onsemi NVLJWS5D0N03CL Power Single N Channel Owner’s Manual

September 11, 2024
onsemi

onsemi NVLJWS5D0N03CL Power Single N Channel

Specifications

  • Product Name: MOSFET – Power, Single N-Channel
  • Operating Voltage: 30 V
  • Power Dissipation : 4.2 mW
  • Continuous Drain Current: 77 A
  • Model Number: NVLJWS5D0N03CL

Product Features

  • Drain-to-Source Voltage: 30 V
  • Gate-to-Source Voltage: V
  • Continuous Drain Current RqJC: 77 A
  • Power Dissipation RqJC: 55 W
  • Continuous Drain Current RqJA: 18 A
  • Power Dissipation RqJA: 13 W
  • Operating Junction and Storage Temperature Range Source Current (Body Diode): 37 A

Features

  • Small Footprint for Compact Design
  • Low RDS(on) to Minimize Conduction Losses
  • Low QG and Capacitance to Minimize Driver Losses
  • Wettable Flank Option for Enhanced Optical Inspection
  • AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free and are RoHS Compliant

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Parameter Symbol Value Unit
Drain−to−Source Voltage VDSS 30 V
Gate−to−Source Voltage VGS ±20 V
Continuous Drain Current R8JC (Notes 1, 3)

Steady State

| TC = 25°C| ID| 77| A
TC = 100°C| 55
Power Dissipation R8JC (Note 1)| TC = 25°C| PD| 45| W
TC = 100°C| 23
Continuous Drain Current R8JA (Notes 1, 2, 3)|

Steady State

| TA = 25°C| ID| 18| A
TA = 100°C| 13
Power Dissipation R8JA (Notes 1, 2)| TA = 25°C| PD| 2.5| W
TA = 100°C| 1.2
Pulsed Drain Current| TA = 25°C, tp = 10 µs| IDM| 317| A
Operating Junction and Storage Temperature Range| TJ, Tstg| − 55 to

+175

| °C
Source Current (Body Diode)| IS| 37| A
Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 4.8 A)| EAS| 101| MJ
Lead Temperature for Soldering Purposes (1/8² from case for 10 s)| TL| 260| °C

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter Symbol Value Unit
Junction−to−Case − Steady State R8JC 3.3 °C/W
Junction−to−Ambient − Steady State (Note 2) R8JA 61
  1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted.
  2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
  3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle.
V (BR)DSS R DS(on) MAX I D MAX

30 V

| 4.2 mQ @ 10 V|

77 A

6.6 mQ @ 4.5 V

ELECTRICAL CONNECTION

ORDERING INFORMATION
See detailed ordering, marking, and shipping information in the package dimensions section on page 5 of this data sheet.

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

Parameter| Symbol| Test Condition| Min| Typ| Max| Unit
---|---|---|---|---|---|---

OFF CHARACTERISTICS

Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 µA 30 V
Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/ TJ ID =
250 µA, ref to 25°C 14.4 mV/°C
Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 30 V TJ = 25°C
1 µA
TJ = 125°C 10
Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = 20 V 100 nA

ON CHARACTERISTICS (Note 4)

Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250 µA 1.2 2.0 V
Threshold Temperature Coefficient VGS/TJ ID = 250 µA, ref to 25°C −4.4

mV/°C
Drain−to−Source On Resistance| RDS(on)| VGS = 10 V, ID = 10 A| | 3.5| 4.2| mQ
VGS = 4.5 V, ID = 10 A| | 5.1| 6.6
Forward Transconductance| NFS| VDS = 10 V, ID = 10 A| | 44| | S

CHARGES AND CAPACITANCES

Input Capacitance| Ciss| ****

VGS = 0 V, VDS = 15 V, f = 1.0 MHz

| | 1350| | pF
---|---|---|---|---|---|---
Output Capacitance| Coss| | 650|
Reverse Transfer Capacitance| Cross| | 20|
Total Gate Charge| QG(TOT)| VGS = 4.5 V, VDS = 15 V; ID = 10 A| | 9.0| | ****



C

Total Gate Charge| QG(TOT)| ****


VGS = 10 V, VDS = 15 V, ID = 10 A

| | 20|
Threshold Gate Charge| QG(TH)| | 1.8|
Gate−to−Source Charge| QGS| | 3.0|
Gate−to−Drain Charge| QGD| | 2.0|
Plateau Voltage| VGP| | 2.3| | V

SWITCHING CHARACTERISTICS (Note 5)

Turn−On Delay Time| td(on)|

VGS = 10 V, VDD = 15 V, ID = 10 A, RG = 6 Q

| | 9.0| | ns
---|---|---|---|---|---|---
Rise Time| tr| | 4.0|
Turn−Off Delay Time| td(off)| | 30|
Fall Time| tf| | 6.0|

DRAIN−SOURCE DIODE CHARACTERISTICS

Forward Diode Voltage VSD VGS = 0 V, IS = 10 A TJ = 25°C 0.78 1.2 V
TJ = 125°C 0.64
Reverse Recovery Time tRR ****

VGS = 0 V, dlS/dt = 100 A/µs, IS = 10 A

| | 35| | ns
Charge Time| ta| | 17|
Discharge Time| TB| | 18|
Reverse Recovery Charge| QRR| | 23| | C

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  • Pulse Test: Pulse Width ≤ 300 s, Duty Cycle ≤ 2%.
  • Switching characteristics are independent of operating junction temperatures.

NVLJWS5D0N03CL

TYPICAL CHARACTERISTICS

DEVICE ORDERING INFORMATION

Device Marking Package Shipping
NVLJWS5D0N03CLTAG 5D0N WDFNW6

(Pb−Free, Wettable Flanks)

| 3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

PACKAGE DIMENSIONS

WDFNW6 2.05×2.05, 0.65P

  • CASE 515AD
  • ISSUE O

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PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

TECHNICAL SUPPORT

North American Technical Support:

  • Voice Mail: 1 800−282−9855
  • Toll-Free USA/Canada Phone: 011 421 33 790 2910

Europe, Middle East, and Africa Technical Support:

Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative

Frequently Asked Questions

  • Q: What is the maximum power dissipation of the MOSFET?
    • A: The MOSFET has a maximum power dissipation of 55 W for RqJC and 13 W for RqJA.
  • Q: Can the MOSFET handle high continuous drain currents?
    • A: Yes, the MOSFET is rated for a continuous drain current of up to 77 A.
  • Q: How should I handle the MOSFET during soldering?
    • A: Maintain the lead temperature for soldering purposes at TL for 10 seconds as specified in the user manual.

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