Micron 5400 Series SATA NAND Flash SSD Owner’s Manual
- June 13, 2024
- Micron
Table of Contents
Micron 5400 Series NAND Flash SSD
Micron 5400 Series SATA NAND Flash
SSD Technical Product Specification
For additional technical and warranty information, contact your Micron sales representative.
Features
-
Micron® 3D TLC NAND Flash
-
Three performance/endurance levels
– BOOT
– PRO
– MAX -
TCG Enterprise and TCG Opal 2.0 compliant selfencrypting drive (SED) options
-
SATA 6 Gb/s interface
-
ATA modes supported
– PIO mode 3, 4
– Multiword DMA mode 0, 1, 2
– Ultra DMA mode 0, 1, 2, 3, 4, 5, 6 -
512-byte sector size support
-
Hot-plug capable (2.5-inch only)
-
ATA-8 ACS-4 command set compliant
-
Security erase command set: fast and secure erase
-
Performance (steady state)¹
– Sequential 128KB read: Up to 540 MB/s
– Sequential 128KB write: Up to 520 MB/s
– Random 4KB read: Up to 95,000 IOPS
– Random 4KB write: Up to 65,000 IOPS -
Endurance³ : Total bytes written (TBW)
– BOOT: Up to 438TB
– PRO: Up to 10,512TB
– MAX: Up to 23,827TB -
Reliability
– MTTF: 3.0 million device hours²
– Static and dynamic wear leveling
– Uncorrectable bit error rate (UBER): <1 sector per 10 17 bits read
– End-to-end data protection
– Enhanced power-loss data protection with data protection capacitor monitoring -
Self-monitoring, analysis, and reporting technology (SMART) command set
-
Capacity 3 (unformatted): 240GB, 480GB, 960GB, 1920GB, 3840GB, 7680GB
-
Mechanical:
– 2.5-inch x 7.0mm form factor
– M.2 Type 2280 form factor -
RoHS-compliant package
-
Secure field-upgradeable firmware with digitally signed firmware image
-
Operating temperature
– Commercial (0°C to 70°C) 4
Notes:
- Performance varies by capacity and endurance.
- The product achieves a MTTF based on population statistics not relevant to individual units.
- 1GB = 1 billion bytes; formatted capacity is less.
- As reported by SMART.
Part Numbering Information
Micron’s 5400 SSD is available in different configurations and densities. The
chart below is a comprehensive list of options for the 5400 series devices;
not all options listed can be combined to define an offered product. Visit
micron.com for a list of valid part numbers.
Figure 1: Part Number Chart
Important Notes and Warnings
Micron Technology, Inc. (“Micron”) reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions. This document supersedes and replaces
all information supplied prior to the publication hereof. You may not rely on
any information set forth in this document if you obtain the product described
herein from any unauthorized distributor or other source not authorized by
Micron.
Automotive Applications. Products are not designed or intended for use in
automotive applications unless specifically designated by Micron as
automotive-grade by their respective data sheets. Distributor and customer/
distributor shall assume the sole risk and liability for and shall indemnify
and hold Micron harmless against all claims, costs, damages, and expenses and
reasonable attorneys’ fees arising out of, directly or indirectly, any claim
of product liability, personal injury, death, or property damage resulting
directly or indirectly from any use of non-automotive-grade products in
automotive applications. Customer/distributor shall ensure that the terms and
conditions of sale between customer/distributor and any customer of
distributor/customer (1) state that Micron products are not designed or
intended for use in automotive applications unless specifically designated by
Micron as automotive-grade by their respective data sheets and (2) require
such customer of distributor/ customer to indemnify and hold Micron harmless
against all claims, costs, damages, and expenses and reasonable attorneys’
fees arising out of, directly or indirectly, any claim of product liability,
personal injury, death, or property damage resulting from any use of non-
automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in
which failure of the Micron component could result, directly or indirectly in
death, personal injury, or severe property or environmental damage (“Critical
Applications”). Customer must protect against death, personal injury, and
severe property and environmental damage by incorporating safety design
measures into customer’s applications to ensure that failure of the Micron
component will not result in such harms. Should customer or distributor
purchase, use, or sell any Micron component for any critical application,
customer and distributor shall indemnify and hold harmless Micron and its
subsidiaries, subcontractors, and affiliates and the directors, officers, and
employees of each against all claims, costs, damages, and expenses and
reasonable attorneys’ fees arising out of, directly or indirectly, any claim
of product liability, personal injury, or death arising in any way out of such
critical application, whether or not Micron or its subsidiaries,
subcontractors, or affiliates were negligent in the design, manufacture, or
warning of the Micron product.
Customer Responsibility. Customers are responsible for the design,
manufacture, and operation of their systems, applications, and products using
Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND
LIMITED USEFUL LIVES. IT IS THE CUSTOMER’S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER’S SYSTEM,
APPLICATION, OR PRODUCT. Customers must ensure that adequate design,
manufacturing, and operating safeguards are included in customer’s
applications and products to eliminate the risk that personal injury, death,
or severe property or environmental damages will result from failure of any
semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect,
incidental, punitive, special or consequential damages (including without
limitation lost profits, lost savings, business interruption, costs related to
the removal or replacement of any products or rework charges) whether or not
such damages are based on tort, warranty, breach of contract or other legal
theory, unless explicitly stated in a written agreement executed by Micron’s
duly authorized representative.
Performance
Measured performance can vary for a number of reasons. The major factors
affecting drive performance are the capacity of the drive and the
interface/HBA of the host. Additionally, overall system performance can affect
the measured drive performance. When comparing drives, it is recommended that
all system variables are the same, and only the drive being tested varies.
Performance numbers will vary depending on the host system configuration.
Performance is measured using a single drive direct attached (no RAID) to an
integrated SATA controller.
Table 1: Drive Performance – BOOT M.2
Parameter | Capacity | Unit |
---|
240GB
Sequential read (128KB transfer)| 540| MB/s
Sequential write (128KB transfer)| 290| MB/s
Random read (4KB transfer)| 62,000| IOPS
Random write (4KB transfer)| 12,000| IOPS
Random 70/30 R/W (4KB transfer)| 24,000| IOPS
READ latency (99.9%)| 170| µs
WRITE latency (99.9%)| 390| µs
Notes:
- Performance measured using FIO with a queue depth of 32 in the steady state region.
- 4KB transfers with a queue depth of 1 are used to measure READ/WRITE latency values.
- System variations and HBA used will affect measured results.
Table 2: Drive Performance – PRO M.2/2.5″
Parameter | Capacity | Unit |
---|---|---|
240GB | 480GB | 960GB |
Sequential read (128KB transfer) | 540 | 540 |
Sequential write (128KB transfer) | 350 | 520 |
Random read (4KB transfer) | 75,000 | 95,000 |
IOPS
Random write (4KB transfer)| 37,000| 37,000| 33,000| 33,000| 30,000| 10,500|
IOPS
Random 70/30 R/W (4KB transfer)| 49,000| 59,000| 58,000| 58,000| 51,000|
30,000| IOPS
READ latency (99.9%)| 170| 170| 170| 170| 170| 170| µs
WRITE latency (99.9%)| 150| 42| 80| 120| 210| 400| µs
Notes:
- Performance measured using FIO with a queue depth of 32 in the steady state region.
- 4KB transfers with a queue depth of 1 are used to measure READ/WRITE latency values.
- System variations and HBA used will affect measured results.
Table 3: Drive Performance – MAX 2.5″
Parameter | Capacity | Unit |
---|---|---|
480GB | 960GB | 1920GB |
Sequential read (128KB transfer) | 540 | 540 |
Sequential write (128KB transfer) | 520 | 520 |
Random read (4KB transfer) | 95,000 | 95,000 |
Random write (4KB transfer) | 58,000 | 65,000 |
Random 70/30 R/W (4KB transfer) | 69,000 | 77,000 |
READ latency (99.9%) | 170 | 170 |
WRITE latency (99.9%) | 36 | 35 |
Notes:
- Performance measured using FIO with a queue depth of 32 in the steady state region.
- 4KB transfers with a queue depth of 1 are used to measure READ/WRITE latency values.
- System variations and HBA used will affect measured results.
Endurance
Endurance for the SSD can be predicted based on the usage conditions applied
to the device, the internal NAND component cycles, the write amplification
factor, and the wear-leveling efficiency of the drive. Total bytes written
measured with 55°C case temperature within the total bytes written values
listed in this document. The table below shows the drive lifetime for each SSD
capacity based on predefined usage conditions.
Table 4: Drive Lifetime
Capacity | Drive Lifetime (Total Bytes Written) | Unit |
---|---|---|
BOOT | PRO | MAX |
240GB | 438 | 657 |
480GB | – | 1324 |
960GB | – | 2628 |
1920GB | – | 5256 |
3840GB | – | 8410 |
7680GB | – | 9110 |
Notes:
- Total bytes written were calculated assuming drive is 100% full (user capacity) and a workload of 100% random, aligned 4KB writes.
- 1TB = 1,000,000,000,000 bytes
Electrical Characteristics
Table 5: SATA Power Consumption – 2.5-inch
Capacity| Idle Average| Sequential Write (128KB transfer)|
Sequential Read (128KB transfer)
---|---|---|---
240GB| 1.5W| 3W| 2.5W
480GB| 1.5W| 3.1W| 2.5W
960GB| 1.5W| 3.1W| 2.8W
1920GB| 1.5W| 3.6W| 3.0W
3840GB| 1.5W| 3.8W| 2.8W
7680GB| 1.5W| 3.9W| 2.8W
Notes:
- Data taken at 25°C using a 6 Gb/s SATA interface.
- Sequential power measured during Biometer with 128KB transfer, RMS average over a 500ms window.
Table 6: SATA Power Consumption – M.2 Type 2280
Capacity| Idle Average| Sequential Write (128KB transfer)|
Sequential Read (128KB transfer)
---|---|---|---
240GB| 1.5W| 3W| 2.5W
480GB| 1.5W| 3.1W| 2.5W
960GB| 1.5W| 3.1W| 2.8W
Notes:
- Data taken at 25°C using a 6 Gb/s SATA interface.
- Sequential power measured during Biometer with 128KB transfer, RMS average over a 500ms window.
Table 7: Operating Voltage
Parameter/Condition | Symbol | Min | Max | Unit |
---|---|---|---|---|
Voltage input (2.5-inch)1 | V12 | 10.8 | 13.2 | V |
V5 | 4.5 | 5.5 | V | |
Voltage input (M.2) | 3V3 | 3.14 | 3.46 | V |
Operating temperature2 | TC | 0 | 70 | °C |
Non-operating temperature | – | –40 | 85 | °C |
Rate of temperature change | – | – | 20 | °C/hour |
Relative humidity (non-condensing) | – | 5 | 95 | % |
Notes:
- 5V supply required; 12V supply optional
- Based upon drive temperature reported by SMART
Physical Configuration
2.5-Inch 7mm
Screw: M3 x 0.5 with a maximum of 5mm encroachment into the SSD
Torque: Maximum of 4 in-lbs @ 200 rpm with an actuation style lever
Figure 2: 2.5-Inch Package – 7mm
Note:
- All dimensions are in millimeters.
M.2 2280
Physical dimensions conform to the applicable form factor specifications as
listed in the figure below.
Figure 3: M.2 Type 2280 Package
Note:
- All dimensions are in millimeters.
Compliance
Micron SSDs comply with the following:
-
Micron Green Standard
-
Built with sulfur resistant resistors
-
CE (Europe): EN 55032 Class B, RoHS
-
UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS
-
FCC: CFR Title 47, Part 15 Class B
-
UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013
-
BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663
-
RCM (Australia, New Zealand): AS/NZS CISPR32 Class B
-
KC RRA (Korea): approval to KN32 Class B, KN 35 Class B
-
W.E.E.E.: compliance with EU WEEE directive 2012/19/EC. Additional obligations may apply to customers who place these products in the markets where WEEE is enforced.
-
TUV (Germany): approval to IEC60950/EN60950
-
VCCI (Japan): 2015-04 Class B
-
IC (Canada): ICES-003 Class B
– This Class B digital apparatus complies with Canadian ICES-003. -
Morocco: approval to EN55032/EN55024 Class B
-
Ukr SEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Revision History
Rev. A – 09/2023
- Initial release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006
208-368-4000, micron.com/support
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power
supply and temperature range set forth
herein. Although considered final, these specifications are subject to change,
as further product development and data characterization
sometimes occur.
CCM005-731836775-10659
5400_ssd_tech_prod_spec.pdf – Rev. A 09/2023 EN
Micron Technology, Inc. reserves the right to change products or
specifications without notice.
© 2023 Micron Technology, Inc.. All rights reserved.
References
- Micron Technology | Global Leaders in Semiconductors | Micron Technology Inc.
- Sales & support | Micron Technology Inc.
- Micron Technology | Global Leader in Semiconductors
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