onsemi XGS X-Celerator Developer Kit User Guide

onsemi XGS X-Celerator Developer Kit

INTRODUCTION

The X−Celerator kit is designed to enable FPGA development around ON Semiconductor’s XGS image sensor family. The kit provides a sensor HiSpi receiver example as starting point to allow for a quicker and more easy integration to standard FPGA evaluation environments. The interface example was created for a Xilinx UltraScale architecture.
The headboard can feature ON Semiconductor XGS 5000, XGS 12000 or XGS 16000 image sensor integrated on a standard High−Speed Array VITA 57.1 FPGA Mezzanine Card (FMC) with onboard power management.

IP CORE ARCHITECTURE
Reference RTL code for the HiSpi receiver (see Figure 2) is available under NDA and structured as three modular IP core blocks (deserializer, decoder and remapper) that convert the XGS HiSpi output to an AXI4 video streaming standard. These blocks are written in a flexible and generic form that is easily modified and inserted in any FPGA vendor technology or design methodology. The X−Celerator contains a ready-to-use block diagram example solution for each of the sensor variants, designed for the Xilinx Kintex UltraScale architecture.
Although the RTL IP core blocks have been validated to work on Altera (Intel) development boards, active support for the HiSpi receiver on these systems is currently not yet available.

SYSTEM OVERVIEW
Figure 1 shows the stripped XGS 12000 X−Celerator FMC headboard (78.8 x 69 mm) with protective foil on the sensor, designed with a small form factor in mind (29 x 29 mm). This is the single part that changes between the different Orderable Part Numbers (OPN’s), provided in Table 1. The kit furthermore consists out of a lens mount, extension barrel, Low−pin Count (LPC) FMC cable, tripod mount and a tripod in order to enable a more user−friendly tripod configuration. The individual parts are discussed in more detail in the following subsections. Please note that these OPN’s do NOT include a lens or development board.

Table 1. ORDERABLE PART NUMBERS

includes LPC FMC cable, lens mount, tri- pod mount and tripod.
XCEL-NOIX4SN5000BL-GEVK| X−Celerator − XGS 5000 − monochrome image sensor board, includes LPC FMC cable, lens mount, tripod mount and tripod.
XCEL-NOIX1SE012KBL-GEVK| X−Celerator − XGS 12000 − color image sensor board, includes LPC FMC cable, lens mount, tripod mount and tripod.
XCEL-NOIX1SN012KBL-GEVK| X−Celerator − XGS 12000 − monochrome image sensor board, includes LPC FMC cable, lens mount, tripod mount and tripod.
XCEL-NOIX1SE016KBL-GEVK| X−Celerator − XGS 16000 − color image sensor board, includes LPC FMC cable, lens mount, tripod mount and tripod.
XCEL-NOIX1SN016KBL-GEVK| X−Celerator − XGS 16000 − monochrome image sensor board, includes LPC FMC cable, lens mount, tripod mount and tripod.

Image Sensor Board
This board features one of ON Semiconductor XGS image sensors implemented on an ANSI/VITA 57.1 single-width FMC standard module board with full channel (24 lanes for XGS 12000 and XGS 16000 and 16 lanes for XGS 5000) HiSpi video output, the necessary sensor control signals provided over SPI and a single 3.3 V power supply input. The ON Semiconductor’s NCP6914 Mini−PMIC provides all the necessary low-noise power supplies for image sensor operations.
Figure 3 and Table 2 show the board layout and the Bill of Materials (BOM) for the X−Celebrator. Detailed layout files and schematics are available under NDA.

Low−pin Count (LPC) FMC Cable
Provided with the OPN’s comes a VITA 57.1 FMC Samtec LPC HDR Cable, as shown in Figure 4, to connect the headboard in its tripod configuration. Specifications on the usable cables can be found on the Samtec VITA family webpage.
The provided cable (HDR−169473−01) is the LPC variant of the FMC connection, chosen for improved flexibility, proof of concept and reduced costs. The HPC variant of this cable can be chosen just as well but is not provided in this development kit OPN.
More information on LPC vs HPC can be found in the section on FMC connection pins.

DIMENTIONS

EVBUM2676/D

Lens Mount
The headboard comes with a standard C−mount lens holder that is screwed onto the board. The lens mount is made of black aluminum and fits in a 29 x 29 mm2 design, as shown in Figure 6.
The lens mount comes with a 5 mm C−Mount extender barrel, see Figure 6, to provide a focal distance of 17.4 mm to the sensor.

Tripod Mount
In order to mount the cable firmly to the provided headboard, two different aluminum mounting pieces are provided that serve a dual purpose. Both as tripod mount for the provided tripod, see Figure 7, and as FMC cable connector lock, see Figure 8, to secure your hardware connection. These pieces are connected by two M2.5 screws and nuts.

Tripod
The last part to make the development kit complete is a standard adjustable tripod to aim the image sensor in any direction that is desired.
Not Included: Lens and FPGA Development Platform
ON Semiconductor provides a suggested lens list compatible with the XGS products on the public product page. The development kit does not include a FPGA development platform as different needs require different platforms.

Table 2. X−CELERATOR BOM

Item

| ****

Qty

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Part Reference

| ****

Value

| ****

Package

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Description

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Manufacturer

| Manufacturer Part Number
---|---|---|---|---|---|---|---
1| 8| C1 C2 C3 C4 C7 C8 C28 C138| 100 nF| 402| CAP, CERAMIC, 100 nF, 16 V, X7R, 10%, 0402| Murata| ****

GRM155R71C104KA88D

2| 11| C5 C9 C17 C33 C37 C41 C42 C69 C134 C135 C136| 2.2 µF| 201| CAP, CERAMIC, 2.2 µF, 10 V, X5R, 10%, 0201| Murata| GRM033R61A225KE47D
3| 1| C10| 100 µF| 1210| CAP, CERAMIC, 100 µF, 6.3 V, X5R, 20%, 1210| Murata| GRM32ER60J107ME20L
4| 1| C11| 680 pF| 402| CAP, CERAMIC, 680 pF, 25 V, X7R, 10%, 0402| Panasonic| ECJ0EB1E681K
5| 1| C12| 12 nF| 402| CAP, CERAMIC, 12 nF, 16 V, X7R, 10%, 0402| Panasonic| ECJ0EB1C123K
6| 1| C13| 150 pF| 402| CAP, CERAMIC, 150 pF, 25 V, X7R, 10%, 0402| Panasonic| ECJ0EB1E151K
7| 1| C14| 10 nF| 402| CAP, CERAMIC, 10 nF, 50 V, X6S, 10%, 0402| TDK

Corporation

| C1005X6S1H103K
8| 1| C15| 100 µF| 7361−38| CAP, TANTALUM CHIP, LOW ESR, 100 µ F, 25 V, 10%, 7361| AVX| TPSV107K025R0100
9| 27| C16 C18 C19 C20 C21 C23 C24 C25 C27 C31 C49 C53 C68 C71 C80 C83 C84 C99 C100 C101 C102 C103 C104 C105 C113 C114 C130| 10 µF| 402| CAP, CERAMIC, 10 µF, 6.3 V, X5R, 20%, 0402| Murata| GRM155R60J106ME15D
10| 6| C22 C29 C39 C43 C45 C51| 4.7 µF| 402| CAP, CERAMIC, 4.7 µF, 6.3 V, X5R, 20%, 0402,

Automotive AEC−Q200

| Taiyo Yuden| JMK105BBJ475MVHF
11| 64| C26 C30 C32 C34 C35 C36 C38 C40 C44 C46 C47 C48 C50 C52 C54 C56 C57 C59 C60 C61 C62 C63 C64 C65 C66 C67 C79 C81 C82 C85 C86 C87 C88 C89 C90 C91 C92 C93 C94 C95 C96 C97 C98 C106 C107 C108 C109 C110 C111 C115 C116 C117 C118 C119 C120 C121 C122 C123 C124 C125 C126 C127 C128 C129| 100 µF| 201| CAP, CERAMIC, 100 nF, 10 V, X5R, 20%, 0201| Panasonic| ECJZEB1A104M
12| 1| FL1| 1 µF| 603| IND, EMI FILTER, CHIP, FERRITE BEAD, SMD, 1 µF, 2 A, 6.3 V, 0603| Murata| NFM18PC105R0J3D
13| 1| L1| 1 µH| 98x79x35| IND, POWER, MULTILAYER, SMD, 1.0 µH, 1.6 A, +/−20%,

.098”L x .079”W x .035”H

| Murata| LQM2HPN1R0MG0
14| 1| L3| 5.6 µH| 254x262x240| IND, POWER, SMD, 5.6 µH, 6.9 A, .254”L x

.262”W x .240”H

| Wurth ElectroniK| 74439346056
15| 1| P1| HDR400−10×40−P| | CONN, HEADER, SINGLE END ARRAY, 10×40,

400 PIN, 1.27 MM PITCH, ALGNMNT PINS, SMD

| Samtec| ASP−134488−01
16| 1| R2| 24 K| 402| RESISTOR, PRECISION THICK FILM CHIP, SMD, 24 K, 0.1 W, 1%, 0402,

AEC−Q200 compliant

| Panasonic| ERJ2RKF2402X
17| 2| R3 R7| 1 K| 402| RESISTOR, PRECISION THICK FILM CHIP, SMD, 1 K, 0.1 W, 1%, 0402 ,

Automotive grade, AEC−Q200 compliant

| Panasonic| ERJ−2RKF1001X

Item

| ****

Qty

| ****

Part Reference

| ****

Value

| ****

Package

| ****

Description

| ****

Manufacturer

| Manufacturer Part Number
---|---|---|---|---|---|---|---
18| 1| R4| 14.7 K| 402| RESISTOR, PRECISION THICK FILM CHIP, SMD, 14.7 KQ, 0.1 W, 1%, 0402,

Automotive grade, AEC−Q200 compliant

| Panasonic| ERJ−2RKF1472X
19| 1| R5| 8.06 K| 402| RESISTOR, METAL THIN FILM CHIP, SMD, 8.06 K, 0.063 W, 0.1%, 0402| Panasonic| ERA2AEB8061
20| 1| R6| 0| 603| RESISTOR, THICK FILM CHIP, SMD, 0 Q JUMPER, 0.1 W, 5%, 0603,

AEC−Q200 compliant

| Panasonic| ERJ3GEY0R00V
21| 2| R9 R10| 10 K| 603| RESISTOR, PRECISION THICK FILM CHIP, SMD, 10 K, 0.1 W, 1%, 0603| Panasonic| ERJ3EKF1002V
22| 1| R11| 300 K| 402| RESISTOR, PRECISION THICK FILM CHIP, SMD, 300 K, 0.1 W, 1%, 0402| Panasonic| ERJ−2RKF3003
23| 2| R12 R13| 0| 402| RESISTOR, PRECISION THICK FILM CHIP, SMD, 0 Q, 0.1 W, 1%, 0402,

Automotive grade, AEC−Q200 compliant

| Panasonic| ERJ2GE0R00X
24| 1| R14| 0| 201| RESISTOR, PRECISION THICK FILM CHIP, SMD, 0,

0.05 W, JUMPER, 0201, AEC−Q200

| Panasonic| ERJ1GN0R00C
25| 4| R43 R44 R46 R47| 100| 201| RESISTOR, PRECISION THICK FILM CHIP, SMD, 100 Q, 0.05 W, 1%, 0201| Panasonic| ERJ1GEF1000C
26| 1| R49| 10 K| 402| RESISTOR, THICK FILM CHIP, SMD, 10 K, 0.063 W,

5%, 0402, AEC−Q200

compliant

| Panasonic| ERJ2GEJ103X
27| 2| R50 R51| 4.7 K| 402| RESISTOR, THICK FILM CHIP, SMD, 4.7 K, 0.063 W, 5%, 0402| Panasonic| ERJ2GEJ472X
28| 1| R52| 0| 201| RESISTOR, THICK FILM CHIP, SMD, 0 Q JUMPER, 0.05 W, 5%, 0201| Panasonic| ERJ1GE0R00C
29| 4| TP6 TP7 TP8 TP9| TSTPT−5016| | CONN, TERMINAL, TEST POINT COMPACT, .015 THICK, SMT| Keystone Electronics| 5016
30| 1| U1| NOIX1SN012KB− LTI| LGA163| IC, SENSOR, ACTIVE−PIXEL DIGITAL IMAGE, CMOS, XGS12M, LGA163| ON

Semiconductor

| NOIX1SN012KB−LTI
31| 1| U2| CAT24C64| SO8| IC, SERIAL EEPROM, I2C, 64 Kbit, +1.7 V TO +5.5 V,

−40°C to +85°C, SO8

Narrow

| ON

Semiconductor

| CAT24C64WI−GT3
32| 1| U3| NLSV8T244| UDFN20| IC, LEVEL TRANSLATOR, NON−INVERTING, DUAL SUPPLY, 8−BIT, 0.9 V TO

4.5 V, UDFN20

| ON

Semiconductor

| NLSV8T244MUTAG
33| 1| U4| NCP3170| SO8| IC, VOLTAGE REGULATOR, 500 kHz SYNCHRONOUS BUCK CONVERTER, 4.5 V TO 18 V IN, ADJUSTABLE OUT, 3 A, SO8| ON

Semiconductor

| NCP3170ADR2G
34| 1| U6| NCP6914| WLCSP20| IC, PMIC, 5 CHANNEL, ONE DC-DC CONVERTER AND 4 LDOs, 2.3 V TO

5.5 V INPUT, WLCSP20

| ON

Semiconductor

| NCP6914AFCDT1G

Item

| ****

Qty

| ****

Part Reference

| ****

Value

| ****

Package

| ****

Description

| ****

Manufacturer

| Manufacturer Part Number
---|---|---|---|---|---|---|---
35| 1| U7| PCA9654E| TSSOP16| IC, I/O EXPANDER, I2C, 8−BIT, 1 MHz, 1.65 V TO

5.5 V, TSSOP16

| ON

Semiconductor

| PCA9654EDTR2G
36| 1| U9| 32 MHz| | OSC, SPXO, 32 MHz, 50 ppm, SMD, 1.6 V −

3.6 V, 2.5 MM x 2.0 MM x

0.8 MM

| SEIKO EPSON CORPORATION| SG−210STF 32.0000ML
37| 1| U10| TMUX1104DGSR| VSSOP10| IC, PRECISION MULTIPLEXER, 4:1, LOW LEAKAGE CURRENT,

1.08 V TO 5.5 V, VSSOP10

| Texas Instruments| TMUX1104DGSR
38| 1| U11| NLSV2T244| UDFN8| IC, LEVEL TRANSLATOR, NON−INVERTING, DUAL SUPPLY, 2−BIT, 0.9 V TO

4.5 V, UDFN8

| ON

Semiconductor

| NLSV2T244MUTAG

FMC CONNECTION PINS

The High−pin Count (HPC) FMC connector, see Table 3, provides maximal compatibility for the X−Celebrator. This HPC connector is designed to mate with both LPC and HPC connectors on the carrier board. Table 4 demonstrates this by using only the C, D, G, H pin arrays for critical communication. Only 28 out of the 80 differential pairs on the HPC (34 on LPC) connector are being used to communicate with the sensor. The other pins are still available for additional development. For example, a display port module.

DELAWARE AS INTERFACING SOFTWARE LAYER
From DevWare version 6.0.38 onward, Delaware is able to recognize and interface with FPGA boards, that contain the latest X−Celerator bit files. With the RADON driver (found on MyON) installed, DevWare should automatically recognize the X−Celebrator on your FPGA board connected to the PC, the correct sensor INI file still needs to be selected (and downloaded from the image sensor portal) to load the latest register settings and demonstrate the best capabilities of the sensor.
Figure 9 shows a complete development platform setup using the X−Celerator development kit, an Edmund optics lens (not included) and a Xilinx Kintex UltraScale FPGA KCU105 evaluation kit. Please note that for most development needs this KCU105 evaluation kit is over−qualified and cheaper options are available.

Table 3. X−CELERATOR HPC FMC CONNECTOR

1.27 MM PITCH, ALGNMNT PINS, SMD

Table 4. FMC CONNECTOR P1 PIN DESCRIPTION

(EEPROM)
H1| PWR| VREF_A_M2C| K1| PWR| VREF_B_M2C
J39, K40| PWR| VIO_B_M2C| H19| IN| RESET_N_VADJ
H20| IN| TRIGGER_INT_VADJ| G19| IN| TRIGGER_RD_VADJ
D17| IN| SCLK_VADJ| D18| IN| SDATA_VADJ
C18| IN| CS_N_VADJ| C19| OUT| SDATAOUT_VADJ
C30| IN| SCL (EEPROM)| C31| IN / OUT| SDA (EEPROM)
C34| IN| GA0 (EEPROM)| C35| IN| GA1 (EEPROM)

SPECIFICATIONS AND USEFUL REFERENCES

Detailed schematics, layout files, EEPROM bin content and FPGA bitfiles of the X−Celerator together with the sensor-specific DevWare software can be found under NDA on the image sensor portal.
The X−Celerator headboard outline was designed according to the ANSI/VITA 57.1 standard specifications. More information about this standard can be found at: https://www.samtec.com/standards/vita/fmc

The product page of ON Semiconductor XGS 5000, XGS 12000 and XGS 16000 image sensors contains the datasheet, lens list and other resources for these sensors.
More detailed technical information on the XGS 5000, XGS 12000 and XGS 16000 image sensors can be found in their respective developer guides, namely AND90031−D, AND9878−D and AND90029−D, which are also available on the image sensor portal under standard products → XGS.

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References

• VITA 57.1 Industry Standard FMC Connectors and Systems | Samtec

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