onsemi MC74VHC1G08 Single 2 Input And Gate User Guide

: June 14, 2024
: onsemi

Table of Contents

onsemi MC74VHC1G08 Single 2 Input And Gate
Features
PACKAGE DIMENSIONS
PUBLICATION ORDERING INFORMATION
Read User Manual Online (PDF format)
Download This Manual (PDF format)

onsemi MC74VHC1G08 Single 2 Input And Gate

Single 2-Input AND Gate MC74VHC1G08, MC74VHC1GT08

The MC74VHC1G08 / MC74VHC1GT08 is a single 2 input AND gate in tiny footprint packages. The MC74VHC1G08 has CMOS−level input thresholds while the MC74VHC1GT08 has TTL−level input thresholds.
The input structures provide protection when voltages up to 5.5 V are applied, regardless of the supply voltage. This allows the device to be used to interface 5 V circuits to 3 V circuits. Some output structures also provide protection when VCC = 0 V and when the output voltage exceeds VCC. These input and output structures help prevent device destruction caused by supply voltage − input/output voltage mismatch, battery backup, hot insertion, etc.

Features

Designed for 2.0 V to 5.5 V VCC Operation
3.5 ns tPD at 5 V (typ)
Inputs/Outputs Over−Voltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 8 mA at 3.0 V
Available in SC−88A, SC−74A, TSOP−5, SOT−953 and UDFN6 Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-2

XX = Specific Device Code
M = Date Code*
A = Assembly Location
Y = Year
W = Work Week
= Pb−Free Package

(Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location.

ORDERING INFORMATION

See detailed ordering, marking and shipping information on page 8 of this data sheet.

MC74VHC1G08, MC74VHC1GT08

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-3

PIN ASSIGNMENT (SC−88A / TSOP−5 / SC−74A)

Pin	Function
1	B
2	A
3	GND
4	Y
5	VCC

PIN ASSIGNMENT (SOT−953)

Pin	Function
1	A
2	GND
3	B
4	Y
5	VCC

PIN ASSIGNMENT (UDFN)

Pin	Function
1	B
2	A
3	GND
4	Y
5	NC
6	VCC

FUNCTION TABLE

Input	Output
A	B
L	L
L	H
H	L
H	H

MC74VHC1G08, MC74VHC1GT08

MAXIMUM RATINGS

Symbol	Characteristics	Value	Unit
VCC	DC Supply Voltage	TSOP−5, SC−88A (NLV) SC−74A, SC−88A, UDFN6, SOT−553,
SOT−953	−0.5 to +7.0

−0.5 to +6.5

| V
VIN| DC Input Voltage| TSOP−5, SC−88A (NLV) SC−74A, SC−88A, UDFN6, SOT−553, SOT−953| −0.5 to +7.0

−0.5 to +6.5

| V
VOUT| DC Output Voltage (NLV)| 1Gxx and MC74VHC1GT08P5T5G−L22088| −0.5 to VCC

0.5| V
1GTxx Active−Mode (High or Low State)

Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V)

| −0.5 to VCC + 0.5

−0.5 to +7.0

DC Output Voltage| Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V)| −0.5 to VCC + 0.5

−0.5 to +6.5

VOUT > VCC, VOUT < GND

| ±20| mA
1GTxx VOUT < GND| −20
DC Output Diode Current| VOUT < GND| −20| mA
IOUT| DC Output Source/Sink Current| ±25| mA
ICC or IGND| DC Supply Current per Supply Pin or Ground Pin| ±50| mA
TSTG| Storage Temperature Range| −65 to +150| °C
TL| Lead Temperature, 1 mm from Case for 10 secs| 260| °C
TJ| Junction Temperature Under Bias| +150| °C
8JA| Thermal Resistance (Note 2)| SC−88A SC−74A SOT−553 SOT−953 UDFN6| 377

320

324

254

154

| ° C/W
PD| Power Dissipation in Still Air| SC−88A SC−74A SOT−553 SOT−953 UDFN6| 332

390

386

491

812

1000

| V
ILatchup| Latchup Performance (Note 4)| ±100| mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

Applicable to devices with outputs that may be tri−stated.
Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
Tested to EIA/JESD78 Class II.

RECOMMENDED OPERATING CONDITIONS

Symbol	Characteristics	Min	Max	Unit
VCC	Positive DC Supply Voltage	2.0	5.5	V
VIN	DC Input Voltage	0	5.5	V
VOUT	DC Output Voltage (NLV)	1Gxx and MC74VHC1GT08P5T5G−L22088	0	VCC

1GTxx Active−Mode (High or Low State)

Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V)

| 0

0

| VCC 5.5

5.5

DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V)| 0

0

| VCC 5.5

5.5

| V
TA| Operating Temperature Range| −55| +125| °C
tr , tf| Input Rise and Fall Time TSOP−5, SC−88A (NLV) VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V| ****

0

| ****

100

20

| ns/V
Input Rise and Fall Time SC−74A, SC−88A, UDFN6, SOT−553, SOT−953

VCC = 2.0 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V

| ****

0

| ****

20

10

5

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (MC74VHC1G08)

Symbol

| ****

Parameter

Unit

---|---|---|---|---|---|---|---
Min| Typ| Max| Min| Max| Min| Max
VIH| High−Level Input Voltage| | 2.0| 1.5| −| −| 1.5| −| 1.5| −| V
3.0| 2.1| −| −| 2.1| −| 2.1| −
4.5| 3.15| −| −| 3.15| −| 3.15| −
5.5| 3.85| −| −| 3.85| −| 3.85| −
VIL| Low−Level Input Voltage| | 2.0| −| −| 0.5| −| 0.5| −| 0.5| V
3.0| −| −| 0.9| −| 0.9| −| 0.9
4.5| −| −| 1.35| −| 1.35| −| 1.35
5.5| −| −| 1.65| −| 1.65| −| 1.65
VOH| High−Level Output Voltage| VIN = VIH or VIL IOH = −50 µA IOH = −50 µA IOH = −50 µA IOH = −4 mA IOH = −8 mA| ****

2.0

3.0

4.5

3.0

4.5

| ****

1.9

2.9

4.4

2.58

3.94

| ****

2.0

3.0

4.5

−

| ****

−

| ****

1.9

2.9

4.4

2.48

3.80

| ****

−

| ****

1.9

2.9

4.4

2.34

3.66

| ****

−

| V
VOL| Low−Level Output Voltage| VIN = VIH or VIL IOL = 50 µA

IOL = 50 µA IOL = 50 µA IOL = 4 mA IOL = 8 mA

| ****

2.0

3.0

4.5

3.0

4.5

| ****

−

| ****

0.0

−

| ****

0.1

0.36

| ****

−

| ****

0.1

0.44

| ****

−

| ****

0.1

0.52

| V
IIN| Input Leakage Current| VIN = 5.5 V or GND| 2.0 to 5.5| −| −| ±0.1| −| ±1.0| −| ±1.0| µA
IOFF| Power Off Leakage Current (NLV)| VIN = 5.5 V| 0.0| −| −| 1.0| −| 10| −| 10| µA
Power Off Leakage Current| VIN = 5.5 V or VOUT = 5.5 V| 0.0| −| −| 1.0| −| 10| −| 10| µA
ICC| Quiescent Supply Current| VIN = VCC or GND| 5.5| −| −| 1.0| −| 20| −| 40| µA

Symbol

| ****

Parameter

Unit

---|---|---|---|---|---|---|---
Min| Typ| Max| Min| Max| Min| Max
VIH| High−Level Input Voltage| | 2.0| 1.0| −| −| 1.0| −| 1.0| −| V
3.0| 1.4| −| −| 1.4| −| 1.4| −
4.5| 2.0| −| −| 2.0| −| 2.0| −
5.5| 2.0| −| −| 2.0| −| 2.0| −
VIL| Low−Level Input Voltage| | 2.0| −| −| 0.28| −| 0.28| −| 0.28| V
3.0| −| −| 0.45| −| 0.45| −| 0.45
4.5| −| −| 0.8| −| 0.8| −| 0.8
5.5| −| −| 0.8| −| 0.8| −| 0.8
VOH| High−Level Output Voltage| VIN = VIH or VIL IOH = −50 µA IOH = −50 µA IOH = −50 µA IOH = −4 mA IOH = −8 mA| ****

2.0

3.0

4.5

3.0

4.5

| ****

1.9

2.9

4.4

2.58

3.94

| ****

2.0

3.0

4.5

−

| ****

−

| ****

1.9

2.9

4.4

2.48

3.80

| ****

−

| ****

1.9

2.9

4.4

2.34

3.66

| ****

−

| V
VOL| Low−Level Output Voltage| VIN = VIH or VIL IOL = 50 µA

IOL = 50 µA IOL = 50 µA IOL = 4 mA IOL = 8 mA

| ****

2.0

3.0

4.5

3.0

4.5

| ****

−

| ****

0.0

−

| ****

0.1

0.36

| ****

−

| ****

0.1

0.44

| ****

−

| ****

0.1

0.52

| V
IIN| Input Leakage Current| VIN = 5.5 V or GND| 2.0 to 5.5| −| −| ±0.1| −| ±1.0| −| ±1.0| µA
IOFF| Power Off Leakage Current| VIN = 5.5 V or VOUT = 5.5 V| 0| −| −| 1.0| −| 10| −| 10| µA
Power Off Leakage Current (MC74VHC1GT08P 5T5G−L22088

Only)

| VIN = 5.5 V| 0| −| −| 1.0| −| 10| −| 10
ICC| Quiescent Supply Current| VIN = VCC or GND| 5.5| −| −| 1.0| −| 20| −| 40| µA
ICCT| Increase in Quies- cent Supply Current per Input Pin| One Input: VIN

= 3.4 V; Other

Input at VCC or GND

| 5.5| −| −| 1.35| −| 1.5| −| 1.65| mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

AC ELECTRICAL CHARACTERISTICS

Symbol

| ****

Parameter

| ****

Conditions

| ****

V CC (V)

| T A = 25 ° C| − 40 ° C £ T A £ 85 ° C| − 55 ° C £ T A £ 125 ° C| ****

Unit

---|---|---|---|---|---|---|---
Min| Typ| Max| Min| Max| Min| Max
tPLH, tPHL| Propagation Delay,

A to Y

(Figures 3 and 4)

| CL = 15 pF| 3.0 to 3.6| −| 4.1| 8.8| −| 10.5| −| 12.5| ns
CL = 50 pF| −| 5.9| 12.3| −| 14.0| −| 16.5
CL = 15 pF| 4.5 to 5.5| −| 3.5| 5.9| −| 7.0| −| 9.0
CL = 50 pF| −| 4.2| 7.9| −| 9.0| −| 11.0
CIN| Input Capacitance| | | −| 4.0| 10| −| 10| −| 10| pF
COUT| Output Capacitance| Output in High Impedance State| | −| 6.0| −| −| −| −| −| pF
Symbol| Parameter| Typical @ 25 ° C, V CC = 5.0 V| Unit
---|---|---|---
CPD| Power Dissipation Capacitance (Note 5)| 8.0| pF

CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC 2 fin + ICC VCC.

MC74VHC1G08, MC74VHC1GT08

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-4

V CC , V

| ****

V mi , V

| V mo , V| ****

V Y , V

---|---|---|---
t PLH , t PHL| t PZL , t PLZ , t PZH , t PHZ
3.0 to 3.6| VCC/2| VCC/2| VCC/2| 0.3
4.5 to 5.5| VCC/2| VCC/2| VCC/2| 0.3

ORDERING INFORMATION

Device| Packages| Specific Device Code| Pin 1 Orientation (See below)| Shipping †
---|---|---|---|---
MC74VHC1G08DFT1G| SC−88A| V2| Q2| 3000 / Tape & Reel
MC74VHC1G08DFT1G−L22038| SC−88A| V2| Q2| 3000 / Tape & Reel
MC74VHC1G08DFT2G| SC−88A| V2| Q4| 3000 / Tape & Reel
MC74VHC1G08DFT2G−F22038| SC−88A| V2| Q4| 3000 / Tape & Reel
NLVVHC1G08DFT1G| SC−88A| V2| Q2| 3000 / Tape & Reel
NLVVHC1G08DFT2G| SC−88A| V2| Q4| 3000 / Tape & Reel
M74VHC1GT08DFT1G| SC−88A| VT| Q2| 3000 / Tape & Reel
M74VHC1GT08DFT1G−L22038| SC−88A| VT| Q2| 3000 / Tape & Reel
M74VHC1GT08DFT2G| SC−88A| VT| Q4| 3000 / Tape & Reel
M74VHC1GT08DFT2G−F22038| SC−88A| VT| Q4| 3000 / Tape & Reel
NLVVHC1GT08DFT1G| SC−88A| VT| Q2| 3000 / Tape & Reel
NLVVHC1GT08DFT2G| SC−88A| VT| Q4| 3000 / Tape & Reel
MC74VHC1G08DBVT1G| SC−74A| V2| Q4| 3000 / Tape & Reel
MC74VHC1GT08DBVT1G| SC−74A| VT| Q4| 3000 / Tape & Reel
MC74VHC1G08DTT1G| TSOP−5| V2| Q4| 3000 / Tape & Reel
M74VHC1GT08DTT1G| TSOP−5| VT| Q4| 3000 / Tape & Reel
NLV74VHC1G08DTT1G| TSOP−5| V2| Q4| 3000 / Tape & Reel
NLVVHC1GT08DTT1G| TSOP−5| VT| Q4| 3000 / Tape & Reel
MC74VHC1G08P5T5G| SOT−953| E| Q2| 8000 / Tape & Reel
MC74VHC1G08P5T5G−L22088| SOT−953| E| Q2| 8000 / Tape & Reel
MC74VHC1GT08P5T5G| SOT−953| P| Q2| 8000 / Tape & Reel
MC74VHC1GT08P5T5G−L22088| SOT−953| P| Q2| 8000 / Tape & Reel
MC74VHC1G08MU1TCG| UDFN6, 1.45 x 1.0, 0.5P| K (Rotated 180° CW)| Q4| 3000 / Tape & Reel
MC74VHC1GT08MU1TCG| UDFN6, 1.45 x 1.0, 0.5P| 4 (Rotated 270° CW)| Q4| 3000 / Tape & Reel
MC74VHC1G08MU2TCG| UDFN6, 1.2 x 1.0, 0.4P| 2| Q4| 3000 / Tape & Reel
MC74VHC1G08MU3TCG| UDFN6, 1.0 x 1.0, 0.35| D (Rotated 270° CW)| Q4| 3000 / Tape & Reel
MC74VHC1GT08MU3TCG| UDFN6, 1.0 x 1.0, 0.35| K| Q4| 3000 / Tape & Reel

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
Please refer to NLV specifications for this device.

PACKAGE DIMENSIONS

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-6

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

NOTES

DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETERS.
MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE.

DIM

| MILLIMETERS
---|---
MIN| MAX
A| 0.90| 1.10
A1| 0.01| 0.10
b| 0.25| 0.50
c| 0.10| 0.26
D| 2.85| 3.15
E| 2.50| 3.00
E1| 1.35| 1.65
e| 0.95 BSC
L| 0.20°| 0.6°0
M| 0| 10

GENERIC MARKING DIAGRAM

XXX = Specific Device Code
M = Date Code
= Pb−Free Package

(Note: Microdot may be in either location)

This information is generic. Please refer to the device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking.

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-9

NOTES

DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
419A−01 OBSOLETE. NEW STANDARD 419A−02.
DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.

DIM

| INCHES| MILLIMETERS
---|---|---
MIN| MAX| MIN| MAX
A| 0.071| 0.087| 1.80| 2.20
B| 0.045| 0.053| 1.15| 1.35
C| 0.031| 0.043| 0.80| 1.10
D| 0.004| 0.012| 0.10| 0.30
G| 0.026 BSC| 0.65 BSC
H| —| 0.004| —| 0.10
J| 0.004| 0.010| 0.10| 0.25
K| 0.004| 0.012| 0.10| 0.30
N| 0.008 REF| 0.20 REF
S| 0.079| 0.087| 2.00| 2.20

GENERIC MARKING DIAGRAM

XXX = Specific Device Code
M = Date Code
= Pb−Free Package

(Note: Microdot may be in either location)

This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking.

STYLE 1:

PIN 1. BASE
EMITTER
BASE
COLLECTOR
COLLECTOR

STYLE 2:

PIN 1. ANODE
EMITTER
BASE
COLLECTOR
CATHODE

STYLE 3:

PIN 1. ANODE 1
N/C
ANODE 2
CATHODE 2
CATHODE 1

STYLE 4:

PIN 1. SOURCE 1
DRAIN 1/2
SOURCE 1
GATE 1
GATE 2

STYLE 5:
P

IN 1. CATHODE
COMMON ANODE
CATHODE 2
CATHODE 3
CATHODE 4

STYLE 6:

PIN 1. EMITTER 2
BASE 2
EMITTER 1
COLLECTOR
COLLECTOR 2/BASE 1

STYLE 7:

PIN 1. BASE
EMITTER
BASE
COLLECTOR
COLLECTOR

STYLE 8:

PIN 1. CATHODE
COLLECTOR
N/C
BASE
EMITTER

STYLE 9:

PIN 1. ANODE
CATHODE
ANODE
ANODE
ANODE

Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment.

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-11

For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

NOTES

DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETERS.
MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A.
OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY.

DIM

| MILLIMETERS
---|---
MIN| MAX
A| 2.85| 3.15
B| 1.35| 1.65
C| 0.90| 1.10
D| 0.25| 0.50
G| 0.95 BSC
H| 0.01| 0.10
J| 0.10| 0.26
K| 0.20°| 0.6°0
M| 0| 10
S| 2.50| 3.00

GENERIC MARKING DIAGRAM

XXX = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
= Pb−Free Package
XXX = Specific Device Code
M = Date Code
= Pb−Free Package

(Note: Microdot may be in either location)

This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “ ”,may or may not be present.

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-13

NOTES

DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETERS.
DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL.
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.

| | MILLIMETERS
---|---|---
DIM| MIN| MAX
A| 0.45| 0.55
A1| 0.00| 0.05
A3| 0.127 REF
b| 0.15| 0.25
D| 1.20 BSC
E| 1.00 BSC
e| 0.40 BSC
L| 0.30| 0.40
L1| 0.00| 0.15
L2| 0.40| 0.50

**GENERIC MARKING DIAGRAM***

X = Specific Device Code
M = Date Code

*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present.

MOUNTING FOOTPRINT

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-16

GENERIC MARKING DIAGRAM

X = Specific Device Code
M = Date Code

This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present.

NOTES

DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETERS.
DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP.

MOUNTING FOOTPRINT

For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-19

GENERIC MARKING DIAGRAM

X = Specific Device Code
M = Date Code

This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot ”, may or may not be present. Some products may not follow the Generic Marking.

NOTES

DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETERS.
DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP.
PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH.

**RECOMMENDED SOLDERING FOOTPRINT***

For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

onsemi-MC74VHC1G08-Single-2-Input-And-Gate-fig-22

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

NOTES

DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETERS
MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL.
DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.

DIM

| MILLIMETERS
---|---
MIN| NOM| MAX
A| 0.34| 0.37| 0.40
b| 0.10| 0.15| 0.20
C| 0.07| 0.12| 0.17
D| 0.95| 1.00| 1.05
E| 0.75| 0.80| 0.85
e| 0.35 BSC
H E| 0.95| 1.00| 1.05
L| 0.175 REF
L2| 0.05| 0.10| 0.15
L3| −−−| −−−| 0.15

GENERIC MARKING DIAGRAM

X = Specific Device Code
M = Month Code

This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present.

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