DFI TGU173 Mini-ITX Industrial Motherboard User Manual

TGU171/TGU173
Mini-ITX Industrial Motherboard
User’s Manual

TGU173 Mini-ITX Industrial Motherboard

Co pyright
This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.
Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.
© 2023. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.

FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

About this Manual
This manual can be downloaded from the website.
The manual is subject to change and update without notice, and may be based on editions that do not resemble your actual products. Please visit our website or contact our sales representatives for the latest editions.

Warranty

1. Warranty does not cover damages or failures that arise from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to the product that has been modified or altered.

Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.
5.  Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.

Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

Safety Measures

• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord.

About the Package
The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.

• 1 TGU171/TGU173 motherboard
• 1 COM port cable (Length: 250mm, 1 x COM ports)
• 1 Serial ATA data with power cable (Length: 300mm)
• 1 Heat sink
  -(Wide/Normal Temp -Cooler for 28W)(Default)
  -(Normal Temp. Fanless HS for 15W)(By request)
  -(Wide Temp. Fanless for 15W)(By request)

Note: The items are subject to change in the developing stage.
The board and accessories in the package may not come similar to the information listed above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact  your dealer or sales representative.

Before Using the System Board
When installing the system board in a new system, you will need at least the following internal components.

• Power adapter

External system peripherals may also be required for navigation and display, including at least a keyboard, a mouse and a video display monitor.

Introduction

▶ Specifications

**SYSTEM| **

Processor

| ****

11th Generation Intel® Core™ Processors Intel® Core™ i7-1185GRE, Quad Core, 12M Cache, 1.8GHz (4.4GHz), 15~28W Intel® Core™ i5-1145GRE, Quad Core, 8M Cache, 1.5GHz (4.1GHz), 15~28W Intel® Core™ i3-1115GRE, Dual Core, 6M Cache, 2.2GHz (3.9GHz), 15~28W Intel® Celeron® 6305E, Dual Core, 4M Cache, 1.8GHz (1.8GHz), 15W

---|---|---
Memory| 2 x 260-pin SO-DIMM up to 64GB (32GB per slot)

Dual channel DDR4 up to 3200MHz (Support in-band ECC)

BIOS| AMI SPI 256Mbit

GRAPHICS

| Controller| Intel® Iris® Xe Graphics for i7/i5 Processors
Intel® UHD Graphics for i3/Celeron Processors
Feature| OpenGL 4.5, DirectX 12, OpenCL 2.1 HW Decode: WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1 HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display| 1 x LVDS (Resolution up to 1920×1200 @60Hz) 1 x eDP (Resolution up to 3840×2160 @60Hz) 1 x DP++ (Resolution up to 3840×2160 @60Hz) 1 x HDMI (Resolution up to 3840×2160 @60Hz) 1 x USB Type C (Resolution up to 3840×2160 @60Hz. Support USB3.1 Gen2, 15W power delivery and DP Alt mode)
Quad Displays| LVDS + eDP + DP++ + HDMI + USB Type C
**EXPANSION| Interface| 1 x PCIe x4 (PCIe Gen 3 x4)
1 x M.2 2242/2280 M Key (PCIe Gen4 x4) (Support NVMe and Intel® Optane memory) (Support DFI proprietary expansion module) 1 x M.2 2242/3042/3052 B Key (PCIe Gen3 x1/SATA/USB 3.1 Gen1) (Support 4G/5G and storage module) (Opt.: PCIe Gen3 x2)
1 x M.2 2230 E Key (USB2.0) (Support Intel® CNVi module only and Intel® vPro) 1 x Nano-SIM Socket (Connect to M.2 Key B for 4G/5G module)
Note: Intel CNVi module Support List: AX201 & AC-9560
AUDIO| Audio Codec| Realtek ALC888

ETHERNET

| Controller| 2 x Intel® I211AT/I210IT PCIe (10/100/1000Mbps) 1 x Intel® I225LM/I225IT PCIe (10/100/1000Mbps/2.5Gbps)

REAR I/O

| Ethernet| 2 x GbE (RJ-45) 1 x 2.5GbE (RJ-45)
USB| 4 x USB 3.1 Gen2 (Type-A) 1 x USB Type-C (Support USB 3.1 Gen2, 15W power delivery and DP Alt mode)
Display| 1 x DP++ 1 x HDMI
**INTERNAL I/O**| Serial| 2 x RS-232/422/485 (2.0mm pitch) 2 x RS-232 (2.0mm pitch) (RS-232 w/ power)
---|---|---
USB| 4 x USB 2.0 (2.0mm pitch)
Display| 1 x LVDS

1 x eDP

Audio| 1 x Front Audio (2.0mm pitch)
SATA| 2 x SATA 3.0 (up to 6Gb/s) (RAID 0/1) 2 x SATA Power
DIO| 1 x 8-bit DIO 1 x DIO Power
Cooling| 1 x CPU fan 1 x System fan
WATCHDOG TIMER| Output & Interval| System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY| TPM| fTPM (default) / dTPM (option)
**POWER| Type| TGU171: Single 12V +/-5% DC
TGU173: Wide Range 9~36V
Connector| DC-in Jack
Right Angle Connector (4-pin) (available upon request) Straightl Type Connector (4-pin) (available upon request)
Consumption| Idle: TGU173-IE-1185GRE 15W: 12V@ 1.12A (13.44W) Max: TGU173-IE- 1185GRE 15W: 12V@ 6.26A (75.12W)
RTC Battery| CR2032 Coin Cell
****OS SUPPORT| Microsoft| Windows 10 IoT Enterprise 64-bit
Linux| Linux
****ENVIRONMENT| Temperature| Operating: -5 to 65°C / -20 to 70°C Storage: -40 to 85°C
Humidity| Operating: 5 to 90% RH Storage: 5 to 90% RH
MTBF| TGU171-IE-1185GRE 414,291 hrs @ 25°C; 254,601 hrs @ 45°C; 166,963 hrs @ 60°; 124,264 hrs @ 70°C; TGU173-IE-1185GRE 397,863 hrs @ 25°C; 244,099 hrs @ 45°C; 160,483 hrs @ 60°; 119,765 hrs @ 70°C; Calculation model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled
****MECHANICAL| Dimensions| 170mm (6.7″) x 170mm (6.7″)
Height| Top Side: 16.5mm, Bottom Side: 3.5mm
CERTIFICATIONS**| Certifications| CE, FCC, RoHS, UKCA

▶Block Diagram

▶ Dimension

Hardware Installation

▶ Board Layout

▶ Installing the Heat Sink

The CPU must be kept cool by using a heat sink, otherwise the CPU will overheat damaging both the CPU and system board.

1. Before you install the fan / heat sink, you must apply a thermal paste onto the top of the CPU. The thermal paste is usually supplied when you purchase the fan / heat sink assembly. Do not spread the paste all over the surface. When you later place the heat sink on top of the CPU, the compound will disperse evenly.
   Some heat sinks come with a patch of pre-applied thermal paste. Do not apply thermal paste if the fan / heat sink already has a patch of thermal paste on its underside. Peel the strip that covers the paste before you place the fan / heat sink on top of the CPU.

2. Place the heat sink on top of the CPU. The 4 spring screws around the heat sink, which are used to secure the heat sink onto the system board, must match the 4 mounting holes around the board.

3.  Screw tight two of the spring screws at opposite corners into the mounting holes. And then proceed with the other two spring screws.

Note:
Some components are optional and only available upon request.
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

▶ Jumper Settings

ClearCMOS (JP1)

COM 4 RS232 Power (JP3)

COM 3 RS232 Power (JP2)

SATA Selection (JP8)

It can be able to swap each function below in BIOS :

USB3.0 (from PCIe Switch)
2-3| SATA0 (via PCIe11)| SATA1 (via PCIe12)| N/A| USB3.0 (from PCIe Switch)
1-2| N/A| N/A| PCIe x2 (via PCIe11/12)

eDP Inverter Power (DPJP1)

Panel Inverter Power (DPJP2)

Panel Power Jumper (DPJP3)

Panel Backlight Selection (DPJP4)

▶ PIN Assignment

CASEOPEN-

SMBus

Digital I/O Power

Digital I/O

COM 1 & COM 2

COM 3 & COM 4

USB 5/6

USB 7/8

SATA0/1 HDD Power

Front Audio

LCD/Inverter Power

LVDS

eDP

▶ Expansion Slots

A PCIe 1 (PCIe Gen3 x4 signal)
B M.2 M KEY
C M.2 B KEY
D M.2 E KEY
E SIM Card Slot
PCI Express x4 Slot
Install PCI Express cards such as network cards or other expansion cards.
M.2 Socket
The M.2 socket is the Next Generation Form Factor (NGFF) which is designed to support multiple modules and make the M.2 more suitable in application for solid-state storage.
SIM Card Slot
For SIM card usage.

Installing the M.2 Module
Before installing the M.2 module into the M.2 socket, please make sure that the following safety cautions are well-attended.

1. Make sure the PC and all other peripheral devices connected to it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the M.2 socket on the system board
4. Make sure the notch on card is aligned to the key on the socket.
5. Make sure the standoff screw is removed from the standoff.

Please follow the steps below to install the card into the socket.

Step 1:
Insert the card into the socket at an angle while making sure the notch and key are perfectly aligned.

Step 2:
Press the end of the card far from the socket down until against the stand- off.

Step 3:
Screw tight the card onto the stand-off with a screw driver and a stand-off screw until the gap between the card and  the stand-off closes up. Thecard should be lying parallel to the board when it’s correctly mounted.

Installing the SO-DIMM Module
Before installing the memory module, please make sure that the following safety cautions are well-attended.

1. Make sure the PC and all other peripheral devices connected to it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the SO-DIMM socket on the system board
4. Make sure the notch on memory card is aligned to the key on the socket.

Please follow the steps below to install the memory card into the socket.

the memory card into the slot naking sure 1) the notch and y are aligned, and 2) the nonttor end rises approximately 45s horizontally. Press the card into the socket while applying aintaining even pressure on both

the end of the card far from cket down while making sure ention notch and the clip align cated by the dotted line in the tion. If the retention notch and do not align, please remove the id re-insert it. Press the card ally down.
lips snap automatically and y to the retention notches of the ounding a distinctive click, and e card in place. Inspect that the s in the notch. If not, please pull 2s outward, release and remove the card, and mount it again.

BIOS Settings

▶ Overview
The BIOS is a program that takes care of the basic level of communication between the CPU and peripherals. It contains codes for various advanced features found in this system board.
The BIOS allows you to configure the system and save the configuration in a battery-backed CMOS so that the data retains even when the power is off. In general, the information stored in the CMOS RAM of the EEPROM will stay unchanged unless a  configuration change has been made such as a hard drive replaced or a device added.
It is possible that the CMOS battery will fail causing CMOS data loss. If this happens, you need to install a new CMOS battery and reconfigure the BIOS settings.
Note:
The BIOS is constantly updated to improve the performance of the system board; therefore the BIOS screens in this chapter may not appear the same as the actual one. These screens are for reference purpose only.
Default Configuration
Most of the configuration settings are either predefined according to the Load Optimal Defaults settings which are stored in the BIOS or are automatically detected and configured without requiring any actions. There are a few settings that you may need to change depending on your system configuration.
Entering the BIOS Setup Utility
The BIOS Setup Utility can only be operated from the keyboard and all commands are keyboard commands. The commands are available at the right side of each setup screen.
The BIOS Setup Utility does not require an operating system to run. After you power up the system, the BIOS message appears on the screen and the memory count begins. After the memory test, the message “Press DEL to run setup” will appear on the screen. If  the message disappears before you respond, restart the system or press the “Reset” button. You may also restart the system by pressing the and keys simultaneously.

Legends

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– (minus key)/F5| Scroll backward through the values or options of the highlighted field