AIYATO ESP-C20 2.4GHz WiFi and BLE5.0 Combo Module User Manual
- June 12, 2024
- AIYATO
Table of Contents
- Product Specification
- Introduction
- Interface Definition
- Size and Layout
- Electronica Characteristics
- Power Consumption
- Wi-Fi RF Characteristics
- Bluetooth LE Radio
- Recommended Sold Temperature Curve
- Minimum User System
- Recommended Layout Design
- Peripheral Design Suggestion
- Product Handling
- U.FL RF Connector
- Packing Instruction
- Module Schematic
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
ESP-C20 2.4GHz WIFI and BLE5.0 Combo Module
User Manual
ESP-C20
2.4GHz Wi-Fi and BLE5.0 Combo Module
Version: 1.0 Date: Feb.20, 2023
Product Specification
Features
- General
- Chip: ESP32-C3
- Module Size:18mm20mm3mm
- 4MByte embedded flash (default)
- 384KB ROM
- 400KB SRAM
- Wi-Fi Features
- IEEE 802.11 b/g/n-compliant
- Center frequency range of operating channel: 2412 ~ 2484 MHz
- Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz band
- 1T1R mode with data rate up to 150 Mbps
- TX/RX A-MPDU, TX/RX A-MSDU
- Immediate Block ACK
- Fragmentation and defragmentation
- Automatic Beacon monitoring (hardware TSF)
- 4 X virtual Wi-Fi interfaces
- Simultaneous support for Infrastructure BSS in Station mode, Soft-AP mode, Station + Soft-AP mode, and promiscuous mode
Bluetooth Features
- Bluetooth LE: Bluetooth 5, Bluetooth mesh
- Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
- Advertising extensions
- Multiple advertisement sets
- Channel selection algorithm #2
Peripheral Interfaces
- GPIO * 15;
- UART * 2;
- IIC ;
- SPI;
- EN ;
- PWM x 6 ;
- ADC;
- Working Temperature: -40 ℃-85 ℃
Applications
- Serial transparent transmission;
- Wi-Fi prober;
- Smart power plug/Smart LED light;
- Mesh networks;
- Sensor networks;
- Over-the-top (OTT) devices;
- Wireless location system beacon;
- Industrial field bus;
Module Type
Name | Antenna Type |
---|---|
ESP-C20 | PCB ANT |
ESP-C20-E | U.FL Ipex |
Module Structure
Update Record
Date | Version | Update |
---|---|---|
2023-02-20 | V1.0 | First released |
Introduction
ESP-C20 Wi-Fi and BLE coexistence Module is a highly integrated single-chip
low power 802.11bgn Wireless LAN (WLAN) network controller. It combines a RISC
CPU, WLAN MAC, a 1T1R capable WLAN baseband, RF, and Bluetooth in a single
chip. It also provides a bunch of configurable GPIO, which are configured as
digital peripherals for different applications and control usage. ESP-C20
Module use ESP32-C3 as Wi-Fi and BLE coexistence SOC chip.
ESP-C20 Module integrates internal memories for complete Wi-Fi protocol
functions. The embedded memory configuration also provides convenient
application developments.
ESP-C20 module supports the standard IEEE802.11 b/g/n/e/i protocol and the
complete TCP/IP protocol stack. User can use it to add the Wi-Fi function for
the installed devices, and also can be viewed as an independent network
controller. Anyway, ESP-C20 Wi-Fi module provides many probabilities with the
best price.
Fig.1.1 ESP-C20 Module Structure
Technical parameters for ESP-C20 are listed as follows.
Table.1.1 ESP-C20 Parameters
Type | Item | Parameter |
---|---|---|
Wi-Fi | Frequency | 2.4G~2.5G (2412M~2484M) |
Transmit power | 802.11b: +18.0 dBm |
802.11g: +21.0 dBm
802.11n: +21.0 dBm
Receiver sensitivity| 802.11b: -89 dBm (11Mbps)
802.11g: -77 dBm(54Mbps)
802.11n: -74 dBm(MCS7)
EVM| -25dB @802.11b,11Mbps @18dBm
-28dB @802.11n,54Mbps @21dBm
-30dB @802.11n,HT40,MCS7 @21dBm
Antenna| PCB antenna / U.FL
BLE| RF power control range| -27~18dBm
Hardware| CPU| 32-bit RISC CPU
Interface| UART/SDIO/SPI/I2C/GPIO/PWM
Working voltage| 3.0V ~ 3.6V
Working temperature| -40°C ~ 85°C
Environment temperature| -40°C ~ 105°C
Shape| 18mm x 20mm x 3mm
Software| Wi-Fi working mode| STA, Soft-AP and sniffer modes
Security mode| WPS / WEP / WPA / WPA2 / WPA3
Update firmware| UART Download
Software develop| SDK
Network protocol| IPv4, TCP/UDP/HTTP/FTP/MQTT
Interface Definition
ESP-C20 Wi-Fi & BLE module interface definition is shown as below。
Working modes and pins function is shown in Table 2.1.
Table.2.1Working Mode
Mode | IO9 Voltage Level |
---|---|
UART Download Mode | LOW |
Flash Boot Mode | HIGH (Default) |
Table.2.2 Pins Function Definition
Num. | Pin Name | Type | Function |
---|---|---|---|
8 | VCC | P | Power, 3.3V/500mA Recommended |
3 | EN | I/O | Chip enable; Internal Pull-up. HIGH: enable the chip |
6 | IO4 | I/O | GPIO4, ADC1_CH4, MTMS, FSPIHD |
7 | IO5 | I/O | GPIO5, ADC2_CH0, MTDI, FSPIWP |
12 | IO6 | I/O | GPIO6,FSPICLK,MTCK |
13 | IO7 | I/O | GPIO7,FSPID,MTDO |
16 | IO8 | I/O | GPIO8 |
--- | --- | --- | --- |
18 | IO9 | I/O | GPIO9 |
15 | GND | P | Power, 3.3V/500mA Recommended |
17
|
IO10
|
I/O
| GPIO10, FSPICS0. When the value of eFuse bit EFUSE_JTAG_SEL_ENABLE is 0, JTAG signals cannot be used. 1, if IO10 is 0, JTAG signals come from chip pins; if IO10 is 1,
JTAG signals cannot be used
21| RXD| I/O| GPIO20,U0RXD
22| TXD| I/O| GPIO21,U0TXD
19| IO18| I/O| GPIO18,USB-D-
20| IO19| I/O| GPIO19,USB-D+
5| IO3| I/O| GPIO3, ADC1_CH3
4| IO2| I/O| GPIO2, ADC1_CH2, FSPIQ, Internal Pull-up
2| IO1| I/O| GPIO1,ADC1_CH1, XTAL_32K_N
1| IO0| I/O| GPIO0,ADC1_CH1,XTAL_32K_P
Size and Layout
Size for ESP-C20 can be shown as follows. (a) Vertical View
Electronica Characteristics
Table.4.1 Electronica Characteristics
Parameter | Condition | Min | Classical | Max | Unit |
---|---|---|---|---|---|
Store Temperature | – | -40 | Normal | 150 | ℃ |
Sold Temperature | IPC/JEDEC J-STD-020 | – | – | 260 | ℃ |
Working Voltage | – | 3.0 | 3.3 | 3.6 | V |
I/O
| VIL| –| -0.3| –| 0.25*VDD|
V
VIH| –| 0.75VDD| –| VDD+0.3
VOL| –| –| –| 0.1VDD
VOH| –| 0.8*VDD| –| –
Electrostatic Release Quantity (Human model)| TAMB=25℃| –| –| 2| KV
Electrostatic Release Quantity (Machine model)| TAMB=25℃| –| –| 0.5| KV
Power Consumption
Table.5.1 Power Consumption
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
RX 11b /g/n, HT20 | – | – | 82 | mA |
RX 11n, HT40 | – | 84 | mA | |
TX 11b, 1Mbps @21dBm | – | 350 | mA | |
TX 11g, 54Mbps @19dBm | – | – | 295 | mA |
TX 11n, HT20, MCS7, @18.5dBm | – | – | 290 | mA |
TX 11n, HT40, MCS7, @18.5dBm | – | – | 290 | mA |
Modem-sleep, CPU is powered on @80MHz | – | 15 | – | mA |
Light-sleep | – | 130 | – | uA |
Deep-sleep, RTC timer + RTC memory | – | 5 | – | uA |
Power off, CHIP_PU is set to low level | – | 1 | 0 | uA |
The peak current consumption of ESP-C20 exceed 400mA when the module start
work (RF calibration work consumes maximum current). Therefore, the
recommended power supply is no less than 500mA.
Note:
-
Active Mode: CPU and RF are all turned on.
-
Modem-sleep Mode: CPU is turned on. RF and baseband are turned off, but the communication is still
connected. -
Light-sleep Mode: CPU is turned off. RTC/external interrupt/MAC can wake up the chip. The
communication is still connected. -
Deep-sleep Mode: Only RTC is turned on.
Wi-Fi RF Characteristics
The data in the following table is gotten when voltage is 3.3V in the indoor
temperature environment.
Table.6.1 Wi-Fi TX Characteristics
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
Input frequency | 2412 | – | 2484 | MHz |
802.11b @1Mbps,11Mbps | – | 20.5 | – | dBm |
802.11g @6Mbps | – | 20 | – | dBm |
802.11g @54Mbps | – | 18 | – | dBm |
802.11n,HT20 MCS0 | – | 19 | – | dBm |
802.11n,HT40 MCS0 | – | 18.5 | – | dBm |
EVM @11b,1Mbps@20dBm | – | -24.5 | – | dBm |
EVM @11g,54Mbps@19dBm | – | -28 | – | dBm |
EVM @11n,MCS7@18.5dBm | – | -30 | – | dBm |
EVM @11n, HT40, MCS7@18.5dBm | – | -30.5 | – | dBm |
Table.6.2 Wi-Fi RX Sensitivity
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
802.11b,1Mbps | – | -98 | – | dBm |
802.11b,11Mbps | – | -88 | – | dBm |
802.11g,6Mbps | – | -92 | – | dBm |
802.11g,54Mbps | – | -76 | – | dBm |
802.11n,HT20,MCS0 | – | -92 | – | dBm |
802.11n,HT20,MCS3 | – | -85 | – | dBm |
802.11n,HT20,MCS7 | – | -74 | – | dBm |
802.11n,HT40,MCS0 | – | -90 | – | dBm |
802.11n,HT40,MCS3 | – | -81 | – | dBm |
802.11n,HT40,MCS7 | – | -71 | – | dBm |
Table.6.3 Wi-Fi RX Characteristics
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
MAX RX Level @11b,1Mbps | – | 5 | – | dBm |
MAX RX Level @11b,11Mbps | – | 5 | – | dBm |
MAX RX Level @11g,6Mbps | – | 5 | – | dBm |
MAX RX Level @11g,54Mbps | – | 0 | – | dBm |
MAX RX Level @11n,HT20,MCS0 | – | 5 | – | dBm |
MAX RX Level @11n,HT20,MCS7 | – | 0 | – | dBm |
MAX RX Level @11n,HT40,MCS0 | – | 5 | – | dBm |
--- | --- | --- | --- | --- |
MAX RX Level @11n,HT40,MCS7 | – | 0 | – | dBm |
RX Adjacent Channel Rejection@11b,1Mbps | – | 35 | – | dB |
RX Adjacent Channel Rejection@11b,11Mbps | – | 35 | – | dB |
RX Adjacent Channel Rejection@11g,6Mbps | – | 31 | – | dB |
RX Adjacent Channel Rejection@11g,54Mbps | – | 14 | – | dB |
RX Adjacent Channel Rejection@11n,HT20,MCS0 | – | 31 | – | dB |
RX Adjacent Channel Rejection@11n,HT20,MCS7 | – | 13 | – | dB |
RX Adjacent Channel Rejection@11n,HT40,MCS0 | – | 19 | – | dB |
Bluetooth LE Radio
Table.7.1 TX Transmitter General Characteristics
Parameter | Min | Classical | Max | Unit |
---|---|---|---|---|
Gain control power | – | 3 | – | dBm |
RF power control range | -27 | – | 18 | dBm |
In-band emissions @F-F0±3MHz, LE 1M | – | -41.95 | – | dBm |
In-band emissions @F-F0±>3MHz, LE 1M | – | -44.48 | – | dBm |
Modulation characteristics @ △f1avg, LE 1M | – | 245 | – | kHz |
Modulation characteristics @△f2max, LE 1M | – | 208 | – | kHz |
Carrier frequency offset, LE 1M | – | -9 | – | kHz |
In-band emissions @F-F0±5MHz, LE 2M | – | -45.26 | – | dBm |
In-band emissions @F-F0±>5MHz, LE 2M | – | -47 | – | dBm |
Modulation characteristics @ △f1avg, LE 2M | – | 497 | – | kHz |
Modulation characteristics @△f2max, LE 2M | – | 398 | – | kHz |
Carrier frequency offset, LE 2M | – | -9 | – | kHz |
In-band emissions @F-F0±3MHz, LE 500K | – | -41.3 | – | dBm |
In-band emissions @F-F0±>3MHz, LE 500K | – | -42.8 | – | dBm |
Modulation characteristics @ △f1avg, LE 500K | – | 220 | – | kHz |
Modulation characteristics @△f2max, LE 500K | – | 205 | – | kHz |
Carrier frequency offset, LE 500K | – | -11.9 | – | kHz |
Maximum received signal @30.8% PER | – | 10 | – | dBm |
Table.7.2 RX Transmitter General Characteristics
Parameter | Min | Classical | Max | Unit |
---|
1
M
| Sensitivity @30.8% PER| –| -96| –| dBm
Maximum received signal @30.8% PER| –| 10| –| dBm
Co-channel C/I| –| 8| –| dB
Image frequency| –| -29| –| dB
Adjacent channel to image frequency @F =Fimage+1| –| -38| –| dB
Adjacent channel to image frequency @F =Fimage-1| –| -34| –| dB
Adjacent channel selectivity @ F =F0+1| –| -4| –| dB
Adjacent channel selectivity @ F =F0-1| –| -3| –| dB
Adjacent channel selectivity @ F ≥F0+3| –| –| –| dB
Adjacent channel selectivity @ F ≤F0-3| –| -39| –| dB
2
M
| Sensitivity @30.8% PER| –| -93| –| dBm
Maximum received signal @30.8% PER| –| 0| –| dBm
Co-channel C/I| –| 10| –| dB
Image frequency| –| -27| –| dB
Adjacent channel to image frequency @F =Fimage+2| –| -39| –| dB
Adjacent channel to image frequency @F =Fimage-2| –| –| –| dB
Adjacent channel selectivity @ F =F0+2| –| -7| –| dB
Adjacent channel selectivity @ F =F0-2| –| -7| –| dB
Adjacent channel selectivity @ F ≥F0+6| –| -39| –| dB
Adjacent channel selectivity @ F ≤F0-6| –| -39| –| dB
1
2
5
K
| Sensitivity @30.8% PER| –| -104| –| dBm
Maximum received signal @30.8% PER| –| 10| –| dBm
Co-channel C/I| –| 2| –| dB
Image frequency| –| -34| –| dB
Adjacent channel to image frequency @F =Fimage+1| –| -44| –| dB
Adjacent channel to image frequency @F =Fimage-1| –| -37| –| dB
Adjacent channel selectivity @ F =F0+2| –| -40| –| dB
| Adjacent channel selectivity @ F =F0-2| –| -42| –| dB
---|---|---|---|---|---
Adjacent channel selectivity @ F ≥F0+3| –| –| –| dB
Adjacent channel selectivity @ F ≤F0-3| –| -46| –| dB
Recommended Sold Temperature Curve
- Reflow Times <= 2 times (Max.)
- Max Rising Slope: 3℃/sec
- Max Falling Slope: -3℃/sec
- Over 217 ℃ Time: 60~120sec
- Peak Temp:240℃~250 ℃
Minimum User System
This module can work just at 3.3V voltage condition:
Note:
- The working voltage for module is DC 3.3V;
- The max current from IO of this module is 40mA;
- Wi-Fi module is at download mode: IO9 is LOW level, then module reset to power;
- Wi-Fi module is connected to RXD of the other MCU, and TXD is connected to RXD of the other MCU.
Recommended Layout Design
ESP-C20 module can be sold on PCB board directly. For the high RF performance
for the device, please notice the placement of the module. There are three
ways to use the module for Wi-Fi Module with PCB antenna.
Solution 1: optical solution. The Wi-Fi module is placed on the side of the
board, and the antennas are all exposed, and there is no metal material around
the antenna, including wires, metal casings, weight plates, and the like.
Solution 2: sub-optical solution. The Wi-Fi module is placed on the side of
the board, and the antenna below is hollowed out. There is a gap of not less
than 5 mm reserved with the PCB, and there is no metal material around the
antenna, including wires, metal casings, weight plates, and the like.
Solution 3: The Wi-Fi module is placed on the side of the board, and the PCB
area under the antenna is empty, and copper cannot be laid.
Peripheral Design Suggestion
Wi-Fi module is already integrated into high-speed GPIO and Peripheral interface, which may be generated the switch noise. If there is a high request for the power consumption and EMI characteristics, it is suggested to connect a serial 10~100 ohm resistance, which can suppress overshoot when switching power supply, and can smooth signal. At the same time, it also can prevent electrostatic discharge (ESD).
Product Handling
12.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-
condensing atmospheric environment of < 40 °C and 90%RH. The module is rated
at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory
conditions 25±5 °C and 60%RH. If the above conditions are not met, the module
needs to be baked.
12.2 Electrostatic Discharge (ESD)
- Human body model (HBM): ±2000 V
- Charged-device model (CDM): ±500 V
U.FL RF Connector
ESP-C20 module use U.FL type RF connector for external antenna connection. (IPEX V1.0).
Packing Instruction
The product is packed in a tray, as shown in the following figure.
The size of the single box is: 340 x 360 x 60mm, and 800 pieces module is in
the box. And the outer box size is 355 x 375 x 325mm, including 5 single box
which include 4000 pieces module.
Module Schematic
FCC Statement
This device complies with part 15 of the FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for
compliance could void the user’ s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates uses and
can radiate radio frequency energy a nd, if not installed and used in
accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
‐ Reorient or relocate the receiving antenna.
‐ Increase the separation between the equipment and receiver.
‐Connect the equipment into an outlet on a circuit different from that to
which the receiver is connected.
‐Consult the dealer or an experienced radio/TV technician for help important
announcement
Important Note:
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
minimum distance 20cm between the radiator and your
body.
This transmitter must not be co-located or operating in conjunction with any
other antenna or transmitter.
Country Code selection feature to be disabled for products marketed to the
US/Canada.
This device is intended only for OEM integrators under the following
conditions:
- The antenna must be installed such that 20 cm is maintained between the antenna and users, and
- The transmitter module may not be co-located with any other transmitter or antenna,
- For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. (if modular only test Channel 1-11)
As long as the three conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Important Note:
In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID cannot be used on
the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC authorization.
End Product Labeling
The final end product must be labeled in a visible area with the following”
Contains FCC ID: 2BB77-ESP-C20″
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user
regarding how to install or remove this RF module in the user’s manual of the
end product which integrates this module.
The end user manual shall include all required regulatory information/warning
as show in this manual.
Integration instructions for host product manufacturers according to KDB
996369 D03 OEM
Manual v01
2.2 List of applicable FCC rules
CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the
modular transmitter
2.3 Specific operational use conditions
This module is stand-alone modular. If the end product will involve the
Multiple simultaneously transmitting condition or different operational
conditions for a stand-alone modular transmitter in a host, host manufacturer
have to consult with module manufacturer for the installation method in end
system.
2.4 Limited module procedures
Not applicable
2.5 Trace antenna designs
Not applicable
2.6 RF exposure considerations
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
minimum distance 20cm between the radiator & your body.
2.7 Antennas
This radio transmitter FCC ID:2BB77-ESP-C20 has been approved by Federal
Communications Commission to operate with the antenna types listed below, with
the maximum permissible gain indicated. Antenna types not included in this
list that have a gain greater than the maximum gain indicated for any type
listed are strictly prohibited for use with this device.
Antenna No.| Model No. of antenna:| Type of antenna:| Gain of the antenna
(Max.)| Frequency range:
---|---|---|---|---
BT/2.4GWiFi| /| PCB Antenna| 3.57dBi for 2400-2500MHz;
2.8 Label and compliance information
The final end product must be labeled in a visible area with the following”
Contains FCC ID:2BB77-ESP-C20″.
2.9 Information on test modes and additional testing requirements
Host manufacturer is strongly recommended to confirm compliance with FCC
requirements for the transmitter when the module is installed in the host.
2.10 Additional testing, Part 15 Subpart B disclaimer
Host manufacturer is responsible for compliance of the host system with module
installed with all other applicable requirements for the system such as Part
15 B.
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