onsemi FPF2266 Evaluation Board User Manual

onsemi FPF2266 Evaluation Board

Product Information

Specifications:

• Model: FPF2266 Evaluation Board
• Power Supply Range: 3.6 V to 24 V
• Components: Terminals, jumpers, test points
• Functions: Over Voltage Protection, Over Current Protection, NTC Temperature Protection

Product Usage Instructions

Initial Setup:

1. Connect OVP to GND.
2. Jump NTC1 circuit to one of J17, J18, J20 and NTC2 circuit to one of J15, J16, J19.
3. Connect BO to LDO pin.
4. Connect DC power supply to VIN and GND.

Function Testing:
To test the BO function, follow these steps:

1. Sense BO event via inner VLDO or external resistor divider connected between VIN and GND.
2. Compare the event to the internal reference VREF_BO.
3. When a brownout event is detected, the internal switch is turned OFF and auto discharge is enabled.

To test the NTC over Temperature Protection:

1. Detect NTC event via an external resistor divider connected between VLDO and GND.
2. Compare the event to internal reference VREF_THERM.
3. If an over-temperature condition is detected, ALERT/KILL is pulled HIGH and the internal switch is turned OFF.

To test Over Voltage Protection (OVP):

1. Sense OVP event via an external resistor divider connected between VIN and GND.
2. Compare the event to reference VREF_OVP or internally fixed threshold Vovp_internel.

To test Over Current Protection (OCP):

1. Ensure the current through the switch does not exceed the maximum set value by adjusting the external resistor RSET connected to the ILIM pin.

FAQ

• Q: What is the recommended capacitance for VIN and VOUT caps?
  A: The VIN cap should be a minimum of 1 mF, while the VOUT cap should be more than 10 mF for optimal performance.

• Q: How can I optimize the thermal performance of the power path?
  A: Ensure that the VIN, VOUT, and GND paths are wide enough and consider using more vias to reduce resistors and improve thermal performance.

EVBUM2898/D
The FPF2266 features 4.5 A continuous current for USB charging port application. which offers Over−Voltage Protection (OVP), over-current protection (OCP), also NTC block to monitor system temperature. It has low On−resistance of typical 15 m can operate over an input voltage range of 3.6 V to 24 V and up to 28 V absolute maximum. The FPF2266 also provides an open−drain output (BATT_SHDN) for system battery disconnect and a bi−directional interface (ALERT/KILL) with SOC, MCU, or another external source (provides temperature fault condition to an external source or it can receive system KILL signal to turn OFF internal switch and disconnect battery).it should be used in conjunction with the FPF2266 datasheet. Please visit Onsemi’s website at www.onsemi.com.

Board Specification

FPF2266 evaluation board has the components and circuitry to demonstrate the basic functions of the FPF2266 load switch. VIN operation input voltage range is 3.6 V to 24 V, and VBAT input voltage range is 2.7 V to 5.5 V. Board size is 50 mm × 50 mm.
The board has terminals, jumpers and test points for easy power connection, it is easy for RON and other function parameters measurement.

1. Connect OVP to GND.
2. NTC1 circuit should jump one of “J17, J18, J20”, NTC2 circuit should jump one of “J15, J16,J19”.
3. BO connect to “LDO” pin.
4. Connect DC power supply to VIN (3.6 V to 24 V)\ and GND.
5. VIN_S and VOUT_S Test Point in middle−up of the board: can be used to sense the voltage of VIN,VOUT, measure the voltage drop between VIN and VOUT to calculate the path power FET RON.

Operating Function Selection

BO Function Test
BO event is sensed via inner VLDO (J9 jumper to LDO)or via an external resistor divider connected between VIN and GND (J13 jumper and J9 jumper to DIV), which is compared to an internal reference VREF_BO (TYP 1.19 V).
When a brownout event is detected, the internal switch is turned OFF and auto discharge enabled

NTC over Temperature Protection
There are two NTC channels to detect the over-temperature event. On our board, there are three over-temperature protection points 60°C (jumper J20 and J15), 70°C (jumper J18 and J19), 80°C (jumper J17 and J16). The NTC resistor (R9, R10) parameter is Murata NCP15WF104F03RC R /80°C ≈ 10.5 K, 25°C = 100 K.
NTC event is sensed via an external resistor divider (R14, R10/R5, R10/R4,R10; R11,R9/R12,R9/R13,R9) connected between VLDO and GND, which compared to an internal reference VREF_THERM (0.5 V/V). When an overtemperature condition is detected by any of NTC channels, ALERT/KILL is pulled HIGH alerting SOC that a temperature fault condition has occurred. The internal switch is turned OFF and BATT_SHDN is pulled LOW

Over Voltage Protection OVP
OV event can be sensed via an external resistor divider connected between VIN and GND (J14 jumper and J8 jump to DIV) compared to reference VREF_OVP (TYP 1.19 V) or sensed via an internally fixed threshold Vovp_internel (TYP 6 V) through J8 jump to GND.

Over Current Protection OCP
The current limit ensures that the current through the switch does not exceed the maximum set value, while not limiting the minimum value. The current at which the part’s limit is adjustable through the selection of the external resistor RSET (R6) connected to the ILIM pin. Typ ILIM = 490/ RSET

Full Schematic

Layout Design Notes

1. OCP ILIM trace should short enough, the layer 2(GND1) plane that is directly below the ILIM trace and pad should be removed. This would reduce any parasitic capacitance created on this node. If necessary, the test point should not connect to the RSET directly can soldering another 0 Ω to test this signal.
2. Power path VIN, VOUT, GND path should wide enough, it is possible for more vias to reduce resistors and have better thermal performance VIN and VOUT cap should as near the chip as possible, VIN cap should min 1 F, VOUT should more than 10 F.

BOM List
Table 1. BOM

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