Cactus 270PM6 Industrial 3D TLC M.2 SSD User Manual
- September 3, 2024
- CACTUS
Table of Contents
270PM6 Industrial 3D TLC M.2 SSD
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Specifications
System Environmental Specifications
Temperature| Operating:| Humidity:| Vibration:| Shock:| Altitude (relative to
sea level):
---|---|---|---|---|---
| 8% to 95%, non-condensing| 16.4G, MIL-STD-810F Method 514.5, Procedure 1| 50
G, MIL-STD-810F Method 516.5, Procedure 1| 100,000 feet maximum
System Power Requirements
| DC Input Voltage (VCC) | 128GB | 256GB | 512GB |
|---|---|---|---|
| (Maximum Average Value) | See Notes. | Idle: 190mA, Read: 1040mA, Write: 880mA | |
| Idle: 190mA, Read: 1130mA, Write: 1010mA | Idle: 190mA, Read: 1130mA, Write: |
1140mA
NOTES: All values quoted are typical at ambient
temperature and nominal supply voltage unless otherwise stated.
Idle mode is specified under the condition that all drive inputs
are static CMOS levels and in a Not Busy operating state.
System Performance
All performance timings assume the drive controller is in the
default (i.e., fastest) mode.
Product Usage Instructions
Installation
-
Locate the M.2 slot on your device.
-
Carefully insert the M.2 SSD into the slot at a 30-degree
angle. -
Gently push down and secure the SSD in place with the screw
provided.
Data Management
Ensure regular backups of your data to prevent loss in case of
drive failure.
Maintenance
Clean the contacts of the SSD with a soft, dry cloth to maintain
proper connectivity.
Troubleshooting
If experiencing issues, refer to the user manual for error codes
and possible solutions.
Frequently Asked Questions (FAQ)
Q: What should I do if my M.2 SSD is not recognized by the
system?
A: Check if the SSD is properly installed in the M.2 slot and
ensure compatibility with your system’s interface.
Q: How often should I perform data backups?
A: It is recommended to perform data backups regularly,
depending on your usage frequency and criticality of data.
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Industrial 3D TLC -270PM6 series M.2 SSD Product Manual
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The information in this manual is preliminary and is subject to change without
notice. Cactus Technologies ® , Limited shall not be liable for technical or
editorial errors or omissions contained herein; nor for incidental or
consequential damages resulting from the furnishing, performance, or use of
this material.
Cactus Technologies® makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Cactus
Technologies® assume any liability arising out of the application or use of
its products, and specifically disclaims any and all liability, including
without limitation consequential or incidental damages.
Cactus Technologies® products are not designed, intended or authorized for use
as components in systems intended for surgical implant into the body or in
other applications intended to support or sustain life or for any application
where the failure of a Cactus Technologies® product can result in personal
injury or death. Users of Cactus Technologies® products for such unintended
and unauthorized applications shall assume all risk of such use and shall
indemnify and hold Cactus Technologies® and its officers, employees,
subsidiaries, affiliates and distributors harmless against all claims, costs,
damages, expenses and attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended and
unauthorized use, even if such claim alleges that Cactus Technologies® was
negligent regarding the design or manufacture of the part.
All parts of the Cactus Technologies® documentation are protected by copyright
law and all rights are reserved. This documentation may not, in whole or in
part, be copied, photocopied, reproduced, translated, or reduced to any
electronic medium or machine-readable form without prior consent, in writing,
from Cactus Technologies®, Limited.
© 2005-2023 Cactus Technologies® Limited. All rights reserved.
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Table of Contents
1. Introduction to Cactus Technologies® Industrial 3D TLC -270PM6 Series M.2
SSD Products…………………………..5 1.1. Supported
Standards………………………………………………………………………………………………………………….6 1.2. Product
Features……………………………………………………………………………………………………………………….6 1.2.1. Host and
Technology Independence…………………………………………………………………………………..6 1.2.2. Defect and
Error Management…………………………………………………………………………………………..6 1.2.3. Power Supply
Requirements……………………………………………………………………………………………..7
2. Product Specifications……………………………………………………………………………………………………………………………….7
2.1. System Environmental Specifications………………………………………………………………………………………….7
2.2. System Power Requirements………………………………………………………………………………………………………7 2.3.
System Performance………………………………………………………………………………………………………………….8 2.4. System
Reliability……………………………………………………………………………………………………………………..8 2.5. Physical
Specifications………………………………………………………………………………………………………………9 2.5.1. M.2 2242 SSD
Physical Specifications……………………………………………………………………………….9
3. Interface Description……………………………………………………………………………………………………………………………….10
3.1. M.2 SSD Pin Assignments and Pin Type……………………………………………………………………………………10
4. Electrical
Specifications…………………………………………………………………………………………………………………………..12 4.1.1.
Absolute Maximum Ratings…………………………………………………………………………………………….12 4.1.2. DC
Characteristics………………………………………………………………………………………………………….12 4.1.3. AC
Characteristics………………………………………………………………………………………………………….13
5. PCI Configuration…………………………………………………………………………………………………………………………………..13
5.1. PCI Express Capabilities………………………………………………………………………………………………………….14 5.2.
NVM Express Registers…………………………………………………………………………………………………………..15 5.2.1.
Controller Capabilities (CAP)………………………………………………………………………………………….16 5.2.2.
Version (VS)………………………………………………………………………………………………………………….16 5.2.3. Interrupt
Mask Set (INTMS)……………………………………………………………………………………………16 5.2.4. Interrupt Mask
Clear (INTMC)………………………………………………………………………………………..17 5.2.5. Controller
Configuration (CC)…………………………………………………………………………………………17 5.2.6. Controller
Status (CSTS)…………………………………………………………………………………………………17 5.2.7. NVM Subsystem
Reset (NSSR)……………………………………………………………………………………….18 5.2.8. Admin Queue Attributes
(AQA)………………………………………………………………………………………18 5.2.9. Admin Submission Queue Base
Address (ASQ)………………………………………………………………..18 5.2.10. Admin Completion Queue Base
Address (ACQ)………………………………………………………………19 5.2.11. Controller Buffer Memory
Location (CMBLOC)…………………………………………………………….19 5.2.12. Controller Buffer Memory
Size (CMBSZ)………………………………………………………………………19 5.2.13. Boot Partition Info
(BPINFO)………………………………………………………………………………………..20 5.2.14. Boot Partition Read
Select (BPRSEL)…………………………………………………………………………….20 5.2.15. Boot Partition Memory
Buffer Location (BPMBL)…………………………………………………………..20 5.2.16. Submission Queue y
Tail Doorbell (SQyTDBL)………………………………………………………………20 5.2.17. Completion Queue y
Head Doorbell (CQyHDBL)……………………………………………………………20
6. Identify Command………………………………………………………………………………………………………………………………….20 6.1.
Identify Controller Data Struture……………………………………………………………………………………………….21
7. SMART Reporting………………………………………………………………………………………………………………………………….24 7.1.
SMART Attributes………………………………………………………………………………………………………………….24
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8. Device Features………………………………………………………………………………………………………………………………………25 9.
Ordering Information……………………………………………………………………………………………………………………………..28
Appendix A. Technical Support
Services………………………………………………………………………………………………………29 Appendix B. Cactus
Technologies® Worldwide Sales Offices………………………………………………………………………….30 Appendix
C. Limited Warranty……………………………………………………………………………………………………………………31
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1.Introduction to Cactus Technologies® Industrial
3D TLC -270PM6 Series M.2 SSD Products
Features:
· Solid state design with no moving parts
· conformal coated
· Equipped with heat spreader (standard temp. version) or heat sink (extended
temp. version) for thermal management
· Capacities of 128/256/512GB
· Available in M.2 2242 form factor
· Native NVMe interface
· Compliant with PCI Express base specifications, ver.3.1
· Compliant with NVMExpress specifications, ver.1.3
· PCI Express Gen3 x4 configuration
· Supports ASPM L1.0, L1.1, L1.2
· Supports NVMe defined SMART attributes
· Supports 16 I/O queues w/ max. queue depth of 32 each
· LDPC error correction
· End-to-End datapath protection
· -40°C to 85°C operation
· Voltage support: 3.3V±5%
Cactus Technologies® Industrial 3D TLC M.2 PCIe SSD is a high capacity solid-
state flash memory product that complies with the PCI Express base standard
v3.1 and NVM Express v1.3 standard. It is a PCIe device that operates in
native NVMe mode. Cactus Technologies® Industrial 3D TLC M.2 SSD provides up
to 512GB of formatted storage capacity. Cactus Technologies® Industrial 3D TLC
M.2 SSD product uses high quality industrial grade 3D TLC (gTLC) NAND flash
memory from Kioxia Corporation. In addition, it includes an on-drive
intelligent controller that manages interface protocols, data storage and
retrieval as well as ECC, defect handling and diagnostics, power management,
and clock control. The controller’s firmware is upgradeable, thus allowing
feature enhancements and firmware updates while keeping the BOM stable.
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1.1. Supported Standards
Cactus Technologies® M.2 SSD is fully compatible with the following
specification: · PCI Express base specification, ver. 3.1, published by PCI-
SIG · NVM Express Specification 1.3 published by NVM Express Organization
1.2. Product Features
Cactus Technologies® Industrial 3D TLC M.2 SSD contains a high level,
intelligent controller. This intelligent controller provides many capabilities
including the following:
· Standard NVMe register and command set · Manages details of erasing and
programming flash memory independent of the host
system · Sophisticated defect managing capabilities (similar to magnetic disk
drives). · Sophisticated system for error recovery using powerful error
correction code (ECC). · Intelligent power management for low power operation.
1.2.1.
Host and Technology Independence
Cactus Technologies® Industrial 3D TLC M.2 SSD operates in native NVMe mode. To write or read to the device, the host computer software simply issues a PCI memory Read or Write command to the drive as per the PCI Express protocol. The host software then waits for the command to complete. The host system does not get involved in the details of how the flash memory is erased, programmed or read as this is all managed by the built-in controller in the drive. Also, with the intelligent on-board controller, the host system software will not require changing as new flash memory evolves. Thus, systems that support the Cactus Technologies® Industrial 3D TLC M.2 SSD products today will continue to work with future Cactus Technologies® Industrial 3D TLC M.2 SSDs built with new flash technology without having to update or change host software.
1.2.2.
Defect and Error Management
Cactus Technologies® Industrial 3D TLC M.2 SSD contains a sophisticated defect and error management system similar to those found in magnetic disk drives. The defect management is completely transparent to the host and does not consume any user data space. The soft error rate for Cactus Technologies® Industrial 3D TLC M.2 SSD is much lower than that of magnetic disk drives. In the extremely rare case where a read error does occur, the drive has sophisticated ECC to recover the data. These defect and error management systems, coupled with the solid-state construction, give Cactus Technologies® Industrial 3D TLC M.2 SSDs unparalleled reliability.
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1.2.3. Power Supply Requirements
Cactus Technologies® Industrial 3D TLC M.2 SSD operates at a voltage range of
3.3 volts ± 5%.
2.Product Specifications
For all the following specifications, values are defined at ambient
temperature and nominal supply voltage unless otherwise stated.
2.1. System Environmental Specifications
Table 2-1. Environmental Specifications
Cactus Technologies® Industrial 3D TLC M.2 SSD
Temperature
Operating:
0°C to 70°C (standard temp.) -40° C to +85° C (extended temp.)
Humidity
Operating & NonOperating:
8% to 95%, non-condensing
Vibration
Operating & NonOperating:
16.4G, MIL-STD-810F Method 514.5, Procedure 1
Shock
Operating & NonOperating:
50 G, MIL-STD-810F Method 516.5, Procedure 1
Altitude (relative to Operating & Non-
sea level)
Operating:
100,000 feet maximum
2.2. System Power Requirements
Table 2-2. Power Requirements
DC Input Voltage (VCC) 100 mV max. ripple (p-p)
(Maximum Average Value) See Notes.
Cactus Technologies® Industrial 3D TLC M.2 SSD
128GB 256GB 512GB
3.3V ±5%
Idle: 190mA 200mA
190mA
Read: 1040mA Write 880mA
1130mA 1010mA
1130mA 1140mA
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NOTES: All values quoted are typical at ambient temperature and nominal supply
voltage unless
otherwise stated.
Idle mode is specified under the condition that all drive inputs are static
CMOS levels and in a “Not Busy” operating state.
2.3. System Performance
All performance timings assume the drive controller is in the default (i.e., fastest) mode.
The IOPS numbers are steady state values when the SLC cache partition is
already full.
Note: Due to the high throughput of PCIe interface, the drive controller
implements thermal throttling to prevent excessive die temperature which will
damage the device. Thermal throttling will kick in when internal die
temperature reaches 90°C. The drive’s rd/wr performance will drop
significantly when thermal throttling kicks in. It is advised that the user
provides adequate air flow in their system to reduce the likelihood of thermal
throttling from happening.
Table 2-3. Performance
Seq. Read (25°C) Seq. Read (70°C standard temp.) (85°C extended temp.)
Seq. Write (SLC partition) Seq. Write (TLC partition) Seq. Write (70°C
standard temp.) (85°C extended temp.)
Random 4K read Queue depth=32
Random 4K write Queue depth=32
Random 4K read IOPS Queue depth=32
Random 4K write IOPS Queue depth=32
128GB 1.4GB/s
1.0GB/s 500MB/s 140MB/s
500MB/s 100MB/s
7MB/s
26000
1700
256GB 1.6GB/s
1.0GB/s
512GB 1.6GB/s
1.0GB/s
1GB/s
1.4GB/s
250MB/s 500MB/s
780MB/s 850MB/s
190MB/s 300MB/s
15MB/s 24MB/s
47000
76000
3600
5900
.
2.4. System Reliability
Data Reliability
Endurance (estimated TBW): 128GB 256GB 512GB
Table 2-4. Reliability
< 1 non-recoverable error in 1014 bits READ Up to: 384TB 768TB 1536TB
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Note: estimated TBW assumes workload consisting of mostly large block writes;
estimated TBW will be significantly reduced for workloads consisting of mostly
random, small block writes. Data retention requirements are not considered in
this estimation.
2.5. Physical Specifications
The following sections provide the physical specifications for Cactus
Technologies® Industrial 3D TLC M.2 SSD products.
2.5.1. M.2 2242 SSD Physical Specifications
Note: the top side thickness is without the heat spreader. Heat spreader adds approximately 0.4mm to the thickness.
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2-1. M.2 2242 SSD Dimensions
2-2. M.2 2242 SSD Heat Sink Dimensions (for extended temp. version)
3.Interface Description
The following sections provide detailed information on the Cactus
Technologies® Industrial 3D TLC M.2 SSD interface.
3.1. M.2 SSD Pin Assignments and Pin Type
The signal/pin assignments and descriptions are listed in Table 3-5. Note that
the pinout definitions are from the perspective of the device.
Table 3-5. M.2 SSD Pin Assignments and Pin Type
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Pin # 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59
Pin Name GND GND PETn3 PETp3 GND PERn3 PERp3 GND PETn2 PETp2 GND PERn2 PERp2
GND PETn1 PETp1 GND PERn1 PERp1 GND PETn0 PETp0 GND PERn0 PERp0 GND
REFCLKn REFCLKp
GND
Description PCIe Reference Clock
Pin # 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60
Pin Name 3.3V 3.3V
Reserved Reserved
LED1# 3.3V 3.3V 3.3V 3.3V Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved PERST# CLKREQ# PEWAKE# MFG_1 MFG_2
Description 3.3V supply LED for Drive activity
PCIe reset PCIe clock request Not used Reserved for manufacturer use Reserved
for manufacture use
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Pin # 61 63 65 67 69 71 73 75
Pin Name
Description M Key
DNU NC GND GND GND
Pin # 62 64 66 68 70 72 74 76
Pin Name
Description M Key
SUSCLK 3.3V 3.3V 3.3V
32kHz clock input; not used
4.Electrical Specifications
The following table defines all D.C. Characteristics for the M.2 SSD products.
Unless otherwise stated, conditions are:
Vcc = 3.3V ± 5% Ta = -40°C to 85°C
4.1.1.
Absolute Maximum Ratings
Parameter
Storage Temperature Operating Temperature Vcc with respect to GND
Symbol
Ts TA Vcc
MIN
-55 -40 -0.3
MAX
100 85 3.6
Units
oC oC V
4.1.2.
DC Characteristics
Parameter
Input Voltage Output Voltage Input Leakage Current Output Leakage Current
Input/Output Capacitance Operating Current
Idle Active
Symbol
Vin Vout
ILI ILO CI/Co ICC
MIN
-0.5 -0.3 -10 -10
MAX
Vcc + 0.5 Vcc + 0.3
10 10 10
210 1160
Units
V V uA uA pF mA
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4.1.3. AC Characteristics
Cactus Technologies® M.2 SSD products conforms to all AC timing requirements
as specified in the PCI Express base specifications. Please refer to that
document for details of AC timing for all operation modes of the device.
5.PCI Configuration
Cactus Technologies® M.2 SSD is a PCIe device. The following table shows the PCI Configuration Register values for this device:
address 00h 04h 08h
0Ch
10h 14h 18h 1Ch 20h 24h 28h 2Ch
30h 34h
38h
Bit[31:24] Bit[23:16] Bit[15:8] Bit[7:0]
Device ID : 2263h
Vendor ID: 1E3Ah
Status: 0010h
Command
Class Code : 010802h Mass Storage Controller
Revision ID: 03h
Non-volatile Memory
NVM Express
BIST
Header Latency Cacheline
Type: 00h Timer:
Size
Base Address Registers
Cardbus CIS Pointer: N/A
Subsystem ID: 2263h Subsystem Vendor ID: 1E3Ah
Expansion ROM Base Address
Reserved
Capabilities Pointer: N/A
Reserved
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address 3Ch
Bit[31:24] Bit[23:16] Bit[15:8] Bit[7:0]
Max Lat: Min Gnt: Interrupt Interrupt
00h
00h
Pin
Line
5.1. PCI Express Capabilities
Cactus Technologies® Industrial 3D TLC grade M.2 SSD supported PCI Express capabilities are listed in the following table, please consult PCI Express Specifications for detailed explanation of the capabilities:
Capability
Register
Description
PCI Express
Ver. 2; PCIe Endpoint; Slot not Implemented
Device Capabilities
Max. payload size: 128 bytes; Phantom Function Supported: 0; Extended Tag Field supported: 5-bit; EndPoint L0s latency: unlimited; EndPoint L1 latency: unlimited; Role-based Error Reporting: supported; Slot Power Limit: 75W; Function Level Reset: supported
Device Control Set by host
Device Status
Reported Status: Correctable Error Detected, Non-Fatal Error Detected, Fatal Error Detected, Unsupported Request Detected, Aux Power Detected, Transaction Pending
Link Capabilities
8GT/s, 4 lanes; ASPM L1 supported; L0s Exit Latency: 512ns – 1us; L1 Exit Latency: 4 – 8us; Clock Power Management: supported; Surprise Down Error Reporting: not supported; Data Link Layer Link Active Reporting: not supported; Link Bandwidth Notification: not supported; ASPM: supported
Link Control
Set by host
Link Status
Reported Status: Current Link Speed, Negotiated Link Width, Slot Clock Configuration
Device Capabilities 2
Completion Timeout Range: ABCD; Completion Timeout Disable: supported; LTR Mechanism: supported; OBFF: not supported; Extended Fmt Field: not supported
Device Control 2 Set by host
Link Capabilities 2 Supported Link Speeds: 2.5/5.0/8.0 GT/s; Crosslinks: not supported
Link Control 2 Set by host
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Capability
Register
Description
Link Status 2
Reported Status: Current De-emphasis Level, Equalization Complete, Equalization Phase 1 Successful, Equalization Phase 2 Successful, Equalization Phase 3 Successful, Link Equalization Request
MSI
64-bit address capable; Per vector masking supported
MSI-X
MSI-X table size: 16; Per Vector Mask Bit
Power Management
Complies with v3 of PCI Power Management Interface; DSI not required; PME# not supported; PME# assertion in D0, D1, D2, D3 not supported; Aux Current Required=0
Power Management Control/Status
Reported Status: No_Soft_Reset
Extended Capabilities
Latency Tolerance Capability version 1; Max Snoop Latency: 71680ns; Max No- Snoop
Reporting
Latency: 71680ns
L1 PM Substate
Version 1; PCI-PM L1.1, L1.2 supported; ASPM L1.1, L1.2 supported; L1 PM Substates supported; Port Common Mode Restore Time: 10us; Port T_Power_On Value: 10us
L1 PM Substate Set by host Control 1
L1 PM Substate Set by host Control 2
Advanced Error Reporting
Capability version 2; Implemented Registers: Uncorrectable Error Status, Uncorrectable Error Mask, Uncorrectable Error Severity, Correctable Error Status, Correctable Error Mask, Advanced Error Capabilities and Control, Header Log
Secondary PCI Express Extended Capability
Capability version 1;
Link Control 3 Set by host
Lane Error Status
Lane Equalization Set by host, one register per lane Control
5.2. NVM Express Registers
The following sections describe the NVMe register contents of Cactus
Technologies® Industrial 3D TLC grade M.2 SSD.
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5.2.1.
Controller Capabilities (CAP)
This 64-bit register indicates basic capabilities of the controller.
Bit(s) 63:56 55:52 51:48 47:46 45 44:37 36 35:32
31:24 23:19 18:17 16
15:0
Name Value Description
Reserved
MPSMAX 0
Memory Page Size Max: 8192
MPSMIN 0
Memory Page Size Min: 4096
Reserved
BPS
0
Boot Partition: not supported
CSS
1
Command Set Supported: NVM command set
NSSRS 0
NVMe Subsystem Reset Supported: Yes
DSTRD 0
Doorbell Stride: 4 bytes, this indicates there is no gap between doorbells registers
TO
78h TimeOut for CSTS.RDY to switch states: 120s
Reserved
AMS
00
Arbitration Mechanism Supported: Round robin
CQR
1
Contiguous Queue Required. I/O submission and completions queues must be physically contiguous.
MQES 3FFFh Max. Queue Entries Supported for I/O queues: 16384
5.2.2.
Version (VS)
This 32-bit register indicates the NVMe Specification supported by the device. Cactus Technologies® Industrial 3D TLC grade M.2 SSD supports NVMe Specification v1.3.
Bit(s) 31:16 15:8 7:0
Name MJR MNR TER
Value Description
0001h Major Version Number: 1
03h Minor Version Number: 3
0
Tertiary Version Number: 0
5.2.3.
Interrupt Mask Set (INTMS)
This 32-bit register is used to mask interrupts if legacy or MSI interrupts are used, this register is not used if MSI-X interrupts are used.
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Bit(s) 31:0
Name IVMS
Value
Description
Interrupt Vector Mask Set. Each bit that is set to `1′ masks the corresponding
interrupt vector.
5.2.4.
Interrupt Mask Clear (INTMC)
This 32-bit register is used to clear interrupt masks if legacy or MSI interrupts are used, this register is not used if MSI-X interrupts are used.
Bit(s) 31:0
Name IVMC
Value
Description
Interrupt Vector Mask Clear. Each bit that is set to `1′ clears the
corresponding interrupt vector mask.
5.2.5.
Controller Configuration (CC)
This 32-bit register is written by the host to modify settings for the drive controller.
Bit(s) 31:24 23:20 19:16 15:14 13:11 10:7 6:4 3:1 0
Name Value Description
Reserved
IOCQES
I/O Completion Queue Entry Size
IOSQES
I/O Submission Queue Entry Size
SHN
Shutdown Notification
AMS
Arbitration Mechanism Selected
MPS
Memory Page Size
CSS
I/O Command Set Selected
Reserved
EN
Enable. Host writes `1′ to this bit to enable the device to start processing
commands.
5.2.6.
Controller Status (CSTS)
This 32-bit register provides status information of the drive controller.
Bit(s) 31:6
Name
Value Description Reserved
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Bit(s) 5 4 3:2 1 0
Name PP NSSRO SHST CFS RDY
Value Description
Process Paused. When set to 1′, it indicates the drive controller has stopped processing commands NVM Subsystem Reset Occurred. When set to1′, it indicates a reset has
occurred while powered up.
Shutdown Status. 00b: Normal, no shutdown requested; 01b: shutdown processing
occuring; 10b: shutdown processing complete; 11b: reserved
Controller Fatal Status. A value of 1′ indicates a fatal controller error has occurred. Ready. A value of1′ indicates the drive controller is ready to accept
commands
5.2.7. NVM Subsystem Reset (NSSR)
Host writes a value of 4E564D65h to this register to request a NVM Susbsystem
Reset. A write of any other values to this register has no effect. A read of
this register always returns zeroes. This register is supported only if the
NSSRS bit is set.
5.2.8. Admin Queue Attributes (AQA)
This 32-bit register contains attributes for the Admin Submission and Completion queues.
Bit(s) 31:28 27:16 15:12 11:0
Name ACQS ASQS
Value Description Reserved Admin Completion Queue Size: 32 Reserved Admin Submission Queue Size: 32
5.2.9. Admin Submission Queue Base Address (ASQ)
This 64-bit register is written by the host to set the Admin Submission Queue
Base Address.
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5.2.10. Admin Completion Queue Base Address (ACQ)
This 64-bit register is written by the host to set the Admin Completion Queue
Base Address.
5.2.11. Controller Buffer Memory Location (CMBLOC)
This 32-bit register contains the location of the drive’s Controller Buffer Memory. If the Controller Buffer Memory Size (CMBSZ) register content is zero, this register is reserved.
Bit(s) 31:12
Name OFST
11:3
2:0
BIR
Value Description
Offset. This indicates the offset of the Controller Buffer Memory in multiples
of the size unit indicated in CMBSZ. This value is 4KB aligned.
Reserved
Base Indicator Register. This indicates the Base Address Register (BAR) that
contains the Controller Buffer Memory.
5.2.12. Controller Buffer Memory Size (CMBSZ)
This 32-bit register defines the size of the drive’s Controller Buffer Memory.
Bit(s) 31:12
Name SZ
11:8 7:5 4 3 2 1
0
SZU
WDS RDS LISTS CQS
SQS
Value Description
0
Size. This indicates the size of the Controller Buffer Memory in multiples
of the size unit indicated in bit[2:0]. Cactus Technologies® M.2 SSD
does not support Controller Buffer Memory.
0
Size Unit.
Reserved
0
Write Data Support. All write data must be transferred from host memory.
0
Read Data Support. All read data must be transferred to host memory.
0
PRP SGL Support. All PRP and SGL lists must be placed in host memory.
0
Completion Queue Support. All Completion Queues must be placed in
host memory.
0
Submission Queue Support. All Submission Queues must be placed in
host memory.
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5.2.13. Boot Partition Info (BPINFO) Cactus Technologies® M.2 SSD does not
support Boot Partition, this register will read back zeroes.
5.2.14. Boot Partition Read Select (BPRSEL) Cactus Technologies® M.2 SSD does
not support Boot Partition, this register will read back zeroes.
5.2.15. Boot Partition Memory Buffer Location (BPMBL) Cactus Technologies® M.2
SSD does not support Boot Partition, this register will read back zeroes.
5.2.16. Submission Queue y Tail Doorbell (SQyTDBL)
This 32-bit register defines the Tail entry pointer for submission queue y. There is one tail doorbell register for each submission queue. The register for queue y is located at (1000h + ((2y)*(4<<CAP.DSTRD))).
Bit(s) 31:16 15:0
Name SQT
Value Description Reserved Submission Queue Tail
5.2.17. Completion Queue y Head Doorbell (CQyHDBL)
This 32-bit register defines the Head entry pointer for completion queue y. There is one head doorbell register for each completion queue. The register for queue y is located at (1000h + ((2y+1)*(4<<CAP.DSTRD))).
Bit(s) 31:16 15:0
Name CQH
Value Description Reserved Completion Queue Head
6.Identify Command
The Identify command is an Admin command that retrieves information about the
NVM subsystem. The returned structure is 4096 bytes and the following section
describes the contents of this structure in Cactus Technologies® Industrial 3D
TLC grade M.2 SSDs.
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6.1. Identify Controller Data Struture
Byte(s) 1:0
3:2 23:4 63:24 71:64 72 75:73 76 77 79:78 83:80 87:84 91:88 95:92 99:96
239:100 254:240 255 257:256
258 259 260 261
262 263 264 265 267:266
Name VID SSVID SN MN FR RAB IEEE CMIC MDTS CNTLID VER RTD3R RTD3E OAES CTRATT
OACS
ACL AERL FRMW LPA
ELPE NPSS AVSCC APSTA WCTEMP
Value
Description
1E3Ah 1E3Ah varies Fixed varies 6 0 0 5 1 10300h 7A120h 1E8480h 200h 0
0 17h
4 7 14h Fh
255 4 0 1 348
PCI Vendor ID. This is PCISIG assigned Vendor ID for Cactus Technologies®
PCI Subsystem ID. This field returns product specific serial number. This
field returns manufacturer’s name. For this product, the returned string is:
CactusFlashCard Firmware version. Recommended Arbitration Burst size in bytes.
IEEE OUI Identifier. Not applicable for this product. Controller Multipath I/O
and Namespace Sharing Capacbilities: Single Port, Single Controller, PCI
function. Max. Data Transfer Size: 2^5 x MPSMIN Controller ID. Version: NVM
Express 1.30 RTD3 Resume Latency. Resume time from Runtime D3 : 500ms RTD3
Entry Latency. Latency to enter Runtime D3: 2s Optional Asynchronous Events
Supported: Firmware Activation Notices supported Controller Attributes:
128-bit host identifier not supported; Non-operational State Power State
Permissive Mode not supported Reserved Reserved Management Endpoint
Capabilities: none Optional Admin Command Support Security Send & Receive
commands: supported Format NVM command: supported Firmware commit and
Download: supported Namespace management & Attachment commands: not supported
Device Self-test: supported Abort Command Limit Asynchronous Event Request
Limit Firmware Updates: Firmware Slot 1 Rd/Wr; 2 firmware slots; firmware
activation without reset supported Log Page Attributes: SMART Log page per
namespace supported, Command Effects Log page supported, Extended data for Get
Log Page supported, Telemetry log page supported Error Log Page Entries Number
of Power States Support Admin Vendor Specific Command Configuration: Vendor
Specific Autonomous Power State Transition Attributes: Autonomous Power State
Transition supported Warning Composite Temperature Threshold: 348K (75C)
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Byte(s) 269:268 271:270 275:272 279:276 295:280
311:296 315:312 317:316 318
319 321:320 323:322 325:324 327:326 331:328 511:332 512 513 515:514 519:516
521:520
523:522
524
525 527:526
529:528
530
531 533:532
535:534 539:536 767:540
Name
Value
CCTEMP 353
MTFA
50
HMPRE 0
HMMIN
0
TNVMCAP 0
UNVMCAP 0
RPMBS 0
EDSTT
5
DSTO
1
FWUG
0
KAS
0
HCTMA 1
MNTMT 303
MXTMT 348
SANICAP 2
SQES
66h
CQES
44h
MAXCMD 0
NN
1
ONCS
5Fh
FUSES
0
FNA
0
VWC
7
AWUN
0
AWUPF 0
NVSCC 0
ACWU
0
SGLS
0
Description
Critical Compostie Temperature Threshold: 353K (80C) Max. Firmware Activation
Time: 5s Host Memory Buffer Prefer Size: HBM not supported Host Memory Buffer
Min. Size: HBM not supported Total NVM Capacity: Not reported as Namespace
Mangement & Attachment commands are not supported Unallocated NVM Capacity:
not reported Replay Protected Memory Block Support: not supported Extended
Device Self-test Time: 5 mins Device Self-test Option: one device self-test
operation at a time Firware Update Granularity: no information provided Keep
Alive Support: not supported Host Controlled Thermal Management Attribute:
supported Min. Thermal Management Temperature: 30C Max. Thermal Management
Temperature: 75C Sanitize Capabilities: Block Erase Sanitize supported
Reserved Submission Queue Entry Size. Required: 64, Max: 64 Completion Queue
Entry Size. Required: 16, Max: 16 Max Outstanding Command: not applicable
Number of Namespaces: 1 Optional NVM Command Support: Compare Command:
supported Write Uncorrectable Command: supported Dataset Management Command:
supported Write Zeroes Command: supported Save and Select Fields: supported
Reservations: not supported Timestamp: supported Fused Operation Support:
Fused Compare and Write operation not supported Format NVM Attributes: Format
applies to single namespace, Crypto and user data erase applies to single
namespace, Cryptoerase not supported as part of Secure Erase Volatile Write
Cache: present Atomic Write Unit Normal: size of write unit guaranteed to be
written atomically during normal operation Atomic Write Unit Power Fail: size
of write unit guaranteed to be written atomically during power fail or error
condition NVM Vendor Specific Command Configuration: Vendor specific Reserved
Atomic Compare & Write Unit: size of write unit guaranteed to be written
atomically during a fused compare and write operation Reserved SGL Support:
not supported Reserved
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Byte(s) 1023:768 2047:1024 2079:2048
2111:2080
2143:2112
2175:2144
Name SUBNQN PSD0
PSD1
PSD2
PSD3
Value
Description
NVM Subsystem NVMe Qualified Name: not applicable Reserved Power State 0
Descriptor: Max Power (MP): 9W Non-Operational State (NOPS): I/O commands
operational Entry Latency (ENLAT): 0 Exit Latency (EXLAT): 0 Relative Read
Throughput (RRT): 0 Relative Read Latency (RRL): 0 Relative Write Throughput
(RWT): 0 Relative Write Latency (RWL): 0 Idle Power (IDLP): Active Power
(ACTP): Power State 1 Descriptor: Max Power (MP): 4.6W Non-Operational State
(NOPS): I/O commands operational Entry Latency (ENLAT): 0 Exit Latency
(EXLAT): 0 Relative Read Throughput (RRT): 1 Relative Read Latency (RRL): 1
Relative Write Throughput (RWT): 1 Relative Write Latency (RWL): 1 Idle Power
(IDLP): Active Power (ACTP): Power State 2 Descriptor: Max Power (MP): 3.8W
Non-Operational State (NOPS): I/O commands operational Entry Latency (ENLAT):
0 Exit Latency (EXLAT): 0 Relative Read Throughput (RRT): 2 Relative Read
Latency (RRL): 2 Relative Write Throughput (RWT): 2 Relative Write Latency
(RWL): 2 Idle Power (IDLP): Active Power (ACTP): Power State 3 Descriptor: Max
Power (MP): 0.045W Non-Operational State (NOPS): I/O commands nonoperational
Entry Latency (ENLAT): 2000us Exit Latency (EXLAT): 2000us Relative Read
Throughput (RRT): 3 Relative Read Latency (RRL): 3 Relative Write Throughput
(RWT): 3 Relative Write Latency (RWL): 3 Idle Power (IDLP): Active Power
(ACTP): –
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Byte(s) 2207:2176
Name PSD4
4095:2208
Value
Description
Power State 4 Descriptor: Max Power (MP): 0.004W Non-Operational State (NOPS):
I/O commands not operational Entry Latency (ENLAT): 15000us Exit Latency
(EXLAT): 15000us Relative Read Throughput (RRT): 4 Relative Read Latency
(RRL): 4 Relative Write Throughput (RWT): 4 Relative Write Latency (RWL): 4
Reserved
7.SMART Reporting
Cactus Technologies® Industrial 3D TLC M.2 SSD supports SMART attribute
reporting in the SMART Log Page using the Get Log Page Admin command. The
attributes reported are shown below.
7.1. SMART Attributes
The following attributes are reported in the SMART Log page:
Attribute
Description
Critical Warning
Bit 0: if set to 1′, this indicates available spare has fallen below threshold Bit 1: if set to1′, this indicates temperature has exceeded high
temperature threshold or dropped below low temperature threshold Bit 2: if set
to 1′, this indicates excessive media error Bit 3: if set to1′, this
indicates the drive is in read only mode Bit[7:4]: reserved
Temperature
Temperature in Kelvin
Available Spare Percentage remaining spares
Available Spare Threshold
Warning flag is set if remaining spares drops below this threshold percentage
Percentage Used This is a vendor specific estimation of the percentage life used for the device
Data Units Read Number of 512bytes units read; each count represents 1000 units
Data Units Written Number of 512bytes units written; each count represents 1000 units
Host Read Commands Number of host read commands processed
Host Write Commands Number of host write commands processed
Controller Busy Time The amount of time the drive is busy processing I/O commands; the unit is in minutes
Power Cycles
Number of power cycles
Power On Hours Number of Power On Hours
Unsafe Shutdowns The number of power loss without prior Shutdown notification.
Media and Data Integrity Errors
Number of uncorrectable data errors
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Attribute
Description
Number of Error Number of Error Information Log Entries over the product’s life Information Log Entries
Warning Composite Amount of time in minutes that the drive is in operation above the Warning Temperature Threshold Temperature Time but below the Critical Temperature Threshold
Critical Composite Amount of time in minutes that the drive is in operation above the Critical Temperature Threshold Temperature Time
8.Device Features
Features supported by Cactus Technologies® Industrial 3D TLC M.2 SSD are reported using the Get Features Admin command. The supported features are listed below:
Identifier Name
Value
Description
1
Arbitration
6h
This feature controls command arbitration.
Bit[31:24]: High Priority Weight (HPW). This defines the number of commands that can be executed from the High Priority service class in each arbitration round.
Bit[23:16]: Medium Priority Weight (MPW). This defines the number of commands that can be executed from the Medium Priority service class in each arbitration round.
Bit[15:08]: Low Priority Weight (LPW). This defines the number of commands that can be executed from the Low Priority service class in each arbitration round.
Bit[7:3]: Reserved
Bit [2:0]: Arbitration Burst (AB). This indicates the max. number of commands the controller can launch at one time from a Submission Queue. Value specified is 2^n.
2
Power
0
Management
This feature is used by the host to control the device power state. The returned content reflects the current power state attributes.
Bit[31:8]: Reserved
Bit [7:5]: Workload Hint (WH). This field indicates the type of workload expected; this is set by the host with the Set Feature command.
Bit[4:0]: Power State (PS). This field indicates the power state the device should transition to. This is set by the host with the Set Feature command.
3
LBA Range
0
Type
This field always returns zeroes on reads.
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Identifier Name
Value
Description
4
Temperature 15Ch
Bit[31:22]: Reserved
Threshold
Bit[21:20]: Threshold Type Select (THSEL). 00b over
temperature threshold; 01b Under temperature threshold;
10b, 11b Reserved.
Bit[19:16]: Threshold Temperature Select (TMPSEL). 0000b composite temperature; 0001b 1000b : binary coded value of temperature sensor; 1001b 1111b: Reserved
Bit[15:0]: Temperature Threshold (TMPTH). Value indicated in °K.
5
Error Recovery 0
This field reflects Error Recovery options as set by the host.
Bit[31:17]: Reserverd
Bit[16]: Deallocated or Unwritten Logical Block Error Enable (DULBE) not enabled
Bit[15:0]: Time Limited Error Recovery (TLER). This indicates a limited retry timeout value in units of 100ms.
6
Volatile Write 1
Cache
Volatile Write Cache Enable (WCE). This field reflects the state of Volatile Write Cache as set by the host.
Bit[31:1]: Reserved
Bit[0]: If set, Volatile Write Cache is enabled.
7
Number of
000F000Fh Bit[31:16]: Number of I/O Completion Queue Allocated
Queues
(NCQA).
Bit[15:0]: Number of I/O Submission Queue Allocated (NSQA).
These values reflect the max. number of queues the controller can support.
8
Interrupt
0
Coalescing
Bit[31:16]: Reserved
Bit[15:8]: Aggregation Time (TIME). Max. time in 100us units that the
controller can delay an interrupt. 0 indicates no delay.
Bit[7:0]: Aggregation Threshold (THR). This indicates the min. number of completion queue entries to aggregrate before interrupting the host, value is n+1.
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Identifier Name
9
Interrupt
Vector
Configuration
Value 0
10
Write Atomicity 0
Normal
11
Asynchronous 200h
Event
Configuration
12
Autonomous 0
Power State
Transition
Description
This field returns status of Interrupt Vector Configuration as set by the
host.
Bit[31:17]: Reserved
Bit[16]: Coalescing Disable (CD). If set to 1, interrupt coalescing is
disabled for the Interrupt Vector indicated in bit[15:0].
Bit[15:0]: Interrupt Vector (IV). This field indicates the Interrupt Vector
applicable to this configuration.
This field reflects the opertions of AWUN and NAWUN parameters as set by the
host.
Bit[31:1]: Reserved
Bit[0]: Disable Normal (DN). If set to 1, controller are not required to honor
AWUN and NAWUN.
This field controls asynchronous event reporting as set by the host.
Bit[31:10]: Reserved
Bit[9]: Firmware Activation Notice. If set, firmware activation notices are to
be sent to the host.
Bit[8]: Namespace Attribute Notice. If set, namespace attribute change event
notices are to be sent to the host.
Bit[7:0]: SMART Critical Warning. If set, each corresponding critical warning
bit in SMART Log will trigger notice to the host.
This feature reports power state transition settings.
Bit[31:1]: Reserved.
Bit[0]: Autonomous Power State Transition Enable (ASPTE). If cleared,
Autonomous Power State Transition is disbaled. If set, transition attributes
for each power state is returned in the Autonomous Power State Transition
Structure.
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9. Ordering Information
Model KDXFY-270PM6
Where: X is drive capacities: 128G —————- 128GB 256G —————- 256GB 512G —————-
512GB
Where: Y is temperature grade Blank ————— standard temp. (comes with heat
spreader) I ———————- extended temp. (comes with heat sink)
Example: 1. KD128GF-270PM6 ————————————— 128G standard temp. SSD 2. KD256GFI-
270PM6 ————————————– 256G extended temp. SSD
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Appendix A.Technical Support Services
A.1.Direct Cactus Technologies® Technical Support
Email: tech@cactus-tech.com
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Appendix B.Cactus Technologies® Worldwide Sales Offices
Email: sales@cactus-tech.com
Email: americas@cactus-tech.com
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Appendix C.Limited Warranty
I. WARRANTY STATEMENT
Cactus Technologies® warrants its Industrial Grade products only to be free of
any defects in materials or workmanship that would prevent them from
functioning properly for two years from the date of purchase or when rated TBW
is exceeded, whichever occurs first. This express warranty is extended by
Cactus Technologies® Limited to customers of our products.
II. GENERAL PROVISIONS
This warranty sets forth the full extent of Cactus Technologies®
responsibilities regarding the Cactus Technologies® Industrial 3D TLC Grade
Flash Storage Products. Cactus Technologies®, at its sole option, will repair,
replace or refund the purchase price of the defective product. Cactus
Technologies® guarantees our products meet all specifications detailed in our
product manuals. Although Cactus Technologies® products are designed to
withstand harsh environments and have the highest specifications in the
industry, they are not warranted to never have failure and Cactus
Technologies® does not warranty against incidental or consequential damages.
Accordingly, in any use of products in life support systems or other
applications where failure could cause injury or loss of life, the products
should only be incorporated in systems designed with appropriate redundancy,
fault tolerant or backup features.
III. WHAT THIS WARRANTY COVERS
For products found to be defective, Cactus Technologies® will have the option
of repairing, replacing or refunding the purchase price the defective product,
if the following conditions are met:
A. The defective product is returned to Cactus Technologies® for failure
analysis as soon as possible after the failure occurs.
B. An incident card filled out by the user, explaining the conditions of usage
and the nature of the failure, accompanies each returned defective product.
C. No evidence is found of abuse or operation of products not in accordance
with the published specifications, or of exceeding maximum ratings or
operating conditions.
All failing products returned to Cactus Technologies® under the provisions of
this limited warranty shall be tested to the product’s functional and
performance specifications. Upon confirmation of failure, each product will be
analyzed, by whatever means necessary, to determine the root cause of failure.
If the root cause of failure is found to be not covered by the above
provisions, then the product will be returned to the customer with a report
indicating why the failure was not covered under the warranty.
This warranty does not cover defects, malfunctions, performance failures or
damages to the unit resulting from use in other than its normal and customary
manner, misuse, accident or neglect; or improper alterations or repairs.
Cactus Technologies® Limited may repair or replace, at its discretion, any
product returned by its customers, even if such product is not covered under
warranty, but is under no obligation to do so.
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IV. RECEIVING WARRANTY SERVICE
According to Cactus Technologies® warranty procedure, defective product should
be returned only with prior authorization from Cactus Technologies® Limited.
Please contact Cactus Technologies® Customer Service department (tech@cactus-
tech.com) with the following information: product model number and
description, nature of defect, conditions of use, proof of purchase and
purchase date. If approved, Cactus Technologies® will issue a Return Material
Authorization or Product Repair Authorization number and instructions to ship
the product back to us for service.
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