GIGABYTE B760M Key Features Motherboard User Manual

June 1, 2024
Gigabyte

B760M Key Features Motherboard

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Product Information

Specifications

  • Model: B760M GAMING X AX DDR4
  • Revision: 1404
  • Manufacturer: GIGABYTE
  • Supported Memory Type: DDR4
  • Form Factor: ATX
  • Socket: LGA1700

Product Usage Instructions

Identifying Your Motherboard Revision

The revision number on your motherboard looks like this: REV:
X.X. For example, REV: 1.0 means the revision of the motherboard is
1.0. Check your motherboard revision before updating motherboard
BIOS, drivers, or when looking for technical information.

Chapter 1: Product Introduction

1-1 Motherboard Layout

Refer to the provided diagram for the layout of the motherboard
components such as CPU socket, memory slots, PCIe slots, fan
connectors, SATA ports, and audio jacks.

Chapter 3: BIOS Setup

Access the BIOS setup to configure system settings, boot order,
and other parameters for optimal performance.

Chapter 4: Installing the Operating System and Drivers

Follow the instructions in this section to install the operating
system and necessary drivers for proper functionality. It includes
steps for operating system installation and driver
installation.

Chapter 5: Appendix

5-1 Configuring a RAID Set

If you wish to set up a RAID configuration, follow the
guidelines provided in this section for configuring a RAID set.

FAQ

Q: Where can I find more detailed product information?

A: For detailed product information, refer to the User’s Manual
provided with the product or visit GIGABYTE’s website.

Q: How can I check for product-related information or

updates?

A: You can check for product-related information or updates on
GIGABYTE’s website at https://www.gigabyte.com.

“`

B760M GAMING X AX B760M GAMING X B760M GAMING X AX DDR4
(B760M G X AX DDR4)
B760M GAMING X DDR4
User’s Manual
Rev. 1404
GIGABYTE will reduce paper use in order to fulfill the responsibilities of a global citizen. Also, to reduce the impacts on global warming, the packaging materials of this product are recyclable and reusable. GIGABYTE works with you to protect the environment. For more product details, please visit GIGABYTE’s website.

Copyright © 2024 GIGA-BYTE TECHNOLOGY CO., LTD. All rights reserved. The trademarks mentioned in this manual are legally registered to their respective owners.
Disclaimer Information in this manual is protected by copyright laws and is the property of GIGABYTE. Changes to the specifications and features in this manual may be made by GIGABYTE without prior notice. No part of this manual may be reproduced, copied, translated, transmitted, or published in any form or by any means without GIGABYTE’s prior written permission.
For detailed product information, carefully read the User’s Manual. For quick set-up of the product, refer to the Quick Installation Guide on GIGABYTE’s
website.
https://download.gigabyte.com/FileList/Manual/mb_manual_installation- guide_12QM-100xR.pdf
For product-related information, check on our website at: https://www.gigabyte.com
Identifying Your Motherboard Revision The revision number on your motherboard looks like this: “REV: X.X.” For example, “REV: 1.0” means the revision of the motherboard is 1.0. Check your motherboard revision before updating motherboard BIOS, drivers, or when looking for technical information.
Example:

Table of Contents
Chapter 1 Product Introduction……………………………………………………………………………4 1-1 Motherboard Layout…………………………………………………………………………….. 4 1-2 Box Contents………………………………………………………………………………………. 6
Chapter 2 Hardware Installation ………………………………………………………………………….7 2-1 Installation Precautions………………………………………………………………………… 7 2-2 Product Specifications………………………………………………………………………….. 8 2-3 Installing the CPU and CPU Cooler ……………………………………………………… 12 2-4 Installing the Memory …………………………………………………………………………. 15 2-5 Installing an Expansion Card ………………………………………………………………. 16 2-6 Back Panel Connectors………………………………………………………………………. 17 2-7 Internal Connectors……………………………………………………………………………. 19
Chapter 3 BIOS Setup ……………………………………………………………………………………..31
Chapter 4 Installing the Operating System and Drivers…………………………………………33 4-1 Operating System Installation ……………………………………………………………… 33 4-2 Drivers Installation……………………………………………………………………………… 34
Chapter 5 Appendix …………………………………………………………………………………………35 5-1 Configuring a RAID Set………………………………………………………………………. 35 Regulatory Notices………………………………………………………………………………………. 36 Contact Us …………………………………………………………………………………………………. 40
– 3 –

Chapter 1 Product Introduction
1-1 Motherboard Layout

R_USB20_1

SYS_FAN1

M2_WIFIj

R_USB20_2

USB 2.0 Hub

ATX_12V_2X4

CPU_FAN LGA1700

D_LED2 LED_C2 ATX

SYS_FAN2

B760M GAMING X AX B760M GAMING X

DP_HDMI20

U32_USB20

F_U32 F_U32C

DDR5_A1 DDR5_A2 DDR5_B1 DDR5_B2

U32_LAN

M2A_CPU

AUDIO

Realtek® 2.5GbE LAN

PCIEX16

iTE®

Super I/O

BAT

110

80

80 M_BIOS

Intel® B760

7 6

SATA3

M2P_SB

CODEC F_AUDIO

PCIEX4 D_LED1

THB_C2

QFLED

USB 2.0 Hub

RST CLR_CMOS

SATA3 4 5

SPDIF_O COM
Temperature sensor

LED_C1 THB_C1 SPI_TPM

F_USB2 QFLASH_PLUS F_USB1

SYS_FAN3

F_PANEL

j Only for B760M GAMING X AX. – 4 –

R_USB20_1

SYS_FAN1

M2_WIFIl

R_USB20_2

USB 2.0 Hub

ATX_12V_2X4

CPU_FAN LGA1700

D_LED2 LED_C2 ATX

SYS_FAN2

B760M GAMING X AX DDR4 B760M GAMING X DDR4

DP_HDMI20

U32_USB20

F_U32 F_U32C

DDR4_A1 DDR4_A2 DDR4_B1 DDR4_B2

U32_LAN

M2A_CPU

AUDIO

Realtek® 2.5GbE LAN

PCIEX16

iTE®

Super I/O

BAT

110

80

80 M_BIOS

Intel® B760

7 6

SATA3

M2P_SB

CODEC F_AUDIO

PCIEX4 D_LED1

THB_C2

QFLED

USB 2.0 Hub

RST CLR_CMOS

SATA3 4 5

SPDIF_O COM
Temperature sensor

LED_C1 THB_C1 SPI_TPM

F_USB2 QFLASH_PLUS F_USB1

SYS_FAN3

F_PANEL

l Only for B760M GAMING X AX DDR4. – 5 –

1-2 Box Contents
5 B760M GAMING X AX, B760M GAMING X, B760M GAMING X AX DDR4, or B760M GAMING X DDR4 motherboard
5 User’s Manual 5 One antenna jl 5 Two SATA cables 5 M.2 screw

  • The box contents above are for reference only and the actual items shall depend on the product package you obtain. The box contents are subject to change without notice.
    j Only for B760M GAMING X AX. l Only for B760M GAMING X AX DDR4.
    – 6 –

Chapter 2 Hardware Installation
2-1 Installation Precautions
The motherboard contains numerous delicate electronic circuits and components which can become damaged as a result of electrostatic discharge (ESD). Prior to installation, carefully read the user’s manual and follow these procedures:
· Prior to installation, make sure the chassis is suitable for the motherboard. · Prior to installation, do not remove or break motherboard S/N (Serial Number) sticker or
warranty sticker provided by your dealer. These stickers are required for warranty validation. · Always remove the AC power by unplugging the power cord from the power outlet before
installing or removing the motherboard or other hardware components. · When connecting hardware components to the internal connectors on the motherboard, make
sure they are connected tightly and securely. · When handling the motherboard, avoid touching any metal leads or connectors. · It is best to wear an electrostatic discharge (ESD) wrist strap when handling electronic
components such as a motherboard, CPU or memory. If you do not have an ESD wrist strap, keep your hands dry and first touch a metal object to eliminate static electricity. · Prior to installing the motherboard, please have it on top of an antistatic pad or within an electrostatic shielding container. · Before connecting or unplugging the power supply cable from the motherboard, make sure the power supply has been turned off. · Before turning on the power, make sure the power supply voltage has been set according to the local voltage standard. · Before using the product, please verify that all cables and power connectors of your hardware components are connected. · To prevent damage to the motherboard, do not allow screws to come in contact with the motherboard circuit or its components. · Make sure there are no leftover screws or metal components placed on the motherboard or within the computer casing. · Do not place the computer system on an uneven surface. · Do not place the computer system in a high-temperature or wet environment. · Turning on the computer power during the installation process can lead to damage to system components as well as physical harm to the user. · If you are uncertain about any installation steps or have a problem related to the use of the product, please consult a certified computer technician. · If you use an adapter, extension power cable, or power strip, ensure to consult with its installation and/or grounding instructions.
– 7 –

2-2 Product Specifications

CPU Chipset Memory
Onboard Graphics Audio LAN

LGA1700 socket: Support for the 14th, 13th, and 12th Generation Intel® CoreTM, Pentium® Gold and Celeron® Processors (Go to GIGABYTE’s website for the latest CPU support list.)
L3 cache varies with CPU
Intel® B760 Express Chipset
14th and 13th Generation Intel® CoreTM i9/i7 Pocessors: – Support for DDR5 5600/5200/4800/4400 MT/s memory modules jk
13th Generation Intel® CoreTM i5/i3 and 12th Generation Intel® CoreTM, Pentium® Gold and Celeron® Processors: – Support for DDR5 4800/4400 MT/s memory modules jk
Support for DDR4 3200/3000/2933/2666/2400/2133 MT/s memory modules lm 4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity)
of system memory jk 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity)
of system memory lm Dual channel memory architecture Support for ECC Un- buffered DIMM 1Rx8/2Rx8 memory modules (operate in
non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules
(The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” on GIGABYTE’s website for more information.) Integrated Graphics Processor-Intel® HD Graphics support: – 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz

  • Support for HDMI 2.1 version and HDCP 2.3. * Support native HDMI 2.1 TMDS compatible ports.
    – 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
    Support for DisplayPort 1.2 version and HDCP 2.3
    (Graphics specifications may vary depending on CPU support.) Realtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel
  • You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
    Support for S/PDIF Out
    Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)

j Only for B760M GAMING X AX. k Only for B760M GAMING X. l Only for B760M GAMING X AX DDR4. m Only for B760M GAMING X DDR4.
– 8 –

Wireless

Communication

Modulej

Wireless

Communication

Modulel

Expansion Slots
Storage Interface

Intel® Wi-Fi 6E AX210 (PCB rev. 1.0) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard Intel® Wi-Fi 6E AX211 (PCB rev. 1.1) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard Realtek® Wi-Fi 6E RTL8852CE (PCB rev. 1.2) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard (Actual data rate may vary depending on environment and equipment.)
AMD Wi-Fi 6E RZ608 (MT7921K) (PCB rev. 1.0) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.2
– Support for 11ax 80MHz wireless standard Intel® Wi-Fi 6E AX210 (PCB rev. 1.1) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard Intel® Wi-Fi 6E AX211 (PCB rev. 1.2/PCB rev. 1.4) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard Realtek® Wi-Fi 6E RTL8852CE (PCB rev. 1.3) – WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands – BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard (Actual data rate may vary depending on environment and equipment.)
CPU: – 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)

  • The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot.
    Chipset: – 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4)
    CPU: – 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support)
    (M2A_CPU) Chipset: – 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD
    support) (M2P_SB) – 4 x SATA 6Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices

j Only for B760M GAMING X AX. l Only for B760M GAMING X AX DDR4.
– 9 –

USB Internal Connectors
Back Panel Connectors I/O Controller

Chipset:
– 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the
internal USB header
– 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available
through the internal USB header)
– 1 x USB 2.0/1.1 port on the back panel Chipset+2 USB 2.0 Hubs:
– 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through
the internal USB headers)
1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 3 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x S/PDIF Out header 1 x USB Type-C® header, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 2 x ThunderboltTM add-in card connectors 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/
GC-TPM2.0 SPI V2 module only) 1 x serial port header 1 x Q-Flash Plus button 1 x reset jumper 1 x Clear CMOS jumper
3 x USB 3.2 Gen 1 ports 5 x USB 2.0/1.1 ports 2 x SMA antenna connectors (2T2R)jl 1 x HDMI port 1 x DisplayPort 1 x RJ-45 port 3 x audio jacks
iTE® I/O Controller Chip

j Only for B760M GAMING X AX. l Only for B760M GAMING X AX DDR4.
– 10 –

Hardware

Monitor

BIOS

Unique Features

Bundled

Software

Operating

System

Form Factor

Voltage detection Temperature detection Fan speed detection Water cooling flow rate detection Fan fail warning Fan speed control

  • Whether the fan speed control function is supported will depend on the fan you install.
    1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
    Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
    Support for Q-Flash Support for Q-Flash Plus Norton® Internet Security (OEM version) LAN bandwidth management software
    Support for Windows 11 64-bit Support for Windows 10 64-bit
    Micro ATX Form Factor; 24.4cm x 24.4cm

  • GIGABYTE reserves the right to make any changes to the product specifications and product-related information without prior notice.

& Please visit the SERVICE/SUPPORTUtility page on GIGABYTE’s website to download the latest version of apps. https://www.gigabyte.com/Support/Utility/Motherboard?m=ut
– 11 –

2-3 Installing the CPU and CPU Cooler
Read the following guidelines before you begin to install the CPU: · Make sure that the motherboard supports the CPU.
(Go to GIGABYTE’s website for the latest CPU support list.) · Always turn off the computer and unplug the power cord from the power outlet before installing the
CPU to prevent hardware damage. · Locate the pin one of the CPU. The CPU cannot be inserted if oriented incorrectly. (Or you may
locate the notches on both sides of the CPU and alignment keys on the CPU socket.) · Apply an even and thin layer of thermal grease on the surface of the CPU. · Do not turn on the computer if the CPU cooler is not installed, otherwise overheating and damage
of the CPU may occur. · Set the CPU host frequency in accordance with the CPU specifications. It is not recommended
that the system bus frequency be set beyond hardware specifications since it does not meet the standard requirements for the peripherals. If you wish to set the frequency beyond the standard specifications, please do so according to your hardware specifications including the CPU, graphics card, memory, hard drive, etc.
A. Note the CPU Orientation
Note the alignment keys on the motherboard CPU socket and the notches on the CPU.
Alignment Key

Triangle Pin One Marking of the CPU Socket

LGA1700 CPU Socket
Alignment Key Notch

Triangle Pin One Marking on the CPU

LGA1700 CPU
Notch

Do not remove the CPU socket cover before inserting the CPU. It may pop off from the load plate automatically after you insert the CPU and close the load plate.
& Please visit GIGABYTE’s website for details on hardware installation. https://www.gigabyte.com/WebPage/210/quick-guide.html?m=sw
– 12 –

B. Installing the CPU
Follow the steps below to correctly install the CPU into the motherboard CPU socket.

u

Finger Tab

jGently press the CPU socket lever handle down and away from the socket.
kCompletely lift up the CPU socket locking lever.
lUse the finger tab on the side of the metal load plate to lift open the metal load plate with the plastic protective cover attached to it.

l k

j

v
Hold the CPU with your fingers by the edges. Align the CPU pin one marking (triangle) with the pin one corner of the CPU socket (or you may align the CPU notches with the socket alignment keys) and gently insert the CPU into position.

Pin One

w
j
Make sure the CPU is properly installed and

then close the load plate. The plastic protec-

tive cover will pop off, just remove it. Secure

the lever under its retention tab to complete

the installation of the CPU. * Always replace the plastic protective cover

k

when the CPU is not installed to protect the CPU socket.

l

Do not force to engage the CPU socket locking lever when the CPU is not installed correctly as this would damage the CPU and CPU socket.
– 13 –

C. Installing the CPU Cooler
Be sure to install the CPU cooler after installing the CPU. (Actual installation process may differ depending the CPU cooler to be used. Refer to the user’s manual for your CPU cooler.)
u
Apply an even and thin layer of thermal grease on the surface of the installed CPU.

v
Place the cooler atop the CPU, aligning the four push pins through the pin holes on the motherboard. Push down on the push pins diagonally.

j k
k
j

w
Finally, attach the power connector of the CPU cooler to the CPU fan header (CPU_FAN) on the motherboard.

– 14 –

CPU_FAN

2-4 Installing the Memory

Read the following guidelines before you begin to install the memory: · Make sure that the motherboard supports the memory. It is recommended that memory of the same
capacity, brand, speed, and chips be used. (Go to GIGABYTE’s website for the latest supported memory speeds and memory modules.) · Always turn off the computer and unplug the power cord from the power outlet before installing the memory to prevent hardware damage. · Memory modules have a foolproof design. A memory module can be installed in only one direction. If you are unable to insert the memory, switch the direction.

Dual Channel Memory Configuration This motherboard provides four memory sockets and supports Dual Channel Technology. After the memory is installed, the BIOS will automatically detect the specifications and capacity of the memory. Enabling Dual Channel memory mode will double the original memory bandwidth. The four memory sockets are divided into two channels and each channel has two memory sockets as following: Channel A: DDR5_A1jk/DDR4_A1lm, DDR5_A2jk/DDR4_A2lm Channel B: DDR5_B1jk/DDR4_B1lm, DDR5_B2jk/DDR4_B2lm

  • Recommended Dual Channel Memory Configuration:
    DDR5_A1jk DDR5_A2jk DDR5_B1jk DDR4_A1lm DDR4_A2lm DDR4_B1lm

2 Modules

– –

DS/SS

– –

DDR5_B2jk DDR4_B2lm
DS/SS

4 Modules

DS/SS

DS/SS

(SS=Single-Sided, DS=Double-Sided, “- -“=No Memory)

DS/SS

DS/SS

Due to CPU limitations, read the following guidelines before installing the memory in Dual Channel mode. 1. Dual Channel mode cannot be enabled if only one memory module is installed. 2. When enabling Dual Channel mode with two or four memory modules, it is recommended that memory of
the same capacity, brand, speed, and chips be used.

DDR5_A1jk/DDR4_A1lm DDR5_A2jk/DDR4_A2lm DDR5_B1jk/DDR4_B1lm
DDR5_B2jk/DDR4_B2lm
When installing a single memory module, we recommend that you install it in the DDR5_A2jk/ DDR4_A2lm or DDR5_B2jk/DDR4_B2lm socket.
j Only for B760M GAMING X AX. k Only for B760M GAMING X. l Only for B760M GAMING X AX DDR4. m Only for B760M GAMING X DDR4.
– 15 –

2-5 Installing an Expansion Card
Read the following guidelines before you begin to install an expansion card: · Make sure the motherboard supports the expansion card. Carefully read the manual that came
with your expansion card. · Always turn off the computer and unplug the power cord from the power outlet before installing an
expansion card to prevent hardware damage. Follow the steps below to correctly install your expansion card in the expansion slot. 1. Locate an expansion slot that supports your card. Remove the metal slot cover from the chassis back panel. 2. Align the card with the slot, and press down on the card until it is fully seated in the slot. 3. Make sure that the expansion card is fully seated in its slot. 4. Secure the card’s metal bracket to the chassis back panel with a screw. 5. After installing all expansion cards, replace the chassis cover(s). 6. Turn on your computer. If necessary, go to BIOS Setup to make any required BIOS changes for your
expansion card(s). 7. Install the driver provided with the expansion card in your operating system.
PCIEX16 Slot
– 16 –

2-6 Back Panel Connectors
jl

USB 2.0/1.1 Port The USB port supports the USB 2.0/1.1 specification. Use this port for USB devices. SMA Antenna Connectors (2T2R)jl Use this connector to connect an antenna.
Tighten the antennas to the antenna connectors and then aim the antennas correctly for better signal reception.
DisplayPort DisplayPort delivers high quality digital imaging and audio, supporting bi-directional audio transmission. DisplayPort can support HDCP 2.3 content protection mechanisms. You can use this port to connect your DisplayPort-supported monitor. Note: The DisplayPort Technology can support a maximum resolution of 4096×2304@60 Hz but the actual resolutions supported depend on the monitor being used. HDMI Port
The HDMI port is HDCP 2.3 compliant and supports Dolby TrueHD and DTS HD Master Audio formats. It also supports up to 192KHz/24bit 7.1-channel LPCM audio output. You can use this port to connect your HDMI-supported monitor. The maximum supported resolution is 4096×2160@60 Hz, but the actual resolutions supported are dependent on the monitor being used.
After installing the DisplayPort/HDMI device, make sure to set the default sound playback device to DisplayPort/HDMI. (The item name may differ depending on your operating system.)
USB 3.2 Gen 1 Port The USB 3.2 Gen 1 port supports the USB 3.2 Gen 1 specification and is compatible to the USB 2.0 specification. Use this port for USB devices. USB 2.0/1.1 Port (Q-Flash Plus Port) The USB port supports the USB 2.0/1.1 specification. Use this port for USB devices. Before using Q-Flash Plus , (Note) make sure to insert the USB flash drive into this port first.

j Only for B760M GAMING X AX. l Only for B760M GAMING X AX DDR4.

(Note)

To enable the Q-Flash Plus function, please navigate to the “Unique Features” page of GIGABYTE’s website for more information.
– 17 –

RJ-45 LAN Port The Gigabit Ethernet LAN port provides Internet connection at up to 2.5 Gbps data rate. The following describes the states of the LAN port LEDs.

Speed LED Activity LED Speed LED:

Activity LED:

LAN Port

State Orange Green Off

Description 2.5 Gbps data rate 1 Gbps data rate 100 Mbps data rate

State Blinking Off

Description Data transmission or receiving is occurring No data transmission or receiving is occurring

Line In/Rear Speaker Out The line in jack. Use this audio jack for line in devices such as an optical drive, walkman, etc. Line Out/Front Speaker Out The line out jack. Mic In/Center/Subwoofer Speaker Out The Mic in jack.

Audio Jack Configurations: Jack
Line In/Rear Speaker Out

Headphone/ 2-channel

4-channel a

5.1-channel a

7.1-channel a

Line Out/Front Speaker Out

a

a

a

a

Mic In/Center/Subwoofer Speaker Out

a

a

Front Panel Line Out/Side Speaker Out

a

You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.

& Please visit GIGABYTE’s website for details on configuring the audio software. https://www.gigabyte.com/WebPage/697/realtek897-audio.html

· When removing the cable connected to a back panel connector, first remove the cable from your device and then remove it from the motherboard.
· When removing the cable, pull it straight out from the connector. Do not rock it side to side to prevent an electrical short inside the cable connector.
– 18 –

2-7 Internal Connectors

41

3

6

5

2

4 11

8

12

18

7

8

20

19

17

15

10 16 6 5 14 15 4 21 13

7

9

  1. ATX_12V_2X4 2) ATX 3) CPU_FAN 4) SYS_FAN1/2/3 5) LED_C1/LED_C2 6) D_LED1/D_LED2 7) SATA3 4/5/6/7 8) M2A_CPU/M2P_SB 9) F_PANEL 10) F_AUDIO 11) F_U32C

  2. F_U32 13) F_USB1/F_USB2 14) SPI_TPM 15) THB_C1/THB_C2 16) COM 17) SPDIF_O

  3. BAT 19) CLR_CMOS 20) RST 21) QFLASH_PLUS

Read the following guidelines before connecting external devices: · First make sure your devices are compliant with the connectors you wish to connect. · Before installing the devices, be sure to turn off the devices and your computer. Unplug the power
cord from the power outlet to prevent damage to the devices. · After installing the device and before turning on the computer, make sure the device cable has
been securely attached to the connector on the motherboard.
– 19 –

1/2) ATX_12V_2X4/ATX (2×4 12V Power Connector and 2×12 Main Power Connector) With the use of the power connector, the power supply can supply enough stable power to all the components on the motherboard. Before connecting the power connector, first make sure the power supply is turned off and all devices are properly installed. The power connector possesses a foolproof design. Connect the power supply cable to the power connector in the correct orientation. The 12V power connector mainly supplies power to the CPU. If the 12V power connector is not connected, the computer will not start.
To meet expansion requirements, it is recommended that a power supply that can withstand high power consumption be used (500W or greater). If a power supply is used that does not provide the required power, the result can lead to an unstable or unbootable system.

5

8

1

4

ATX_12V_2X4

ATX_12V_2X4:

Pin No. Definition

Pin No.

1 GND (Only for 2×4-pin 12V) 5

2 GND (Only for 2×4-pin 12V) 6

3 GND

7

4 GND

8

Definition +12V (Only for 2×4-pin 12V) +12V (Only for 2×4-pin 12V) +12V +12V

12

24

1

13

ATX

ATX:
Pin No. 1 2 3 4 5 6 7 8 9 10 11
12

Definition

Pin No.

3.3V

13

3.3V

14

GND

15

+5V

16

GND

17

+5V

18

GND

19

Power Good

20

5VSB (stand by +5V)

21

+12V

22

+12V (Only for 2×12-pin 23 ATX) 3.3V (Only for 2×12-pin 24 ATX)

Definition 3.3V -12V GND PS_ON (soft On/Off) GND GND GND NC +5V +5V +5V (Only for 2×12-pin ATX)
GND (Only for 2×12-pin ATX)

– 20 –

3/4) CPU_FAN/SYS_FAN1/2/3 (Fan Headers) All fan headers on this motherboard are 4-pin. Most fan headers possess a foolproof insertion design. When connecting a fan cable, be sure to connect it in the correct orientation (the black connector wire is the ground wire). The speed control function requires the use of a fan with fan speed control design. For optimum heat dissipation, it is recommended that a system fan be installed inside the chassis.

1 CPU_FAN
1 SYS_FAN1/SYS_FAN2
1 SYS_FAN3

Pin No. 1 2 3 4

Definition GND Voltage Speed Control Sense PWM Speed Control

Connector

CPU_FAN

SYS_FAN1~3

Maximum Current

2A

2A

Maximum Power

24W

24W

· Be sure to connect fan cables to the fan headers to prevent your CPU and system from overheating. Overheating may result in damage to the CPU or the system may hang.
· These fan headers are not configuration jumper blocks. Do not place a jumper cap on the headers.

  1. LED_C1/LED_C2 (RGB LED Strip Headers) The headers can be used to connect a standard 5050 RGB LED strip (12V/G/R/B), with maximum power rating of 2A (12V) and maximum length of 2m.

1 LED_C2

Pin No. 1 2 3 4

Definition 12V G R B

1 LED_C1

Connect your RGB LED strip to the header. The power pin (marked with a triangle on the plug) of the LED strip must be connected to Pin 1 (12V) of this header. Incorrect connection may lead to the damage of the LED strip.

RGB LED Strip
1 12V

For how to turn on/off the lights of the LED strip, please navigate to the “Unique Features” page of GIGABYTE’s website.
Before installing or removing the devices, be sure to turn off the devices and your computer. Unplug the power cord from the power outlet to prevent damage to the devices.

– 21 –

  1. D_LED1/D_LED2 (Addressable LED Strip Headers) The headers can be used to connect a standard 5050 addressable LED strip, with maximum power rating of 5A (5V) and maximum number of 1000 LEDs.

1 D_LED2
1 D_LED1

Pin No. 1 2 3 4

Definition V (5V) Data No Pin GND

Connect your addressable LED strip to the header. The power pin (marked with a triangle on the plug) of the LED strip must be connected to Pin 1 of the addressable LED strip header. Incorrect connection may lead to the damage of the LED strip.

Addressable LED Strip 1

For how to turn on/off the lights of the LED strip, please navigate to the “Unique Features” page of GIGABYTE’s website.
Before installing or removing the devices, be sure to turn off the devices and your computer. Unplug the power cord from the power outlet to prevent damage to the devices.

  1. SATA3 4/5/6/7 (SATA 6Gb/s Connectors)

The SATA connectors conform to SATA 6Gb/s standard and are compatible with SATA 3Gb/s and SATA 1.5Gb/s

standard. Each SATA connector supports a single SATA device. The Intel® Chipset supports RAID 0, RAID 1,

RAID 5, and RAID 10. Please navigate to the “Configuring a RAID Set” page of GIGABYTE’s website for

instructions on configuring a RAID array.

G.QBOFM

SATA3

7

17

7

16

SATA3 4 5

1

7

Pin No. 1 2 3 4 5 6 7

Definition GND TXP TXN GND RXN RXP GND

To enable hot-plugging for the SATA ports, please navigate to the “BIOS Setup” page of GIGABYTE’s website and search for “SATA Configuration” for more information.

– 22 –

  1. M2A_CPU/M2P_SB (M.2 Socket 3 Connectors) The M.2 connectors on the motherboard support only M.2 PCIe SSDs.

M2A_CPU

110

80

80 M2P_SB

Follow the steps below to correctly install an M.2 SSD in the M.2 connector. Step 1: Locate the M.2 connector where you will install the M.2 SSD, use a screwdriver to unfasten the screw on the heatsink and then remove the heatsink. (Only the M2A_CPU connector has the heatsink) Step 2: Locate the proper mounting hole based on the length of your M.2 SSD drive. If needed, move the standoff to the desired mounting hole. Insert the M.2 SSD into the M.2 connector at an angle. Step 3: Press the M.2 SSD down and then use the included screw to secure it in the connector. Remove the protective film from the bottom of the heatsink. Then replace the heatsink and secure it to the original hole.

  • Types of M.2 SSDs supported by each M.2 connector:

M.2 PCIe x4 SSD M.2 PCIe x2 SSD

M2A_CPU

a

a

M2P_SB

a

a

M.2 SATA SSD r r

– 23 –

  1. F_PANEL (Front Panel Header) Connect the power switch, reset switch, speaker, chassis intrusion switch/sensor and system status indicator on the chassis to this header according to the pin assignments below. Note the positive and negative pins before connecting the cables.
    Power LED Power Switch Speaker

PLED+ PLED-
PW+ PWSPEAK+ NC NC SPEAK-

2

20

1

19

HD+ HD-
RESRES+
CICI+
PWR_LED+ PWR_LEDPWR_LED-

Hard Drive Reset Activity LED Switch

Power LED
Chassis Intrusion Header

· PLED/PWR_LED (Power LED):

System Status LED Connects to the power status indicator on the chassis front panel. The LED

S0

On

S3/S4/S5

Off

is on when the system is operating. The LED is off when the system is in S3/ S4 sleep state or powered off (S5).

· PW (Power Switch): Connects to the power switch on the chassis front panel. You may configure the way to turn off your system using the power switch (please navigate to the “BIOS Setup” page of GIGABYTE’s website and search for “Soft-Off by PWR-BTTN” for more information).
· SPEAK (Speaker): Connects to the speaker on the chassis front panel. The system reports system startup status by issuing a beep code. One single short beep will be heard if no problem is detected at system startup.
· HD (Hard Drive Activity LED): Connects to the hard drive activity LED on the chassis front panel. The LED is on when the hard drive is reading or writing data.
· RES (Reset Switch): Connects to the reset switch on the chassis front panel. Press the reset switch to restart the computer if the computer freezes and fails to perform a normal restart.
· CI (Chassis Intrusion Header): Connects to the chassis intrusion switch/sensor on the chassis that can detect if the chassis cover has been removed. This function requires a chassis with a chassis intrusion switch/sensor.
· NC: No connection.

The front panel design may differ by chassis. A front panel module mainly consists of power switch, reset switch, power LED, hard drive activity LED, speaker and etc. When connecting your chassis front panel module to this header, make sure the wire assignments and the pin assignments are matched correctly.
– 24 –

  1. F_AUDIO (Front Panel Audio Header) The front panel audio header supports High Definition audio (HD). You may connect your chassis front panel audio module to this header. Make sure the wire assignments of the module connector match the pin assignments of the motherboard header. Incorrect connection between the module connector and the motherboard header will make the device unable to work or even damage it.

9

1

10

2

Pin No. 1 2 3 4 5 6 7 8 9 10

Definition MIC L GND MIC R NC Head Phone R MIC Detection SENSE_SEND No Pin Head Phone L Head Phone Detection

Some chassis provide a front panel audio module that has separated connectors on each wire instead of a single plug. For information about connecting the front panel audio module that has different wire assignments, please contact the chassis manufacturer.

  1. F_U32C (USB Type-C® Header, with USB 3.2 Gen 2 Support) The header conforms to USB 3.2 Gen 2 specification and can provide one USB port.

10

11

1

20

Pin No. 1 2 3 4 5 6 7 8 9 10

Definition VBUS TX1+ TX1GND RX1+ RX1VBUS CC1 SBU1 SBU2

Pin No. 11 12 13 14 15 16 17 18 19 20

Definition VBUS TX2+ TX2GND RX2+ RX2GND DD+ CC2

– 25 –

  1. F_U32 (USB 3.2 Gen 1 Header) The header conforms to USB 3.2 Gen 1 and USB 2.0 specification and can provide two USB ports. For purchasing the optional 3.5″ front panel that provides two USB 3.2 Gen 1 ports, please contact the local dealer.

Pin No. Definition

Pin No. Definition

20

1

1 VBUS

11 D2+

2 SSRX1-

12 D2-

3 SSRX1+

13 GND

4 GND

14 SSTX2+

5 SSTX1-

15 SSTX2-

11

10

6 SSTX1+

7 GND

16 GND 17 SSRX2+

8 D1-

18 SSRX2-

9 D1+

19 VBUS

10 NC

20 No Pin

  1. F_USB1/F_USB2 (USB 2.0/1.1 Headers) The headers conform to USB 2.0/1.1 specification. Each USB header can provide two USB ports via an optional USB bracket. For purchasing the optional USB bracket, please contact the local dealer.

9

1

10

2

Pin No. 1 2 3 4 5 6 7 8 9 10

Definition Power (5V) Power (5V) USB DXUSB DYUSB DX+ USB DY+ GND GND No Pin NC

Prior to installing the USB bracket, be sure to turn off your computer and unplug the power cord from the power outlet to prevent damage to the USB bracket.

– 26 –

  1. SPI_TPM (Trusted Platform Module Header) You may connect an SPI TPM (Trusted Platform Module) to this header.

Pin No. Definition

1 Data Output

2 Power (3.3V)

11

1

3 No Pin

12

2

4 NC

5 Data Input

6 CLK

7 Chip Select

8 GND

9 IRQ

10 NC

11 NC

12 RST

  1. THB_C1/THB_C2 (ThunderboltTM Add-in Card Connectors) The connectors are used to connect to a GIGABYTE ThunderboltTM add-in card.
    THB_C2 1 1
    THB_C1

Supports a ThunderboltTM add-in card. – 27 –

  1. COM (Serial Port Header) The COM header can provide one serial port via an optional COM port cable. For purchasing the optional COM port cable, please contact the local dealer.

Pin No. Definition

1 NDCD-

9

1

2 NSIN

10

2

3 NSOUT

4 NDTR-

5 GND

6 NDSR-

7 NRTS-

8 NCTS-

9 NRI-

10 No Pin

  1. SPDIF_O (S/PDIF Out Header) This header supports S/PDIF digital output, which allows you to connect a S/PDIF digital audio cable to output digital audio from your motherboard to the supported audio devices. For information about connecting the digital audio cable, carefully read the manual for your audio devices.

Pin No. Definition

1

1 5VDUAL

2 No Pin

3 SPDIFO

4 GND

– 28 –

  1. BAT (Battery) The battery provides power to keep the values (such as BIOS configurations, date, and time information) in the CMOS when the computer is turned off. Replace the battery when the battery voltage drops to a low level, or the CMOS values may not be accurate or may be lost.
    You may clear the CMOS values by removing the battery: 1. Turn off your computer and unplug the power cord. 2. Gently remove the battery from the battery holder and wait for one minute.
    (Or use a metal object like a screwdriver to touch the positive and negative terminals of the battery holder, making them short for 5 seconds.) 3. Replace the battery. 4. Plug in the power cord and restart your computer. · Always turn off your computer and unplug the power cord before replacing the battery. · Replace the battery with an equivalent one. Damage to your devices may occur if the battery is replaced with an incorrect model. · Contact the place of purchase or local dealer if you are not able to replace the battery by yourself or uncertain about the battery model. · When installing the battery, note the orientation of the positive side (+) and the negative side (-) of the battery (the positive side should face up). · Used batteries must be handled in accordance with local environmental regulations.

  2. CLR_CMOS (Clear CMOS Jumper) Use this jumper to clear the BIOS configuration and reset the CMOS values to factory defaults. To clear the CMOS values, use a metal object like a screwdriver to touch the two pins for a few seconds.
    Open: Normal
    Short: Clear CMOS Values
    · Always turn off your computer and unplug the power cord from the power outlet before clearing the CMOS values.
    · After system restart, go to BIOS Setup to load factory defaults (select Load Optimized Defaults) or manually configure the BIOS settings (please navigate to the “BIOS Setup” page of GIGABYTE’s website for more information).
    – 29 –

  3. RST (Reset Jumper) The reset jumper can connect to the reset switch on the chassis front panel. Press the reset switch to restart the computer if the computer freezes and fails to perform a normal restart.

Pin No. Definition

1

1 Reset

2 GND

The reset jumper provides you with several functions to use. To remap the button to perform different tasks, please navigate to the “BIOS Setup” page of GIGABYTE’s website and search for “RST_SW (MULTIKEY)” for more information.
21) QFLASH_PLUS (Q-Flash Plus Button) Q-Flash Plus allows you to update the BIOS when your system is off (S5 shutdown state). Save the latest BIOS on a USB thumb drive and plug it into the dedicated port, and then you can now flash the BIOS automatically by simply pressing the Q-Flash Plus button. The QFLED will flash when the BIOS matching and flashing activities start and will stop flashing when the main BIOS flashing is complete.
QFLED QFLASH_PLUS
To enable the Q-Flash Plus function, please navigate to the “Unique Features” page of GIGABYTE’s website for more information.
– 30 –

Chapter 3 BIOS Setup
BIOS (Basic Input and Output System) records hardware parameters of the system in the CMOS on the motherboard. Its major functions include conducting the Power-On Self-Test (POST) during system startup, saving system parameters and loading operating system, etc. BIOS includes a BIOS Setup program that allows the user to modify basic system configuration settings or to activate certain system features. When the power is turned off, the battery on the motherboard supplies the necessary power to the CMOS to keep the configuration values in the CMOS. To access the BIOS Setup program, press the key during the POST when the power is turned on. To upgrade the BIOS, use either the GIGABYTE Q-Flash or Q-Flash Plus utility.
· Q-Flash allows the user to quickly and easily upgrade or back up BIOS without entering the operating system. · Q-Flash Plus allows you to update the BIOS when your system is off (S5 shutdown state). Save the latest
BIOS on a USB thumb drive and plug it into the dedicated port, and then you can now flash the BIOS automatically by simply pressing the Q-Flash Plus button. For instructions on using the Q-Flash and Q-Flash Plus utilities, please navigate to the “Unique Features” page of GIGABYTE’s website and search for “BIOS Update Utilities.”
· Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
· It is recommended that you not alter the default settings (unless you need to) to prevent system instability or other unexpected results. Inadequately altering the settings may result in system’s failure to boot. If this occurs, try to clear the CMOS values and reset the board to default values.
· Refer to the introductions of the battery/clear CMOS jumper in Chapter 2 or navigate to the “BIOS Setup” page of GIGABYTE’s website and search for “Load Optimized Defaults” for how to clear the CMOS values.
& Please visit GIGABYTE’s website for details on configuring BIOS Setup. https://www.gigabyte.com/WebPage/928/intel700-bios.html
– 31 –

Startup Screen: The following startup Logo screen will appear when the computer boots.
Function Keys
Function Keys: : BIOS SETUPQ-FLASH
Press the key to enter BIOS Setup or to access the Q-Flash utility in BIOS Setup. : BOOT MENU
Boot Menu allows you to set the first boot device without entering BIOS Setup. In Boot Menu, use the up arrow key or the down arrow key to select the first boot device, then press to accept. The system will boot from the device immediately. Note: The setting in Boot Menu is effective for one time only. After system restart, the device boot order will still be based on BIOS Setup settings. : Q-FLASH Press the key to access the Q-Flash utility directly without having to enter BIOS Setup first.
– 32 –

Chapter 4 Installing the Operating System and Drivers
4-1 Operating System Installation
With the correct BIOS settings, you are ready to install the operating system. If you want to install an operating system on a RAID volume, you need to install the Intel® RST VMD Controller driver first during the OS installation process. Refer to the steps below: Step 1: Go to GIGABYTE’s website, browse to the motherboard model’s web page, download the Intel SATA Preinstall driver file on the SupportDownloadSATA RAID/AHCI page, unzip the file and copy the files to your USB thumb drive. Step 2: Boot from the Windows setup disc and perform standard OS installation steps. When the screen requesting you to load the driver appears, select Browse. Step 3: Insert the USB thumb drive and then browse to the location of the driver. When a screen as shown below appears, select Intel RST VMD Controller 467F and click Next to load the driver and continue the OS installation.
– 33 –

4-2 Drivers Installation
After you install the operating system, a dialog box will appear on the bottom-right corner of the desktop asking if you want to download and install the drivers and GIGABYTE applications via GIGABYTE Control Center (GCC). Click Install to proceed with the installation. (In BIOS Setup, make sure SettingsGigabyte Utilities Downloader ConfigurationGigabyte Utilities Downloader is set to Enabled.)
When the End User License Agreement dialog box appears, press to install GIGABYTE Control Center (GCC). On the GIGABYTE CONTROL CENTER screen, select the drivers and applications you want to install and click Install.
Before the installation, make sure the system is connected to the Internet. & Please visit GIGABYTE’s website for more software information.
https://www.gigabyte.com/WebPage/926/intel700-app.html & Please visit GIGABYTE’s website for more troubleshooting information.
https://www.gigabyte.com/WebPage/351/faq.html – 34 –

Chapter 5 Appendix

5-1 Configuring a RAID Set

RAID Levels

RAID 0

Minimum Number of Hard Drives Array Capacity

2
Number of hard drives * Size of the
smallest drive

Fault Tolerance

No

RAID 1
2
Size of the smallest drive Yes

RAID 5

RAID 10

3

4

(Number of hard drives -1) * Size of the smallest drive
Yes

(Number of hard drives/2) * Size of the
smallest drive
Yes

Before you begin, please prepare the following items: This motherboard supports SATA RAID 0, RAID 1, RAID 5, and RAID 10. Prepare the correct number of hard drives as indicated in the table above before configuring a RAID array.
· SATA hard drives or SSDs. To ensure optimal performance, it is recommended that you use two hard drives with identical model and capacity.
· Windows setup disc. · An Internet connected computer. · A USB thumb drive.
The Intel® B760 Chipset doesn’t include RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices.

& Please visit GIGABYTE’s website for details on configuring a RAID array. https://www.gigabyte.com/WebPage/927/intel700-raid.html
– 35 –

Regulatory Notices
United States of America, Federal Communications Commission Statement
Supplier’s Declaration of Conformity 47 CFR § 2.1077 Compliance Information
Product Name: Motherboard Trade Name: GIGABYTE Model Number: B760M GAMING X AX/B760M GAMING X/B760M G X AX DDR4/B760M GAMING X DDR4
Responsible Party ­ U.S. Contact Information: G.B.T. Inc. Address: 17358 Railroad street, City Of Industry, CA91748 Tel.: 1-626-854-9338 Internet contact information: https://www.gigabyte.com
FCC Compliance Statement: This device complies with Part 15 of the FCC Rules, Subpart B, Unintentional Radiators. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

The FCC with its action in ET Docket 96-8 has adopted a safety standard for human exposure to radio frequency (RF) electromagnetic energy emitted by FCC certified equipment. The Intel PRO/Wireless 5000 LAN products meet the Human Exposure limits found in OET Bulletin 65, 2001, and ANSI/ IEEE C95.1, 1992. Proper operation of this radio according to the instructions found in this manual will result in exposure substantially below the FCC’s recommended limits.
The following safety precautions should be observed: · Do not touch or move antenna while the unit is transmitting or receiving. · Do not hold any component containing the radio such that the antenna is very close or touching any exposed parts of the body, especially the face
or eyes, while transmitting. · Do not operate the radio or attempt to transmit data unless the antenna is connected; if not, the radio may be damaged. · Use in specific environments:
– The use of wireless devices in hazardous locations is limited by the constraints posed by the safety directors of such environments. – The use of wireless devices on airplanes is governed by the Federal Aviation Administration (FAA). – The use of wireless devices in hospitals is restricted to the limits set forth by each hospital.

Antenna use: In order to comply with FCC RF exposure limits, low gain integrated antennas should be located at a minimum distance of 7.9 inches (20 cm) or more from the body of all persons.
Explosive Device Proximity Warning Warning: Do not operate a portable transmitter (such as a wireless network device) near unshielded blasting caps or in an explosive environment unless the device has been modified to be qualified for such use.
Antenna Warning The wireless adapter is not designed for use with high-gain antennas.
Use On Aircraft Caution Caution: Regulations of the FCC and FAA prohibit airborne operation of radio-frequency wireless devices because their signals could interfere with critical aircraft instruments.
Other Wireless Devices Safety Notices for Other Devices in the Wireless Network: Refer to the documentation supplied with wireless Ethernet adapters or other devices in the wireless network.
Canada, Canada-Industry Notice: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme aux normes Canada d’Industrie de RSS permis-exempt. L’utilisation est assujetti aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.
Caution: When using IEEE 802.11a wireless LAN, this product is restricted to indoor use due to its operation in the 5.15-to 5.25-GHz frequency range. Industry Canada requires this product to be used indoors for the frequency range of 5.15 GHz to 5.25 GHz to reduce the potential for harmful interference to co-channel mobile satellite systems. High power radar is allocated as the primary user of the 5.25-to 5.35-GHz and 5.65 to 5.85-GHz bands. These radar stations can cause interference with and/or

damage to this device. The maximum allowed antenna gain for use with this device is 6dBi in order tocomply with the E.I.R.P limit for the 5.25-to 5.35 and 5.725 to 5.85 GHz frequency range in point-to-point operation. To comply with RF exposure requirements all antennas should be located at a minimum distance of 20cm, or the minimum separation distance allowed by the module approval, from the body of all persons.
Attention: l’utilisation d’un réseau sans fil IEEE802.11a est restreinte à une utilisation en intérieur à cause du fonctionnement dansla bande de fréquence 5.15-5.25 GHz. Industry Canada requiert que ce produit soit utilisé à l’intérieur des bâtiments pour la bande de fréquence 5.15-5.25 GHz afin de réduire les possibilités d’interférences nuisibles aux canaux co-existants des systèmes de transmission satellites. Les radars de puissances ont fait l’objet d’une allocation primaire de fréquences dans les bandes 5.25-5.35 GHz et 5.65-5.85 GHz. Ces stations radar peuvent créer des interférences avec ce produit et/ou lui être nuisible. Le gain d’antenne maximum permissible pour une utilisation avec ce produit est de 6 dBi afin d’être conforme aux limites de puissance isotropique rayonnée équivalente (P.I.R.E.) applicable dans les bandes 5.25-5.35 GHz et 5.725-5.85 GHz en fonctionnement point-à-point. Pour se conformer aux conditions d’exposition de RF toutes les antennes devraient être localisées à une distance minimum de 20 cm, ou la distance de séparation minimum permise par l’approbation du module, du corps de toutes les personnes.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be chosen so that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
Conformément à la réglementation d’Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d’un type et d’un gain maximal (ou inférieur) approuvé pour l’émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radio électrique à l’intention des autres utilisateurs, il faut choisir le type d’antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l’intensité nécessaire à l’établissement d’une communication satisfaisante.

– 36 –

European Union (EU) CE Declaration of Conformity This device complies with the following directives: Electromagnetic Compatibility Directive 2014/30/EU, Low- voltage Directive 2014/35/EU, Radio Equipment Directive 2014/53/EU, ErP Directive 2009/125/EC, RoHS directive (recast) 2011/65/EU & the 2015/863 Statement. This product has been tested and found to comply with all essential requirements of the Directives.
European Union (EU) RoHS (recast) Directive 2011/65/EU & the European Commission Delegated Directive (EU) 2015/863 Statement GIGABYTE products have not intended to add and safe from hazardous substances (Cd, Pb, Hg, Cr+6, PBDE, PBB, DEHP, BBP, DBP and DIBP). The parts and components have been carefully selected to meet RoHS requirement. Moreover, we at GIGABYTE are continuing our efforts to develop products that do not use internationally banned toxic chemicals.
European Union (EU) Community Waste Electrical & Electronic Equipment (WEEE) Directive Statement GIGABYTE will fulfill the national laws as interpreted from the 2012/19/ EU WEEE (Waste Electrical and Electronic Equipment) (recast) directive. The WEEE Directive specifies the treatment, collection, recycling and disposal of electric and electronic devices and their components. Under the Directive, used equipment must be marked, collected separately, and disposed of properly.
WEEE Symbol Statement The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, the device should be taken to the waste collection centers for activation of the treatment, collection, recycling and disposal procedure.
For more information about where you can drop off your waste equipment for recycling, please contact your local government office, your household waste disposal service or where you purchased the product for details of environmentally safe recycling.
Battery Information European Union–Disposal and recycling information GIGABYTE Recycling Program (available in some regions)
This symbol indicates that this product and/or battery should not be disposed of with household waste. You must use the public collection system to return, recycle, or treat them in compliance with the local regulations.
End of Life Directives-Recycling The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, the device should be taken to the waste collection centers for activation of the treatment, collection, recycling and disposal procedure.
Déclaration de Conformité aux Directives de l’Union européenne (UE) Cet appareil portant la marque CE est conforme aux directives de l’UE suivantes: directive Compatibilité Electromagnétique 2014/30/UE, directive Basse Tension 2014/35/UE, directive équipements radioélectriques 2014/53/UE, la directive RoHS II 2011/65/UE & la déclaration 2015/863. La conformité à ces directives est évaluée sur la base des normes européennes harmonisées applicables.
European Union (EU) CE-Konformitätserklärung Dieses Produkte mit CE- Kennzeichnung erfüllen folgenden EU-Richtlinien: EMV-Richtlinie 2014/30/EU, Niederspannungsrichtlinie 2014/35/EU, Funkanlagen Richtlinie 2014/53/EU, RoHS- Richtlinie 2011/65/EU erfüllt und die 2015/863 Erklärung. Die Konformität mit diesen Richtlinien wird unter Verwendung der entsprechenden Standards zurEuropäischen Normierung beurteilt.
CE declaração de conformidade Este produto com a marcação CE estão em conformidade com das seguintes Diretivas UE: Diretiva Baixa Tensão 2014/35/EU; Diretiva CEM 2014/30/EU; Diretiva RSP 2011/65/UE e a declaração 2015/863. A conformidade com estas diretivas é verificada utilizando as normas europeias harmonizadas.

CE Declaración de conformidad Este producto que llevan la marca CE cumplen con las siguientes Directivas de la Unión Europea: Directiva EMC 2014/30/EU, Directiva de bajo voltaje 2014/35/EU, Directiva de equipamentos de rádio 2014/53/EU, Directiva RoHS 2011/65/EU y la Declaración 2015/863. El cumplimiento de estas directivas se evalúa mediante las normas europeas armonizadas.
CE Dichiarazione di conformità I prodotti con il marchio CE sono conformi con una o più delle seguenti Direttive UE, come applicabile: Direttiva EMC 2014/30/UE, Direttiva sulla bassa tensione 2014/35/UE, Direttiva di apparecchiature radio 2014/53/ UE, Direttiva RoHS 2011/65/EU e Dichiarazione 2015/863. La conformità con tali direttive viene valutata utilizzando gli Standard europei armonizzati applicabili.
Deklaracja zgodnoci UE Unii Europejskiej Urzdzenie jest zgodne z nastpujcymi dyrektywami: Dyrektywa kompatybilnoci elektromagnetycznej 2014/30/UE, Dyrektywa niskonapiciowej 2014/35/UE, Dyrektywa urzdze radiowych 2014/53/ UE, Dyrektywa RoHS 2011/65/UE i dyrektywa2015/863. Niniejsze urzdzenie zostalo poddane testom i stwierdzono jego zgodno z wymaganiami dyrektywy.
ES Prohlásení o shod Toto zaízení spluje pozadavky Smrnice o Elektromagnetické kompatibilit 2014/30/EU, Smrnice o Nízkém naptí 2014/35/EU, Smrnice o rádiových zaízeních 2014/53/EU, Smrnice RoHS 2011/65/ EU a 2015/863. Tento produkt byl testován a bylo shledáno, ze spluje vsechny základní pozadavky smrnic.
EK megfelelségi nyilatkozata A termék megfelelnek az alábbi irányelvek és szabványok követelményeinek, azok a kiállításidpontjában érvényes, aktuális változatában: EMC irányelv 2014/30/EU, Kisfeszültség villamos berendezésekre vonatkozó irányelv 2014/35/EU, rádióberendezések irányelv 2014/53/EU, RoHS irányelv 2011/65/EU és 2015/863.
: 2014/30/ , 2014/35/EU, 2014/53/ , RoHS 2011/65/ 2015/863. .
D33006 RoHS
WARNING
· INGESTION HAZARD: This product contains a button cell or coin battery.
· DEATH or serious injury can occur if ingested. · A swallowed button cell or coin battery can cause Internal
Chemical Burns in as little as 2 hours. · KEEP new and used batteries OUT OF REACH of CHILDREN · Seek immediate medical attention if a battery is suspected to
be swallowed or inserted inside any part of the body.
– Battery type: CR2032, voltage rating: +3VDC. – Non-rechargeable batteries are not to be recharged. – Remove and immediately recycle or dispose of used batteries, batteries
from equipment not used for an extended period of time according to local regulations and keep away from children. Do NOT dispose of batteries in household trash or incinerate. – Even used batteries may cause severe injury or death. – Do not force discharge, recharge, disassemble, heat above (manufacturer’s specified temperature rating) or incinerate. Doing so may result in injury due to venting, leakage or explosion resulting in chemical burns. – For treatment information, call a local poison control center. – The product contains non-replaceable batteries.

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European Community Radio Equipment Directive Compliance Statement:
This equipment complies with all the requirements and other relevant provisions of Radio Equipment Directive 2014/53/EU. This equipment is suitable for home and office use in all the European Community Member States and EFTA Member States. The low band 5.15 -5.35 GHz is for indoor use only.
AT BE BG CH CY CZ DE DK EE EL ES FI FR HR HU IE IS IT LI LT LU LV MT NL PL PT RO SE SI SK TR UK

NCC Wireless Statements / (1)
(2)

Korea KCC NCC Wireless Statement: 5,25GHz – 5,35 GHz .
Japan Wireless Statement: 5.15 GHz ~ 5.35 GHz :

Wireless module approvals: To identify your Motherboard version or revision number, look for “REV: X.X” printed on the PCB on the top left corner of the Motherboard. For example, “REV:1.0” means the revision of the motherboard is 1.0.

Motherboard revision no.: B760M GAMING X AX rev. 1.0

Wireless module manufacturer, model name: Intel® Corporation AX210NGW

B760M GAMING X AX rev. 1.1

Intel® Corporation AX211NGW

B760M GAMING X AX rev. 1.2

Realtek Semiconductor Corp. RTL8852CE

B760M G X AX DDR4 rev. 1.0

AMD Corporation RZ608, MediaTek MT7921K

B760M G X AX DDR4 rev. 1.1

Intel® Corporation AX210NGW

B760M G X AX DDR4 rev. 1.2

Intel® Corporation AX211NGW

B760M G X AX DDR4 rev. 1.3 B760M G X AX DDR4 rev. 1.4

Realtek Semiconductor Corp. RTL8852CE Intel® Corporation AX211NGW

Approvals for wireless module RZ608, MT7921K:

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Approvals for wireless module AX211NGW: Approvals for wireless module AX210NGW: Approvals for wireless module RTL8852CE:
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Contact Us
GIGA-BYTE TECHNOLOGY CO., LTD. Address: No.6, Baoqiang Rd., Xindian Dist., New Taipei City 231 TEL: +886-2-8912-4000, FAX: +886-2-8912-4005 Tech. and Non- Tech. Support (Sales/Marketing) : https://esupport.gigabyte.com WEB address (English): https://www.gigabyte.com WEB address (Chinese): https://www.gigabyte.com/tw
· GIGABYTE eSupport To submit a technical or non-technical (Sales/Marketing) question, please link to: https://esupport.gigabyte.com
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References

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