Laird 455-00030 Sterling EWB Development Kit Hardware User Guide

June 6, 2024
Laird

455-00030 Sterling EWB Development Kit Hardware
User Guide
Date 17 July 2019

06 Aug 2019
18 Sept 2020 11 Mar 2020

Sterling-EWB Development Kit
Hardware User Guide

REVISION HISTORY

Version Date Notes Contributor(s) Approver
1.0 17 July 2019 Initial version Dave Neperud Jay White
--- --- --- --- ---
1. 6-Aug-19 Fixed typo in EWB development Kit power supply diagram (Figure
4) Dave Neperud Jay White
1. 18 Sept 2020 Fixed module part reference in DVK parts list Dave
Drogowski Jay White
1. 11-Mar-20 Added reference to the AT command software Bob Monroe

Jonathan Kaye

OVERVIEW

The Laird Sterling-EWB development kit provides a platform for the development of embedded Wi-Fi and/or Bluetooth Low Energy (BLE) applications. This document describes the development board hardware, highlighting the setup and interfaces available to maximize user flexibility in developing these applications.

Part Number Product Description
455-00030 Development Kit for 453-00014 module – Integrated chip antenna
455-00031 Development Kit for the 453-00013 module – w/ u.FL antenna

connector

Applicable to the following Sterling-EWB module part numbers:

Part Number Product Description
453-00014 Sterling-EWB chip antenna module – Integrated antenna
453-00013 Sterling-EWB U.FL module – External antenna

Note: For information about the AT Command software, please reference the AT Command Set Guide. The AT Command software can be programmed and utilized on any of the above part numbers.

PACKAGE CONTENTS

All kits contain the following items:

Development Board| The development board has the required Sterling-EWB module soldered onto it and exposes all available hardware interfaces.
---|---
USB Cable| USB cable – Type A to micro type B.
The cable also provides serial communications via the FTDI USB – RS232 converter chip on the board and powers the development board.
External 2.4GHz
dipole antenna| Supplied with development kit part # 455-00031 only.
External antenna, 2 dBi, FlexPIFA (Laird part #001-0014) with integral RF coaxial cable with 100 mm length and IPEX-4 compatible RF connector.

DEVELOPMENT KIT – MAIN DEVELOPMENT BOARD
The Sterling-EWB development board is designed to be used directly with the Cypress WICED® SDK. The default configurations provided in this document will enable operation and software development on this board.

Key Features

The EWB development board has the following features:

  • Sterling-EWB series module soldered onto the development board

  • The following power supply options for powering the development board:
    ­ USB (micro-USB, type B) ­
    External DC supply (4.4 ­ 10V) ­ not supplied. Center positive barrel connector or header for bench supply. ­
    (4) AA batteries (not supplied)

  • Powering the EWB module using a single onboard regulator or separating the MCU and radio supplies to use individual on-board regulators (SW8)

  • USB to UART/JTAG bridge (FTDI chip)

  • Pin headers for measuring current (EWB module only)

  • Selectable boot options

  • IO break-out 2.54 mm pitch pin header connectors that bring out all MCU interfaces of the EWB module ­ UART, SPI, QSPI, I2C, SIO [DIO or AIN (ADCs)], I2S, PWM ­ and allow for plugging in external modules/sensors

  • IO breakout 2.54 mm pitch pin header for direct access to Bluetooth radio on the EWB module.

  • DIP switches on all EWB module

  • IO lines run to peripheral devices on the development board to allow disconnection.

  • J-Link JTAG header for access to EWB JTAG

  • 2.54 mm pitch pin header connector and level-shifter supporting connection to an external host MCU (1.8V – 5.0V logic levels).

  • On-board Bosch Sensortec BME680 environmental sensor

  • Two buttons and four LEDs for user interaction

  • One Reset button One Wake button

  • The optional footprint for Apple MFI co-processor (not populated)

  • The optional footprint for Microchip ATECC608A-SSHDA authentication IC (not populated)

UNDERSTANDING THE DEVELOPMENT BOARD

Figure 1: Development board contents and locations

Figure 2: Development board 455-00030 (fitted with 453-00014 EWB module with integrated chip antenna)
IMPORTANT! To ensure correct out-of-the-box configuration, the EWB development board switches must be configured as shown in Figure 3. The default power connection is using the provided USB cable plugged into the DEBUG/PROGRAM micro USB port.

Figure 3: Correct EWB development board 455-00030 or 455-00031 switch settings (image for 455-00030)

FUNCTIONAL BLOCKS

Figure 4 shows the EWB development board power supply tree.
There are five options for powering the development board:

  • DEBUG/PROGRAM USB port (micro-B connector) ­ If using the FTDI USB-UART path (Default)
  • OPTIONAL USB port (micro-B connector) ­ USB function is not supported/connected on the EWB module, but the port can be used as a power input
  • External DC supply (4.4V-10V), into DC jack connector (J18)
  • External DC bench supply (4.4V-10V) using 2-pin header (J9) AA batteries ­
  • Four AA batteries connected to terminal block (J8)
  • The external power sources are fed into selection switch SW7 which allows the selection between either USB sources or the external DC sources.
  • The external power source is regulated to a fixed 3.3V on the development board.
  • Two regulators are on the development board to provide the option to power the EWB module from a single supply or to separate the supplies for the EWB MCU (3V3_MCU) and radio (3V3_WIFI) sections.
  • The development board peripherals are also powered by U5 (3V3_VDD).
  • The EWB module power supply inputs are sourced as follows on the development board:

Note:
The EWB module currently does not support the external USB interface, so the VDD_USB pin is tied directly to 3V3_MCU. The VDD_USB pin supplies power to GPIO PA11 and PA12 on the EWB module.
Note:
The development board connects the VBAT pin directly to 3V3_MCU. An external battery voltage can be applied to the EWB module by cutting SB1 to remove the connection to 3V3_MCU and applying a battery voltage to J22 (Figure 5).
The VBAT pin powers the battery power (RTC and backup registers) domain only when VDD is not present. Figure 5: External VBAT power connector
6.2 Module Reset Button
The development board Module Reset button (SW4) connects directly to the EWB MICRO_RSTN pin and enables manual reset of the module MCU when pressed.
6.3 USB Programming and Debug Interface
The micro-USB connector J24 is used in conjunction with an FTDI FT2232H multipurpose USB UART/FIFO IC on the development board to provide JTAG programming and UART1 serial port access to the STM32F412 MCU on the EWB module. The FT2232H has an external EEPROM which is pre-programmed with the custom VID (0x0A5C) and PID (0x43FA) to enable the USB port to interface with the Cypress WICED® software development kit as well as provide a COM port for monitoring the debug output of the Laird Sterling-EWB demo application.
6.4 Boot Option Configuration Switches
The EWB development board boot option is configured by setting SW5 and SW6 (Figure 6). Figure 6: BOOT configuration switches
Table 1: EWB boot source configuration

SW5 (BOOT 0) position SW5 (BOOT 1) position Boot Source
0 0 or 1 EWB Module boots from embedded User Flash (Default Setting)
1 1 EWB Module boots from Embedded SRAM
1 0 EWB Module boots from System Memory

6.5 DVK Disconnect Switches
The development board contains SPST DIP switches (SW9 ­ SW12) placed in line with the EWB module I/O lines that connect to peripheral devices on the board. This functionality is provided to maximize flexibility, allowing the user to disconnect any EWB module I/O used by the development board, re-assign their functionality, and use them for development purposes.
6.6 UART Interfaces
The EWB module is configurable for up to three UART interfaces which can be accessed through headers J7, J12, and J13 on the development board.
Four-wire UART interfaces (TX, RX, CTS, RTS) are available on J12 (UART1) and J7 (UART3). J13 (UART6) only provides a 2-wire interface (TX, RX).
Note:
UART1 is also driven by the FTDI FT2232H multipurpose USB UART IC to provide a terminal COM port connection available at the micro-USB port (J24). To enable use of a direct external UART connection at J12, SW12 positions 1 ­ 4 must be switched to the OFF position.
The UART connections to the EWB module are shown in Table 2.
Table 2: EWB pin/UART connections available on development board

UART1 (J12) UART1 (J12) UART3 (J7) UART6 (J13)
UART_TX (output) PA9 PD8 PC6
UART_RX (input) PA10 PC5 PC7
UART_RTS (output) PA12 PB14 N/A
UART_CTS (input) PA11 PB13 N/A

The UART header pinouts are designed to be used with FTDI USB-UART TTL (3.3V) converter cables (found at http://www.ftdichip.com/Products/Cables/USBTTLSerial.htm). One example is FTDI part TTL-232R-3V3.
6.7 Indicator LEDs
The development board includes six indicator LEDs.
Four LEDs (LED1 ­ LED4) are for development use and are connected to the MCU port of the EWB as indicated in Table 3.
Table 3: EWB LEDs and signal mapping

Designator Color STM32F412 Port Name
LED1 Green PB12
LED2 Red PB15
LED3 Blue PE7
LED4 Red PE8

Note : The MCU connections to the LEDs can be removed by switching positions 1 ­ 4 of SW11 to the “OFF” position.
LED5 (Green) indicates when DC power is applied to the development board 3.3V regulator inputs.
LED6 (Green) indicates UART activity with the FTDI FT2232H USB UART/FIFO IC.
6.8 Push Buttons
SW2 and SW3 are SPST-NO tact switches that when pressed will provide a low logic level input to the MCU port of the EWB as indicated in Table 4.
Table 4: EWB button signal mapping Designator

Designator STM32F412 Port Connection
SW2 PC13
SW3

Note: The EWB MCU connection to the buttons can be removed by switching positions 3(SW3) and 6(SW2) of SW10 to the OFF position.
6.9 MCU Wake Button
SW1 is an SPST-NO tact switch connected to Port PA0 on the EWB STM32F412 MCU to provide the ability to use the WKUP function of the MCU to wake from Standby, Stop, and Sleep modes of operation.
6.10 BME680 Gas/Pressure/Temperature/Humidity Sensor
The development board includes the Bosch Sensortec BME680 air quality sensor connected to the EWB MCU I2C2 interface bus via pins PB10 (SCL) and PB11 (SDA). The I2C signal traces are pulled high on the development board.
6.11 External Host Interface
The EWB development board provides the capability to connect to an external host MCU that uses 1.8V – 5.0V logic levels.
The following peripherals and pin assignments of the EWB STM32F412 MCU are available on header J4 for connection to an external microcontroller host platform (Table 5).
Table 5: External host Interface connections

J4 Pin # Name Function Type Port
1 GND Ground I
2 VCC_EXT_MCU External Host I/voltage I
3 UART_CTS [1] O UART3_RTS/PB14
4 UART_TX CTS flow control (to external host) I UART3_RX/PC5
5 UART_RX TX Data (from externalhost) O UART3_TX/PD8
6 UART_RTS RX Data (to external host) I UART3_CTS/PB13
7 RESETn RTS flow control (from external host) I MICRO_RST_N
8 WKUPn EWB MCU reset I MICRO_WKUP/PA0
9 BT_WAKE EWB MCU wake O BT_HOST_WAKE
10 GPIO Wake up Signal indicating EWB Bluetooth device requires attention
I/O PE5
11 OEM  General Purpose I/O I
12 Level Shifter enable (active low)
[2] Ground I

Note:  By default, EWB 3V3_MCU power is not provided to the level shifter interface IC on the development board.
[1] Connect EWB module 3V3_MCU to the level shifter and set the logic level for the module interface lines by shorting solder bridge SB3 on the development board (Figure 7).
[2] The OEM line is held low by default on the development board. J4 – pin 11 provides the option for the external host microcontroller to control this line. To allow this capability, the shorted solder bridge SB4 needs to be cut on the development board (Figure 7).

Figure 7: External HOST interface schematic and location of solder bridge modifications

**BREAKOUT CONNECTOR PINOUTS

**

7.1 Trace debugging (JT AG) Interface
The development board provides access to the EWB module J-Link JTAG interface via connector J10 (Figure 8).

Figure 8: JTAG Interface schematic
7.2 Bluetooth Interface
Development board header J3 provides access to the Bluetooth radio on the EWB module (Figure 9).
Figure 9: Bluetooth Interface PIN assignments
7.2.1 Bluetooth PCM Audio Interface
Four PCM audio connections are available.
BT_PCM_CLK, BT_PCM_IN, BT_PCM_OUT, and BT_PCN_SYNC
BT_PCM_CLK and BT_PCN_SYNC can be master (output) or slave (input).|
7.2.2 Bluetooth GPIO Interface
Three Bluetooth General Purpose I/O lines are available for expansion capability.
7.2.3 Bluetooth Wake Interface
BT_HOST_WAKE output signal pin indicates when the EWB module Bluetooth radio requires attention.
7.3 PIN Breakout Headers
Access to the remaining EWB module signal pins is available on 0.1-inch pitch header connectors J5 and J6 (Figure 10 and Table 6).

Figure 10: EWB breakout headers
Table 6: J5 and J6 pin mapping Pin Connection Pin

Pin Connection Pin Connection
1 GND 2 PA2
3 PM 4 PA3
5 PA4 6 PBO
7 PA6 8 PC4
9 PA7 10 PB1
11 GND 12 PE7
13 SP14_NSS/PE11 14 PE8
15 SP14_SCK/PE12 16 GND
17 SPI4_MISO/PE13 18 I2C2_SCUPB10
19 SPI4_MOSI/PEI4 20 12C2_SDA/PB11
21 PE15 22 PB12
23 GND 24 GND
Pin Connection Pin Connection
--- --- --- ---
1 GND 2 viICRO VVKUP/PAO
3 PF7 4 PC3
5 PE5 6 PEO
7 PF6 8 P39
9 PF9 10 PC11
11 PF8 12 PE3
13 GND 14 MICRO_RST_N
15 PA1 16 PC13
17 PB6 18 PB7
19 PB8 20 PD1
21 PG6 22 PD10
23 PB15 24 GND

 OTHER FEATURES

8.1 Current Consumption Measurements
The provided headers on the development board allow you to break the power supply lines and measure current consumption. J1 (3V3_WIFI), J19 (3V3_MCU), and J15 (3V3_VDD) are available to connect an ammeter between the two pins. To enable a current measurement, the shorted solder bridge at each header will need to be cut first (Figure 11). Figure 11: Current measurement schematic and PCB modifications
The mapping of the EWB module pinout to the STM32F412 MCU ports is provided in Table 7.
Table 7: EWB module to STM32 port mapping

Module Pin # Name STM32 Port
2 MICRO_ADC_IN2 PA2
3 MICRO_SPI1_SCK [1] PA5
MICRO_SPI1_NSS [1] PA4
5 MICRO_SPI1_NSS [1] PA6
6 MICRO_ADC_IN3 PA3
7 MICRO_GPIO_5 PB0
8 QUADSPI_BK2_IO2 PC4
12 MICRO_SPI1_MISO3 PC5
13 MICRO_SPI1_MOSI [1] PA7
14 QUADSPI_CLK PB2
15 MICRO_ADC_IN3 PB1
16 QUADSPI_BK2_IO0 PE7
17 MICRO_SPI4_NSS PE11
18 QUADSPI_BK2_IO1 PE8
19 MICRO_SPI4_SCK PE12
20 MICRO_I2C2_SCL PB10
21 MICRO_SPI4_MISO PE13
22 MICRO_I2C2_SDA PB11
23 QUADSPI_CLK PE14
24 MICRO_GPIO_16 PE15
26 MICRO_SPI4_NSS PB12
27 QUADSPI_BK2_IO1 PB13
28 MICRO_SPI4_SCK PB14
30 MICRO_I2C2_SCL PB15
31 MICRO_SPI4_MISO PD8
32 MICRO_I2C2_SDA PD10
36 MICRO_SPI4_MOSI PG6
38 MICRO_GPIO_16 PC7
39 MICRO_SPI2_NSS PC6
42 MICRO_SPI2_SCK PA10
43 MICRO_SPI2_MISO PA9
44 MICRO_SPI2_MOSI PD1
45 MICRO_GPIO27 PB8
46 MICRO_GPIO25 PB7
47 QUADSPI_BK1_NCS PA11
48 MICRO_I2C1_SCL PB6
--- --- ---
49 MICRO_USART1_RTS PA12
50 MICRO_JTAG_TDI PA15
51 MICRO_JTAG_TMS PA13
53 BOOT0 BOOT0
54 MICRO_JTAG_TDO PB3
55 PC13 PC13
56 MICRO_ADC_IN1 PA1
57 MICRO_JTAG_TCK PA14
60 MICRO_RST_N NRST
64 MICRO_JTAG_TRSTN PB4
65 MICRO_GPIO_0 PE3
66 QUADSPI_BK1_IO0 PF8
67 QUADSPI_BK2_NCS PC11
68 QUADSPI_BK1_IO1 PF9
69 MICRO_I2S2_WS PB9
70 QUADSPI_BK1_IO3 PF6
71 MICRO_GPIO_30 PE0
72 OSC_32K_IN PC14
73 MICRO_I2S_DI PE5
74 OSC_32K_OUT PC15
76 MICRO_WKUP PA0
78 QUADSPI_BK1_IO2 PF7
79 MICRO_I2S2_SD PC3

[1] SPI1 is used for the internal EWB module 16 Mb flash communication (PA4, PA5, PA6, and PA7).

10 APPENDIX B-EWB/STM32F412 ALTERNATIVE FUNCTIONS

Note: USART2 is used internally on the EWB module for MCU to radio communication and is not available. SPI1 is used for the internal EWB module 16-Mb flash communication (PA4, PA5, PA6, and PA7).
ADDITIONAL DOCUMENTATION
Laird offers a variety of documentation and ancillary information to support our customers through the initial evaluation process and ultimately into mass production. Additional documentation can be accessed from the Sterling-EWB Product Page: https://www.lairdconnect.com/wireless-modules/wi- fi-bt-modules/sterling-ewb-iot-module
For any additional questions or queries, or to receive technical support for this Development Kit or for the Sterling-EWB module, please contact Embedded Wireless Solutions Support: https://www.lairdconnect.com/resources/support
© Copyright 2019 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. LairdTM, Laird TechnologiesTM, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party intellectual property right.

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