AIMB-277 Intel Core i9/i7/i5/i3 LGA 1200 Mini-ITX User Guide

AIMB-277

Intel®Core™ i9/i7/i5/i3 LGA 1200
Mini-ITX with HDMI/DP/VGA, 2 COM,
Dual LAN, M.2, DDR4, PCIe x16, ATX

Features

•  Supports Intel® 10th Gen Core™ I processor (LGA1200) with Intel Q470E/ H420E chipset
•  Two 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAM
•  Supports displays of HDMI2.0a/DP1.2/VGA/LVDs (or eDP)
•  Supports 1 M.2 M key & 1 M.2 E key
•  Supports 4 USB3.2 Gen2 & 4 USB3.2 Gen1, and 3 SATAIII
•  Supports TPM2.0 and dual channel 3.2W amplifier
• Supports Intel vPro, AMT, Software RAID 0,1,5 (G2 SKU)
• Supports SUSI, WISE-DeviceOn, and Edge AI Suite

Software APIs:

Specifications

Processor System| CPU| i9-10900E/i9-10900TE| i7-10700E/i7-10700TE| i5-10500E/i5-10500TE| i3-10100E/i3-10100TE| G6400E/G6400TE| G5900E/G5900TE
---|---|---|---|---|---|---|---
Core Number| 10/10| 8/8| 6/6| 4/4| 2/2| 2/2
Max Speed| 2.8GHz/ 1.8GHz| 2.9GHz/ 2.0GHz| 3.1GHz/ 2.3GHz| 3.2GHz/ 2.3GHz| 3.8GHz/ 3.2GHz| 3.2GHz/ 3.0GHz
SmartCache| 20MB/20MB| 16MB/16MB| 12MB/12MB| 6MB/6MB| 2MB/2MB| 2MB/2MB
TDP| 65W/35W| 65W/35W| 65W/35W| 65W/35W| 58W/35W| 58W/35W
Chipset| Q470E/H420E|
BIOS| AMI EFI 256 Mbit SPI|
Expansion Slot| M.2| 1 x M key for SSD and 3G/4G (Type: 2280), on top side

1 x E key for wireless (Type: 2230mm), on bottom side

PCIe x16 (Gen3)| 16 GB/s per direction, 1 slot
Memory| Technology| Dual Channel DDR4 2933 MHz SDRAM
Max. Capacity| 64GB (up to 32GB per SO-DIMM)
Socket| 2 x 260 PIN DDR4 SO-DIMM (Non-ECC)
Graphics| Controller| Intel HD Graphics
HDMI 2.0a| Yes, supports max. resolution  4096 x 2160 @ 60 Hz (Only for G2 sku)
DP1.2| Yes, supports max. resolution 4096 x 2304 @ 60 Hz
LVDs| Yes, with internal pin header, supports singel/dual channel 18/24-bit with maximum resolution up to  1920 x 1200 @ 60 Hz (LVDs colay with eDP)
eDP| Yes, with internal pin header, supports max. resolution 4096 x 2304 @ 60 Hz (eDP colay with LVDs)
VGA| Yes, with internal pin header, supports max. resolution 1920 x 1200 @ 60 Hz
Triple Display (G2 sku)| HDMI+DP+VGA, HDMI+DP+LVDS (or eDP), HDMI+VGA+LVDS (or eDP), DP+VGA+LVDs (or eDP)
Dual Display (L sku)| VGA+LVDS (or eDP), DP+VGA, DP+LVDs (or eDP)
Ethernet| Interface| 10/100/1000 Mbps
Controller| GbE LAN1: Intel i219LM
GbE LAN2: Intel i211AT
Connector| RJ-45 x 2
SATA| Max Data Transfer Rate| 600 MB/s (SATA 3.0)
Channel| 3 SATAIII (for G2 sku), 2 SATAIII (for L sku)
Rear I/O| DP 1.2 (DP++)| 1
HMDI 2.0| 1
Ethernet| 2
USB| G2 sku: 4 USB3.2 Gen2

L sku: 4 USB3.2 Gen1

Audio| 1 (Line in/Line out/Mic in)
Internal Connector| USB| G2 sku: 4 USB3.2 Gen1

L sku: 2 USB3.2 Gen1, 2 USB2.0

VGA| 1 (pin header)
LVDs/eDP| 1 (LVDs colay with eDP)
Serial| 2 (1 RS-232, 1 RS-232/422/485)
SATA| G2 sku: 3 SATAIII; L sku: 2 SATAIII
M.2| 1 x M key for SSD, Type: 2280mm (on top side)

1 x E key for wireless, Type: 2230mm (on bottom side)

GPIO| 8-bit
Watchdog Timer| Output| System reset
Interval| Programmable 1 ~ 255 sec/min
Power Requirements| Boost| 117.882W (Intel Core i9-10900E, DDR4 3200MHz 32GB x 2pcs)
Typical| 102W (Intel Core i9-10900E, DDR4 3200MHz 32GB x 2pcs)
Environment| | | Non-Operating
Temperature| 0 ~ 60° C (32 ~ 140° F), depends on CPU speed and cooler solution| -40 ~ 85° C (-40 ~ 185° F)
Physical Characteristics| Dimensions| 170 mm x 170 mm (6.69″ x 6.69″)

Block Diagram

Ordering Information

P/N| Chipset| HDMI
2.0| LVDS/eDP| DP 1.2| VGA| GbE
LAN| COM| SATAIII| USB3.2
Gen 2| USB 3.2
Gen1| USB 2.0| M.2
M key| M.2
E key| PCIe
x16| TPM2.0| AMP| Rugged
CPU Plate
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
AIMB-277G2-FLA1E| Q470E| 2| 1/(1)| 1| 1| 2| 2| 3| 4| 4| 0| 1| 1| 1| 1| 1| Y
AIMB-277G2-00A1E| Q470E| 1| 0/(1)| 1| 0| 2| 2| 3| 4| 4| 0| 1| 1| 1| 0| 0| Y
AIMB-277L-00A1E| H420E| 1| 1/(1)| 1| 0| 2| 2| 2| 4| 4| 2| 1| 1| 1| (1)| (1)| Y

Packing List

Optional Chassis

I/O View

Optional Accessories

(for CPU TDP <= 65W)
1960060732N001| LGA1150 CPU cooler for CPU TDP 45W, 80 (W) x 80 (L) x 32.2 (H) mm
1970004564T010| C.L.R3 Kaby Lake 35W 75x75x25 sunflower

Embedded OS/API

Online Download

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