ROHM MK715X1 Evaluation Kit Mini User Manual
- June 26, 2024
- ROHM
Table of Contents
ROHM MK715X1 Evaluation Kit Mini
Introduction
Dear customer
ROHM Co., Ltd. (“ROHM”), on the 1st day of April, 2024, has absorbed into
merger with 100%-owned subsidiary of LAPIS Technology Co., Ltd.
Therefore, all references to “LAPIS Technology Co., Ltd.”, “LAPIS Technology”
and/or “LAPIS” in this document shall be replaced with “ROHM Co., Ltd.”
Furthermore, there are no changes to the documents relating to our products
other than the company name, the company trademark, logo, etc.
Thank you for your understanding.
ROHM Co., Ltd.
April 1, 2024
Precautions
Precautions for the Specification
- Contents of the Specification are the information at the time of their issuance. The information contained herein is subject to change without notice.
- LAPIS Technology has used reasonable care in preparing the information included in the Specification, but LAPIS Technology does not warrant that such information is error free. LAPIS Technology assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
- The technical information specified herein is intended only to show the typical functions of the Products and examples of application circuits for the Products. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology or any third party with respect to the information contained in this document; therefore LAPIS Technology shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.
- The Specification contains information related to the LAPIS Technology’s copyright and technical know-how. Any use of them other than pertaining to the usage of appropriate products is not permitted. Further, the Specification, in part or in whole, may not be reprinted or reproduced and disclosed to third parties without prior consent of LAPIS Technology.
Precautions for the Products
Precautions for Safety
-
The Products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.).
-
For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a LAPIS Technology representative: transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems.
-
Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters.
-
The Products are designed for use in a standard environment and not in any special environments. Application of the Products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions:
- Use in various types of liquid, including water, oils, chemicals, and organic solvents.
- Use outdoors where the Products are exposed to direct sunlight, or in dusty places.
- Use in places where the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2.
- Use in places where the products are exposed to static electricity or electromagnetic waves.
- Use in environment subject to strong vibration and impact.
- Use in proximity to heat-producing components, plastic cords, or other flammable items.
- Use involving sealing or coating the Products with resin or other coating materials.
- Use of the Products in places subject to dew condensation.
- Use in an environment where the temperature is always low, such as in a freezer.
- Use in an environment where the temperature change of this product increases due to the influence of the surrounding heat source.
(Example: IH cooking heaters, industrial robots, FA equipment, infrastructure equipment, etc.)
-
The Products might receive the radio wave interference from electronic devices such as Wireless LAN devices, Bluetooth devices, digital cordless telephone, microwave oven and so on that radiate electromagnetic wave.
-
The Products are not radiation resistant.
-
Verification and confirmation of performance characteristics of Products, after on-board mounting, is advised.
-
Confirm that operation temperature is within the specified range described in the Specification.
-
Although LAPIS Technology is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, if product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following:
- Installation of protection circuits or other protective devices to improve system safety.
- Installation of redundant circuits in the case of single-circuit failure.
-
Failure induced under deviant condition from what defined in the Specification can not be guaranteed.
-
This product is a specification to radiate the radio wave. It is necessary to acquire the attestation of decided Radio Law of each region used to use the equipment that radiates the radio wave. Please inquire about the attestation of Radio Law that this product acquires.
-
When product safety related problems arises, please immediately inform to LAPIS Technology, and consider technical counter measure.
Precautions for Reference Circuits
- If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics.
- The reference circuit examples, their constants, and other types of information contained herein are applicable only when the Products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made.
Precaution for Electrostatic
This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won’t be applied to the Products. Please take special care under dry condition (Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control etc.)
Precautions for Storage / Transportation
- Product performance and connector mating may deteriorate if the Products are stored in the following places:
- Where the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2 and NO2
- Where the temperature or humidity exceeds those recommended by LAPIS Technology Temperature: 5°C to 40°C, Humidity 40% to 60%
- Storage in direct sunshine or condensation.
- Storage in high Electrostatic.
- Even under LAPIS Technology recommended storage condition, connector mating, mountability, and heat resistance of products over 1 year old may be degraded.
- Store / transport cartons in the correct direction, which is indicated on a carton as a symbol, otherwise bent leads may occur due to excessive stress applied when dropping of a carton.
Precaution for Product Label
- QR code printed on LAPIS Technology product label is only for internal use, and please do not use at customer site.
- It might contain internal products information that is inconsistent with product information.
Precaution for Disposition
- When disposing Products, please dispose them properly with an industry waste company.
Prohibition Regarding Intellectual Property
- LAPIS Technology prohibits the purchaser of the Products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by LAPIS Technology, other than the right to use, sell, or dispose of the Products.
The other precautions
- Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS Technology shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
- When providing our Products and technologies contained in the Specification to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.
Copyright 2020 LAPIS Technology Co., Ltd.
LAPIS Technology Co., Ltd.
- 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan
- http://www.lapis-tech.com/en/
Preface
This document outlines the hardware of the MK715x1 evaluation kit Mini
[MK715x1EK1] and MK715x1 evaluation kit Mini Plus [MK715XxEK1P] equipped with
Bluetooth® 5 compatible Bluetooth low energy module MK715x1 [MK71521 or
MK71511] made by Lapis Technology.
This evaluation kit is pre-installed with the AT command application that
easily realizes Bluetooth® Low Energy communication by using a simple AT
command via UART.
The following related documents are available, so please refer to them if necessary.
- MK71511 Data Sheet
- MK71521 Data Sheet
- MK715x1 Software Development Startup Guide
- BLE Tool User’s Manual
- MK715x1 AT command application Quick Reference Guide
- MK715x1 AT command application User’s Manual
Note: In this document, MK715x1 refers to both MK71511 and MK71521.
- Bluetooth® is a registered trademark of Bluetooth SIG, Inc.
- All other company and product names are the trademarks or registered trademarks of the respective companies.
Overview
Handling precautions
- MK715x1EK1/MK715x1EK1P can be used only for evaluating MK715x1. We do not take any responsibility for any direct or indirect damage caused by installing this product in your product.
- We are not responsible for any modification or illegal use of this development kit.
MK715x1EK1/MK715x1EK1Pconfiguration
When you receive the MK715x1EK1/MK715x1EK1P, make sure that the following items are all included in the kit. If you find any broken or missing items, please contact the distributor where you purchased the product or the ROHM sales office.
MK715x1EK1 configuration
Component | Quantity |
---|---|
MK715x1 evaluation board | 1 |
MK715x1EK1P configuration
Component | Quantity |
---|---|
MK715x1 evaluation board | 1 |
USB cable | 1 |
J-Link LITE | 1 |
Lineup
The MK715x1 evaluation kit has the following lineup depending on the installed modules and accessories.
Product name | Module | accessories |
---|---|---|
MK71511 evaluation kit Mini (MK71511EK1) | MK71511 | – |
MK71521 evaluation kit Mini (MK71521EK1) | MK71521 | – |
MK71511 evaluation kit Mini Plus (MK71511EK1P) | MK71511 | USB cable、J-Link LITE |
MK71521 evaluation kit Mini Plus (MK71521EK1P) | MK71521 | USB cable、J-Link LITE |
- J-Link LITE is licensed for MK71511EK1/MK71521EK1.
- Use of MK71511EK1/ MK71521EK1 for purposes other than evaluation is prohibited.
Hardware specifications
Circuit schematic
- See next…..
BOM List
Reference | Value | Manufacturer | Model number |
---|---|---|---|
U1 | - | FTDI | FT232RQ |
U2 | - | Lapis Technology | MK71511 or MK71521 |
LED1,LED2 | - | ROHM | SML-P11MT |
LED3 | - | ROHM | SML-P11UT |
LED4,LED5,LED6,LED7 | - | ROHM | SML-P11MT |
R1,R2 | 1k | ROHM | MCR01MZPJ102 |
R3 | 1.2k | ROHM | MCR01MZPJ122 |
R4,R5,R6,R7 | 1k | ROHM | MCR01MZPJ102 |
R8,R9,R10,R11 | 0 | ROHM | MCR01MZPJ000 |
R12,R13,R14,R15,R16,R17,R18 | 0 | ROHM | MCR01MZPJ000 |
R19,R20 | NoMount | ROHM | |
R21 | 0 | ROHM | MCR01MZPJ000 |
R22,R23 | NoMount | ROHM | |
R24,R25,R26 | 10k | ROHM | MCR01MZPJ103 |
C1 | 4.7u | MURATA | GRM188R61C475KAAJ |
C2 | 0.1u | MURATA | GRM155B31H104KE14D |
C3 | NoMount | – | – |
C4 | NoMount | – | – |
C5 | 4.7u | MURATA | GRM188R61C475KAAJ |
C6 | 0.1u | MURATA | GRM155B31H104KE14D |
C7 | NoMount | – | – |
C8 | NoMount | – | – |
C9 | NoMount | – | – |
OSC1 | NoMount | River Eletec | X6D-32768-33-GR4 |
CN1 | - | HIrose | ZX62R-B-5P(30) |
CN21 | NoMount | K.K. Tokiwa Shoko | TCHM13-19-002S-802R |
CN22 | NoMount | K.K. Tokiwa Shoko | TCHM13-19-004S-802R |
CN23 | NoMount | K.K. Tokiwa Shoko | TCHM13-19-004S-802R |
CN24 | NoMount | K.K. Tokiwa Shoko | TCHM13-19-005S-802R |
CN25 | NoMount | K.K. Tokiwa Shoko | TCHM13-19-004S-802R |
CN3 | NoMount | K.K. Tokiwa Shoko | TCHM13-19-019S-802R |
CN4 | - | HIROSUGI | PSS-720153-05 |
CN5 | - | Murata | MM8130-2600 |
CN6 | NoMount | K.K. Tokiwa Shoko | TCHM13-19-002S-802R |
SW1 | - | ALPS | SKRPABE010 |
SW2 | - | CTS |
Electrocomponents
| 218-4LPST
JP1| NoMount| K.K. Tokiwa Shoko| TCHM13-19-002S-802R
Layout of MK715x1EK1
No | Name | Description | Symbol | (Maker) Part.NO | Remarks |
---|---|---|---|---|---|
(1) | MK715X1 | Bluetooth® low energy module | U2 | (LAPIS) |
MK71511 or MK71521
|
(2a)| -| General-purpose LED×4| LED4-LED7| (ROHM) SML-P11MT| Green
(2b)| -| Power LED×1| LED3| (ROHM) SML-P11UT| Red
(2c)| -| UART status LED×2| LED1-LED2| (ROHM) SML-P11MT| Green
(3)| PSS-720153-05| J-Link| CN4| PSS-720153-05|
(4)| -| NFC Interface| CN6| | Valid for only MK71521
(5)| Reset Switch| Module Reset| SW1| (ALPS) SKRPABE010|
(6)| -| Current measurement Interface| JP1| NoMount| Shorted by R18 at
shipment
(7)| USB Interface| Micro USB Interface| CN1| (Hirose)
ZX62R-B-5P(30)
| UART, +5V-DC power supply
(8)| -| external Interface| CN3| NoMount| GPIO,
external power supply
(9)| -| external Interface| CN21-CN25| NoMount| GPIO,
external power supply
(10)| DIPSW-4| Switch| SW2| (CTS Elec.) 218-4LPST|
Silkscreen Printing
The pin assignment for External interface
CN25
Pin Name. | MK715x1EK1 Assignment | nRF52 Port | nRF52 Function |
---|---|---|---|
P24 | GPIO | P0.24 | GPIO |
P23 | GPIO | P0.23 | GPIO |
P22 | GPIO | P0.22 | GPIO |
P25 | GPIO | P0.25 | GPIO |
CN24: Suitable for I2C I/F board connection
Pin Name. | MK715x1EK1 Assignment | nRF52 Port | nRF52 Function |
---|---|---|---|
P28 | GPIO/AIN4 | P0.28 | GPIO/AIN4 |
P27 | GPIO | P0.27 | GPIO |
P26 | GPIO | P0.26 | GPIO |
GND | GND | GND | Ground |
VDD | VDDIO | VDD | Power |
Connection example
I2C I/F board
Pin Function
INT
SCL
SDA
GND
VDD
【Supplement】
- P26~P28 : 10kΩ pull-up
CN23
Pin Name. | MK715x1EK1 Assignment | nRF52 Port | nRF52 Function |
---|---|---|---|
P29 | GPIO/AIN5 | P0.29 | GPIO/AIN5 |
P30 | GPIO/AIN6 | P0.30 | GPIO/AIN6 |
P31 | GPIO/AIN7 | P0.31 | GPIO/AIN7 |
P06 | UART TXD | P0.06 | GPIO |
CN22 : Suitable for analog I/F board connection
Pin Name | MK715x1EK1 Assignment | nRF52 Port | nRF52 Function |
---|---|---|---|
P04 | GPIO/AIN2 | P0.04 | GPIO/AIN2 |
P03 | GPIO/AIN1 | P0.03 | GPIO/AIN1 |
GND | GND | GND | Ground |
VDD | VDDIO | VDD | Power |
Connection example
Analog I/F board
Pin Function
AOUT2
AOUT1
GND
VDD
CN21
Pin Name | MK715x1EK1 Assignment | nRF52 Port | nRF52 Function |
---|---|---|---|
P02 | GPIO/AIN0 | P0.02 | GPIO/AIN0 |
P08 | UART RXD | P0.08 | GPIO |
CN3
Pin Name | MK715x1EK1 Assignment | nRF52 Port | nRF52 Function |
---|---|---|---|
SCLK | SWDCLK | SWDCLK | SWDCLK |
SIO | SWDIO | SWDIO | SWDIO |
P20 | LED7 | P0.20 | GPIO |
P18 | LED5 | P0.18 | GPIO |
P21 | nRESET | P0.21 | GPIO/nRESET |
P19 | LED6 | P0.19 | GPIO |
P17 | LED4 | P0.17 | GPIO |
P14 | DIP SW (2) | P0.14 | GPIO |
P12 | GPIO | P0.12 | GPIO |
P16 | DIP SW (4) | P0.16 | GPIO |
P15 | DIP SW (3) | P0.15 | GPIO |
P13 | DIP SW (1) | P0.13 | GPIO |
P11 | GPIO | P0.11 | GPIO |
P10 | GPIO | P0.10 | GPIO/NFC2 |
P09 | GPIO | P0.09 | GPIO/NFC1 |
P07 | UART CTS | P0.07 | GPIO |
P05 | UART RTS | P0.05 | GPIO/AIN3 |
GND | GND | GND | Ground |
VDD | VDDIO | VDD | Power |
Switch
DIPSW-4
- DIP SW is connected to four ports from P0.13 to P0.16
- The port assignment and circuit configuration are shown below.
Symbol | Pin No. | GPIO | Initial setting |
---|
SW2
| 1| P0.13| On
2| P0.14| Off
3| P0.15| Off
4| P0.16| Off
DIP SW substitutes the four user buttons on the Nordic nRF52DK Board.
Reset Switch
- Pushing the reset switch puts the MK715x1 into a reset state.
State | Function |
---|---|
ON | P0.21/nRESET = Low (Reset state) |
OFF | P0.21/nRESET = High (Reset releas state) |
LED
General-purpose LED
- General-purpose LEDs (green) are connected to the ports from P0.17 to P0.20.
The port assignment and circuit configuration are shown below.
No | Silkscreen Printing | port | LED active |
---|---|---|---|
LED4 | P.17 | P0.17 | P0.17=Low |
LED5 | P.18 | P0.18 | P0.18=Low |
LED6 | P.19 | P0.19 | P0.19=Low |
LED7 | P.20 | P0.20 | P0.20=Low |
Power LED
- The Power LED (red) lights on when the power (VDDIO) to the MK715x1 is turned on.
No | Silkscreen Printing |
---|---|
LED3 | PWR |
UART status LED
- The UART status LED (green) flashes during UART transmission and reception.
No | Silkscreen Printing |
---|---|
LED1 | RX |
LED2 | TX |
[Parts placement information]
Outline
How to use sample software
The AT command application software is installed in this kit. Please prepare MK715x1 evaluation kit and smartphone application “BLE Tool”. This section briefly describes the operation of the AT command application, using the MK715x1 side as a peripheral device and connecting to a central device such as a smartphone as an example.
Refer to “MK715x1 AT Command Application User’s Manual” for detailed specifications of AT command application for MK715x1.
PC set up
- Connect MK715x1EK1 and the USB port of your PC with USB cable(A-microB type).
- When using it for the first time, USB serial conversion IC driver should be installed.
- Download driver software from the following site, if necessary. https://www.ftdichip.com/Drivers/VCP.htm
- Start up terminal software such as Tera Term, and set the serial port as follows:
- Port: COM port number used
- Baud Rate: 57,600 bps
- Data: 8 bit
- Parity: None
- Stop: 1 bit
- Flow Control: Hardware
Smartphone Set up
The application on the smartphone uses BLE Tool. Please download and install from the following.
- Google Play: https://play.google.com/store/apps/details?id=com.lapis_semi.bleapp
- App Store: https://itunes.apple.com/jp/app/ble-tool/id915714158?mt=8&ign-mpt=uo%3D4
Terminal Software Operation
With the Dip Switch on the MK715x1 evaluation kit as the initial setting,
pushing the reset button executes the AT command application. If you input
“at
Then, when you start the peripheral operation, type “atd
BLE Tool operation
Application start
- Tap the “BLE Tool” icon to start the application. (Fig. 3-3)
Data communication
Bluetooth® Low Energy communication can be performed by the following steps.
For details on how to use “BLE Tool”, refer to the related document “BLE Tool
User’s Manual”.
- When “BLE Tool” is started, the screen in Fig. 3-4 (A) is displayed. In this screen, the central side scans and displays Bluetooth® low energy devices from the detected advertisement packets. The AT command application for MK715x1 is displayed with the device name “LapisDev” by default, so tap this.
- The Bluetooth® Low Energy connection procedure is executed, and the service search screen shown in Fig. 3-4 (B) is displayed. At this time, “CONNECT” is output to the terminal screen on the peripheral side. In the screen in Fig. 3-4 (B), the central side executes the service search and displays the detected services. In case of AT command application for MK715x1, two services of “Device Information” and “LAPIS Serial Port Profile” are displayed. The latter is the service used for data communication in AT command applications. Tap the “LAPIS Serial Port Profile” icon.
- The screen shown in Fig. 3-4 (C) is displayed. You can send and receive data on this screen. When you tap the text box displayed at the bottom of the screen, the soft keyboard is displayed, so if you input a character string from the soft keyboard and tap the “Send” button, the character string you input to the peripheral will be sent. Similarly, if you enter characters from the terminal screen on the peripheral side, it will be sent to the central side.
- The figure below shows an example of performing data communication using the above procedure. The character string input from “BLE Tool” is output in black characters as shown in Fig. 3-5 (a), and the same character string is also output to the terminal on the peripheral side (Fig. 3-5 (b)). The character string input from the terminal on the peripheral side as shown in Fig. 3-5 (c) is output in red on the “BLE Tool” screen (Fig. 3-5 (d)).
Read device information
- The AT command application for MK715x1 also provides Bluetooth SIG standard device information service (DIS). As shown in Fig. 3-6, tap the “DIS” icon on the service search screen to read the device information of the peripheral. Fig. 3-6 shows the default settings for the AT command application for MK715x1. It is necessary to change the device information according to the customer system used. For correction of device information, refer to “MK715x1 AT Command Application User’s Manual”.
- This concludes the brief explanation of how to use the AT command application for the MK715x1. For other AT command operations, refer to “3. AT Command” in “AT Command Application for MK715x1 Quick Reference Guide”.
Current measurement method
- To measure the current of MK715x1, remove the R18 and insert an ammeter between pin1 and pin2 of JP1.
[Parts placement information]
Appendix
A.1 Correspondence between each evaluation kit and Nordic SDK Example Project
If you use the Nordic SDK v16.0.0 Example Project, follow the table below.
Eval. Kit Name| Applicable Nordic DK Board Type| Preferable Nordic SoftDevice|
Note
---|---|---|---
MK71511EK1| PCA10056e| S112| Some modifications are required (See A.2)
MK71521EK1| PCA10040| S132|
Table. A-1: Correspondence between each evaluation kit and Nordic SDK Example Project
A.2 Example Project modification steps required for MK71511EK1
MK71511EK1’s GPIO interface assignment is subjected to Nordic’s PCA10040 board, so when using the Nordic SDK’s Example Project with MK71511EK1, it is necessary to change the assignment of reset buttons and LEDs. The procedure is described below using the Example Project for the SEGGER Embedded Studio IDE of Blood Pressure Service of nRF SDK v16.0.0 as an example.
- Open the following project file with SEGGER Embedded Studio IDE.
-
¥nRF5_SDK_16.0.0_98a08e2¥examples¥ - ble_peripheral¥ble_app_bps¥pca10056e¥s112¥ses¥ble_app_bps_pca10056e_s112.emProject
-
- Select Project>Options from the Menu Bar.
- Select “Common” setting.
- Select “Preprocessor” in “Code list”
- Double-click “Preprocessor Definitions” to display the setting screen.
- Change “BOARD_PCA10056” to “BOARD_PCA10040”.
- Delete “DEVELOP_IN_NRF52840”.
- Click the “OK” button to close the screen.
Revision History
Document No.
|
Issue date
| Page|
Revision description
---|---|---|---
Before revision| After revision
FEXK715x1EK1_
HardManual-01
| Dec. 1, 2020| -| -| Final first edition
Caution: This does not include typographical errors, changes in expressions, or corrections.
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