EBYTE E73-2G4M08S1C 2.4GHz SMD Wireless Module User Manual

: June 6, 2024
: ebyte

EBYTE E73-2G4M08S1C 2.4GHz SMD Wireless Module User Manual

Product overview

Brief Introduction

E73-2G4M08S1C are wireless Bluetooth modules designed by Chengdu Ebyte which feature small size, low power consumption. It adopt the originally imported RFIC nRF52840 of NORDIC, supporting BLE 4.2 and BLE 5.0. The chip has high- performance ARM CORTEX-M4F kernel and other peripheral resources, such as UART, I2C, SPI, ADC, DMA, PWM etc. The module led out most IO Port of nRF52840 for multilateral development.Please see the pin definition for details.

Dimensions

E73-2G4M08S1C is hardware platform without firmware, so users need to conduct a secondary development.The characteristics of the nRF52840 chip can be found in the official Datasheet.

Features

Small size: 13x18mm;
Support BLE4.2 and BLE 5.0;
The measured communication distance is up to 120m;
Maximum transmission power of 6mW, software multi-level adjustable;
Support the global license-free ISM 2.4GHz band;
Built-in high performance low power ARM® and Cortex ® -M4 dual core processor;
Rich resources, 1024KB FLASH, 256KB RAM;
Support 1.7V~5.5Vpower supply, power supply over 3.3Vcan guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
Built-in ceramic antenna, no antenna is required for the built-in antenna.

Application

Smart homes and industrial sensors；
Security system, positioning system；
Wireless remote control, drone；
Wireless game remote control；
Health care products；
Wireless voice, wireless headset；
Automotive industry applications.

Specification and parameter

Limit parameter

Main parameter

| Performance|

Remark

---|---|---

Min

|

Max

Power supply （V）| 0| 5.5| Voltage over 5.5V will cause permanent damage to module
Blocking power（dBm）| –| 10| Chances of burn is slim when modules are used in short distance
Operating temperature（℃）| -40| 85|

Operating parameter

Main parameter

| Performance|

Remark

---|---|---
Min| Type| Max

Operating voltage（V）

| 1.7| 3.3| 5.5|

≥3.3 V ensures output power

Communication level （V）

| –| 3.3| –|

For 5V TTL, it may be at risk of burning down

Operating temperature （℃）

| -40| –| 85| Industrial grade
Operating frequency（GHz）| 2360| –| 2500|

Support ISM band

Transmitting current| TX only run current (DC/DC, 3 V) PRF = +8 dBm| –| 17.05| –| mA
TX only run current (DC/DC, 3 V) PRF = +4 dBm| –| 12.68| –| mA
TX only run current (DC/DC, 5 V, REG0 out = 3.3 V)PRF = 0dBm| –| 7.25| –| mA
TX only run current (DC/DC, 3 V)P RF = 0 dBm| –| 7.63| –| mA
Transmitting current| TX only run current (DC/DC, 3 V) PRF = +8 dBm| –| 17.05| –| mA
---|---|---|---|---|---
Receiving current| RX only run current (DC/DC, 3 V) 1 Mbps / 1 Mbps BLE| –| 7.71| –| mA
RX only run current (DC/DC, 3 V) 2 Mbps / 2 Mbps BLE| –| 8.27| –| mA
Transmitting power| 7| 8| 9| dBm
Receiving sensitivity| -103 dBm@BLE 125kbps(long distance mode), -95 dBm@BLE 1M

Main parameter

| Description|

Remark

---|---|---
Reference distance| 120m| Clear and open area, antenna gain: 5dBi, antenna height: 2.5m，air data rate: 1Mbps
Crystal Oscillator| 32MHz|
Protocol| BLE 4.2/5.0|
Package| SMD|
Interface| 1.27mm| Stamp hole/Ceramic antenna
IC| nRF52840-QIAAC0/ aQFN ™ 73|
FLASH| 1024KB|
RAM| 256KB|
Core| ARM® Cortex ® -M4|
Size| 13.0 * 18.0 mm|
Antenna| ceramic antenna| 50 ohm impedance

Size and pin definition

Pad quantity: 43
Unit: mm

No.| Pin item| Corresponding chip pin item| Pin direction| Application
---|---|---|---|---
1| P1.11| P1.11| Common I/O| See details about nrf52840 datasheet on Nordic website
2| P1.10| P1.10| Common I/O| Low frequency I/O, standard drive
3| P0.03| P0.03/AIN1| Common I/O| Analog input 1, low frequency I/O, standard drive
4| AI4| P0.28/AIN4| Common I/O| Analog input 4
5| GND| –| –| Single ground line ， connect to the power reference ground
6| P1.13| P1.13| Common I/O| Low frequency I/O, standard drive
**** 7| AI0| P0.02/AIN0| Common I/O| Analog input 0, low frequency I/O, standard drive
8| AI5| P0.29/AIN5| Common I/O| Analog input 5, low frequency I/O, standard drive
9| AI7| P0.31/AIN7| Common I/O| Analog input 7, low frequency I/O, standard drive
| | | | drive
10| AI6| P0.30/AIN6| Common I/O| Analog input 6, low frequency I/O, standard drive
11| XL1| P0.00/XL1| Common I/O| Connect to 32.768 kHz crystal
12| P0.26| P0.26| Common I/O| See details about nrf52840 datasheet on Nordic website
13| XL2| P0.01/XL2| Common I/O| Connect to 32.768 kHz crystal
14| P0.06| P0.06| Common I/O| See details about nrf52840 datasheet on Nordic website
15| AI3| P0.05/AIN3| Common I/O| Analog input 3
16| P0.08| P0.08| Common I/O| See details about nrf52840 datasheet on Nordic website
17| P1.09| P1.09| Common I/O| See details about nrf52840 datasheet on Nordic website
18| AI2| P0.04/AIN2| Common I/O| Analog input 2
19| VDD| –| –| Power supply
20| P12| P0.12| Common I/O| See details about nrf52840 datasheet on Nordic website
21| GND| –| –| ground line ， connect to the power reference ground
22| P0.07| P0.07| Common I/O| See details about nrf52840 datasheet on Nordic website
23| VDH| VDDH| –| High-voltage power supply
24| GND| –| –| ground line ， connect to the power reference ground
25| DCH| DCCH| –| DC/DC Converter output
26| RST| P0.18/RESET| Common I/O| QSPI/CSN/external reset
27| VBS| VBUS| –| USB power supply ， 5V input ， used to USB3.3V voltage regulator
28| P15| P0.15| Common I/O| See details about nrf52840 datasheet on Nordic website
29| D-| –| –| USB D-
30| P17| P0.17| Common I/O| See details about nrf52840 datasheet on Nordic website
31| D+| –| –| USB D+
32| P0.20| P0.20| Common I/O| See details about nrf52840 datasheet on Nordic website
33| P0.13| P0.13| Common I/O| See details about nrf52840 datasheet on Nordic website
34| P0.22| P0.22| Common I/O| QSPI
35| P0.24| P0.24| Common I/O|
36| P1.00| P1.00| Common I/O| See details about nrf52840 datasheet on Nordic website
37| SWD| SWDIO| –| Serial debug programming port data
38| P1.02| P1.02| Common I/O| See details about nrf52840 datasheet on Nordic website
39| SWC| SWDCLK| –| Serial debug programming port clock
40| P1.04| P1.04| Common I/O| Low frequency I/O, standard drive
41| NF1| P0.09/NFC1| Common I/O| NFC input
42| P1.06| P1.06| Common I/O| Low frequency I/O, standard drive
43| NF2| P0.10/NFC2| Common I/O| NFC input

Development and Application

No.

| Item|

Notes

---|---|---
1| Burn Firmware|

The module is embedded with ARM MCU. For program downloading, please use the J-LINK downloader. Any other serial port or JTAG、ISP、ICP are unavailable to download.
The burn firmware needs to be completed in two parts. Since the protocol stack provided by NORDIC is not loaded in the program, in the second development, you need to use the official burning tool nRFgo studio to burn the protocol stack, and then use nRFgo studio to burn. The hex of the application code; you can also use the official burning tool nRFgo studio to burn the protocol stack, and then download it with IAR or KEIL. Website of tool download:
http://www.nordicsemi.com/eng/Products/Bluetooth-low- energy/nRF52832/(language)/eng-GB

2| Testing Board| Testing board is not available.

Basic operation

**** Hardware design

Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module.
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;
Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference;
Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding can be done;
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside;
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.

FAQ

Communication range is too short

The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance);
The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the lower the transmitting power;
Due to antenna quality or poor matching between antenna and module.

Module is easy to damage

Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.

BER(Bit Error Rate) is high

Here are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.

Production guidance

Reflow soldering temperature

Profile Feature

| 曲线特征| Sn-Pb Assembly|

Pb-Free Assembly

---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)| Min preheating temp.| 100℃| 150℃
Preheat temperature max (Tsmax)| Max preheating temp.| 150℃| 200℃
Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average ramp-up rate| 3℃/second max| 3℃/second max
Liquidous Temperature (TL)| Liquid phase temp| 183℃| 217℃
Time(tL)Maintained Above(TL)| Time below liquid phase line| 60-90 sec| 30-90 sec
Peak temperature(Tp)| Peak temp| 220-235℃| 230-250℃
Aveage ramp-down rate(Tp to Tsmax)| Average ramp-down rate| 6℃/second max| 6℃/second max
Time 25℃ to peak temperature| Time to peak temperature for 25℃| 6 minutes max| 8 minutes max

Reflow soldering curve

E73 series

Model| IC| Frequency Hz| Tx power dBm| Distance km| Protocol| Package| Size mm| Antenna
---|---|---|---|---|---|---|---|---
E73-2G4M08S1C| ****

nRF52840

| ****

2.4G

| ****

8

| ****

0.1

| ****

BLE 4.2/5.0

| ****

SMD

| 13.0 18.0| Ceramic antenna/Sta mp hole
E73-2G4M04S1A| nRF52810| 2.4G| 4| 0.1| BLE 4.2/5.0| SMD| 17.5 28.7| PCB/IPX
E73-2G4M04S1D| nRF51822| 2.4G| 4| 0.1| BLE 4.2| SMD| 17.5 28.7| PCB/IPX
E73-2G4M04S1B| nRF52832| 2.4G| 4| 0.1| BLE 4.2/5.0| SMD| 17.5 28.7| PCB/IPX

Antenna recommendation

Recommendation

The antenna is an important role in the communication process. A good antenna can largely improve the communication system.

Model No.

Feature

---|---|---|---|---|---|---
TX2400-NP-5010| Flexible Antenna| IPEX| 2| 50*10mm| –| FPC soft antenna
TX2400-XP-150| Sucker antenna| SMA-J| 3.5| 15cm| 150cm| High Gain
TX2400-JK-20| Rubber antenna| SMA-J| 3| 200mm| –| Flexible&omnidirectional
TX2400-JK-11| Rubber antenna| SMA-J| 2.5| 110mm| –| Flexible&omnidirectional
TX2400-JZ-3| Rubber antenna| SMA-J| 2| 30mm| –| Short straight &omnidirectional