Microchip Technology PL360 G3-PLC Hybrid Profile User Guide

Microchip Technology PL360 G3-PLC Hybrid Profile

Product Introduction

The Microchip hardware platform proposal to run the G3-PLC Hybrid solution is based on a host controller, which runs the upper layers of the communication stack and the user application, and two modems, one for PLC and the other for RF. Taking this into account, Microchip proposes different hardware platforms where the examples can be run directly.

Product Hardware Platforms

The Microchip hardware platform proposal to run the G3-PLC Hybrid solution is based on a host controller, which runs the upper layers of the communication stack and the user application, and two modems, one for PLC and the other for RF. Taking this into account, Microchip proposes different hardware platforms where the examples can be run directly.

PL360G55Cx-EK + ATREB215-XPRO-A

The PL360G55Cx-EK uses the USB connector (J4) to communicate with a PC via console and the MikroBUS to communicate with the ATREB215-XPRO-A. The lines used in the connection between both boards are described in the following table and figure:

Figure 1-2 shows the connection of PL360G55Cx-EK and ATREB215-XPRO-A.

Product Usage Instructions

To use the PL360G55Cx-EK + ATREB215-XPRO-A hardware platform, follow these steps:

1. Connect the PL360G55Cx-EK and ATREB215-XPRO-A using the lines specified in the table above and shown in Figure 1-2.
2. Connect the PL360G55Cx-EK to a PC using the USB connector (J4) and open a console.
3. Run the upper layers of the communication stack and the user application on the host controller.
4. The two modems, one for PLC and the other for RF, will enable communication between the PL360G55Cx-EK and ATREB215-XPRO-A.

Introduction

The Microchip implementation of the G3-PLC firmware stack includes the G3-PLC Hybrid Profile based on the Hybrid G3-PLC and RF Profile Annex to the G3-PLC specification. This document explains how to start using the different resources, hardware and software, that Microchip provides related to the implementation of the G3-PLC Hybrid Profile. The Microchip G3-PLC Hybrid solution can be run in several hardware platforms, mainly composed by a PLC modem and a RF module. The PLC modems are based on the PL360 or PL460 devices to run the lower PLC layers of the stack. The RF module is based on the AT86RF215 device to run the lower RF layers of the stack. The upper layers of the communication stack run in the main microcontroller (host controller), SAMG55.

Hardware Platforms

The Microchip hardware platform proposal to run the G3-PLC Hybrid solution is based on a host controller, which runs the upper layers of the communication stack and the user application, and two modems, one for PLC and the other for RF. Taking this into account, Microchip proposes different hardware platforms where the examples can be run directly.

PL360G55Cx-EK + ATREB215-XPRO-A

This supported platform is composed of two different evaluation boards:

• The first board, a PL360G55Cx-EK (PL360G55CF-EK for CENELEC-A or FCC working bands or a PL360G55CB-EK for CENELEC-B working band), includes the host controller, a SAMG55J19, to run the application and the upper layers of the stack, and the PLC device, PL360, to run the PHY and MAC-RT layers for PLC communications.
• The second board is an ATREB215-XPRO-A with the AT86RF215 to run the PHY layer for the RF communications. The RF module is configured to run on the sub-GHz band.

The PL360G55Cx-EK uses the USB connector (J4) to communicate with a PC via console and the MikroBUS to communicate with the ATREB215-XPRO-A. The lines used in the connection between both boards are described in the following table and figure:

Description| mikroBUS Socket (PL360G55Cx-EK)| Xpained PRO Header (ATREB215-XPRO-A)
---|---|---
Power| 7 (+3.3V)| 20 (3V3)
GND| 8 (GND)| 2 (GND)
9 (GDN)| 19 (GND)
SPI| 3 (CS)| 15 (SPI_SS_A)
4 (SCK)| 18 (SPI_SCK)
5 (MISO)| 17 (SPI_MISO)
6 (MOSI)| 16 ( SPI_MOSI)
RF215 Reset| 16 (PWM)| 7 (PWM+)
RF215 Interruption| 15 (INT)| 9 (IRQ/GPIO)
---|---|---
LED1| 11 (SDA)| 6 (GPIO2)
LED2| 12 (SCL)| 5 (GPIO1)

Important: To power up the ATREB215-XPRO-A board from a PL360G55Cx-EK board, it is required to mount a 0-Ohm resistor in the footprint close to the microbus pin of +3.3V (R21 in PL360G55CF-EK or R22 in PL360G55CB-EK).
The design files of a customized adapter from mikroBus to Xplained PRO to connect PL360G55Cx-EK and ATREB215-XPRO-A boards is available from the Microchip website.

SAMG55 XPLAINED PRO + PL460-EK + ATREB215-XPRO-A
This supported platform is composed of three different evaluation boards:

• The first board, a SAMG55 EXPLAINED PRO evaluation kit, includes the host controller, a SAMG55J19, to run the application and the upper layers of the stack.
• The second board is the PL460-EK as the PLC module with a PL460 to run the PHY and MAC-RT layers for the PLC communications.
• The third board is an ATREB215-XPRO-A with the AT86RF215 to run the PHY layer for the RF module. The RF module is configured to run on the sub-GHz band.

The SAMG55 EXPLAINED PRO board uses the DEBUG USB connector to communicate with a PC via console. The SAMG55 EXPLAINED PRO board uses EXT3 to communicate with the ATREB215-XPRO-A board. The lines used in the connection between both boards are described in the following table:

19 (GND)
SPI| 15 (SPI_SS_A)
18 (SPI_SCK)
17 (SPI_MISO)
16 ( SPI_MOSI)
RF215 Reset| 7 (PWM+)
RF215 Interruption| 9 (IRQ/GPIO)
LED1| 6 (GPIO2)
LED2| 5 (GPIO1)

The SAMG55 EXPLAINED PRO board uses EXT1 (with the Xplained Pro Power Header) to communicate with the  PL460-EK. The lines used in the connection between both boards are described in the following table:

19 (GND)
SPI| 15 (SPI_SS_A)
18 (SPI_SCK)
17 (SPI_MISO)
16 ( SPI_MOSI)
PL460 Reset| 7 (PWM+)
PL460 Enable| 8 (PWM-)
PL460 Interruption| 9 (IRQ/GPIO)
PL460 NTHW0 Thermal warning| 10 (GPIO)
PL460 Standby| 11 (SDA)
PL460 Carrier detect| 12 (SCL)

The SAMG55 EXPLAINED PRO board is powered by a USB connector, which also powers the ATREB215-XPRO-A board. The PL460-EK must be powered independently with its own 15V power supply.

Example Applications

Microchip provides a firmware package including the G3-PLC communication stack, with examples and tools. The Microchip G3-PLC stack supports the G3-PLC Hybrid profile, and it includes several examples for using it in the supported hardware platforms. The projects for the hybrid platforms in the different examples are identified with the text “_hybrid” in the name of the folder:

DLMS G3-PLC Coordinator
The DLMS example for the G3-PLC coordinator implements a DLMS client that shows how the G3-PLC API along with an IPv6 stack can be used in a typical DLMS application. The coordinator performs a continuous DLMS data collection that generates data traffic in the G3-PLC network. Besides DLMS traffic, the application can be configured to generate ICMPv6 traffic sending PINGs to other nodes. The DLMS example for the coordinator periodically asks every device registered in the network for DLMS objects. A log can be checked using the console in the UART port. This example is located in the folder \thirdparty\g3\apps\dlms_app_coord\ of the firmware package:

Table 2-1. LEDs

DLMS G3-PLC Device
The DLMS example for a G3-PLC device implements a DLMS server that shows how the G3-PLC API along with an IPv6 stack can be used in a typical DLMS application.The device runs the DLMS server supporting some basic DLMS objects that can be consulted by a DLMS client. Besides DLMS traffic, the application can be configured to generate ICMPv6 traffic sending PINGs to other nodes. This application has to be combined with another board running the DLMS G3-PLC Coordinator to evaluate the complete evaluation of a full G3-PLC Network where typical DLMS traffic is interchanged. The DLMS example for the coordinator, provided by the Microchip G3-PLC stack, cycles a pooling asking every device registered in the network for DLMS objects. This example is located in the folder \thirdparty\g3\apps\dlms_app_dev\ of the firmware package:

Table 2-2. LEDs

ADP & MAC Serialization
The ADP and MAC serialization is an application example that brings access to the ADP, MAC and Coordinator API through a serialized interface attached to a serial connection. This application is useful for users who want to make an intensive test of the stack or want to run the upper layers in another CPU. The application interfaces with the G3-PLC stack at different levels. The user can make use of the ADP API (standard access) or access the MAC Wrapper API directly as a shortcut for some tests. Serialization is also available to the provided Coordinator module in case the user wants to control the Bootstrap phase on the Coordinator side. The example provided offers the serial interface configured through a certain UART or USB (depending on the platform) at 230400 bps by default. This example is located in the folder \thirdparty\g3\apps\adp_mac_serialized_app\ of the firmware package:

Table 2-3. Serial Ports

Table 2-4. LEDs

PHY Sniffer
The PHY Sniffer is an application example that uses the PHY layer to monitor G3-PLC frames in the network and send them via USI serialization. The Hybrid Sniffer PC tool is also provided to interface with the board and interpret the frames. This example requires only one board and a G3-PLC network to be monitored. The example provided offers the serial interface configured through a certain UART or USB (depending on the platform) at 230400 bps by default. This example is located in the folder \thirdparty\g3\phy\atpl360\apps\phy_sniffer_hybrid_tool\ of the firmware package:

Table 2-5. LEDs

Revision History

Rev A – 04/2022

• Document Initial release

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