NXP AN14179 Based Micro Controllers User Guide

: September 27, 2024
: NXP

Table of Contents

AN14179 Based Micro Controllers
Specifications
Product Usage Instructions
Step 1: Understanding the Migration Guide
Step 2: Assessing Application Compatibility
Step 3: Porting Applications
Step 4: Testing and Validation
- Frequently Asked Questions (FAQ)
Q: What are the key differences between MCXNx4x and
Q: How can I migrate my applications from MCXNx4x to
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)

AN14179 Based Micro Controllers

“`html

Specifications

Core Platform: Arm Cortex-M33 up to 150 MHz
with TrustZone, MPU, FPU, SIMD, DSP
SmartDMA
System Control: Power control, Clock
generation unit, PMC, Secure DMA0, Secure DMA1, Secure AHB bus
Analog: 4x 16 b ADC, Temp sensor, 2x ACMP,
Glitch detect, VREF
Interfaces: 8x LP flexcomm supporting UART,
SPI, I2C, 4ch SAI, 2x CAN-FD, USB HS, 2x I3C
Memory: Flash up to 512 kB, RAM up to 320 kB,
ECC RAM 32 kB
HMI: FlexIO, DMIC
Security: PKC, ECC-256, SHA-512, RNG AES-256,
Multi-Rate Timer, Windowed WDT, Debug auth., PRINCE, RTC with
anti-tamper pins
General Purpose Timers: 5x 32 b Timers
Other Features: Micro-Tick Timer, DICE + UUID,
PFR, SRAM PUF, 2x FlexPWM with 2 QDC module, OS Event Timer, 2x
Code WDG, OTP, Tamper detect

Product Usage Instructions

Step 1: Understanding the Migration Guide

Read through the migration guide provided from MCXNx4x to
MCXN23x to understand the differences and changes in the
platforms.

Step 2: Assessing Application Compatibility

Check if your current applications on MCXNx4x are compatible
with the MCXN23x platform. Identify any specific features or
peripherals that may need modification.

Step 3: Porting Applications

Follow the guidelines in the migration guide to port your
applications from MCXNx4x to MCXN23x. Make necessary code changes
based on the platform variations.

Step 4: Testing and Validation

After porting the applications, thoroughly test them on the
MCXN23x platform to ensure proper functionality and
performance.

Frequently Asked Questions (FAQ)

Q: What are the key differences between MCXNx4x and

MCXN23x?

A: MCXN23x is a cropped version of MCXNx4x with some
co-processors and peripherals removed. The MCX series MCU is
divided into subseries N, A, L, and W.

Q: How can I migrate my applications from MCXNx4x to

MCXN23x?

A: Refer to the migration guide provided by NXP that outlines
the steps to migrate applications between the two platforms. Ensure
compatibility and make necessary adjustments in the code.

“`

AN14179
Migration Guide from MCXNx4x to MCXN23x
Rev. 1 — 6 May 2024

Application note

Document information

Information

Content

Keywords

AN14179, MCXNx4x, MCXN23x, migration guide

Abstract

This application note describes the differences between MCXNx4x and MCXN23x and guides customers on how to quickly migrate applications from the MCXNx4x platform to the MCXN23x platform.

NXP Semiconductors

AN14179
Migration Guide from MCXNx4x to MCXN23x

1 Introduction
The MCXNx4x is a new-generation MCU launched by NXP after Kinetis and LPC. It integrates excellent IP from both Kinetis and LPC platforms, such as CMC, FlexCAN, FlexIO, and SPC from the Kinetis platform and PowerQuad, SmartDMA, PINT, RTC, and MRT from the LPC platform. The MCX series MCU is divided into four subseries: N, A, L, and W.
· MCX N (Neural): 150 MHz, 512KB-2MB On-chip accelerators, enhanced peripherals, and advanced security
· MCX A (All-purpose): Up to 96 MHz, 32KB-1MB Intelligent peripherals and various device options for a wide range of applications
· MCX W (Wireless): Up to 96 MHz Low-power Bluetooth LE, Thread, and Zigbee radio optimized for IIoT and Matter applications and advanced security
· MCX L (Low-power): Below 50 MHz, up to 1 MB Optimized for always on battery operated applications with the lowest active power and leakage
The MCXNx4x series microcontrollers combine the Arm Cortex-M33 TrustZone core with a CoolFlux BSP32, a PowerQuad DSP Co-processor, and multiple high-speed connectivity options running at 150 MHz. To support a wide variety of applications, the MCX N series includes advanced serial peripherals, timers, high-precision analog, and state-of-the-art security features like secure user code, data, and communications. All MCXNx4x products include dual-bank flash, which supports read-while-write operation from internal flash. The MCXNx4x series also supports large external serial memory configurations.
The MCXNx4x MCU families are as follows:
· N54x: Mainstream MCU with a second M33 core, advanced timers, analog and high-speed connectivity, including high-speed USB, 10/100 Ethernet, and FlexIO, which can be programmed as an LCD controller.
· N94x: Integration of CPU and DSP serial connectivity, advanced timers, high precision analog, and highspeed connectivity, including high-speed USB, CAN 2.0, 10/100 Ethernet, and FlexIO, which can be programmed as an LCD controller.
MCXN23x is the second product in the MCX N series. It can be regarded as a cropped version of MCXNx4x. Almost all IPs are reused from MCXNx4x, and some co-processors and peripherals are removed. These removed modules are as follows:
· Co-processor: Secondary Cortex-M33 Core, PowerQuad, NPU, CoolFlux BSP32, and so on. · Peripherals: FlexSPI, uSDHC, EMVSIM, Ethernet, 12-bit DAC, 14-bit DAC, and so on.
This document describes how to migrate applications from the MCXNx4x platform to the MCXN23x platform.
The system block diagram of MCXN23x is shown in Figure 1.

AN14179
Application note

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Rev. 1 — 6 May 2024

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AN14179
Migration Guide from MCXNx4x to MCXN23x

Core platform
Arm cortex-M33 up to 150 MHz Trustzone, MPU, FPU, SIMD, DSP
SmartDMA

System control
Power control Single Vdd power supply, POR, LVD/HVD, DCDC converter, Core LDO, IVS, system LDO, VBAT RAM LDO,
VBAT switch

Clock generation unit FRO12M, FRO144M, 2x PLLs, XTAL32K, XTAL40M, clock out

PMC

Secure DMA0

Secure DMA1

Secure AHB bus

Analog
4x 16 b ADC 2 Msps 16 bit 3.15 Msps 12 bit

Temp sensor

2x ACMP

Glitch detect

VREF

Interfaces
8x LP flexcomm supports UART, SPI, I2C

4ch SAI 2x CAN-FD

USB HS 2x I3C

Flash up to 512 kB

Memory
Flash up to 512 kB

Flash cache

HMI

FlexIO

DMIC

RAM up to 320 kB

ECC RAM 32 kB

ROM boot + power API

General purpose timers 5x 32 b Timers

Security

PKC

ECC-256

SHA-512 RNG AES-256

Multi-Rate Timer

Windowed WDT

Debug auth.

PRINCE

RTC w anti tamper pins

Micro-Tick Timer

DICE + UUID

PFR

SRAM PUF

2x FlexPWM w 2 QDC module

OS Event Timer

2x Code WDG

OTP

Tamper detect

aaa-054528
Figure 1.MCXN23x system block diagram Table 1 lists the comparison of system resources between the MCXNx4x and MCXN23x.

Table 1.Comparison of MCXNx4x and MCXN23x

MCU series

MCXNx4x

Part

MCXN947

MCXN946

Package

VFBGA184 HLQFP100

Temp range (junction)

-40 ºC to 125 -40 ºC to 125

ºC

MCXN547
VFBGA184 HLQFP100
-40 ºC to 125 ºC

MCXN546
VFBGA184 HLQFP100
-40 ºC to 125 ºC

MCXN23x
MCXN236
VFBGA184 HLQFP100
-40 ºC to 125 ºC

MCXN235
VFBGA184 HLQFP100
-40 ºC to 125 ºC

AN14179
Application note

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Rev. 1 — 6 May 2024

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AN14179
Migration Guide from MCXNx4x to MCXN23x

Table 1.Comparison of MCXNx4x and MCXN23x…continued

MCU series

MCXNx4x

Part

MCXN947

MCXN946

MCXN547

Core #1 CortexM33

150 MHz TZM 150 MHz TZM 150 MHz TZM +FPU+ETM +FPU+ETM +FPU+ETM

Core #1 Cache 16 K

16 K

Core #2 CortexM33

150 MHz

PowerQuad (DSP Y

Y

and Cordic)

NPU

Y

SmartDMA

Y

CoolFlux BSP32 Y

Y

–

Total flash

2 MB

1 MB

2 MB

Dual bank flash Y

Y

Flash ECC and Y

Y

CRC

Flash encrypt

Y

(Prince)

SRAM (ECC user 480 K configurable)

320 K

480 K

SRAM with ECC 32 K (in addition to main SRAM)

32 K

FlexSPI with 16 k cache
uSDHC
EMVSIM

1x, 2 ch
Y[1] Y[1]

1x, 2 ch
–

1x, 2 ch
Y Y

Secure key management

PUF/UDF

Secure subsystem Y

Y

Anti-tamper pin[2] 8

8

Display controller 1

1

(FlexIO)

TSI

1[1]

N

1

DMIC

4 ch[1]

–

4 ch

SAI

4 ch

LP_FLEXCOMM 10

10

I3C

2

USB HS

1

–

1

USB FS

1

MCXN546 150 MHz TZM +FPU+ETM 16 K 150 MHz
Y
Y Y 1 MB Y Y
Y
320 K
32 K
1x, 2 ch
Y Y PUF/UDF
Y 8 1
1 4 ch 4 ch 10 2 1 1

MCXN23x MCXN236 150 MHz TZM +FPU+ETM 16 K –
–
Y 1 MB Y Y
Y
320 K
32 K
–
PUF/UDF
Y 6 1
4 ch 4 ch 8 2 1 –

MCXN235 150 MHz TZM +FPU+ETM 16 K –
–
Y 512 kB Y Y
Y
160 K
32 K
–
PUF/UDF
Y 6 1
4 ch 4 ch 8 2 1 –

AN14179
Application note

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Rev. 1 — 6 May 2024

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AN14179
Migration Guide from MCXNx4x to MCXN23x

Table 1.Comparison of MCXNx4x and MCXN23x…continued

MCU series

MCXNx4x

Part

MCXN947

MCXN946

MCXN547

10/100 Ethernet MAC

MII/RMII

FlexCAN (FD)

2

1

DAC 12b, 1 Msps 2

2

1

DAC 14b, 5 Msps 1

1

–

Comparator

3

2

Opamp

3

–

ADC

2

VREF

Y

FlexPWM

2

1

Quadrature

2

1

Decoder

SINC filter

Y

–

RTC

1

32b timer

5

SCTimer

1

MRT 24b

1

uTick timer

1

WWDT

1

OS timer

1

MCXN546 MII/RMII
1 1 2 2 Y 1 1
1 5 1 1 1 1 1

MCXN23x MCXN236 –
2 2 2 Y 2 2
1 5 1 1 1 1

MCXN235 –
2 2 2 Y 2 2
1 5 1 1 1 1

[1] This feature is only supported on the MCXN947 VFBGA184 package. [2] The 100HLQFP supports two Anti-tamper pins.
The following section compares the MCXNx4x and MCXN23x in terms of memory, clock, pinout, and peripherals.

2 Memory

This section provides details about flash memory and SRAM memory.

2.1 Flash memory

The MCXNx4x has a flash size of up to 2 MB, while the MCXN23x has a flash size of up to 1 MB, both support dual bank flash and dual image boot. The configuration of flash size for each part is listed in Table 2 and Table 3.

Table 2.MCXNx4x part list

Part Number

Embedded memory

Flash (MB) SRAM (kB)

(P)MCXN547VNLT

2

512

Features

Tamper pins GPIOs

(max)

2

74

Package

SRAM PUF Pin count

Type

Y

100

HLQFP

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Migration Guide from MCXNx4x to MCXN23x

Table 2.MCXNx4x part list…continued

Part Number

Embedded memory

Flash (MB) SRAM (kB)

(P)MCXN546VNLT

1

352

(P)MCXN547VDFT

2

512

(P)MCXN546VDFT

1

352

(P)MCXN947VDFT

2

512

(P)MCXN947VNLT

2

512

(P)MCXN946VNLT

1

352

(P)MCXN946VDFT

1

352

Features

Tamper pins GPIOs

(max)

2

74

8

124

8

124

8

124

2

78

2

78

8

124

Package

SRAM PUF Pin count

Type

Y

100

HLQFP

Y

184

VFBGA

Y

184

VFBGA

Y

184

VFBGA

Y

100

HLQFP

Y

100

HLQFP

Y

184

VFBGA

Table 3.MCXN23x part list Part Number
(P)MCXN236VNLT (P)MCXN236VDFT (P)MCXN235VNLT (P)MCXN235VDFT

Embedded Memory Features

Flash (MB)

SRAM (kB) Tamper GPIOs pins (max) (max)

1

352

6

74

1

352

6

108

0.512

192

6

74

0.512

192

6

108

Package SRAM PUF Pin count Type

Y

100

HLQFP

Y

184

VFBGA

Y

100

HLQFP

Y

184

VFBGA

2.2 SRAM memory

The RAM size of the MCXNx4x is up to 512 kB, and the RAM size of the MCXN23x is up to 352 kB. The size of flash and RAM for each part of the MCXNx4x and MCXN23x is listed in Table 4.

Table 4.Flash and RAM size of different parts

Parts

MCXNx47

Flash

2M

SRAM (kB) Total size

512

SRAMX

96 (0x040000000x04017FFF)

SRAMA

32 (0x200000000x20007FFF)

SRAMB

32 (0x200080000x2000FFFF)

SRAMC

64 (0x200100000x2001FFFF)

SRAMD

64 (0x200200000x2002FFFFF)

SRAME

64 (0x200300000x2003FFFFF)

MCXNx46
1M
352
96 (0x040000000x04017FFF)
32 (0x200000000x20007FFF)
32 (0x200080000x2000FFFF)
64 (0x200100000x2001FFFF)
64 (0x200200000x2002FFFFF)
64 (0x200300000x2003FFFFF)

MCXN236
1M
352
96 (0x040000000x04017FFF)
32 (0x200000000x20007FFF)
32 (0x200080000x2000FFFF)
64 (0x200100000x2001FFFF)
64 (0x200200000x2002FFFFF)
64 (0x200300000x2003FFFFF)

MCXN235
512 kB
192
32 (0x040000000x04007FFF)
32 (0x200000000x20007FFF)
32 (0x200080000x2000FFFF)
64 (0x200100000x2001FFFF)
64 (0x200200000x2002FFFFF)
64 (0x200300000x2003FFFFF)

AN14179
Application note

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Rev. 1 — 6 May 2024

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AN14179
Migration Guide from MCXNx4x to MCXN23x

Table 4.Flash and RAM size of different parts…continued

Parts

MCXNx47

MCXNx46

SRAMF

64 (0x20040000-

–

0x2004FFFFF)

SRAMG

64 (0x20050000-

–

0x2005FFFFF)

SRAMH

32 (0x20060000-

–

0x20067FFF)

MCXN236 –
–
–

MCXN235 –
–
–

3 Clock system

The MCXN23x and MCXNx4x use almost the same clock system, with a few differences.

3.1 FRG
A Fractional Rate Generator (FRG) is added to the MCXN23x to generate a more accurate clock for the CLKOUT divider. The FRG output is used as the input of the CLKOUT divider, see Figure 2. It can be used to obtain more precise baud rates when the function clock is not a multiple of standard baud rates. This can be primarily used to create a base baud rate clock for USART functions, and can be used for other purposes, such as metering applications.

main_clk

000

pll0_clk

001

clk_in

010

fro_hf

011

fro_12m

100

pll1_clk0

101

lp _osc

110

usb_pll_clk

111

FRG

100 MHz CLKOUT CLKOUT clock divider

CLKOUTDIV[7:0]

CLKOUT select CLKOUTSEL[2:0] Figure 2.MCXN23x CLKOUT diagram For the CLKOUT diagram of the MCXNx4x, see Figure 3.

aaa- 054535

main_clk pll0_clk clk_in
fro_hf fro_12m pll1_clk0
lp _osc usb_pll_clk

000

001

010

100 MHz

011

CLKOUT CLKOUT

100

clock divider

101

110

111 CLKOUTDIV[7:0]

CLKOUT select CLKOUTSEL[2:0]

aaa-054536

Figure 3.MCXNx4x CLKOUT diagram

The CLKOUT_FRGCTRL register has been added to the SYSCON module of MCXN23x and used to configure numerator and denominator values.

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Migration Guide from MCXNx4x to MCXN23x

3.2 UTICK
The clock sources of UTICK (Micro-Tick) on the MCNX23x have been expanded from 1 to 3, and xtal32k[2] and clk_in have been added as clock sources of UTICK. The clock source of UTICK on the MCXN23x is shown in Figure 4.

clk_in

00

xtal32k[2]

01

clk_1m

10

None

11

UTICK divider

1 MHz To UTICK

UTICKCLKSEL[2:0]

aaa – 05 4 5 37

Figure 4.MCXN23x UTICK clock source

In the metering application, UTICK is used to measure power line frequency. To support metering applications, clk_in and xtal32k[2] are added to the MCXN23x for high-accuracy clock source.

3.3 I3C
The clock diagram of I3C on the MCXN23x is shown in Figure 5.
1× instance per I3C

0 pll0_clk
0 fro_hf
clk_1m pll1_clk0
usb_pll_clk None

000

001

010

011

I3C FCLK

100

divider

101

110

111 I3CnFCLKDIV[7:0]

I3CnFCLKSEL[2:0]

CG I3Cn FCLK gate
CG I3Cn tc_slow_gate
CG I3Cn slow_gate

25 MHz To I3Cn FCLK
25 MHz To I3Cn CLK _SLOW_TC
25 MHz To I3Cn CLK _SLOW
aaa-054538

Figure 5.MCXN23x I3C clock diagram

Add clk_1m as the clock source to the I3C_FCLK divider, and keep CLK_SLOW and CLK_SLOW_TC synchronized with FCLK.

The I3C clock diagram of MCXNx4x is shown in Figure 6.

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Migration Guide from MCXNx4x to MCXN23x

1× instance per I3C

0

000

pll0_clk

001

clk_in

010

fro_hf

011

0

100

pll1_clk0

101

usb_pll_clk

110

None

111

I3C FCLK divider
I3CnFCLKDIV[7:0]

25 MHz
To I3C0/1 FCLK

I3CnFCLKSEL[2:0]

0

clk_1m

1

25 MHz

I3C FCLK_STC divider

To I3C0/1 CLK _SLOW_TC

I3CnFCLKSTCDIV[7:0] I3CnFCLKSTCSEL[2:0]

clk_1m

I3C slow clock divider

1 MHz
To I3C0/1 CLK_SLOW

Figure 6.MCXNx4x I3C clock diagram

I3CnFCLKSDIV[7:0]

aaa-054539

4 Pinout

This section compares the pinout differences between MCXNx4x and MCXN23x, including 184VFBGA and 100HLQFP packages.

4.1 184VFBGA
For the 184VFBGA package, the MCXN23x is pin-to-pin compatible with the MCXNx4x. However, there are some differences between the two. In MCXN23x, 28 pins are removed, including 18 GPIO pins, eight analog pins, and two USB pins. The pinout of the MCXN23x 184VFBGA package is illustrated in Figure 7.

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Migration Guide from MCXNx4x to MCXN23x

1

2

A P1_8 P1_7

3

4

P1_4

5

6

P0_25

7

8

P0_ 21

9

10

P0_17

11

12

NC

13

14

P0_5

15

16

17

P0_1 P0_0

B P1_9 P1_6 P1_5 P1_3

P0_24 P0_23 P0_22

P0_16 NC

NC

P0_4 P0_3 P0_2 P3_0

C

P1_10 P1_2 P1_1 P1_0

P0_20 P0_19 P0_18

NC P0_7 P0_6 P3_1

D P1_13 P1_12 P1_11 P1_14

VSS NC

VSS

NC VSS

P3_7 P3_2 NC P3_6

E

P1_15 VSS

NC P0_28

P0_27 P0_14

VSS P3_8

F

P1_30 P1_31

RESE T_B

P1_17

P1_16

P0_29

P0_26

NC

NC P3_9 P3_11 P3_10

G

VSS

P1_18 P1_19

VDD

VDD_ P3

P0_15 NC

P3_12

H P2_1 P2_0 P2_2

VSS VDD

VDD

VSS VDD_ P3

VDD_ VSS P3

P3_15 P3_13 P3_14

J

P2_3 VSS

VSS

VSS P3_16

K P2_5 P2_6 P2_4

L

P2_7

NC

VDDL NC DO
CORE

VDD_ P2

VSS

VDD_ CORE

P5_5 P5_6

NC

VDD_

P2

VDD_ CORE

P5_7

P3_17 P3_18 NC

NC

P3_ 21

M P2_9 P2_8 P2_10 NC

P4_4

P4_5

P5_2

P5_4

NC P3_23 P3_22 P3_20

N P P4_0 P4_1 R

P2_11

VDD_ P4

P4_6 P4_14

P4_18 P5_3

VSS

VDD_ SYS

NC

VDD_ P4

VSS VSS

P4

VSS_ P4

USB1_ ID

VSS

VDD LDO SYS

VSS DCDC DCDC LX

NC

VDD_ VREF VREF

ANA

H

L

P4_16 P4_17 P4_19

VDD USB1 USB1 VDD USB DP DM DCDC

T P4_2 NC

NC P4_7

P4_12 P4_13 P4_15

P4_20 P4_21 P4_22

NC

VSS

VDD_ BAT

U P4_3 NC

ANA_7

NC

P4_23

USB1_ VBUS

P5_0 P5_1

aaa – 05 4 5 4 0

Figure 7.MCXN23x 184VFBGA pinout

In Figure 7, the removed pins are labeled “NC” and are highlighted in yellow.

The removed pins on the MCXN23x 184VFBGA are as follows:

· GPIO pins: P0_8 P0_9 P0_10 P0_11 P0_12 P0_13 P0_30 P0_31 P1_20 P1_21 P1_22 P1_23

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P3_3 P3_4 P3_5 P3_19 P5_8 P5_9 · Analog pins: ANA_0 ANA_1 ANA_4 ANA_5 ANA_6 ANA_14 ANA_18 ANA_22 · USB pins: USB0_DM USB0_DP
The pinout of the MCXNx4x 184VFBGA package is shown in Figure 8.

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Migration Guide from MCXNx4x to MCXN23x

1

2

A P1_8 P1_7

3

4

P1_4

5

6

P0_25

7

8

P0_ 21

9

10

P0_17

11

12

P0_9

13

14

P0_5

15

16

17

P0_1 P0_0

B P1_9 P1_6 P1_5 P1_3

P0_24 P0_23 P0_22

P0_16 P0_11 P0_10

P0_4 P0_3 P0_2 P3_0

C

P1_10 P1_2 P1_1 P1_0

P0_20 P0_19 P0_18

P0_8 P0_7 P0_6 P3_1

D P1_13 P1_12 P1_11 P1_14

VSS P0_31

VSS

P0_12 VSS

P3_7 P3_2 P3_3 P3_6

E

P1_15 VSS

P0_30 P0_28

P0_27 P0_14

VSS P3_8

F

P1_30 P1_31

RESE T_B

P1_17

P1_16

P0_29

P0_26

P0_13

P3_4 P3_9 P3_11 P3_10

G

VSS

P1_18 P1_19

VDD

VDD_ P3

P0_15 P3_5

P3_12

H P2_1 P2_0 P2_2

VSS VDD

VDD

VSS VDD_ P3

VDD_ VSS P3

P3_15 P3_13 P3_14

J

P2_3 VSS

VSS

VSS P3_16

K P2_5 P2_6 P2_4

VDD_L P120 DO
CORE

VDD_ P2

VSS

VDD_ CORE

P5_5 P5_6

P3_17 P3_18 P3_19

L

P2_7

P1_22 P1_21

VDD_

P2

VDD_ CORE

P5_7 P5_8

P3_ 21

M P2_9 P2_8 P2_10 P1_23

P4_4

P4_5

P5_2

P5_4

P5_9 P3_23 P3_22 P3_20

N

P2_11

VDD_ P4

P4_6 P4_14

P4_18 P5_3

VSS

VDD_ SYS

P

P4_0

P4_1

ANA_0

VDD_ P4

VSS VSS

P4

VSS_ P4

USB1_ ID

VSS

VDD LDO SYS

VSS DCDC DCDC LX

R

AN A _1

VDD_ ANA

VREF H

VREF L

P4_16 P4_17 P4_19

VDD USB1 USB1 VDD USB DP DM DCDC

T P4_2 ANA_4 ANA_5 P4_7

P4_12 P4_13 P4_15

P4_20 P4_21 P4_22

USB0 USB0 DM DP

VSS

VDD_ BAT

U P4_3 ANA_6

ANA_7

AN A _1 4

ANA _1 8

ANA_ 22

P4_23

USB1_ VBUS

P5_0 P5_1 aaa_054541

Figure 8.MCXNx4x 184VFBGA pinout

4.2 100HLQFP
For the 100HLQFP package, MCXN23x is almost pin-to-pin compatible with MCXN54x. The only difference is the USB pin. The MCXN54x supports full-speed USB (USB0) and high-speed USB (USB1), but the MCXN23x only supports USB1, so the MCXN23x does not have USB0_DM and USB0_DP pins. The pinout of the MCXN23x 100HLQFP package is as shown in Figure 9.

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P1_ 8

1

P1_9

2

P1_10

3

P1_11

4

P1_12

5

P1_13

6

P1_14

7

P1_15

8

RESET_b 9

P1_30

10

P1_ 31

11

VDD_CORE 12

VDD

13

P2_0

14

P2_1

15

P2_2

16

P2_3

17

P2_4

18

P2_5

19

P2_6

20

P2_7

21

P4_0

22

P4_1

23

P4_ 2

24

P4_3

25

P1_7 100

P1_6 99

P1_5 98

P1_4 97

VDD 96

P1_3 95

P1_2 94

P1_1 93

P1_0 92

P0_23 P0_22 P0_21 P0_20 P0_19 P0_18

91

90

89

88

87

86

P0_17 P0_16

85

84

VDO 83

P0_6 82

P0_5 81

P0_4 80

P0_3 79

P0_2 78

P0_1 77

P0_0 76

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

P4_4

P4_5

P4_6

P4_7

V DD_ A NA

VREFH

VREFL VSS_P4 VDD_P4

P4_12

P4_13

P4_15

P4_16

P4_17

USB1 USB1

DP

DM

USB1_ VBUS

VSS_ USB

VDD_ USB

NC

46

47

48

49

50

NC

VDD_ BAT

P5_0

P5_1

P5_2

75

P3_0

74

P3 _1

73 VDD_P3

72

P3_6

71

P3_7

70

P3_8

69

P3_9

68

P3 _10

67

P3_11

66 VDD_P3

65

P3 _12

64

P3_13

63

P3 _14

62

P3 _15

61

P3 _16

60

P3_17

59 VDD_P3

58 VDD_CORE

57

P3_ 20

56

P3_ 21

55 VDD_SYS

54 VDD_DCD

53 DCDC_LX

52 VSS_DCDC

51

P5_3

aaa-05 4542

Figure 9.MCXN23x 100HLQFP pinout

The pinout of the MCXN54x and MCXN94x 100HLQFP package is shown in Figure 10.

N54x

N94x

P1_ 8

P1_8

1

P1_9

2

P1_10

3

P1_11

4

P1_12

5

P1_13

6

P1_14

7

P1_15

8

RESET_b RESET_b 9

P1_30

10

P1_ 31

P1_31

11

VDD_COREVDD_CORE 12

VDD

13

P2_0

14

P2_1

15

P2_2

16

P2_3

17

P2_4

18

P2_5

19

P2_6

20

P2_7

21

P4_0

22

P4_1

23

P4_ 2

P4_2

24

P4_3

25

N54x

N94x

P1_7 P1_7 100

P1_6 P1_6
99

P1_5 P1_5
98

P1_4 P1_4
97

VDD VDD
96

P1_3 P1_3
95

P1 2 P1 2
94

P1_1 P1_1
93

P1_0 P1_0
92

P0_23 P0_22 P0_21 P0_20 P0_19 P0_18 P0_17

91

90

89

88

87

86

85

P0_16 P0_16
84

VDD VDD
83

P0_6 P0_6
82

P0_5 P0_5
81

P0_4 P0_4
80

P0_3 P0_3
79

P0_2 P0_2
78

P0_1 P0_1
77

P0_0 P0_0
76

26 P4_4 P4_4

27 P4_5 P4_5

28 P4_6 P4_6

29 P4_7 P4_7

30

31

32

33

34

35

VDD_A NA

VREFH

VREFL VSS_P4 VDD_P4

P4_12

VDD_A NA

VREFH

VREFL VSS_P4 VDD_P4

P4_12

36 P4_13 P4_13

37 P4_15 P4_15

38 P4_16 P4_16

39

40

41

42

43

P4_17 P4_19 P4_20 P4_21 P4_23

P4_17

USB1_ DP

USB1_ DS

USB1_ VBUS

VSS_ USB

44
VDD USB VDD USB

45

46

USB0 DM
USB0 DM

USB0 DP
USB0 DP

47
VDD BAT VDD BAT

48 P5_0 P5_0

49 P5_1 P5_1

50 P5 _2 P5 _2

N94x

N54x

75

P3_0

74

P3_1

73 VDD_P3 VDD_P3

72

P3_6

71

P3_7

70

P3_8

69

P3_9

68

P3_10

67

P3_11

66 VDD_P3 VDD_P3

65

P3_12

P3 _12

64

P3_13

P3 _13

63

P3_14

P3 _14

62

P3_15

P3 _15

61

P3_16

60

P3_17

P3 _17

59 VDD_P3 VDD_P3

58 VDD_CORE VDD_CORE

57

P3_20

P3_ 20

56

P3 _21

P3_ 21

55 VDD_SYS VDD_SYS

54 VDD_DCDC VDD_DCDC

53 DCDC_LX DCDC_LX

52 VSS_DCDC VSS_DCDC

51

P5 _3

P5_3

N94x

N54x aaa-05 4529

Figure 10.MCXN94x and MCXN54x 100HLQFP pinout

MCXN94x has six pins P4_19, P4_20, P4_21, P4_23, USB0_DM, and USB0_DP. However, MCXN23x does not have these six pins but instead has four different pins USB1_DP, USB1_DM, USB1_VBUS, and VSS_USB.
For more detailed information about the pinouts, refer to the pinout table in the attachments of MCX Nx4x Reference Manual (document MCXNX4XRM) and MCXN23x Reference Manual (document MCXN23XRM).

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5 Peripherals

In Table 1, we have compared the differences between MCNX23x and MCXNx4x. The MCXN23x does not have various modules such as FlexSPI, PowerQuad, NPU, CoolFlux BSP32, uSDHC, EMVSIM, TSI, USB FS, Ethernet, 12-bit DAC, 14-bit DAC, Opamp, SINC Filter, and SCTimer. The following section describes the differences between the common peripherals between the MCXN23x and MCXNx4x.

5.1 GPIO
As described in Section 4.1, the MCXNx4x supports up to 124 GPIOs, and the MCXN23x supports up to 106 GPIOs. However, in the case of MCXN23x, 18 GPIO pins are not supported. Apart from being used as GPIOs, these 16 pins also support the functions listed in Table 5.

Table 5.Removed GPIOs on the MCXN23x 184VFBGA package

184BGA ALL

184BGA ALL Pin Name

Analog

ALT0

ALT1

ALT2

ALT3

ALT4

ALT5

K5

P1_20

ADC1_A20/ P1_20 TRIG_IN2

FC5_P4

FC4_P0

CT3MAT2 SCT0

CMP1_IN3

OUT8

L5

P1_21

ADC1_A21/ P1_21 TRIG_OUT2 FC5_P5

FC4_P1

CT3MAT3 SCT0

CMP2_IN3

OUT9

L4

P1_22

ADC1_A22 P1_22 TRIG_IN3

FC5_P6

FC4_P2

CTINP14 SCT0

OUT4

M4

P1_23

ADC1_A23 P1_23 –

–

FC4_P3

CTINP15 SCT0

OUT5

L14

P5_8

ADC1_B16 P5_8

TRIG_OUT7 –

TAMPER6 –

–

M14

P5_9

ADC1_B17 P5_9

–

TAMPER7 –

–

K17

P3_19

–

P3_19 –

FC7_P6

–

CT2_MAT1 PWM1_X1

G14

P3_5

–

P3_5

–

FC7_P3

–

CT_INP19 PWM0_X3

F14

P3_4

–

P3_4

–

FC7_P2

–

CT_INP18 PWM0_X2

D16

P3_3

–

P3_3

–

FC7_P1

–

CT4_MAT1 PWM0_X1

C12

P0_8

ADC0_B8 P0_8

–

FC0_P4

–

CT_INP0 –

A12

P0_9

ADC0_B9 P0_9

–

FC0_P5

–

CT_INP1 –

B12

P0_10

ADC0_B10 P0_10 –

FC0_P6

–

CT0_MAT0 –

B11

P0_11

ADC0_B11 P0_11 –

–

CT0_MAT1 –

D11

P0_12

ADC0_B12 P0_12 –

FC1_P4

FC0_P0

CT0_MAT2 –

F12

P0_13

ADC0_B13 P0_13 –

FC1_P5

FC0_P1

CT0_MAT3 –

E7

P0_30

ADC0_B22 P0_30 –

D7

P0_31

ADC0_B23 P0_31 –

FC1_P6 –

FC0_P6 –

CT_INP2 CT_INP3 –

ALT6
FLEXIO0 D28
FLEXIO0 D29
FLEXIO0 D30
FLEXIO0 D31
–
–
FLEXIO0 D27
FLEXIO0 D13
FLEXIO0 D12
FLEXIO0 D11
FLEXIO0 D0
FLEXIO0 D1
FLEXIO0 D2
FLEXIO0 D3
FLEXIO0 D4
FLEXIO0 D5
–
–

ALT7

ALT10

SmartDMA_ PIO16

SmartDMA SAI1

PIO17

MCLK

SmartDMA_ PIO18

SmartDMA_ PIO19

–

SmartDMA_ SAI1RX

PIO19

FS

SmartDMA_ PIO5

SmartDMA_ PIO4

SmartDMA_ PIO3

–

ALT11
CAN1_TXD CAN1_RXD –

Table 5 lists the specific pins, including LP_FLEXCOMM0/1/4/5/7, TRIG, CTimer, FlexPWM, FlexIO, SmartDMA, and SAI1 are involved. However, the other pins on the MCX23x can also implement the same functions as these pins. Before migrating from the MCXNx4x to MCXN23x, it is important to check if your design on the MCXNx4x uses these pins. If it does, you must reassign the pins to meet your requirements.

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5.2 USB
All the MCXN54x parts and the MCXN94x 184VFBGA packages support FS USB (USB0) and HS USB (USB1). Whereas the MCXN94x 100HLQFP package only supports HS USB. All the MCXN23x parts only support HS USB.

5.3 DMIC
All parts of the MCXN23x and MCXN54x have a DMIC module and support up to four digital microphone channels. However, for the MCXN94x series, the MCXN946 does not support the DMIC module, and the MCXN947 only supports the DMIC module on the 184VFBGA package.

5.4 LP_FLEXCOMM
The MCXNx4x series supports 10 LP_FLEXCOMM modules. Each LP_FLEXCOMM can be configured as UART, I2C, and SPI. Among them, the IO of LP_FLEXCOMM6/7/8/9 is high-speed IO, and the highest clock that can be configured is 150 MHz. The MCXN23x only supports eight LP_FLEXCOMM modules and does not support LP_FLEXCOMM8 and LP_FLEXCOMM9, only LP_FLEXCOMM6 and LP_FLEXCOMM7 can use high-speed IOs.

5.5 Comparator
The MCXN94x series supports three Comparator (CMP) modules, while the MCXN54x and MCXN23x series only support two CMP modules.

5.6 ADC

The MCXNx4x and MCXN23x series have two 16-bit ADC modules but differ in the number of ADC channels they support. The MCXNx4x can support up to 75 ADC channels, while the MCXN23x can support up to 63 ADC channels. For the 184VFBGA package, the MCXN23x cannot support the 12 ADC channels listed in Table 6 because the 16 pins mentioned in Table 6 are removed.

Table 6.Removed ADC channels on MCXN23x

184BGA ALL Pin Name

Analog

P1_20

ADC1_A20/CMP1_IN3

P1_21

ADC1_A21/CMP2_IN3

P1_22

ADC1_A22

P1_23

ADC1_A23

P5_8

ADC1_B16

P5_9

ADC1_B17

P3_19

–

P3_5

–

P3_4

–

P3_3

–

P0_8

ADC0_B8

P0_9

ADC0_B9

P0_10

ADC0_B10

P0_11

ADC0_B11

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Table 6.Removed ADC channels on MCXN23x…continued

184BGA ALL Pin Name

Analog

P0_12

ADC0_B12

P0_13

ADC0_B13

P0_30

ADC0_B22

P0_31

ADC0_B23

Note: The term ADC channels refer to the external ADC input channels.

5.7 FlexPWM and Quadrature Decoder (QDC)
The MCXN94x and MCXN23x are compatible with dual-motor applications as they support two FlexPWM modules and two QDC modules. But, the MCXN54x supports only one FlexPWM module and one QDC module, making it suitable for single- motor solutions only.

5.8 DMA
The MCXNx4X has two eDMA modules, eDMA0 and eDMA1. Each module supports 16 DMA channels. The MCXN23x also has 2 eDMA modules, but eDMA1 only supports eight channels.

5.9 Anti-tamper pin

The tamper pins for MCXNx4x are listed in Table 7 and Table 8. The MCXNx4x has eight tamper pins, and the MCXN23x has six tamper pins. Pin P5_8 and P5_9 are removed on MCXN23x.
Note: The 100HLQFP packaged parts of MCXN4x and MCXN23x only support two tamper pins.

Table 7.Tamper pins on MCXNx4x
184BGA all 184VFBGA 100HLQFP pin name N94x

M10

P5_2

50

N11

P5_3

51

M12

P5_4

–

K12

P5_5

–

K13

P5_6

–

L13

P5_7

–

L14

P5_8

–

M14

P5_9

–

100HLQFP N94x pin name P5_2 P5_3 –

100HLQFP N54x
50 51 –

100HLQFP N54x pin name P5_2 P5_3 –

ALT0 ALT3

P5_2 P5_3 P5_4 P5_5 P5_6 P5_7 P5_8 P5_9

TAMPER0 TAMPER1 TAMPER2 TAMPER3 TAMPER4 TAMPER5 TAMPER6 TAMPER7

Table 8.Tamper pins on MCXN23x

184BGA ball

184VFBGA pin name

M10

P5_2

N11

P5_3

M12

P5_4

AN14179
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100HLQFP
50 51 –

100HLQFP pin name P5_2
P5_3
–

ALT0
P5_2 P5_3 P5_4

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Table 8.Tamper pins on MCXN23x…continued

184BGA ball

184VFBGA pin name

100HLQFP

K12

P5_5

–

K13

P5_6

–

L13

P5_7

–

100HLQFP pin name –
–
–

ALT0
P5_5 P5_6 P5_7

ALT3
TAMPER3 TAMPER4 TAMPER5

6 Miscellaneous
This section provides details about the boot source and debugging.
6.1 Boot source
The MCXN23x does not have the FlexSPI module and does not support external flash boot, but the MCXNx4x supports external flash boot, which can be configured with the BOOT_CFG field in the Customer Manufacturing/ Factory Configuration Area (CMPA) to implement this function.
6.2 Debug
The MCXNx4x debug module supports ITM, DWT, ETM, ETB W/2KB RAM, and TPIU function, but the ETM and ETB W/2KB functions are removed on the MCXN23x.
6.3 Power management
Power management The power management of MCXN23x and MCXNx4x is identical, so they can use the same power supply circuit.
7 Software
This chapter describes some software considerations when porting the code from the MCXNx4x platform to the MCXN23x platform. In this section, take the hello_world project from the FRDM-MCXN236 SDK as an example, and the IDE is IAR 9.40.1.
7.1 Chip-specified header files
Each SDK project has a device directory containing chip-specific header files. These header files must be replaced when porting code between platforms, see Figure 11.

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Figure 11.Chip-specified header files
7.2 SDK driver
Ensure that the SDK driver directory does not include unsupported modules such as FlexSPI and uSDHC for MCXN23x.
7.3 Start_up file
Replace the start_up file of MCXNx4x with MCXN23x start_up file, as some modules are removed, and the interrupt vector table is different.
7.4 Linker file
The MCXN23x and MCXNx4x can have different Flash and RAM sizes, so the customer must replace the linker file to ensure the Flash and RAM range used in the linker file is suitable.
7.5 IDE-related configuration update
When porting code from the MCXNx4x to MCXN23x, update IDE-related configurations such as path and macro definition, see Figure 12.

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Figure 12.Path and macro definition Note: If the customer does not use the removed pins and peripherals on the MCXN23x, then the customer can directly solder the MCXN23x chip to the MCXNx4x board and can directly use the MCXNx4x software, but the linker file must be updated to match the flash and RAM size of MCXN23x. Currently, this method has only been verified on IAR IDE.

8 Conclusion

This document compares system resources and software differences between the MCXNx4x and MCXN23x, making project migration quick and easy.

9 Related documentation/resources

Table 9 lists additional documents and resources that can be referred to for more information. Some of the documents listed below may be available only under a non-disclosure agreement (NDA). To request access to these documents, contact local field applications engineer (FAE) or sales representative.

Table 9.Related documentation/resources Document MCX Nx4x Reference Manual (document MCXNX4XRM)
MCXN23x Reference Manual (document MCXN23XRM) (document MCXN23XRM)

Link/how to access MCXNX4XRM MCXN23XRM

10 Acronyms and abbreviations
Table 10 defines the acronyms and abbreviations used in this document.

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Table 10.Acronyms and abbreviations

Acronym

Definition

ADC

Analog-to-Digital Converter

CAN

Controller Area Network

CMP

Comparator

CMPA

Customer Manufacturing/Factory Configuration Area

CPU

Central Processing Unit

CRC

Cyclic Redundancy Check

DAC

Digital-to-Analog Converter

DMA

Direct Memory Access

DSP

Digital Signal Processor

DWT

Drop-Weight Tear

ECC

Error Correcting Code

eDMA

Enhanced Direct Memory Access

ETM

Embedded Trace Macrocell

ETB

Embedded Trace Buffer

FlexCAN

Flexible Controller Area Network Interface

FlexIO

Flexible Input/Output

GPIO

General-Purpose Input/Output

HS USB

High-Speed USB

I2C

Inter-Integrated Circuit

ITM

Instrumentation Trace Macrocell

IP

Internet Protocol

LDO

Liquid Crystal Display

LPC

Low Pin Count

MAC

Media Access Control

MCU

Microcontroller Unit

MII

Media-Independent Interface

NDA

Non-Disclosure Agreement

OS

Operating System

QDC

Quadrature Decoder

RTC

Real-Time Clock

TPIU

Trace Port Interface Unit

TSI

Touch System Interface

SAI

Serial Audio Interface

SDK

Software Development Kit

SPI

Serial Peripheral Interface

SRAM

Static Random-Access Memory

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Table 10.Acronyms and abbreviations…continued

Acronym

Definition

RAM

Random-Access Memory

RMII

Reduced Media Independent Interface

TPIU

Trace Port Interface Unit

UART

Universal Asynchronous Receiver Transmitter

USB

Universal Serial Bus

VREF

Voltage Reference

11 Note about the source code in the document

Example code shown in this document has the following copyright and BSD-3-Clause license:
Copyright 2024 NXP Redistribution and use in source and binary forms, with or without modification, are permitted provided that the following conditions are met:
1. Redistributions of source code must retain the above copyright notice, this list of conditions and the following disclaimer.
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12 Revision history

Table 11 summarizes the revisions to this document.

Table 11.Revision history

Document ID

Release date

AN14179 v.1.0

06 May 2024

Description Initial public version

AN14179
Application note

All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 May 2024

NXP Semiconductors

AN14179
Migration Guide from MCXNx4x to MCXN23x

Legal information
Definitions
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Disclaimers
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Trademarks
Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.

AN14179
Application note

All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 May 2024

NXP Semiconductors

AN14179
Migration Guide from MCXNx4x to MCXN23x

AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINKPLUS, ULINKpro, Vision, Versatile — are trademarks and/or registered trademarks of Arm Limited (or its subsidiaries or affiliates) in the US and/or elsewhere. The related technology may be protected by any or all of patents, copyrights, designs and trade secrets. All rights reserved.
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MCX — is a trademark of NXP B.V.

AN14179
Application note

All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 May 2024

NXP Semiconductors

Contents

1

Introduction ……………………………………………… 2

2

Memory ……………………………………………………. 5

2.1

Flash memory …………………………………………….5

2.2

SRAM memory ………………………………………….. 6

3

Clock system …………………………………………… 7

3.1

FRG …………………………………………………………. 7

3.2

UTICK ………………………………………………………. 8

3.3

I3C …………………………………………………………… 8

4

Pinout ……………………………………………………….9

4.1

184VFBGA …………………………………………………9

4.2

100HLQFP ………………………………………………. 12

5

Peripherals …………………………………………….. 14

5.1

GPIO ………………………………………………………. 14

5.2

USB …………………………………………………………15

5.3

DMIC ……………………………………………………….15

5.4

LP_FLEXCOMM ………………………………………. 15

5.5

Comparator ……………………………………………… 15

5.6

ADC ……………………………………………………….. 15

5.7

FlexPWM and Quadrature Decoder (QDC) ….. 16

5.8

DMA ……………………………………………………….. 16

5.9

Anti-tamper pin ………………………………………… 16

6

Miscellaneous ………………………………………… 17

6.1

Boot source …………………………………………….. 17

6.2

Debug …………………………………………………….. 17

6.3

Power management …………………………………..17

7

Software ………………………………………………….17

7.1

Chip-specified header files ………………………… 17

7.2

SDK driver ………………………………………………. 18

7.3

Start_up file …………………………………………….. 18

7.4

Linker file ………………………………………………… 18

7.5

IDE-related configuration update ………………… 18

8

Conclusion …………………………………………….. 19

9

Related documentation/resources …………… 19

10

Acronyms and abbreviations ………………….. 19

11

Note about the source code in the

document ………………………………………………..21

12

Revision history ………………………………………21

Legal information …………………………………….22

AN14179
Migration Guide from MCXNx4x to MCXN23x

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.