ROHM FEBL62Q2737RB-01 Introduces Power Efficient Zero Cross Detection User Manual

ROHM FEBL62Q2737RB-01 Introduces Power Efficient Zero Cross Detection

Product Information

• Product Name: ML62Q2737 Reference Board
• Model: RB-D62Q2737GA80
• Issue Date: June 10, 2022
• Not Radiation Tolerant
• Manufacturer: ROHM Co., Ltd.

Product Usage Instructions

1. Overview
   The ML62Q2737 Reference Board RB-D62Q2737GA80 is designed as a development tool for the ML62Q2737 microcontroller. It provides essential features for prototyping and testing applications.

2. Features
   The board features include:

   • Support for ML62Q2737 microcontroller
   • User interface connectors CN1, CN2, and CNE
   • Outline diagram for easy reference

3. User Interface

   • CN1, CN2 Connectors
     The CN1 and CN2 connectors provide interfaces for connecting external devices or peripherals to the reference board. Refer to the pinout diagrams for proper connections.

   • CNE Connector
     The CNE connector serves a specific purpose, refer to the documentation for details on its functionality and usage.

Frequently Asked Questions

Q: Is the ML62Q2737 Reference Board suitable for high-radiation environments?

A: No, the product is not designed to be radiation tolerant.

Q: Where can I find more information about environmental compliance for the product?

A: Please refer to the RoHS Directive and comply with applicable environmental laws and regulations when using the product.

Q: Can I reproduce or reprint the user manual without prior consent?

A: No, the user manual or its parts cannot be reprinted or reproduced without prior consent from ROHM Co., Ltd.

Dear customer
ROHM Co., Ltd. (“ROHM”), on the 1st day of April 2024, has absorbed into a merger with a 100 %-owned subsidiary of LAPIS Technology Co., Ltd. Therefore, all references to “LAPIS Technology Co., Ltd.”, “LAPIS Technology” and/or “LAPIS” in this document shall be replaced with “ROHM Co., Ltd.” Furthermore, there are no changes to the documents relating to our products other than the company name, the company trademark, logo, etc.

Thank you for your understanding.

Important Notes

1. The information contained herein is subject to change without notice.
2. When using LAPIS Technology Products, refer to the latest product information (data sheets, user’s manuals, application notes, etc.), and ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within the ranges specified. LAPIS Technology disclaims any liability for any malfunctions, failure or accident arising out of or in connection with the use of LAPIS Technology Products outside of such usage conditions specified ranges, or without observing precautions. Even if it is used within such usage conditions specified ranges, semiconductors can break down and malfunction due to various factors. Therefore, to prevent personal injury, fire or other damage from the breakdown or malfunction of LAPIS Technology Products, please take safety at your risk measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. You are responsible for evaluating the safety of the final products or systems manufactured by you.
3. Descriptions of circuits, software and other related information in this document are provided only to illustrate the standard operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. The peripheral conditions must be taken into account when designing circuits for mass production. LAPIS Technology disclaims any liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, and other related information.
4. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology or any third party concerning LAPIS Technology Products or the information contained in this document (including but not limited to, the Product data, drawings, charts, programs, algorithms, and application examples、etc.). Therefore LAPIS Technology shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.
5. The Products are intended for use in general electronic equipment (AV/OA devices, communication, consumer systems, gaming/entertainment sets, etc.) as well as the applications indicated in this document. For use of our Products in applications requiring a high degree of reliability (as exemplified below), please be sure to contact a LAPIS Technology representative and obtain written agreement: transportation equipment (cars, ships, trains, etc.), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems, etc. LAPIS Technology disclaims any liability for any losses and damages incurred by you or third parties arising from using the Product for purposes not intended by us. Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters, etc.
6. The Products specified in this document are not designed to be radiation tolerant.
7. LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. However, LAPIS Technology does not warrant that such information is error-free and LAPIS Technology shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.
8. Please use the Products by any applicable environmental laws and regulations, such as the RoHS Directive. LAPIS Technology shall have no responsibility for any damages or losses resulting from non-compliance with any applicable laws or regulations.
9. When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act..
10. Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology’s Products.
11. This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology.

(Note) “LAPIS Technology” as used in this document means LAPIS Technology Co., Ltd.

This manual describes the ML62Q2737 Reference Board: RB-D62Q2737GA80.

Refer to the following documents when necessary.

• ML62Q2700 Group User’s Manual
  Provides detailed information about the microcontroller ML62Q2700 Group.

• EASE1000 V2 User’s Manual
  Provides the information on how to use the On-chip emulator EASE1000 V2.

Features

• The RB-D62Q2737GA80 can be used for learning ‘how to use’ the ML62Q2737, on which the user needs to provide additional external components if necessary. By using the RB-D62Q2737GA80 together with LAPIS Technology’s on-chip emulator EASE1000 V2 and the provided software development environment, the user can develop software, debug and program the Flash. Also, by connecting an external power supply to RB-D62Q2737GA80, it can be used independently without connecting an EASE1000 V2.
• Before using RB-D62Q2737GA80, be sure to understand and keep in mind the following information.
  • The board is provided with ML62Q2737 80pin QFP.
  • Mounted with the linked connector to EASE1000 V2.
  • Through-holes for connecting the pins of LSI to external peripheral boards.
  • Power supply is selectable; supplied from the on-chip emulator EASE1000 V2 or CN1_3pin/CN2_2pin .Mounted with Crystal (32.768KHz)
  • Mounted with LED (P20, P21, P22).
  • Foot pattern with components for Successive Approximation Type A/D Converter is available (P23, P24, P25, P26).

Hardware specifications

Table 1 shows the hardware specifications of RB-D62Q2737GA80.

Table 1 Hardware specifications

Other

Mounted components

| PWR: Jumper for selecting the power supply input (3pin pin-header and short pin)
J1: Jumper for selecting TEST1_N pin (3pin pin-header and short pin)
J2: Jumper for selecting P00/TEST0 pin (3pin pin-header and short pin)
P20-P22: LEDs
R1-R3: Resistors for LEDs by P20 to P22
J3-J5: Jumper Chip for connecting LEDs
X1, C3, C4: Crystal Oscillator (32.768kHz) and capacitors
CNE: Connector for EASE1000 V2(14pin connector)
C1, C5, C15: Capacitors for VDD and VDDL
R4: Pull-up resistor for RESET_N

Pads (or/and) Through holes for mounting components

| CN1-CN2: Connectors for user application system  (50pin, 2.54mm pitch, φ1.0mm )
C2, C16: Capacitors for VDD
C10-C14, J8: Capacitors and jumper chip for Successive Approximation Type A/D Converter
J6-J7: CN1 connection jumper chip
Power check pin| VDD, VSS, UVDD: φ0.8mm
Operating voltage| +1.8V to +5.5V
Board size| 55.88 mm x 93.98 mm

For more information about the connection of the mounted components, see the schematic.

Outline Diagram

Fig. 1 shows the RB-D62Q2737GA80.

Function

Power Circuit
The input to VDD can be selected from 3.3VOUT of EASE1000 V2 or CN1_3pin/CN2_2pin by PWR jumper.

Note
The power supply ON/OFF procedure in case of setting the PWR jumper to the USR-side when using EASE1000 V2.

The procedure of power supply ON

1. The USB cable of EASE1000 V2 is connected.
2. The power supply of the user’s target system is turned on.

The procedure of power supply OFF

1. The power supply of the user’s target system is turned off
2. The USB cable of EASE1000 V2 is removed

Connection for EASE1000 V2 (CNE)
EASE1000 V2 can be used if J1 and J2 jumpers are set to “CNE”.

Note

P01/TEST0 pin:

• P01/TEST0 pin of ML62Q2737 is initially set as a pull-up input mode
• When using EASE1000 V2, do not set it as an output mode by using an application program, otherwise EASE1000 V2 cannot communicate with the ML62Q2737.

LED (P20, P21, P22)
The P20-P22 pins are ports that can directly drive LED. The Ports are connected to the LEDs through a jumper chip. Remove the jumper chip when not using the LEDs.

XT0/PIO0，XT1/PIO1
RB-D62Q2737GA80 can be mounted with cylinder type or SMD type crystal oscillator.

P23, P24, P25, P26

• When the P23 pin is used as a VREF function of the successive approximation type A/D converter, C10, and C11 can implement a bypass capacitor. In addition, VDD can be connected by mounting the J8 jumper chip.
• Then P24, P25, and P26 pin is used as AIN4, AIN5, and AIN6 functions of the successive approximation type A/D converter, and the C12, C13 and C14 can implement a by-pass capacitor.
• Fig. 6 shows the connection diagram.

User Interface

CN1, CN2
Table 2 and Table 3 show the pin list of the RB-D62Q2737GA80 user interface connection CN1 and CN2.

Table 2 CN1 Pin List

CN1

Pin No.

| Connection destination| CN1

Pin No.

| Connection destination
---|---|---|---
Device| Pin No.| Name| Device| Pin No.| Name
1| J6| 1| XT0| 2| J7| 1| XT1
3| PWR| USR| VDD| 4| –| –| VSS
5| –| –| N.C.| 6| ML62Q2737| 6| RESET_N
7| –| –| N.C.| 8| J2| USR| P00/TEST0
9| ML62Q2737| 9| P80| 10| ML62Q2737| 10| P81
11| ML62Q2737| 11| P82| 12| –| –| N.C.
13| –| –| N.C.| 14| –| –| N.C.
15| –| –| N.C.| 16| –| –| N.C.
17| ML62Q2737| 12| P44| 18| ML62Q2737| 13| P45
19| ML62Q2737| 14| P02| 20| ML62Q2737| 15| P03
21| ML62Q2737| 16| P46| 22| ML62Q2737| 17| P47
23| ML62Q2737| 18| P76| 24| –| –| N.C.
25| –| –| N.C.| 26| –| –| N.C.
27| –| –| N.C.| 28| –| –| N.C.
29| ML62Q2737| 24| P70| 30| ML62Q2737| 25| P04
31| ML62Q2737| 26| P05| 32| ML62Q2737| 27| P06
33| ML62Q2737| 28| P07| 34| ML62Q2737| 29| P10
35| ML62Q2737| 30| P11| 36| ML62Q2737| 31| P12
37| ML62Q2737| 32| P13| 38| ML62Q2737| 33| P50
39| ML62Q2737| 34| P51| 40| ML62Q2737| 35| P52
41| ML62Q2737| 36| P53| 42| –| –| N.C.
43| –| –| N.C.| 44| –| –| N.C.
45| ML62Q2737| 37| P93| 46| ML62Q2737| 38| P94
47| ML62Q2737| 39| P95| 48| ML62Q2737| 40| P96
49| –| –| N.C.| 50| –| –| N.C.

N.C.: Not Connected

Table 3 CN2 Pin List

CN2

Pin No.

| Connection destination| CN2

Pin No.

| Connection destination
---|---|---|---
Device| Pin No.| Name| Device| Pin No.| Name
1| –| –| VSS| 2| PWR| USR| VDD
3| –| –| N.C.| 4| –| –| N.C.
5| ML62Q2737| 43| P54| 6| ML62Q2737| 44| P55
7| ML62Q2737| 45| P14| 8| ML62Q2737| 46| P15
9| ML62Q2737| 47| P16| 10| ML62Q2737| 48| P17
11| ML62Q2737| 49| P20| 12| ML62Q2737| 50| P21
13| ML62Q2737| 51| P22| 14| ML62Q2737| 52| P23
15| ML62Q2737| 53| P24| 16| ML62Q2737| 54| P25
17| ML62Q2737| 55| P26| 18| ML62Q2737| 56| P27
19| ML62Q2737| 57| P56| 20| ML62Q2737| 58| P57
21| ML62Q2737| 59| PA3| 22| ML62Q2737| 60| PA4
23| –| –| N.C.| 24| –| –| N.C.
25| –| –| N.C.| 26| –| –| N.C.
27| –| –| N.C.| 28| ML62Q2737| 61| PB2
29| ML62Q2737| 62| PB3| 30| ML62Q2737| 63| PB4
31| ML62Q2737| 64| PB5| 32| ML62Q2737| 65| P40
33| ML62Q2737| 66| P41| 34| ML62Q2737| 67| P30
35| ML62Q2737| 68| P31| 36| ML62Q2737| 69| P32
37| ML62Q2737| 70| P33| 38| ML62Q2737| 71| P60
39| ML62Q2737| 72| P61| 40| ML62Q2737| 73| P62
41| ML62Q2737| 74| P63| 42| ML62Q2737| 75| P64
43| ML62Q2737| 76| P65| 44| ML62Q2737| 77| P66
45| ML62Q2737| 78| P67| 46| ML62Q2737| 79| P42
47| –| –| N.C.| 48| –| –| N.C.
49| –| –| N.C.| 50| ML62Q2737| 80| P43

CNE
Table 4 shows the pin list of the RB-D62Q2737GA80 user interface connection CNE.

Table 4 CNE

N.C.: Not Connected

Precaution For Usage

1. The RB-D62Q2737GA80 is an unfinished product intended for research and development and expert use in the research and development facility only. The RB-D62Q2737GA80 is not intended to be used for volume production or parts thereof.
2. Since the content specified herein is subject to change for improvement without notice, confirm the latest content when using the board.
3. See the other documents, the ML62Q2700 group user’s manual and the EASE1000 V2 user’s manual when using the RB-D62Q2737GA80.
4. Confirm the final electrical characteristics by using the mass-production parts on your mass-production boards.
5. LAPIS supports replacing the board for an initial failure soon after the shipment. However, LAPIS doesn’t support reparing the board.
6. RB-D62Q2737GA80 have signal patterns on the underside, it might work abnormally if used on conductive materials. Use it on insulating materials or having any preventable parts.

PCB specification, BOM list and Schematic

PCB specification
Fig. 7 shows the PCB dimensional outline diagram and layout of components.

• PCB part number: RB-D62Q2737GA80
• Dimension: 55.88mm x 93.98mm

BOM list

Table 5 BOM list

Manufacturing Co., Ltd.
5| HIF3H-50DA-2.54DSA(71)| CN1, CN2| Unmounted| 2| Hirose Electric Co., Ltd.
6| HIF3FC-14PA-2.54DSA(71)| CNE| 14pin Header Connector| 1| Hirose Electric Co., Ltd.
7| –| CNEM| Unmounted| 1| –
8| A2-3PA-2.54DSA| J1, J2, PWR| 3pin Header Connector| 3| Hirose Electric Co., Ltd.
9| MCR03ERTJ000| J3, J4, J5| Resistor 0Ω| 3| Rohm Co., Ltd.
10| –| J6, J7, J8| Unmounted| 3| –
11| SML-H12P8T| P20, P21, P22| LED Green| 3| Rohm Co., Ltd.
12| MCR03EZPJ271| R1, R2, R3| Resistor 270Ω ±5%| 3| Rohm Co., Ltd.
13| MCR03EZPJ103| R4| Resistor 10kΩ ±5%| 1| Rohm Co., Ltd.
14| ML62Q2737-NNNTB| U1| 16-bit Microcontroller| 1| LAPIS Technology Co., Ltd.
15| –| UVDD, VDD, VSS| Unmounted| 3| –
16| –| VSSPAD| Unmounted| 1| –
17| VT-200-F 12.5pF| XT1| X’tal 32.768kHz 12.5pF| 1| Seiko Instruments Inc.
18| HIF3GA-2.54SP| –| Short pin| 3| Hirose Electric Co., Ltd.

Note:

1. The diameter of the through hole of CN1 and CN2 is 1.0 mm. Using CN1 and CN2, the diameter of the connector pin should use the connector below 0.6mm, such as 0.64mm.
2. The parts may be changed into other parts with equivalent parts special quality.

Schematic
The next page shows the schematic of RB-D62Q2737GA80.

Revision History

LAPIS Technology Co., Ltd.

• 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan.
• https://www.lapis-tech.com/en/.

References

• Notice of Site Integration | LAPIS Technology

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