Microsemi DG0669 SmartFusion2 Code Shadowing from SPI Flash to LPDDR Memory User Guide

June 9, 2024
Microsemi

Microsemi DG0669 SmartFusion2 Code Shadowing from SPI Flash to LPDDR

Memory

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
PRODUCT

Product Information

The SmartFusion2 SoC FPGA is a high-performance, low-power FPGA solution that integrates an ARM Cortex-M3 processor, programmable analog and digital resources, and high-speed communication interfaces onto a single chip. The Libero SoC v11.7 software is a complete design suite for designing with Microsemi FPGAs.

Product Usage

To use the SmartFusion2 SoC FPGA with code shadowing from SPI Flash to LPDDR memory, follow the steps below:

Preface

Purpose
This demo is for SmartFusion®2 system-on-chip (SoC) field programmable gate array (FPGA) devices. It provides instructions on how to use the corresponding reference design.

Intended Audience

This demo guide is intended for:

  • FPGA designers
  • Embedded designers
  • System-level designers

References
See the following web page for a complete and up-to-date listing of SmartFusion2 device documentation: http://www.microsemi.com/products/fpga-soc /soc-fpga/sf2docs
The following documents are referred in this demo guide.

  • UG0331: SmartFusion2 Microcontroller Subsystem User Guide
  • SmartFusion2 System Builder User Guide

SmartFusion2 SoC FPGA – Code Shadowing from SPI Flash to LPDDR Memory

Introduction
This demo design shows SmartFusion2 SoC FPGA device capabilities for code shadowing from the serial peripheral interface (SPI) flash memory device to low power double data rate (LPDDR) synchronous dynamic random access memory (SDRAM) and executing the code from LPDDR SDRAM. Figure 1 shows the top-level block diagram for code shadowing from SPI flash device to LPDDR memory.

Figure 1 Top-Level Block Diagram of the Demo

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-1

Code shadowing is a booting method that is used to run an image from external, faster, and volatile memories (DRAM). It is the process of copying the code from non-volatile memory to the volatile memory for execution. Code shadowing is required, when the non-volatile memory associated with a processor does not support random access to the code for execute-in-place, or there is insufficient non-volatile random access memory. In performance-critical applications, the execution speed can be improved by code shadowing, where code is copied to higher throughput RAM for faster execution. Single data rate (SDR)/DDR SDRAM memories are used in applications that have a large application executable image and require higher performance. Typically, the large executable images are stored in non-volatile memory, such as NAND flash or SPI flash, and copied to volatile memory, such as SDR/DDR SDRAM memory, at power up for execution. SmartFusion2 devices integrate fourth generation flash-based FPGA fabric, an ARM® Cortex®-M3 processor, and high performance communication interfaces on a single chip. The high speed memory controllers in the SmartFusion2 devices are used to interface with the external DDR2/DDR3/LPDDR memories. The LPDDR memory can be operated at a maximum speed of 166 MHz. The Cortex-M3 processor can directly run the instructions from external DDR memory through the microcontroller subsystem (MSS) DDR (MDDR). The FPGA Cache Controller and MSS DDR bridge handles the data flow for a better performance.

Design Requirements
Ensure that you have the following hardware and software requirements:

Hardware and Software Requirements

Table 1 Design Requirements

Design Requirements Description

Hardware Requirements
SmartFusion2 Security Evaluation Kit:

•    12 V adapter

•    FlashPro4

•    USB A to Mini – B USB cable

| Rev D or later
Host PC or Laptop| Windows XP SP2 Operating System – 32-/64-bit Windows 7 Operating System – 32-/64-bit
Software Requirements
Libero® System-on-Chip (SoC)| v11.7
FlashPro Programming Software| v11.7
SoftConsole| v3.4 SP1
Host PC Drivers| USB to UART drivers
Framework for launching demo GUI| Microsoft .NET Framework 4 Client for launching demo GUI
Note: _
For this demo guide, SoftConsole v3.4 SP1 is used. For using SoftConsole v4.0, see the_ TU0546: SoftConsole v4.0 and Libero SoC v11.7 Tutorial .

  • SmartFusion2 Development Kit
  • Libero SoC v11.7 software
  • USB Blaster or USB Blaster II cable

Demo Design
The demo design utilizes a multi-stage boot process method or a hardware boot engine method to load the application image from SPI flash to LPDDR memory. Follow the steps below:The design files are available for download from the following path in the Microsemi website: http://soc.microsemi.com/download/rsc/?f=m2s_dg0669_liberov11p7_df

Design files include:
The demo design files include:

  • Sample application images
  • Programming files
  • Libero
  • GUI executable
  • Linker scripts
  • DDR configuration files
  • Readme.txt file

SmartFusion2 SoC FPGA – Code Shadowing from SPI Flash to LPDDR Memory Figure 2 shows the top-level structure of the design files. For further details, refer to the Readme.txt file.

Figure 2 Design Files Top-Level Structure

Demo Design Description

This demo design implements code shadowing technique to boot the application image from DDR memory. This design also provides host interface over SmartFusion2 SoC FPGA multi-mode universal asynchronous/synchronous receiver/transmitter (MMUART) to load the target application executable image into SPI flash connected to the MSS SPI0 interface.
The code shadowing is implemented in the following two methods:

  • Multi-stage boot process method using the Cortex-M3 processor
  • Hardware boot engine method using the FPGA fabric.

Multi-Stage Boot Process Method

  1. Create an application image for DDR memory using the Libero SoC software.
  2. Load the SPI Flash loader into SPI flash using the Libero SoC software.
  3. Run the Code Shadowing Demo GUI to program the FPGA and load the application image from SPI flash to LPDDR memory.

The application image is run from external DDR memories in the following two boot stages:

  • The Cortex-M3 processor boots the soft boot loader from embedded non-volatile memory (eNVM), which performs the code image transfer from SPI flash device to DDR memory.
  • The Cortex-M3 processor boots the application image from DDR memory.

This design implements a bootloader program to load the target application executable image from SPI flash device to DDR memory for execution. The bootloader program running from eNVM jumps to the target application stored in DDR memory after the target application image is copied to DDR memory.

Figure 3  Code Shadowing  Multi-Stage Boot Process Demo Block Diagram

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-3

The MDDR is configured for LPDDR to operate at 166 MHz. “Appendix: LPDDR Configurations” on page 22 show the LPDDR configuration settings. The DDR is configured before executing the main application code.

Bootloader

The bootloader performs the following operations:

  1. Copying the target application image from SPI flash memory to DDR memory.
  2. Remapping the DDR memory starting address from 0xA0000000 to 0x00000000 by configuring the DDR_CR system register.
  3. Initializing the Cortex-M3 processor stack pointer as per the target application. The first location of the target application vector table contains the stack pointer value. The vector table of the target application is available starting from the address 0x00000000.
  4. Loading the program counter (PC) to reset handler of the target application for running the target application image from the DDR memory. Reset handler of the target application is available in the vector table at the address 0x00000004.

Figure 4 Design Flow for Multi-Stage Boot Process Method

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-4

Hardware Boot Engine Method

  1. Generate an executable binary file using the Libero SoC software.
  2. Load the binary file into SPI flash using the Libero SoC software.
  3. Run the Hardware Boot Engine Design to program the FPGA and load the application image from SPI flash to LPDDR memory.

In this method, the Cortex-M3 directly boots the target application image from external DDR memories. The hardware boot engine copies the application image from SPI flash device to DDR memory, before releasing the Cortex-M3 processor reset. After releasing the reset, the Cortex-M3 processor boots directly from DDR memory. This method requires less boot-up time than multi-stage boot process as it avoids multiple boot stages and copies application image to DDR memory in less time. This demo design implements boot engine logic in FPGA fabric to copy the target application executable image from SPI flash to the DDR memory for execution. This design also implements SPI flash loader, which can be executed by Cortex-M3 processor to load the target application executable image into SPI flash device using the provided host interface over SmartFusion2 SoC FPGA MMUART_1. The DIP switch1 on the SmartFusion2 Security Evaluation Kit can be used to select whether to program the SPI flash device or to execute the code from DDR memory. If the executable target application is available in SPI flash device, the code shadowing from SPI flash device to DDR memory is started on device power-up. The boot engine initializes the MDDR, copies the Image from SPI flash device to DDR memory, and remaps the DDR memory space to 0x00000000 by keeping the Cortex-M3 processor in reset. After boot engine releases the Cortex-M3 reset, the Cortex-M3 executes the target application from DDR memory. Figure 5 shows the detailed block diagram of the demo design. The FIC_0 is configured in Slave mode to access the MSS SPI_0 from FPGA fabric AHB master. The MDDR AXI interface (DDR_FIC) is enabled to access the DDR memory from FPGA fabric AXI master.

Figure 5 Code Shadowing Hardware Boot Engine Demo Block Diagram

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-5

Boot Engine
This is the major part of the code shadowing demo that copies the application image from SPI flash device to the DDR memory. The boot engine performs the following operations:

  1. Initializing MDDR for accessing LPDDR at 166 MHz by keeping the Cortex-M3 processor in reset.
  2. Copying the target application image from SPI flash memory device to DDR memory using the AXI master in the FPGA fabric through MDDR AXI interface.
  3. Remapping the DDR memory starting address from 0xA0000000 to 0x00000000 by writing to the DDR_CR system register.
  4. Releasing reset to Cortex-M3 processor to boot from DDR memory.

Figure 6 Design Flow for Hardware Boot Engine Method

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-6

Creating Target Application Image for DDR Memory

An image that can be executed from the DDR memory is required to run the demo. Use the production-execute-in-place-externalDDR.ld linker description file that is included in the design files to build the application image. This linker description file defines the DDR memory starting address as 0x00000000 since the bootloader or boot engine performs DDR memory remapping from 0xA0000000 to 0x00000000. This linker script creates an application image with instructions, data, and BSS sections in memory whose starting address is 0x00000000. A simple light-emitting diode (LED) blinking, timer and switch based interrupt generation application image file is provided for this demo.

SPI Flash Loader

The SPI flash loader is implemented to load the on-board SPI flash memory with the executable target application image from the host PC through the MMUART_1 interface. The Cortex-M3 processor makes a buffer for the data coming over the MMUART_1 interface and initiates the peripheral DMA (PDMA) to write the buffered data into SPI flash through the MSS_SPI0.

Running the Demo
To run the demo design, follow the steps below:The demo shows how to load the application image in the SPI flash and execute that application image from external DDR memories. This demo provides an example application image sample_image_LPDDR.bin. This image shows the welcome messages and timer interrupt message on the serial console and blinks LED1 to LED8 on the SmartFusion2 Security Evaluation Kit. To see the GPIO interrupt messages on the serial console, press SW2 or SW3 switch.

Setting Up the Demo Design

The following steps describe how to setup the demo for SmartFusion2 Security Evaluation Kit board: Connect the host PC to the J18 Connector using the USB A to mini-B cable. The USB to UART bridge drivers are automatically detected. Verify if the detection is made in the device manager as shown in Figure 7.

  1. If USB drivers are not detected automatically, install the USB driver.
  2. For serial terminal communication through the FTDI mini USB cable, install the FTDI D2XX driver. Download the drivers and installation guide from:
    http://www.microsemi.com/soc/documents/CDM_2.08.24_WHQL_Certified.zip.

Figure 7  Design Flow for Hardware Boot Engine Method

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-7

Connect the jumpers on the SmartFusion2 Security Evaluation Kit board, as shown in Table 2.

Caution: Before making the jumper connections, switch OFF the power supply switch, SW7.

Table 2 SmartFusion2 Security Evaluation Kit Jumper Settings

Jumper Pin (From) Pin (To) Comments
J22 1 2 Default
J23 1 2 Default
J24 1 2 Default
J8 1 2 Default
J3 1 2 Default

In the SmartFusion2 Security Evaluation Kit, connect the power supply to the J6 connector. Figure 8 shows the board setup for running the code shadowing from SPI flash to LPDDR demo on the SmartFusion2 Security Evaluation Kit.

Figure 8 SmartFusion2 Security Evaluation Kit Setup

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-8

SPI Flash Loader and Code Shadowing Demo GUI
This is required to run the code shadowing demo. SPI Flash Loader and Code Shadowing Demo GUI is a simple graphic user interface that runs on the host PC to program the SPI flash and runs the code shadowing demo on the SmartFusion2 Security Evaluation Kit. UART is used as the underlining communication protocol between the host PC and SmartFusion2 Security Evaluation Kit. It also provides the serial console section to print the debug messages received from the application over the UART interface.

Figure 9 SPI Flash Loader and Code Shadowing Demo GUI

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-9

The GUI supports the following features:

  • Program SPI Flash: Programs the image file into the SPI flash.
  • Program and Code Shadowing from SPI Flash to DDR: Programs the image file into SPI flash, copies it to the DDR memory, and boots the image from the DDR memory.
  • Program and Code Shadowing from SPI Flash to SDR: Programs the image file into SPI flash, copies it to the SDR memory, and boots the image from the SDR memory.
  • Code Shadowing to DDR: Copies the existing image file from SPI flash to the DDR memory and boots the image from the DDR memory.
  • Code Shadowing to SDR: Copies the existing image file from SPI flash to the SDR memory and boots the image from the SDR memory.

Click Help for more information on GUI.

Connect the SmartFusion2 Development Kit to your computer using the USB Blaster or USB Blaster II cable. Then follow the steps below:

  1. Power on the SmartFusion2 Development Kit.
  2. Open the Code Shadowing Demo GUI in the Libero SoC software.
  3. Select the appropriate settings for your design and click “Generate” to generate the programming file.
  4. Connect to the SmartFusion2 Development Kit using the USB Blaster or USB Blaster II cable.
  5. Program the FPGA and load the application image from SPI flash to LPDDR memory by clicking “Program” in the Code Shadowing Demo GUI.

Running the Demo Design for Multi-Stage Boot Process Method
To run the demo design for the multi-stage boot process method, follow the steps below:

  1. Power on the SmartFusion2 Development Kit.
  2. Connect to the SmartFusion2 Development Kit using the USB Blaster or USB Blaster II cable.
  3. Reset the board and wait for it to complete the boot process.
  4. The application will run automatically from LPDDR memory.

The following steps describe how to run the demo design for multi-stage boot process method:

  1. Change the power supply switch SW7 to ON.

  2. Program the SmartFusion2 SoC FPGA device with the programming file provided in the design files (SF2_CodeShadowing_LPDDR_DF\Programming
    Files\MultiStageBoot_method\CodeShadowing_LPDDR_top.stp using the FlashPro design software.

  3. Launch the SPI Flash Loader and Code Shadowing Demo GUI executable file available in the design files (SF2_CodeShadowing_LPDDR_DF\GUI Executable\SF2_FlashLoader.exe).

  4. Select the appropriate COM port (to which the USB Serial drivers are pointed) from the COM Port drop-down list.

  5. Click Connect. After establishing the connection, Connect changes to Disconnect.

  6. Click Browse to select the example target executable image file provided with the design files (SF2_CodeShadowing_LPDDR_DF/Sample Application Images/MultiStageBoot_method/sample_image_LPDDR.bin).
    Note: To generate the application image bin file, refer to “Appendix: Generating Executable Bin File” on page 24.

  7. Keep the starting address of the SPI flash memory as default at 0x00000000.

  8. Select the Program and Code Shadowing from SPI Flash to DDR option.

  9. Click Start as shown in Figure 10 to load the executable image into SPI flash and code shadowing from DDR memory.

Figure 10 Starting the Demo

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-10

If the SmartFusion2 device is programmed with a STAPL file in which MDDR is not configured for DDR memory then it shows an error message, as shown in Figure 11.

Figure 11  Wrong Device or Option Message

The serial console section on the GUI shows the debug messages and starts programming SPI flash on successfully erasing the SPI flash. Figure 12 shows the status of SPI flash writing.

Figure 12  Flash Loading

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-12

  1. On programming the SPI flash successfully, the bootloader running on SmartFusion2 SoC FPGA copies the application image from SPI flash to the DDR memory and boots the application image. If the provided image sample_image_LPDDR.bin is selected, the serial console shows the welcome messages, switch interrupt and timer interrupt messages as shown in Figure 13 and Figure
  2. A running LED pattern is displayed on LED1 to LED8 on the SmartFusion2 Security Evaluation Kit.
  3. Press SW2 and SW3 switches to see interrupt messages on serial console.

Figure 13  Running the Target Application Image from DDR3 Memory

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-13

Figure 14  Timer and Interrupt Messages in Serial Console

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-14

Running the Hardware Boot Engine Method Design
To run the demo design for the hardware boot engine method, follow the steps below:

  1. Power on the SmartFusion2 Development Kit.
  2. Connect to the SmartFusion2 Development Kit using the USB Blaster or USB Blaster II cable.
  3. Reset the board and wait for it to complete the boot process.
  4. The application will run automatically from LPDDR memory.

The following steps describe how to run the hardware boot engine method design:

  1. Change the power supply switch SW7 to ON.

  2. Program the SmarFusion2 SoC FPGA device with the programming file provided in the design files (SF2_CodeShadowing_LPDDR_DF\Programming Files\HWBootEngine_method\CodeShadowing_Fabric.stp using the FlashPro design software.

  3. To program the SPI Flash make DIP switch SW5-1 to ON position. This selection makes to boot Cortex-M3 from eNVM. Press SW6 to reset the SmartFusion2 device.

  4. Launch the SPI Flash Loader and Code Shadowing Demo GUI executable file available in the design files (SF2_CodeShadowing_LPDDR_DF\GUI Executable\SF2_FlashLoader.exe).

  5. Select the appropriate COM port (to which the USB Serial drivers are pointed) from the COM Port drop-down list.

  6. Click Connect. After establishing the connection, Connect changes to Disconnect.

  7. Click Browse to select the example target executable image file provided with the design files (SF2_CodeShadowing_LPDDR_DF/Sample Application Images/HWBootEngine_method/sample_image_LPDDR.bin).
    Note: To generate the application image bin file, refer to “Appendix: Generating Executable Bin File” on page 24.

  8. Select Hardware Boot Engine option in Code Shadowing Method.

  9. Select the Program SPI Flash option from Options menu.

  10. Click Start, as shown in Figure 15 to load the executable image into SPI flash.

Figure 15  Starting the Demo

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-15

The serial console section on the GUI shows the debug messages and the status of SPI flash writing, as shown in Figure 16.
Figure 16 Flash Loading

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-16

  1. After programming the SPI flash successfully, change DIP switch SW5-1 to OFF position. This selection makes to boot the Cortex-M3 processor from DDR memory.
  2. Press SW6 to reset the SmartFusion2 device. The boot engine copies the application image from SPI flash to the DDR memory and releases reset to Cortex-M3, which boots the application image from DDR memory. If the provided image “sample_image_LPDDR.bin” is loaded to SPI flash, the serial console shows the welcome messages, switch interrupt (press SW2 or SW3) and timer interrupt messages, as shown in Figure 17 and a running LED pattern is displayed on LED1 to LED8 on the SmartFusion2 Security Evaluation Kit.

Figure 17 Running the Target Application Image from DDR3 Memory

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-17

Conclusion
You have successfully used the SmartFusion2 SoC FPGA with code shadowing from SPI Flash to LPDDR memory.This demo shows the capability of the SmartFusion2 device to interface with DDR  memory and to run the executable image from the DDR memory by shadowing code from SPI flash memory device. It also shows two methods of code shadowing implementation on the SmartFusion2 device.

Appendix: LPDDR Configurations

Figure 18  General DDR Configuration Settings

Figure 19  DDR Memory Initialization Settings

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-19

Figure 20  DDR Memory Timing Settings

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-20

Appendix: Generating Executable Bin File

The executable bin file is required to program the SPI flash for running the code shadowing demo. To generate the executable bin file from “sample_image_LPDDR” SoftConsole, perform the following steps:

  1. Build the SoftConsole project with the linker script production-execute-in-place-externalDDR.
  2. Add the SoftConsole installation path, for example,
    C:\Microsemi\Libero_v11.7\SoftConsole\Sourcery-G++\bin, to the ‘Environment Variables’, as shown in Figure 21.

Figure 21 Adding SoftConsole Installation Path

Microsemi-DG0669-SmartFusion2-Code-Shadowing-from-SPI-Flash-to-LPDDR-Memory-
FIG-21

  1. Double-click the batch file Bin-File-Generator.bat located at: SoftConsole/CodeShadowing_LPDDR_MSS_CM3/Sample_image_LPDDR folder, as shown in Figure 22.

Figure 22  Adding SoftConsole Installation Path

  • The Bin-File-Generator creates sample_image_LPDDR.bin file

Revision History

The following table shows important changes made in this document for each revision.

Revision Changes

Revision 2

(April 2016)

| Updated the document for Libero SoC v11.7 software release (SAR 78258).
Revision 1

(December 2015)

| Initial release.

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Contact Customer Service for non-technical product support, such as product pricing, product upgrades, update information, order status, and authorization. From North America, call 800.262.1060 From the rest of the world, call 650.318.4460 Fax, from anywhere in the world, 408.643.6913

Customer Technical Support Center
Microsemi SoC Products Group staffs its Customer Technical Support Center with highly skilled engineers who can help answer your hardware, software, and design questions about Microsemi SoC Products. The Customer Technical Support Center spends a great deal of time creating application notes, answers to common design cycle questions, documentation of known issues, and various FAQs.So, before you contact us, please visit our online resources. It is very likely we have already answered your questions.

Technical Support
For Microsemi SoC Products Support, visit
http://www.microsemi.com/products/fpga-soc/design-support/fpga-soc-support.

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Contacting the Customer Technical Support Center
Highly skilled engineers staff the Technical Support Center. The Technical Support Center can be contacted by email or through the Microsemi SoC Products Group website.

Email
You can communicate your technical questions to our email address and receive answers back by email, fax, or phone. Also, if you have design problems, you can email your design files to receive assistance. We constantly monitor the email account throughout the day. When sending your request to us, please be sure to include your full name, company name, and your contact information for the efficient processing of your request. The technical support email address is soc_tech@microsemi.com.

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For technical support on RH and RT FPGAs that are regulated by International Traffic in Arms Regulations (ITAR), contact us via soc_tech@microsemi.com. Alternatively, within My Cases, select Yes in the ITAR drop-down list. For a complete list of ITAR- regulated Microsemi FPGAs, visit the ITAR web page.Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Powerover- Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.

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