EBYTE E22-900M22S SX1262 915MHz SPI SMD LoRa Module User Manual

: June 6, 2024
: ebyte

EBYTE E22-900M22S SX1262 915MHz SPI SMD LoRa Module

Overview

Introduction

The E22-900M22S is based on the SX1262, a new generation of LoRaTM RF chip manufactured by Semtech, USA. It is an ultra-small and self-developed 915MHz SMD LoRaTM wireless module.

Because it adopted the original SX1262 as main core, so the anti-interference performance and communication distance have been further improved compared to the previous generation LoRaTM transceiver.Due to its new LoRaTM modulation technology, the anti-interference performance and communication distance are far superior to the current FSK and GFSK modulation products. This module is mainly for smart home, wireless meter reading, scientific and medical research, and long distance wireless communication equipment. The RF performance and components selection are all in accordance with industrial- grade standards and this products obtained FCC, CE and RoHS certification already and so users do not need to worry about the performance. Adopted industrial grade high precision 32MHz crystal, the product can cover an ultra- wide frequency range of 902~928MHz and is backward compatible with SX1278 and SX1276.

Since the module is a RF transceiver module only, users need to use the MCU driver or use a dedicated SPI debug tool.

Features

Communication distance tested is up to 7km
Maximum transmission power of 160mW, software multi-level adjustable
Support the global license-free ISM 915MHz band
Support air date rate of 0.018-62.5kbps in the LoRaTM mode Support 300kpbs in the FSK mode;
Compatible with the transceiver of SX1278/SX1276;
With large capacity, FIFO supports 256Byte data cache.;
New SF5 spreading factor to support dense networks;
Support 2.5V~3.7V power supply, more than 3.3V power supply can guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time
IPEX and stamp hole are optional, which is convenient for secondary development and integration.

Application

Home security alarm and remote keyless entry
Smart home and industrial sensors
Wireless alarm security system
Building automation solutions
Wireless industrial-grade remote control
Health care products
Advanced Meter Reading Architecture(AMI)
Automotive industry applications.

Specification and parameter

Limit parameter

Main parameter	Performance	Remark
Min.	Max.
Power supply（V）	0	3.7

module
Blocking power（dBm）| –| 10| Chances of burn is slim when modules are used in short distance
Operating temperature（℃）| -40| 85|

Operating parameter

Main parameter

| Performance|

Remark

---|---|---
Min.| Typ.| Max.
Operating voltage（V）| 1.8| 3.3| 3.7| It’s recommended to use 3.3V.
Communication level（V）| | 3.3| | For 5V TTL, it may be at risk of burning down
Operating temperature（℃）| -40| –| 85| Industrial design
Operating frequency（GHz）| 850| 915| 930| Support ISM band

Power consumption

| TX current（mA）| | 119| | Instant power consumption
RX current（mA）| | 6.8| |
Sleep current（μA）| | 2| | Software is shut down
Max Tx power（dBm）| 21.4| 21.5| 22.3|
Receiving sensitivity（dBm）| -144| -146| -147| Air data rate is 0.3kbps

Air data rate（bps）

| 0.6k| –| 300k| Controlled via user’s programming
0.018k| | 62.5k| Controlled via user’s programming
Main parameter| Description| Remark
---|---|---
Distance for reference| 7000m| Test condition：clear and open area, antenna gain: 5dBi，antenna height: 2.5m，air data rate: 0.3kbps
FIFO| 256Byte| Maximum length of single transmission
Crystal frequency| 32MHz|
Modulation| LoRa(recommended)|
Package| SMD|
Connector| 1.27mm| Stamp hole
Communication interface| SPI| 0-10Mbps
Size| 20 142.8 mm|
Antenna| IPEX/IPEX| 50 ohm impedance

Size and pin definition

Pad quantity: 22
Unit: mm

No.	Name	Direction	Function
1	GND		Ground wire, connected to the power reference ground
2	GND		Ground wire, connected to the power reference ground
3	GND		Ground wire, connected to the power reference ground
4	GND		Ground wire, connected to the power reference ground
5	GND		Ground wire, connected to the power reference ground
6	RXEN	Input	RF switch receiving control pin, connected to external

Basic Operation

Hardware Design

SN	Brief Connection between Module and Single Chip Microcomputer
1	The IO0、IO1、IO2、IO3 in MCU means the IO port of MCU.

2

| DIO1 、 DIO2 is the normal IO port, which can be configured to multiple function. The DIO2 can connect with TXEN，but not with the IO port of MCU. It’s used to control RF switch, see more details in SX1262 datasheet. Also It can be floated when not in use.
3| The DIO3 is powered by a 32MHz TCXO crystal.
4| Ensure the good grounding, large area of paving, small the power supply ripple, the filter capacitor should be increased and as close as possible to the VCC and GND pins of module.

Note:

It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse connection is connected, the module may be permanently damaged.
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged.
Please check the stability of the power supply, the voltage can not be significantly frequent.
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, and the whole machine is beneficial for long-term stable operation.
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference.
High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to the digital part of the module and routed in the Bottom Layer.
Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees.
Assume that there are traces with large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage).
Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside of the case.
The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.

Software Programming

Its driving mode is exactly the same as SX1268/SX1262. Users can operate according to SX1268/SX1262 chip datasheet.
DIO1 and DIO2 are general-purpose IO ports, which can be configured into multiple functions. DIO2 can be connected to TXEN and not connected to the MCU’s IO port. It can be used to control the RF switch transmission. If not used, you can hang it. For details, see the SX1262 manual.
DIO 3 is used to supply 32 MHz TCXO crystal oscillator.

FAQ

Communication range is too short

The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground. Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
Due to antenna quality or poor matching between antenna and module.

Module is easy to damage

Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.

High bit error rate

There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel to avoid interference.
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus line should not be too long.
Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply. If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.

Welding operation guidance

Reflow Soldering Temperature

Profile Feature| Curve feature| Sn-Pb Assembly| Pb-Free Assembly
---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）| Minimum preheating temperature| 100℃| 150℃
Preheat temperature max (Tsmax)| Maximum preheating temperature| 150℃| 200℃
Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average rising rate| 3℃/second max| 3℃/second max
Liquidous Temperature (TL)| Liquid phase temperature| 183℃| 217℃
Time（tL）Maintained Above（TL）| Time above liquidus| 60-90 sec| 30-90 sec
Peak temperature（Tp）| Peak temperature| 220-235℃| 230-250℃
Aveage ramp-down rate（Tp to Tsmax）| Average descent rate| 6℃/second max| 6℃/second max
Time 25℃ to peak temperature| Time of 25 ° C to peak temperature| 6 minutes max| 8 minutes max

Reflow Soldering Curve

Model

| Chip| Frequency Hz| Transmit power dBm| Test distance

km

| Packaging| Size mm| Communication Interface
---|---|---|---|---|---|---|---
E22-900T22S| SX1262| 868M 915M| 22| 7| SMD| 16*26|

UART

E22-230T22S

| SX1262| 230M| 22| 7| SMD| 1626| UART
E22-400T22S| SX1268| 433M 470M| 22| 7| SMD| 1626|

UART

E22-400M30S

| SX1268| 433M 470M| 30| 12| SMD| 2438.5| SPI
E22-900M30S| SX1262| 868M 915M| 30| 12| SMD| 2438.5|

SPI

E22-900M22S

| SX1262| 915M| 22| 6.5| SMD| 1420| SPI
E22-400M22S| SX1268| 433M 470M| 22| 6.5| SMD| 1420|

SPI

Antenna Type

Antenna recommendation

The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent performance and reasonable price.

Antenna Manufacturer:	CHENGDU ZIISOR TECHNOLOGY CO., LTD.
Antenna Model ：	TX915-XP-100
Antenna type:	Sucker antenna
Antenna gain:	3dBi

Batch packaging

This module has been tested and found to comply with part 15.247 requirements for Modular Approval.

This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to
the product into which this certified RF module is integrated.Additional testing and certification may be necessary when multiple modules are used.

FCC Caution:
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Host product manufacturers that they need to provide a physical or e-label stating, “Contains FCC ID:2ALPH-E22900M22S” with their finished product.
Only those antennas with same type and lesser gain filed under this FCC ID can be used with this device. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The final host integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two-ways authentication between module and the host system.
The final host manual shall include the following regulatory statement:This equipment has been tested and found to comply with the limits for a This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC RF Radiation Exposure Statement:

This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.

Revision history

Version	Date	Description	Issued by
1.0	2018-09-25	Original version	huaa
1.1	2019-02-17	Content added	Ray
1.2	2019-04-03	Content updated	Ray
1.3	2019-11-14		Ren

About us

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Documents and RF Setting download link: www.ebyte.com
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