installation in 19″ EIA-310-E compliant square or un-threaded round hole 4-post racks including all
generations of the Dell racks. Support for tooled installation in 19″ EIA-310-E compliant threaded hole 4-post racks. Support full extension of the system out of the rack to allow serviceability of key internal components. Support for optional strain relief bar (SRB). Support for optional cable management arm (CMA).
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the sliding rails. This reduces the overall length of the rails and eliminates the potential interferences with rear mounted PDUs or the rear rack door.

Rack, rails, and cable management

47

Figure 29. Sliding rails with optional CMA

Figure 30. Sliding rails with optional SRB
B13 Stab-in/Drop-in sliding rails for 4-post racks
Supports drop-in or stab-in installation of the chassis to the rails. Support for tool-less installation in 19″ EIA-310-E compliant square, un-threaded round hole racks including all generations of
the Dell racks. Also supports tool-less installation in threaded round hole 4-post racks. Support for tool-less installation in Dell Titan or Titan-D racks Support full extension of the system out of the rack to allow serviceability of key internal components. Support for optional cable management arm (CMA). Support for optional strain relief bar (SRB).
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the sliding rails. This reduces the overall length of the rails and eliminates the potential interferences with rear mounted PDUs or the rear rack door.
Scan the QRL code for the documentation and trouble-shooting information regarding the installation procedures for Drop-in/ Stab-in rail types.

48

Rack, rails, and cable management

Figure 31. Quick resource locator for combo rails
B4 static rails summary
The static rails offer a greater adjustability range and a smaller overall mounting footprint than the sliding rails because of their reduced complexity and lack of need for CMA support. The static rails support a wider variety of racks than the sliding rails. However, they do not support serviceability in the rack and are thus not compatible with the CMA. The static rails are also not compatible with SRB.

Figure 32. Static rails
Static rails features summary Static rails for 4-post & 2-post racks: Supports stab-in installation of the chassis to the rails. Support tool-less installation in 19″ EIA-310-E compliant square or un-threaded round hole 4-post racks including all
generations of Dell racks. Support tooled installation in 19″ EIA-310-E compliant threaded hole 4-post and 2-post racks. Support for tooled installation in Dell Titan or Titan-D rack.
NOTE: Screws are not included with the static rail kit since racks are offered with various thread types. The screws are
provided for mounting static rails in racks with threaded mounting flanges. Screw head diameter should be 10 mm or less.
2-Post racks installation

Rack, rails, and cable management

49

If installing to 2-Post (Telco) racks, the ReadyRails static rails (B4) must be used. Sliding rails support mounting in 4-post racks only.

Figure 33. Static rails in 2-post center mount configuration
Installation in the Dell Titan or Titan-D racks
For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in Sliding rails (B13) must be used. This rail collapses down sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The Stab-in/Drop-in Sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For tooled installation, Stab-in Static rails (B4) must be used for bezel alignment with Storage systems.
Cable management arm (CMA)
The optional cable management arm (CMA) organizes and secures the cords and cables exiting the back of the systems. It unfolds to allow the systems to extend out of the rack without having to detach the cables. Some key features of the CMA include:
Large U-shaped baskets to support dense cable loads. Open vent pattern for optimal airflow. Ability to mount on either side by swinging the spring-loaded brackets from one side to the other. Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling. Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position. Both the CMA and the tray mount without the use of tools by simple and intuitive snap-in designs. The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easier access to it and the rear drives (if applicable) for service or replacement.

50

Rack, rails, and cable management

Figure 34. Sliding rails with CMA cabling
Strain Relief Bar (SRB)
The optional strain relief bar (SRB) for the PowerEdge R7625 organizes and supports cable connections at the rear end of the server to avoid damage from bending.

Figure 35. Cabled strain relief bar
Tool-less attachment to the rails Two depth positions to accommodate various cable loads and rack depths Supports cable loads and controls stresses on server connectors Cables can be separated into discrete purpose-specific bundles
Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the system down into the remaining J-slots while using the free hand to hold the rail against the side of the system.

Rack, rails, and cable management

51

Figure 36. Installing the system in Drop-in sliding rails
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted into the outer (cabinet) members installed in the rack. For a 2U systems, this is a two person lift.
Installing system into the rack (option A: Drop-In)
1. Pull the inner rails out of the rack until they lock into place.

Figure 37. Pull out inner rail 2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies. 3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

52

Rack, rails, and cable management

Figure 38. Rail standoffs seated in J-slots
4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in the rack.

Figure 39. Slide system into the rack
Installing the system into the rack (option B: Stab-In)
1. Pull the intermediate rails out of the rack until they lock into place. 2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

Rack, rails, and cable management

53

Figure 40. Pull out the intermediate rail

Table 25. Rail component label

Number

Component

1

Intermediate rail

2

Inner rail

3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system and sliding forward on the system until they lock into place.

Figure 41. Attach the inner rails to the system 4. With the intermediate rails extended, install the system into the extended rails.

54

Rack, rails, and cable management

Figure 42. Install system into the extended rails 5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.
Figure 43. Slide system into the rack

Rack, rails, and cable management

55

11
Supported Operating Systems
The PowerEdge system supports the following operating system: Canonical Ubuntu Server LTS Microsoft Windows Server with Hyper-V Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware vSAN/ESXi Links to specific OS versions and editions, certification matrices, Hardware Compatibility Lists (HCL) portal, and Hypervisor support are available at Dell Enterprise Operating Systems.

56

Supported Operating Systems

12
Dell OpenManage Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets. OpenManage solutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently; in physical, virtual, local, and remote environments; all without the need to install an agent in the operating system.
The OpenManage portfolio includes:
Innovative embedded management tools – integrated Dell Remote Access Controller (iDRAC) Consoles – OpenManage Enterprise Extensible with plug-ins – OpenManage Power Manager Update tools – Repository Manager
Dell has developed comprehensive systems management solutions that are based on open standards and has integrated with management consoles from partners such as Microsoft and VMware, allowing advanced management of Dell servers. Dell management capabilities extend to offerings from the industry’s top systems management vendors and frameworks such as Ansible, Splunk, and ServiceNow. OpenManage tools automate the full span of server life cycle management activities along with powerful RESTful APIs to script or integrate with your choice of frameworks.
For more information about the entire OpenManage portfolio, see:
The OpenManage Consoles and Integrations page at PowerEdge Central. The latest Dell Systems Management Overview Guide.
Topics:
· Integrated Dell Remote Access Controller (iDRAC) · Systems Management software support matrix
Integrated Dell Remote Access Controller (iDRAC)
iDRAC9 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC9 provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every PowerEdge server, there is no additional software to install; just plug in power and network cables, and iDRAC is ready to go. Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server management features at their fingertips.
With iDRAC9 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied throughout. This consistent management platform allows easy scaling of PowerEdge servers as an organization’s infrastructure grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale management of PowerEdge servers. By having iDRAC at the core, the entire OpenManage portfolio of Systems Management tools allows every customer to tailor an effective, affordable solution for any size environment.
Zero Touch Provisioning (ZTP) is embedded in iDRAC. ZTP – Zero Touch Provisioning is Intelligent Automation Dell’s agent-free management puts IT administrators in control. Once a PowerEdge server is connected to power and networking, that system can be monitored and fully managed, whether you’re standing in front of the server or remotely over a network. In fact, with no need for software agents, an IT administrator can: · Monitor · Manage · Update · Troubleshoot and remediate Dell servers With features like zero-touch deployment and provisioning, iDRAC Group Manager, and System Lockdown, iDRAC9 is purpose-built to make server administration quick and easy. For those customers whose existing management platform utilizes in-band management, Dell does provide iDRAC Service Module, a lightweight service that can interact with both iDRAC9 and the host operating system to support legacy management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are initially powered up and connected to your network. This process uses profile-based configurations that ensure each server is configured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC9 offers following license tiers:

Dell OpenManage Systems Management

57

Table 26. iDRAC9 license tiers

License iDRAC9 Basic
iDRAC9 Express
iDRAC9 Enterprise
iDRAC9 Datacenter

Description
Available only on 100-500 series rack/tower Basic instrumentation with iDRAC web UI For cost conscious customers that see limited value in management
Default on 600+ series rack/tower, modular, and XR series Includes all features of Basic Expanded remote management and server life-cycle features
Available as an upsell on all servers Includes all features of Basic and Express. Includes key features such as virtual console, AD/LDAP
support, and more Remote presence features with advanced, Enterprise-class, management capabilities
Available as an upsell on all servers Includes all features of Basic, Express, and Enterprise. Includes key features such as telemetry streaming,
Thermal Manage, automated certificate management, and more Extended remote insight into server details, focused on high end server options, granular power, and
thermal management

For a full list of iDRAC features by license tier, see Integrated Dell Remote Access Controller 9 User’s Guide at Dell.com.
For more details on iDRAC9 including white papers and videos, see:
iDRAC and embedded technologies at PowerEdge Central Support for Integrated Dell Remote Access Controller 9 (iDRAC9) on the Knowledge Base page at Dell.com

Systems Management software support matrix

Table 27. Systems Management software support matrix

Categories

Features ServiceNow

Ansible

Third-party Connectors

Security

Secure Enterprise Key Management

Secure Component Verification

Standard operating system

Red Hat Enterprise Linux, SUSE, Windows Server 2021 Ubuntu, CentOS

For more information, see:
OpenManage Consoles and Integrations at PowerEdge Central OpenManage Tools at PowerEdge Central

PE mainstream Supported Supported Supported Supported Supported Supported (Tier-1)

Dell OpenManage Systems Management

59

13
Appendix D: Service and support
Topics:
· Default support levels · Other services and support information
Default support levels
This system offers 3 years Dell ProSupport Next Business Day (NBD), including 24×7 phone support and NBD parts and labor support.
Default deployment levels
This system offers Dell Basic Deployment, including onsite hardware installation during business hours with packaging materials disposal. Optionally, the customer may choose to any of the factory or field deployment offers listed below.
Other services and support information
Dell Technologies Services include a wide, customizable range of service options to simplify the assessment, design, implementation, management and maintenance of IT environments and to help transition from platform to platform. Depending on the current business requirements and correct level of service for customers, we provide factory, onsite, remote, modular, and specialized services that fit the customer requirements and budget. We will help with a little or a lot, based on the customers choice, and provide access to our global resources.
Dell deployment services
Dell ProDeploy Infrastructure Suite
ProDeploy Infrastructure Suite provides a variety of deployment offerings that satisfy a customer’s unique needs. It is made up of 5 offers: ProDeploy Configuration Services, ProDeploy Rack Integration Services, Basic Deployment, ProDeploy, and ProDeploy Plus.

60

Appendix D: Service and support

Figure 44. ProDeploy Infrastructure Suite for servers
The new Factory Services consist of two tiers of deployment that happen prior to shipping to the customer’s site.
Factory Based Services:
ProDeploy Factory Configuration – Ideal for customers buying servers in volume and seeking pre-configuration prior to shipping such as: custom image, system settings, and asset tagging so it arrives ready to use out of the box. Furthermore, servers can be packaged and bundled to meet specific shipping and distribution requirements for each customer location to facilitate the rollout process. Upsell one of the field based services (below) if a customer needs assistance with the final server installation.
ProDeploy Rack Integration – Ideal for customers seeking to build out fully integrated racks prior to shipping. These rack builds include hardware install, cabling, and full system configuration. You can also add-on a factory stress test and optional on-site final rack configuration to complete the rack installation. STANDARD SKUs for Rack Integration is available in US only and requires: 20 or more devices (R and C series servers and all Dell or non-Dell switches). Use Informational SKUs for Dell switches or 3rd party products Shipping to contiguous US USE CUSTOM QUOTE for Rack Integration for: All countries except USA Racks containing less than 20 servers Any rack that includes VxRail or Storage Shipping outside contiguous US Shipping to multiple locations
Field Based Services:
Basic Deployment consists of the hardware installation, cabling and firmware update during normal standard business hours. Basic Deployment is traditionally sold to Competency Enabled Partners. Competency enabled partners often have Dell do the hardware installation while they complete the software configuration.
ProDeploy consists of your hardware installation and configuration of the software using offshore resources. ProDeploy is great for customers who are price sensitive or who are remote from their data centers and don’t require an onsite presence.
ProDeploy Plus will give you in-region or onsite resources to complete the engagement for the customer. It also comes with additional features such as Post Deployment Configuration Assistance and Training Credits.

Appendix D: Service and support

61

Figure 45. ProDeploy Infrastructure Suite – Factory services

Figure 46. ProDeploy Infrastructure Suite – Field services
Dell ProDeploy Plus for Infrastructure
From beginning to end, ProDeploy Plus provides the skill and scale that is must successfully perform demanding deployments in today’s complex IT environments. Certified Dell experts start with extensive environmental assessments and detailed migration

62

Appendix D: Service and support

planning and recommendations. Software installation includes set up of our enterprise connectivity solution (secure connect gateway) and OpenManage system management utilities. Postdeployment configuration assistance, testing, and product orientation services are also available.
Dell ProDeploy for Infrastructure
ProDeploy provides full-service installation and configuration of both server hardware and system software by certified deployment engineers including set up of leading operating systems and hypervisors as well our enterprise connectivity solution (secure connect gateway) and OpenManage system management utilities. To prepare for the deployment, we conduct a site readiness review and implementation planning exercise. System testing, validation, and full project documentation with knowledge transfer complete the process.
Dell Basic Deployment
Basic Deployment delivers worry-free professional installation by experienced technicians who know Dell servers inside and out.
Additional Deployment Services
You can tailor the ProDeploy Infrastructure Suite offer to meet your customer’s unique needs by leveraging “Additional Deployment Time.” ADT will cover additional tasks above the normal scope of the standard offers. ADT can be sold for Project Management or Technical Resources and is sold as blocks of four hours remote or eight hours on-site.
Dell ProDeploy for HPC (available in US/Canada only. All other regions use custom)
HPC deployments require specialists that understand that cutting edge is yesterday’s news. Dell deploys the world ‘s fastest systems and understands the nuances that make them perform. ProDeploy for HPC provides: Global team of dedicated HPC specialists Proven track record, thousands of successful HPC deployments Design validation, benchmarking, and product orientation Learn more at Dell.com/HPC-Services.

Appendix D: Service and support

63

Figure 47. ProDeploy Expansion for HPC
Dell custom deployment Services
Dell custom rack integration and other Dell configuration services help customers save time by providing systems that are racked, cabled, tested, and ready to be integrated into the data center. Dell support preconfigure RAID, BIOS and iDRAC settings, install system images, and even install third-party hardware and software. For more information, see Server Configuration Services.
Dell Residency Services
Residency Services help customers transition to new capabilities quickly with the assistance of onsite or remote Dell experts whose priorities and time they control. Residency experts can provide post implementation management and knowledge transfer that is related to a new technology acquisition or day-to- day operational management of the IT infrastructure.
Dell Data Migration Services
Protect business and data of the customer with our single point of contact to manage data migration projects. A customer project manager works with our experienced team of experts to create a plan using industry-leading tools and proven processes that are based on global best practices to migrate existing files and data, so business systems are up and running quickly and smoothly.

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Appendix D: Service and support

Dell Enterprise Support Services

Dell ProSupport Enterprise Suite

With the ProSupport Enterprise Suite, we help keep IT systems running smoothly, so customers can focus on running their business. We help maintain peak performance and availability of the most essential workloads. ProSupport Enterprise Suite is a suite of support services that enable customers to build the solution that is right for their organization. They choose support models that are based on how they use technology and where they want to allocate resources. From the desktop to the data center, address everyday IT challenges, such as unplanned downtime, mission-critical needs, data and asset protection, support planning, resource allocation, software application management and more. Optimize customer IT resources by choosing the right support model.

Table 28. ProSupport Enterprise Suite

Service

Support model

ProSupport Enterprise Suite

ProSupport Plus for Enterprise

ProSupport for Enterprise Basic hardware support

Description
Proactive, predictive, and reactive support for systems that look after your business-critical applications and workloads
Comprehensive 24 x 7 support
Reactive hardware support during normal business hours

Dell ProSupport Plus for Enterprise
When customers purchase PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support service for business-critical systems. ProSupport Plus provides all the benefits of ProSupport, plus the following:
An assigned Services Account Manager who knows their business and environment Immediate advanced troubleshooting from an engineer Personalized, preventive recommendations that are based on analysis of support trends and best practices from across the
Dell Technologies infrastructure solutions customer base to reduce support issues and improve performance Predictive analysis for issue prevention and optimization that is enabled by secure connect gateway technology Proactive monitoring, issue detection, notification, and automated case creation for accelerated issue resolution enabled by
secure connect gateway On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect
Dell ProSupport for Enterprise
ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize disruptions and maximize availability of PowerEdge server workloads with:
24×7 support through phone, chat and online Predictive, automated tools and innovative technology A central point of accountability for all hardware and software issues Collaborative third-party support Hypervisor, operating system and application support Consistent experience regardless of where customers are located or what language they speak
NOTE: Subject to service offer country or region availability.
Optional onsite parts and labor response options including next business day or four-hour mission critical

Appendix D: Service and support

65

Figure 48. ProSupport Enterprise Suite
Dell ProSupport One for Data Center
ProSupport One for Data Center offers flexible site-wide support for large and distributed data centers with more than 1,000 assets. This offering is built on standard ProSupport components that leverage our global scale but are tailored to a customer’s needs. While not for everyone, this service option offers a truly unique solution for Dell Technologies largest customers with the most complex environments. Team of assigned Services Account Managers with remote, on-site options Assigned ProSupport One technical and field engineers who are trained on the customer’s environment and configurations On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect Flexible on-site support and parts options that fit their operational model A tailored support plan and training for their operations staff
Dell ProSupport Add-on for HPC
The ProSupport Add-on for HPC provides solution-aware support including: Access to senior HPC experts Advanced HPC cluster assistance: performance, interoperability, and configuration Enhanced HPC solution level end-to-end support Remote presupport engagement with HPC Specialists during ProDeploy implementation Learn more at Dell.com/HPC-Services.

66

Appendix D: Service and support

Figure 49. ProSupport Add-on for HPC is an add-on to PS or PSP
Support Technologies
Powering the support experience with predictive, data-driven technologies. NOTE: SupportAssist Enterprise capabilities are now part of the secure connect gateway technology.

Enterprise connectivity

The best time to solve a problem is before it happens. The automated proactive and predictive support features enabled by the secure connect gateway technology helps reduce steps and time to resolution, often detecting issues before they become a crisis. The gateway technology is available in virtual and application editions. It is also implemented as a direct connect version for select Dell hardware and a Services plugin within OpenManage Enterprise for PowerEdge servers. The legacy SupportAssist Enterprise solution has been retired and is now replaced by the secure connect gateway solutions.
Benefits include:
Value: Our connectivity solutions are available to all customers at no additional charge Improve productivity: Replace manual, high-effort routines with automated support Accelerate time to resolution: Receive issue alerts, automatic case creation, and proactive contact from Dell experts Gain insight and control: Optimize enterprise devices with insights in portals reporting like TechDirect, and get predictive
issue detection before the problem starts
NOTE: Connect devices can access these features. Features vary depending on the service level agreement for the
connected device. ProSupport Plus customers experience the full set of automated support capabilities.

Table 29. Features enabled by connectivity

—

Basic hardware

warranty

Automated issue detection and system state information collection

Supported

Proactive, automated case creation and notification

Not supported

ProSupport Supported Supported

ProSupport Plus Supported Supported

Appendix D: Service and support

67

Table 29. Features enabled by connectivity (continued)

—
Predictive issue detection for failure prevention

Basic hardware warranty
Not supported

Get started at DellTechnologies.com/secureconnectgateway.

ProSupport Not supported

ProSupport Plus Supported

Dell TechDirect
TechDirect helps boost IT team productivity when supporting Dell systems.
Boost your productivity with online servoce for Dell products from TechDirect. From deployment to technical support, TechDirect lets you do more with less effort and faster resolution. You can:
OPen and manage support requests or in-warranty systems Execute online self- service for parts dispatch Collaborate on ProDeploy infrastructure deployment projects online Manage proactive and preditive alerts from secure connect gateway technology that help maximize uptime Integrate services functionality into your help desk with TechDirect APIs Join over 10,000 companies that choose TechDirect
Register at TechDirect.Dell.com.

Dell Technologies Consulting Services
Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high value workloads Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting can help determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and proven methodologies that are combined with portfolio and partner ecosystem of Dell Technologies to help achieve real business outcomes. From multi cloud, applications, DevOps, and infrastructure transformations, to business resiliency, data center modernization, analytics, workforce collaboration, and user experiences-we are here to help.
Dell Managed Services
Some customers prefer Dell to manage the complexity and risk of daily IT operations, Dell Managed Services utilizes proactive, AI enabled delivery operations and modern automation to help customers realize desired business outcomes from their infrastructure investments. With these technologies, our experts run, update and fine-tune customer environments aligned with service levels, while providing environment-wide and down-to-the-device visibility. There are two types of managed service offers. First the outsourcing model or CAPEX model where Dell manages the customer owned assets using our people and tools. The second is the as-a-Service model or OPEX model called APEX. In this service, Dell owns all technology and all the management of it. Many customers will have a blend of the two management types depending on the goals of the organization.

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Appendix D: Service and support

Figure 50. Dell Managed Services
Dell Technologies Education Services
Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams with the right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training and certification required for real transformation. Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that their team must confidently install, configure, manage, and troubleshoot Dell servers. To learn more or register for a class today, see Education.Dell.com.

Appendix D: Service and support

69

14
Appendix A. Additional specifications
Topics:
· Chassis dimensions · System weight · NIC port specifications · Video specifications · USB ports specifications · PSU rating · Environmental specifications
Chassis dimensions

Figure 51. Chassis dimensions

70

Appendix A. Additional specifications

Table 30. PowerEdge R7625 chassis dimensions

Xa
482.0 mm (18.97 inches)

Xb
434.0 mm (17.08 inches)

Y
86.8 mm (3.41 inches)

Za
35.84 mm (1.4 inches) With bezel
22.0 mm (0.87 inches) Without bezel

Zb
700.7 mm (27.58 inches) Ear to Rear wall

Zc
736.29 mm (28.98 inches) Ear to PSU handle

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight
Table 31. PowerEdge R7625 system weight System configuration A server with fully populated drives A server without drives and PSU installed

Maximum weight (with all drives/SSDs) 34.4 kg (75.84 pound) 23.3 kg (51.37 pound)

NIC port specifications

The PowerEdge R7625 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the Open Compute Project (OCP) cards.

Table 32. NIC port specification for the system Feature LOM card (optional) OCP card 3.0 (optional)

Specifications 1 GbE x 2 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

NOTE: The system allows either LOM card or an OCP card or both to be installed in the system. NOTE: On the system board, the supported OCP PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.

Video specifications

The PowerEdge R7625 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 33. Supported video resolution options

Resolution

Refresh rate (Hz)

Color depth (bits)

1024 x 768

60

8, 16, 32

1280 x 800

60

8, 16, 32

1280 x 1024

60

8, 16, 32

1360 x 768

60

8, 16, 32

1440 x 900

60

8, 16, 32

1600 x 900

60

8, 16, 32

1600 x 1200

60

8, 16, 32

1680 x 1050

60

8, 16, 32

Appendix A. Additional specifications

71

Table 33. Supported video resolution options (continued)

Resolution 1920 x 1080

Refresh rate (Hz) 60

Color depth (bits) 8, 16, 32

1920 x 1200

60

8, 16, 32

USB ports specifications

Table 34. PowerEdge R7625 USB specifications

Front

Rear

USB port type No. of ports USB port type

No. of ports

USB 2.0-

One

compliant port

USB 3.0-

One

compliant port

iDRAC Direct

One

port (Micro-AB

USB 2.0-

compliant port)

USB 2.0-

One

compliant ports

Internal (optional)

USB port type

No. of ports

Internal USB 3.0-

One

compliant port

NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

PSU rating

Table 35. PSUs Highline and Lowline ratings

Features

800 W

1100 W

Platinum

Titanium

-48VDC

Peak Power 1360 W (Highline/-72 VDC)
Highline/-72 800 W VDC
Peak Power 1360 W (Lowline/-40 VDC)
Lowline/-40 800 W VDC
Highline 240 800 W VDC
Highline 380 N/A VDC
DC-48-60 V N/A

1870 W
1100 W 1785 W
1050 W 1100 W N/A N/A

1870 W
1100 W N/A
N/A N/A N/A 1100 W

1400 W Platinum 2380 W

1800 W Titanium 3060 W

1400 W 1785 W

1800 W N/A

1050 W 1400 W N/A N/A

N/A 1800 W N/A N/A

2400 W Platinum 4080 W

2800 W Titanium 4760 W

2400 W 2380 W

2800 W N/A

1400 W 2400 W N/A N/A

N/A 2800 W N/A N/A

The PowerEdge R7625 supports up to two AC or DC power supplies with 1+1 redundancy, autosensing, and auto-switching capability.
If two PSUs are present during POST, a comparison is made between the wattage capacities of the PSUs. In the event that the PSU wattages don’t match, the larger of the two PSU’s is enabled. Also, there is a PSU mismatch warning displayed in BIOS, iDRAC, or on the System LCD.
If a second PSU is added at run-time, in order for that particular PSU to be enabled, the wattage capacity of the first PSU must equal the second PSU. Otherwise, the PSU will be flagged as unmatched in iDRAC and the second PSU will not be enabled.

72

Appendix A. Additional specifications

Dell PSUs have achieved Platinum efficiency levels as shown in the table below.

Table 36. PSU Efficiency Levels

Efficiency Targets by Load

Form factor Redundant 60 mm

Output 800 W AC

1100 W AC

1100 W -48 VDC

1400 W AC

1800 W AC

Redundant 86 mm

2400 W AC

2800 W AC

Class Platinum Titanium N/A
Platinum Titanium Platinum Titanium

10% 89.00% 90.00% 85.00%
89.00% 90.00% 89.00% 90.00%

20% 93.00% 94.00% 90.00%
93.00% 94.00% 93.00% 94.00%

50% 94.00% 96.00% 92.00%
94.00% 96.00% 94.00% 96.00%

100% 91.50% 91.50% 90.00%
91.50% 94.00% 91.50% 94.00%

Environmental specifications

Table 37. Continuous Operation Specifications for ASHRAE A2

Temperature

Specifications

Allowable continuous operations

Temperature range for altitudes <= 900 m (<= 2953 ft)

1035°C (5095°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all times)

8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point

Operational altitude derating

Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 38. Continuous Operation Specifications for ASHRAE A3

Temperature

Specifications

Allowable continuous operations

Temperature range for altitudes <= 900 m (<= 2953 ft)

540°C (41104°F) with no direct sunlight on the equipment

Excursion Limited Operation

5-35°C (41-95°F) Continuous Operation

35-40°C (95-104°F) 10% Annual Runtime

Humidity percent range (non-condensing at all times)

8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point

Operational altitude derating

Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 39. Continuous Operation Specifications for ASHRAE A4

Temperature

Specifications

Allowable continuous operations

Temperature range for altitudes <= 900 m (<= 2953 ft)

545°C (41113°F) with no direct sunlight on the equipment

Excursion Limited Operation

5-35°C (41-95°F) Continuous Operation

Appendix A. Additional specifications

73

Table 39. Continuous Operation Specifications for ASHRAE A4 (continued)

Temperature

Specifications

35-40°C (95-104°F) 10% Annual Runtime

40-45°C (104-113°F) 1% Annual Runtime

Humidity percent range (non-condensing at all times)

8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point

Operational altitude derating

Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 40. Common Environmental Specifications for ASHRAE A2, A3 and A4

Temperature

Specifications

Allowable continuous operations

Maximum temperature gradient (applies to both operation and non-operation)

20°C in an hour (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour (9°F in an hour) for tape hardware
NOTE: * – Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits Non-operational humidity limits Maximum non-operational altitude Maximum operational altitude

-40 to 65°C (-40 to 149°F) 5% to 95% RH with 27°C (80.6°F) maximum dew point 12,000 meters (39,370 feet) 3,048 meters (10,000 feet)

Table 41. Maximum vibration specifications

Maximum vibration

Specifications

Operating Storage

0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations) 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 42. Maximum shock pulse specifications

Maximum shock pulse

Specifications

Operating

Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms

Storage

Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 43. Particulate contamination specifications

Particulate contamination

Specifications

Air filtration

Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: This condition applies to data center environments only. Air
filtration requirements do not apply to IT equipment designed to be

74

Appendix A. Additional specifications

Table 43. Particulate contamination specifications (continued)

Particulate contamination

Specifications

used outside a data center, in environments such as an office or factory floor.

NOTE: Air entering the data center must have MERV11 or MERV13 filtration.

Conductive dust

Air must be free of conductive dust, zinc whiskers, or other conductive particles
NOTE: This condition applies to data center and non-data center
environments.

Corrosive dust

Air must be free of corrosive dust Residual dust present in the air must have a deliquescent point less
than 60% relative humidity
NOTE: This condition applies to data center and non-data center environments.

Table 44. Gaseous contamination specifications

Gaseous contamination Copper coupon corrosion rate

Specifications <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013

Silver coupon corrosion rate

<200 Å/month as defined by ANSI/ISA71.04-2013

Thermal air restrictions
ASHRAE A3 environment
Two PSUs are required in redundant mode, however single PSU failure is not supported. PCIe SSD is not supported. DIMMs greater than 32 GB are not supported. Both SW and DW GPGPU/FPGA are not supported. CPU TDP greater than 200W are not supported. Rear drives are not supported. PCIe card TDP more than 25 W is not supported. OCP is supported with 85C active optic cable.
ASHRAE A4 environment
Two PSUs are required in redundant mode, however single PSU failure is not supported. PCIe SSD is not supported. DIMMs greater than 32 GB are not supported. Both SW and DW GPGPU/FPGA are not supported. CPU TDP greater than 200W are not supported. Rear drives are not supported. PCIe card TDP more than 25 W is not supported. OCP is supported with 85C active cable and cards Tier<=4 BOSS N1 is not supported.

Appendix A. Additional specifications

75

Thermal restriction matrix

Table 45. Air cooling: Thermal restriction matrix(non-GPU)

Configuration

16 x 16 x

No BP

8 x 2.5″ U.2

2.5″ 2.5″ SAS U.2 (Sma (Sm rtFlo artF

w) low)

24 x 2.5″ SAS

16×2. 5″ SAS +
8×2.5 ” U.2

8×3.5″

12×3.5″

Rear storage

CPU cTDP CPU

Max

TDP

No Rear Drive
s

No Rear Driv
es

No Rear Drive
s

2x Rear 2.5″ w/ 2x RearFan

4x Rear 2.5 w/ 3x RearFan

No Rear Drive
s

No Rear Drives

2x Rear No Rear 2.5″ w/ Drives 2x Rear-
Fan

4x Rear 2.5 w/
3x RearFan

210W 200W 240W

SIROCCO Fan + 2U STD HSK

SIROC CO Fan [75%] + 2U STD HSK

HPR Gold Fan [70%] + 2U EXT HSK

290 W

CPU

280 W

TDP 300

/

W

cTD

P

SIROCCO Fan + 2U EXT HSK

SIROC CO Fan [75%] + 2U EXT HSK

HPR Gold Fan [70%] + 2U EXT HSK (Note 1)

360 W
320 W 400 W

SIROCCO Fan + 2U EXT HSK

HPR Gold Fan + 2U EXT HSK

HPR Gold Fan [75%] + 2U EXT HSK

Not supported

16GB RDIMM
Mem 32GB RDIMM ory 64GB RDIMM
128GB RDIMM HPR Gold Fan

SIROCCO Fan Not supported

SIROC CO Fan [75%]

HPR Gold Fan [70%] Not supported

Note 1: Supported ambient temperature is 30°C.

Table 46. Air cooling: Thermal restriction matrix(GPU Configuration)

Configuration

No BP

8 x 2.5″ U.2

16 x

2.5″ 2.5″

SAS

U.2

(SmartF (Smart

low) Flow)

24 x 2.5″ SAS

16×2.5″ SAS + 8×2.5″
U.2

8×3.5″

Rear storage CPU cTDP Max CPU TDP

Model

No Rear Drives

CPU TDP/ cTDP

240W 300 W

210W 290 W
280 W

9334 9224 9124 9454

HPR Gold Fan + 1U EXT HSK

HPR Gold HPR Gold

Fan

Fan [75%]

+ 1U EXT + 1U EXT

HSK

76

Appendix A. Additional specifications

Table 46. Air cooling: Thermal restriction matrix(GPU Configuration) (continued)

Configuration

No BP

8 x 2.5″ U.2

16 x

2.5″ 2.5″

SAS

U.2

(SmartF (Smart

low) Flow)

24 x 2.5″ SAS

16×2.5″ SAS + 8×2.5″
U.2

8×3.5″

Rear storage CPU cTDP Max CPU TDP

Model 9354

No Rear Drives

400 W

360 W

9654
9554 9474F 9374F

HPR Gold Fan + 1U EXT HSK
HPR Gold Fan + 1U EXT HSK (Note

Not Supported

Nor Supported

320 W

9174F

HPR Gold Fan + 1U EXT HSK

Memor y
GPU

16GB RDIMM 32GB RDIMM 64GB RDIMM 128GB RDIMM
A2
A16 64GB A30 24GB A40 48GB A100 80GB MI210 64GB

HPR Gold Fan

HPR Gold HPR Gold

Fan

Fan [75%]

HPR Gold Fan

Not Supported

Not Supported
HPR Gold Fan [75%] (Note 1)

HPR Gold Fan

HPR Gold Fan [75%]

Note 1: Supported ambient temperature is 30°C. NOTE: “High-Performance Gold Fan” to be supported on all GPU configs.

NOTE: GPU is not supported on 12×3.5-inch configs and system configs with rear module installed.

Appendix A. Additional specifications

77

Table 47. Air Cooling: Thermal Guidance(non GPU)

Configuration

16 x

16 x 2.5

No BP

8 x 2.5″ U.2

2.5″ ” SAS U.2 (Sm (Sm artFl artF

ow) low

)

24 x 2.5″ SAS

16×2. 5″ SAS + 8×2. 5″ U.2

8×3.5 ”

12×3.5″

Rear storage

CPU cTDP Max

Mode l

Core Count

No Rear Drive
s

No Rear Driv
es

No Rea
r Driv es

No Rear Drive
s

2x Rear 2.5″ w/
2x Rear -Fan

9334 32

240 W

9224

24

CPU

9124 16

TDP

9654 96

/

cTD

9554 64

P

400 W

9474F

48

9374F 32

35°C 35°C

4x Rear 2.5 w/
3x Rear -Fan

No Rear Drive
s

No Rear Drives

35°C

No Rear Drives

2x Rear 4x Rear

2.5″ w/ 2.5 w/

2x

3x

Rear- Rear-

Fan

35°C

Requires LC

9174F 16

16GB RDIMM

Me

32GB RDIMM

mor

y

64GB RDIMM

128GB RDIMM

35°C

35°C Not Supported

35°C

Not Supported

NOTE: Not all backplanes/risers support liquid cooling; these are listed as “No Support”.

NOTE: Inlet temperature determined by lowest degree requirement.

Table 48. Air Cooling: Thermal Guidance (GPU Configuration)

Configuration

No BP

8 x 2.5″ U.2

16 x

2.5″ 2.5″

SAS

U.2

(SmartF (Smart

low) Flow)

24 x 2.5″ SAS

16×2.5″ SAS + 8×2.5″
U.2

8×3.5″

Rear storage CPU cTDP Max Model

Core Count#

No Rear Drives

240W

9334

32

9224

24

9124

16

CPU

300 W

9454

48

TDP/

cTDP

9354

32

9654

96

35°C 35°C

35°C

400 W

9554

64

9474F

48

30°C

Requires LC

78

Appendix A. Additional specifications

Table 48. Air Cooling: Thermal Guidance (GPU Configuration) (continued)

Configuration

No BP

8 x 2.5″ U.2

16 x

2.5″ 2.5″

SAS

U.2

(SmartF (Smart

low) Flow)

24 x 2.5″ SAS

16×2.5″ SAS + 8×2.5″
U.2

8×3.5″

Rear storage CPU cTDP Max Model
9374F

Core Count#
32

No Rear Drives

9174F

16

35°C

16GB RDIMM

Memor y

32GB RDIMM 64GB RDIMM

35°C

128GB RDIMM

35°C

Not Supported

A2

A16 64GB

GPU

A30 24GB A40 48GB

35°C

A100 80GB

MI210 64GB

NOTE: Not all backplanes/risers support liquid cooling; these are listed as “No Support”.

NOTE: Inlet temperature determined by lowest degree requirement.
Note 1: Supported ambient temperature is 30°C. NOTE: “High-Performance GOLD Fan” to be supported on all GPU configs.

NOTE: GPU is not supported on 12×3.5″ configs and system configs with rear module installed.

Table 49. Label reference Label SIROCCO (Silver) HPR (Gold) HSK LP FH

Description High performance (silver grade) High performance (gold grade) Heat sink Low profile Full height

Appendix A. Additional specifications

79

15

Appendix B. Standards compliance

The system conforms to the following industry standards.

Table 50. Industry standard documents

Standard

URL for information and specifications

ACPIAdvance Configuration and Power Interface Specification, v2.0c

https://uefi.org/specsandtesttools

Ethernet IEEE 802.3-2005

https://standards.ieee.org/

HDGHardware Design Guide Version 3.0 for Microsoft Windows Server

microsoft.com/whdc/system/platform/pcdesign/desguide/ serverdg.mspx

IPMI Intelligent Platform Management Interface, v2.0

intel.com/design/servers/ipmi

DDR5 Memory DDR5 SDRAM Specification

jedec.org/standards-documents/docs/jesd79-4.pdf

PCI Express PCI Express Base Specification Rev. 2.0 and 3.0 pcisig.com/specifications/pciexpress

PMBus Power System Management Protocol Specification, v1.2

http://pmbus.org/Assets/PDFS/Public/ PMBus_Specification_Part_I_Rev_1-1_20070205.pdf

SAS Serial Attached SCSI, v1.1

http://www.t10.org/

SATA Serial ATA Rev. 2.6; SATA II, SATA 1.0a Extensions, Rev. 1.2

sata-io.org

SMBIOS System Management BIOS Reference Specification, dmtf.org/standards/smbios v2.7

TPM Trusted Platform Module Specification, v1.2 and v2.0

trustedcomputinggroup.org

UEFI Unified Extensible Firmware Interface Specification, v2.1 uefi.org/specifications

USB Universal Serial Bus Specification, Rev. 2.7

usb.org/developers/docs

80

Appendix B. Standards compliance

16

Appendix C Additional resources

Table 51. Additional resources

Resource

Description of contents

Location

Installation and Service Manual This manual, available in PDF format, provides the following Dell.com/Support/Manuals information:

Chassis features System Setup program System indicator codes System BIOS Remove and replace procedures Diagnostics Jumpers and connectors

Getting Started Guide

This guide ships with the system, and is also available in PDF Dell.com/Support/Manuals format. This guide provides the following information:

Initial setup steps

Rack Installation Guide

This document ships with the rack kits, and provides instructions for installing a server in a rack.

Dell.com/Support/Manuals

System Information Label

The system information label documents the system board layout and system jumper settings. Text is minimized due to space limitations and translation considerations. The label size is standardized across platforms.

Inside the system chassis cover

Quick Resource Locator (QRL)

This code on the chassis can be scanned by a phone application to access additional information and resources for the server, including videos, reference materials, service tag information, and Dell contact information.

Inside the system chassis cover

Enterprise Infrastructure Planning Tool (EIPT)

The Dell online EIPT enables easier and more meaningful estimates to help you determine the most efficient configuration possible. Use EIPT to calculate the power consumption of your hardware, power infrastructure, and storage.

Dell.com/calc

Appendix C Additional resources

81